X9269TS24-2.7T1
更新时间:2024-09-18 14:12:38
品牌:RENESAS
描述:DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, PDSO24, PLASTIC, SOIC-24
X9269TS24-2.7T1 概述
DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, PDSO24, PLASTIC, SOIC-24 数字电位计
X9269TS24-2.7T1 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | 0.300 INCH, PLASTIC, SOIC-24 |
针数: | 24 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.76 | 其他特性: | NONVOLATILE MEMORY |
控制接口: | 2-WIRE SERIAL | 转换器类型: | DIGITAL POTENTIOMETER |
JESD-30 代码: | R-PDSO-G24 | 长度: | 15.4 mm |
功能数量: | 2 | 位置数: | 256 |
端子数量: | 24 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 认证状态: | Not Qualified |
电阻定律: | LINEAR | 最大电阻容差: | 20% |
最大电阻器端电压: | 3 V | 最小电阻器端电压: | |
座面最大高度: | 2.65 mm | 标称供电电压: | 3 V |
表面贴装: | YES | 技术: | CMOS |
标称温度系数: | 300 ppm/°C | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 标称总电阻: | 100000 Ω |
宽度: | 7.5 mm | Base Number Matches: | 1 |
X9269TS24-2.7T1 数据手册
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X9269
FN8173
Rev.4.00
April 17, 2007
Single Supply/Low Power/256-Tap/2-Wire Bus Dual Digitally-Controlled (XDCP™)
Potentiometers
FEATURES
DESCRIPTION
• Dual–Two Separate Potentiometers
• 256 Resistor Taps/Pot–0.4% Resolution
• 2-Wire Serial Interface for Write, Read, and
Transfer Operations of the Potentiometer Single
Supply Device
The X9269 integrates
potentiometer (XDCP) on
integrated circuit.
2
digitally controlled
monolithic CMOS
a
The digital controlled potentiometer is implemented
using 255 resistive elements in a series array.
Between each element are tap points connected to the
wiper terminal through switches. The position of the
wiper on the array is controlled by the user through the
2-Wire bus interface. Each potentiometer has
associated with it a volatile Wiper Counter Register
(WCR) and a four nonvolatile Data Registers that can
be directly written to and read by the user. The
contents of the WCR controls the position of the wiper
on the resistor array though the switches. Powerup
recalls the contents of the default Data Register (DR0)
to the WCR.
• Wiper Resistance, 100 Typical V
= 5V
CC
• 4 Nonvolatile Data Registers for Each
Potentiometer
• Nonvolatile Storage of Multiple Wiper Positions
• Power-on Recall. Loads Saved Wiper Position on
Power-up.
• Standby Current < 5µA Max
• 50k, 100k Versions of End to End Pot
Resistance
• 100 yr. Data Retention
• Endurance: 100,000 Data Changes per Bit per
Register
• 24-Lead SOIC, 24-Lead TSSOP
• Low Power CMOS
The XDCP can be used as
a three-terminal
potentiometer or as a two terminal variable resistor in
a wide variety of applications including control,
parameter adjustments, and signal processing.
• Power Supply V
= 2.7V to 5.5V
CC
• Pb-Free Plus Anneal Available (RoHS Compliant)
FUNCTIONAL DIAGRAM
V
R
R
H1
CC
H0
Write
Read
Address
Data
Status
Transfer
Inc/Dec
Power-on Recall
Bus
2-Wire
Bus
Interface
Wiper Counter
Registers (WCR)
Interface
and Control
Data Registers
(DR0–DR3)
Control
V
R
R
R
R
SS
W0
L0
W1
L1
50k
or 100k versions
FN8173 Rev.4.00
April 17, 2007
Page 1 of 24
X9269
Ordering Information
POTENTIOMETER
ORGANIZATION
(k)
TEMP
RANGE
(°C)
PART
MARKING
V
LIMITS
(V)
PKG.
