UPG2418TB [RENESAS]
GaAs Integrated Circuit 0.5 to 3.0 GHz SPDT Switch with 50 Ω Termination; 砷化镓集成电路0.5〜 3.0 GHz的SPDT开关，具有50个I ©终止
| 型号： | UPG2418TB |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | GaAs Integrated Circuit 0.5 to 3.0 GHz SPDT Switch with 50 Ω Termination |
| 文件： | 总12页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PreliminaryData Sheet
μPG2418TB
R09DS0007EJ0100
Rev.1.00
GaAs Integrated Circuit
Aug 24, 2010
0.5 to 3.0 GHz SPDT Switch with 50 Ω Termination
DESCRIPTION
The μPG2418TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch with 50 Ω termination for
2.4 GHz wireless LAN, mobile phone and other L, S-band applications.
This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies from
0.5 to 3.0 GHz, with low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density
surface mounting.
FEATURES
•
Switch control voltage
: Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
•
•
•
•
Low insertion loss
High isolation
Handling power
: Lins = 0.45 dB TYP. @ f = 2.5 GHz
: ISL = 21 dB TYP. @ f = 2.5 GHz
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz
High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
•
•
W-LAN and BluetoothTM etc.
L, S-band digital cellular or cordless telephone
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
μPG2418TB-E4 μPG2418TB-E4-A 6-pin super minimold
G6H
•
•
Embossed tape 8 mm wide
Pin 4, 5, 6 face the perforation side of
the tape
(SC-88/SOT-363 type)
(Pb-Free)
•
Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2418TB
CAUTION
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this
device. This device must be protected at all times from ESD. Static charges may easily produce potentials of
several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard
ESD precautions must be employed at all times.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 1 of 10
μPG2418TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
RF1
(Top View)
(Top View)
(Bottom View)
1
2
3
4
5
6
RF1
V
cont
1
GND
50 Ω
1
2
3
6
5
4
1
2
3
6
5
4
6
5
4
1
2
3
RF2
GND
RF2
RFC
Vcont
RFC
Vcont
2
Vcont
2
1
50 Ω
SW TRUTH TABLE
ON Path
RFC-RF1
RFC-RF2
Vcont
1
Vcont
Low
High
2
High
Low
ABSOLUTE MAXIMUM RATINGS (T = +25°C, unless otherwise specified)
A
Parameter
Symbol
Vcont
Pin
Ratings
+6.0 Note
+33.0
Unit
V
Switch Control Voltage
Input Power (ON Port)
dBm
dBm
°C
Input Power (OFF Port)
Operating Ambient Temperature
Storage Temperature
Pin
+20.0
TA
−45 to +85
−55 to +150
Tstg
°C
Note: ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (T = +25°C, unless otherwise specified)
A
Parameter
Symbol
f
MIN.
0.5
TYP.
MAX.
3.0
Unit
GHz
V
Operating Frequency
−
3.0
0
Switch Control Voltage (H)
Switch Control Voltage (L)
Control Voltage Difference
Vcont (H)
Vcont (L)
2.5
5.3
−0.2
−0.1
0.2
V
ΔVcont (H)
,
0
0.1
V
ΔVcont (L)
Note
Note: ΔVcont (H) = Vcont1 (H) − Vcont2 (H)
ΔVcont (L) = Vcont1 (L) − Vcont2 (L)
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 2 of 10
μPG2418TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF,
unless otherwise specified)
Parameter
Insertion Loss
Symbol
Test Conditions
f = 0.5 to 1.0 GHz
MIN.
−
−
−
−
19
17
16
15
15
10
+26.0
−
TYP.
0.30
0.37
0.45
0.50
23
MAX.
Unit
dB
Lins
0.50
f = 1.0 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 2.5 to 3.0 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 2.5 to 3.0 GHz
f = 0.5 to 3.0 GHz
f = 0.5 to 3.0 GHz
f = 2.0 to 3.0 GHz
0.57
dB
0.65
dB
0.70
−
−
−
−
−
−
−
−
dB
Isolation
ISL
dB
21
dB
20
dB
Input Return Loss
RLin
RLout
URL
20
dB
Output Return Loss
20
dB
Unused Port Return Loss
0.1 dB Loss Compression
Input Power Note1
20
dB
Pin (0.1 dB) f = 2.0/2.5 GHz
f = 0.5 to 3.0 GHz
+29.0
+29.0
+32.0
+32.0
+60
dBm
dBm
dBm
dBm
dBm
1 dB Loss Compression
Input Power Note2
Pin (1 dB) f = 2.0/2.5 GHz
f = 0.5 to 3.0 GHz
+29.0
−
−
−
−
−
Input 3rd Order Intercept Point
IIP3
f = 0.5 to 3.0 GHz, 2 tone,
5 MHz spicing
Switch Control Current
Switch Control Speed
Icont
tSW
No RF input
−
−
0.3
50
20
μA
ns
50% CTL to 90/10% RF
500
Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the
linear range.