DWG. #
CC
PART NUMBER
PACKAGE
X9269TS24*
X9269TS
5 ±10%
100
0 to +70 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9269TS24I*
X9269TS I
X9269TS ZI
M24.3
M24.3
X9269TS24IZ* (Note)
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
X9269TS24Z* (Note)
X9269TS Z
0 to +70 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TV24
X9269TV
0 to +70 24 Ld TSSOP (4.4mm)
0 to +70 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
MDP0044
M24.3
X9269US24*
X9269US
X9269US I
X9269US ZI
50
X9269US24I*
M24.3
X9269US24IZ* (Note)
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269US24Z* (Note)
X9269US Z
0 to +70 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269UV24*
X9269UV
0 to +70 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld TSSOP (4.4mm)
0 to +70 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
MDP0044
MDP0044
M24.3
X9269UV24I
X9269UV I
X9269TS F
X9269TS G
X9269TS ZG
X9269TS24-2.7*
X9269TS24I-2.7*
X9269TS24IZ-2.7* (Note)
2.7 to 5.5
100
M24.3
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TS24Z-2.7* (Note)
X9269TS ZF
0 to +70 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TV24I-2.7
X9269TV G
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
MDP0044
X9269TV24IZ-2.7* (Note)
X9269TV ZG
-40 to +85 24 Ld TSSOP (4.4mm)
(Pb-free)
X9269US24-2.7*
X9269US F
X9269US G
X9269US ZG
50
0 to +70 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
M24.3
M24.3
M24.3
X9269US24I-2.7*
X9269US24IZ-2.7* (Note)
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
X9269US24Z-2.7* (Note)
X9269US ZF
0 to +70 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269UV24-2.7*
X9269UV24I-2.7*
X9269UV24IZ-2.7*
X9269UV F
X9269UV G
X9269UV ZG
0 to +70 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
MDP0044
MDP0044
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
FN8173 Rev.4.00
April 17, 2007
Page 2 of 24
X9269
DETAILED FUNCTIONAL DIAGRAM
R
R
R
H0
L0 W0
V
CC
Power-on
Recall
Pot 0
R
R
0
1
Wiper
Counter
Register
(WCR)
R
R
2
3
SCL
SDA
INTERFACE
AND
50k
and 100k
A3
A2
A1
CONTROL
CIRCUITRY
256-taps
8
Power-on
Recall
A0
Data
WP
R
R
0
1
Wiper
Counter
Register
(WCR)
Resistor
Array
Pot 1
R
R
2
3
V
SS
R
R
R
L1 H1 W1
CIRCUIT LEVEL APPLICATIONS
SYSTEM LEVEL APPLICATIONS
• Vary the gain of a voltage amplifier
• Adjust the contrast in LCD displays
• Provide programmable dc reference voltages for com-
parators and detectors
• Control the power level of LED transmitters in
communication systems
• Control the volume in audio circuits
• Set and regulate the DC biasing point in an RF power
amplifier in wireless systems
• Trim out the offset voltage error in a voltage
amplifier circuit
• Control the gain in audio and home entertainment sys-
tems
• Set the output voltage of a voltage regulator
• Provide the variable DC bias for tuners in RF
wireless systems
• Trim the resistance in Wheatstone bridge circuits
• Control the gain, characteristic frequency and
Q-factor in filter circuits
• Set the operating points in temperature control
systems
• Set the scale factor and zero point in sensor signal
conditioning circuits
• Control the operating point for sensors in industrial
systems
• Vary the frequency and duty cycle of timer ICs
• Trim offset and gain errors in artificial intelligent
systems
• Vary the dc biasing of a pin diode attenuator in RF cir-
cuits
• Provide a control variable (I, V, or R) in feedback
circuits
FN8173 Rev.4.00
April 17, 2007
Page 3 of 24
X9269
PIN CONFIGURATION
SOIC/TSSOP
A3
NC
1
2
24
23
22
21
20
19
18
17
16
SCL
NC
NC
NC
NC
A0
NC
3
NC
NC
NC
4
5
6
X9269
V
V
7
CC
SS
R
R
8
W1
L0
R
R
H0
9
H1
R
R
W0
A2
10
11
12
15
14
L1
A1
WP
13
SDA
PIN ASSIGNMENTS
Pin
(SOIC/TSSOP)
Symbol
NC
Function
1
2
No Connect
A0
Device Address for 2-Wire bus.
No Connect
3
NC
4
NC
No Connect
5
NC
No Connect
6
NC
No Connect
7
V
System Supply Voltage
Low Terminal for Potentiometer 0.
High Terminal for Potentiometer 0.
Wiper Terminal for Potentiometer 0.
Device Address for 2-Wire bus.
Hardware Write Protect
CC
8
R
L0
H0
W0
9
R
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
R
A2
WP
SDA
A1
Serial Data Input/Output for 2-Wire bus.
Device Address for 2-Wire bus.
Low Terminal for Potentiometer 1.
High Terminal for Potentiometer 1.
Wiper Terminal for Potentiometer 1.
System Ground
R
L1
H1
W1
R
R
V
SS
NC
NC
NC
NC
SCL
A3
No Connect
No Connect
No Connect
No Connect
Serial Clock for 2-Wire bus.
Device Address for 2-Wire bus.
FN8173 Rev.4.00
April 17, 2007
Page 4 of 24
X9269
PIN DESCRIPTIONS
Bus Interface Pins
SERIAL DATA INPUT/OUTPUT (SDA)
Potentiometer Pins
R , R
H
L
The R and R pins are equivalent to the terminal
H
L
connections on a mechanical potentiometer. Since there
are 2 potentiometers, there are 2 sets of R and R
The SDA is a bidirectional serial data input/output pin for
a 2-Wire slave device and is used to transfer data into
and out of the device. It receives device address,
opcode, wiper register address and data sent from an 2-
Wire master at the rising edge of the serial clock SCL,
and it shifts out data after each falling edge of the serial
clock SCL.
H
L
such that R
so on.
and R are the terminals of POT 0 and
H0
L0
R
W
The wiper pin are equivalent to the wiper terminal of a
mechanical potentiometer. Since there are
potentiometers, there are 2 sets of R such that R
4
is
It is an open drain output and may be wire-ORed with
any number of open drain or open collector outputs. An
open drain output requires the use of a pull-up resistor.
For selecting typical values, refer to the guidelines for
calculating typical values on the bus pull-up resistors
graph.
W
W0
the terminal of POT 0 and so on.
Bias Supply Pins
SYSTEM SUPPLY VOLTAGE (V ) AND SUPPLY
CC
GROUND (V
)
SS
SERIAL CLOCK (SCL)
The V
is the system ground.
pin is the system supply voltage. The V
pin
SS
CC
This input is used by 2-Wire master to supply 2-Wire
serial clock to the X9269.
Other Pins
DEVICE ADDRESS (A3 - A0)
NO CONNECT
The address inputs are used to set the least significant 4
bits of the 8-bit slave address. A match in the slave
address serial data stream must be made with the
Address input in order to initiate communication with the
X9269. A maximum of 16 devices may occupy the 2-
Wire serial bus.
No connect pins should be left open. This pins are used
for Intersil manufacturing and testing purposes.
HARDWARE WRITE PROTECT INPUT (WP)
The WP pin when LOW prevents nonvolatile writes to
the Data Registers.
FN8173 Rev.4.00
April 17, 2007
Page 5 of 24
X9269
PRINCIPLES OF OPERATION
At both ends of each array and between each resistor
segment is a CMOS switch connected to the wiper (R )
output. Within each individual array only one switch may
be turned on at a time.
W
The X9269 is a integrated microcircuit incorporating four
resistor arrays and their associated registers and
counters and the serial interface logic providing direct
communication between the host and the digitally
controlled potentiometers. This section provides detail
description of the following:
These switches are controlled by a Wiper Counter
Register (WCR). The 8-bits of the WCR (WCR[7:0]) are
decoded to select, and enable, one of 256 switches (See
Table 1).