2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear
range.
CAUTION
It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 3 of 10
μPG2418TB
EVALUATION CIRCUIT
C2
C1
1
2
3
V
cont
1
RF1
RF2
6
5
4
RFC
C1 Note
V
cont
2
C1
C2
Note: C1: 56 pF
C2: 1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1
LESD
C1
•
LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
•
•
The value may be tailored to provide specific electrical responses.
The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for
best performance.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 4 of 10
μPG2418TB
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF,
unless otherwise specified)
RFC-RF1/RF2
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
INSERTION LOSS vs. FREQUENCY
0
–5
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
–10
–15
–20
–25
–30
–35
–40
–45
–50
2.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
3.0
Frequency f (GHz)
Frequency f (GHz)
OUTPUT (RF1/RF2) RETURN LOSS
vs. FREQUENCY
INPUT (RFC) RETURN LOSS
vs. FREQUENCY
0
–5
0
–5
–10
–15
–20
–25
–30
–35
–40
–10
–15
–20
–25
–30
–35
–40
2.5
2.5
0.0
0.5
1.0
1.5
2.0
3.0
0.0
0.5
1.0
1.5
2.0
3.0
Frequency f (GHz)
Frequency f (GHz)
RFC-RF1/RF2
RFC-RF1/RF2 INSERTION LOSS,
UNUSED PORT RETURN LOSS vs. FREQUENCY
vs. SWITCH CONTROL VOLTAGE (H)
0
0.00
–0.10
–0.20
–0.30
–0.40
–0.50
–0.60
–0.70
–5
–10
–15
–20
–25
–30
–35
–40
f = 2.0 GHz
2.5 GHz
3.0 GHz
4.5 5.0 5.5
6.0
0.5
1.0
2.0
2.5
2.0 2.5 3.0 3.5
4.0
0.0
1.5
3.0
Frequency f (GHz)
Switch Control Voltage (H) Vcont (H) (V)
Remark The graphs indicate nominal characteristics.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 5 of 10
μPG2418TB
RFC-RF1/RF2 ISOLATION vs.
RFC-RF1/RF2
SWITCH CONTROL VOLTAGE (H)
INSERTION LOSS, Icont vs. INPUT POWER
0
–5
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
60
50
40
30
20
10
0
f = 2.5 GHz
V
cont = 5.3 V
μ
–10
–15
–20
–25
–30
–35
–40
–45
–50
f = 3.0 GHz
L
ins
3.0 V
2.5 V
2.0 GHz
2.5 GHz
I
cont
5.0
2.0 2.5 3.0 3.5 4.0 4.5
5.5 6.0
20
25
30
35
Switch Control Voltage (H) Vcont (H) (V)
Input Power Pin (dBm)
RFC-RF1/RF2 2f0, 3f0
RFC-RF1/RF2 Pin (1 dB), Pin (0.1 dB)
vs. SWITCH CONTROL VOLTAGE (H)
vs. SWITCH CONTROL VOLTAGE (H)
35
34
33
32
31
30
29
28
27
26
25
24
–60
–65
–70
–75
–80
–85
–90
–95
–100
f = 2.5 GHz
f = 2.5 GHz
P
in (1 dB)
2f0
3f0
P
in (0.1 dB)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
RFC-RF1/RF2
RFC-RF1/RF2 2f0, 3f0 vs. INPUT POWER
OUTPUT POWER, IM vs. INPUT POWER
3
60
50
0
f = 2.5 GHz
f = 2.5 GHz
–10
40
30
20
10
0
–20
–30
–40
–50
–60
–70
–80
–90
–100
3f0
2f0
P
out
–10
–20
–30
–40
–50
–60
–70
IM
3
20
25
30
35
15 20 25 30 35 40 45 50 55 60 65
Input Power Pin (1Tone) (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 6 of 10
μPG2418TB
MOUNTING PAD LAYOUT DIMENSIONS
6-PIN SUPER MINIMOLD (SC-88/SOT-363 TYPE) (UNIT: mm)
0.4
0.65
0.65
Remark The mounting pad layout in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 7 of 10
μPG2418TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (SC-88/SOT-363 TYPE) (UNIT: mm)
2.1 0.1
1.25 0.1
0.1 MIN.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 8 of 10
μPG2418TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260°C or below
IR260
Time at peak temperature
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature): 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
WS260
HS350
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350°C or below
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 9 of 10
μPG2418TB
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Caution GaAs Products
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
Page 10 of 10
Revision History
μPG2418TB Data Sheet
Description
Summary
Rev.
1.00
Date
Page
Aug 24, 2010
−
First edition issued
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
All trademarks and registered trademarks are the property of their respective owners.
C - 1
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