– Resistor Array Description
The WCR may be written directly. These Data Registers
can the WCR can be read and written by the host
system.
– Serial Interface Description
– Instruction and Register Description.
Array Description
Power-up and Down Requirements.
The X9269 is comprised of a resistor array (See Figure
1). Each array contains 255 discrete resistive segments
that are connected in series. The physical ends of each
array are equivalent to the fixed terminals of a mechanical
There are no restrictions on the power-up or power-
down conditions of V
potentiometer pins provided that V
and the voltages applied to the
is always more
positive than or equal to V , V , and V , i.e., V V ,
CC
CC
W
H
L
CC
V , V . The V ramp rate specification is always in
CC
H
potentiometer (R and R inputs).
H
L
L
W
effect.
Figure 1. Detailed Potentiometer Block Diagram
One of Two Potentiometers
SERIAL DATA PATH
SERIAL
R
H
BUS
FROM INTERFACE
CIRCUITRY
INPUT
C
O
U
N
T
REGISTER 0
(DR0)
REGISTER 1
(DR1)
8
8
PARALLEL
BUS
INPUT
E
R
REGISTER 2
(DR2)
REGISTER 3
(DR3)
D
E
C
O
D
E
WIPER
COUNTER
REGISTER
(WCR)
INC/DEC
LOGIC
IF WCR = 00[H] THEN R = R
W
L
UP/DN
UP/DN
CLK
IF WCR = FF[H] THEN R = R
W
H
R
R
MODIFIED SCL
L
W
FN8173 Rev.4.00
April 17, 2007
Page 6 of 24
X9269
SERIAL INTERFACE DESCRIPTION
Serial Interface
Stop Condition
All communications must be terminated by a stop
condition, which is a LOW to HIGH transition of SDA
while SCL is HIGH. See Figure 2.
The X9269 supports a bidirectional bus oriented
protocol. The protocol defines any device that sends
data onto the bus as a transmitter and the receiving
device as the receiver. The device controlling the
transfer is a master and the device being controlled is
the slave. The master will always initiate data transfers
and provide the clock for both transmit and receive
operations. Therefore, the X9269 will be considered a
slave device in all applications.
Acknowledge
Acknowledge is a software convention used to provide a
positive handshake between the master and slave
devices on the bus to indicate the successful receipt of
data. The transmitting device, either the master or the
slave, will release the SDA bus after transmitting eight
bits. The master generates a ninth clock cycle and
during this period the receiver pulls the SDA line LOW to
acknowledge that it successfully received the eight bits
of data.
Clock and Data Conventions
Data states on the SDA line can change only during SCL
LOW periods. SDA state changes during SCL HIGH are
reserved for indicating start and stop conditions. See
Figure 2.
The X9269 will respond with an acknowledge after
recognition of a start condition and its slave address and
once again after successful receipt of the command
byte. If the command is followed by a data byte the
X9269 will respond with a final acknowledge. See Figure
2.
Start Condition
All commands to the X9269 are preceded by the start
condition, which is a HIGH to LOW transition of SDA
while SCL is HIGH. The X9269 continuously monitors
the SDA and SCL lines for the start condition and will not
respond to any command until this condition is met. See
Figure 2.
Figure 2. Acknowledge Response from Receiver
SCL FROM
MASTER
1
8
9
DATA
OUTPUT
FROM
TRANSMITTER
DATA
OUTPUT
FROM
RECEIVER
START
ACKNOWLEDGE
FN8173 Rev.4.00
April 17, 2007
Page 7 of 24
X9269
Acknowledge Polling
INSTRUCTION AND REGISTER DESCRIPTION
Instructions
The disabling of the inputs, during the internal
nonvolatile write operation, can be used to take
advantage of the typical 5ms EEPROM write cycle time.
Once the stop condition is issued to indicate the end of
the nonvolatile write command the X9269 initiates the
internal write cycle. ACK polling, Flow 1, can be initiated
immediately. This involves issuing the start condition
followed by the device slave address. If the X9269 is still
busy with the write operation no ACK will be returned. If
the X9269 has completed the write operation an ACK
will be returned and the master can then proceed with
the next operation.
DEVICE ADDRESSING: IDENTIFICATION BYTE (ID AND A)
The first byte sent to the X9269 from the host is called
the Identification Byte. The most significant four bits of
the slave address are a device type identifier. The
ID[3:0] bits is the device id for the X9269; this is fixed as
0101[B] (refer to Table 1).
The A[3:0] bits in the ID byte is the internal slave
address. The physical device address is defined by the
state of the A3-A0 input pins. The slave address is
externally specified by the user. The X9269 compares
the serial data stream with the address input state; a
successful compare of both address bits is required for
the X9269 to successfully continue the command
sequence. Only the device which slave address
matches the incoming device address sent by the
master executes the instruction. The A3 - A0 inputs can
FLOW 1: ACK Polling Sequence
Nonvolatile Write
Command Completed
EnterACK Polling
Issue
START
be actively driven by CMOS input signals or tied to V
CC
or V
.
SS
INSTRUCTION BYTE (I)
Issue Slave
Issue STOP
Address
The next byte sent to the X9269 contains the instruction
and register pointer information. The three most
significant bits are used provide the instruction opcode I
[3:0]. The RB and RA bits point to one of the four Data
Registers of each associated XDCP. The least
significant bit points to one of two Wiper Counter
Registers or Pots. The format is shown in Table 2.
ACK
Returned?
No
Yes
No
Further
Operation?
Register Selection
Yes
Register Selected
RB
0
RA
0
Issue
Instruction
DR0
DR1
DR2
DR3
Issue STOP
Proceed
0
1
1
0
Proceed
1
1
FN8173 Rev.4.00
April 17, 2007
Page 8 of 24
X9269
Table 1. Identification Byte Format
Device Type
Identifier
Slave Address
ID3
0
ID2
1
ID1
0
ID0
1
A3
A2
A1
A0
(MSB)
(LSB)
Table 2. Instruction Byte Format
Instruction
Opcode
Register
Selection
Pot Selection
(WCR Selection)
I3
I2
I1
I0
RB
RA
0
P0
(MSB)
(LSB)
Table 3. Instruction Set
Instruction
Instruction Set
I3 I2 I1 I0 RB RA
0
P0
Operation
Read Wiper Counter
Register
1
1
1
1
1
0
0
0
1
1
0
1
1
0
0
1
0
1
0
1
0
0
0
0
0
0
0
1/0 Read the contents of the Wiper Counter
Register pointed to by P0
Write Wiper Counter Register
0
0
1/0 Write new value to the Wiper Counter
Register pointed to by P0
Read Data Register
1/0 1/0
1/0 1/0
1/0 1/0
1/0 Read the contents of the Data Register
pointed to by P0 and RB - RA
Write Data Register
1/0 Write new value to the Data Register
pointed to by P0 and RB - RA
XFR Data Register to Wiper
Counter Register
1/0 Transfer the contents of the Data Register
pointed to by P0 and RB - RA to its
associated Wiper Counter Register
XFR Wiper Counter Register
to Data Register
1
0
1
0
1
0
0
0
1
0
0
1
0
1
0
0
1/0 1/0
1/0 1/0
1/0 1/0
0
0
0
0
1/0 Transfer the contents of the Wiper Counter
Register pointed to by P0 to the Data
Register pointed to by RB - RA
Global XFR Data Registers to
Wiper Counter Registers
0
Transfer the contents of the Data Registers
pointed to by RB - RA of all four pots to their
respective Wiper Counter Registers
Global XFR Wiper Counter
Registers to Data Register
0
Transfer the contents of both Wiper Counter
Registers to their respective data Registers
pointed to by RB - RA of all four pots
Increment/Decrement Wiper
Counter Register
0
0
1/0 Enable Increment/decrement of the Control
Latch pointed to by P0
Note: 1/0 = data is one or zero
FN8173 Rev.4.00
April 17, 2007
Page 9 of 24
X9269
DEVICE DESCRIPTION
Wiper Counter Register (WCR)
are recommended to ensure proper loadings of the DR0
value into the WCR (See Design Considerations
Section).
The X9269 contains two Wiper Counter Registers, one
for each DCP potentiometer. The Wiper Counter
Register can be envisioned as a 8-bit parallel and serial
load counter with its outputs decoded to select one of
256 switches along its resistor array. The contents of the
WCR can be altered in four ways: it may be written
directly by the host via the Write Wiper Counter Register
instruction (serial load); it may be written indirectly by
transferring the contents of one of four associated data
registers via the XFR Data Register instruction (parallel
load); it can be modified one step at a time by the
Increment/Decrement instruction (See Instruction
section for more details). Finally, it is loaded with the
contents of its Data Register zero (DR0) upon power-up.
Data Registers (DR)
Each potentiometer has four 8-bit nonvolatile Data
Registers. These can be read or written directly by the
host. Data can also be transferred between any of the
four Data Registers and the associated Wiper Counter
Register. All operations changing data in one of the data
registers is a nonvolatile operation and will take a
maximum of 10ms.
If the application does not require storage of multiple
settings for the potentiometer, the Data Registers can be
used as regular memory locations for system
parameters or user preference data.
Bit [7:0] are used to store one of the 256 wiper positions
(0~255).
The Wiper Counter Register is a volatile register; that is,
its contents are lost when the X9269 is powered-down.
Although the register is automatically loaded with the
value in DR0 upon power-up, this may be different from
the value present at power-down. Power-up guidelines
Table 4. Wiper counter Register, WCR (8-bit), WCR[7:0]: Used to store the current wiper position (Volatile, V).
WCR7
V
WCR6
V
WCR5
V
WCR4
V
WCR3
V
WCR2
V
WCR1
V
WCR0
V
(MSB)
(LSB)
Table 5. Data Register, DR (8-bit), Bit [7:0]: Used to store wiper positions or data (Nonvolatile, NV).
Bit 7
NV
Bit 6
NV
Bit 5
NV
Bit 4
NV
Bit 3
NV
Bit 2
NV
Bit 1
NV
Bit 0
NV
MSB
LSB
FN8173 Rev.4.00
April 17, 2007
Page 10 of 24
X9269
DEVICE DESCRIPTION
Instructions
– XFR Data Register to Wiper Counter Register –
This transfers the contents of one specified Data Reg-
ister to the associated Wiper Counter Register.
Four of the nine instructions are three bytes in length.
These instructions are:
– XFR Wiper Counter Register to Data Register –
This transfers the contents of the specified Wiper
Counter Register to the specified associated Data
Register.
– Read Wiper Counter Register – read the current
wiper position of the selected potentiometer,
– Global XFR Data Register to Wiper Counter
Register – This transfers the contents of all specified
Data Registers to the associated Wiper Counter Reg-
isters.
– Write Wiper Counter Register – change current
wiper position of the selected potentiometer,
– Read Data Register – read the contents of the
selected Data Register;
– Global XFR Wiper Counter Register to Data
Register – This transfers the contents of all Wiper
Counter Registers to the specified associated Data
Registers.
– Write Data Register – write a new value to the
selected Data Register.
The basic sequence of the three byte instructions is
illustrated in Figure 4. These three-byte instructions
exchange data between the WCR and one of the Data
Registers. A transfer from a Data Register to a WCR is
essentially a write to a static RAM, with the static RAM
controlling the wiper position. The response of the wiper
INCREMENT/DECREMENT COMMAND
The final command is Increment/Decrement (Figure 5
and 6). The Increment/Decrement command is different
from the other commands. Once the command is issued
and the X9269 has responded with an acknowledge, the
master can clock the selected wiper up and/or down in
one segment steps; thereby, providing a fine tuning
to this action will be delayed by t
. A transfer from the
WRL
WCR (current wiper position), to a Data Register is a
write to nonvolatile memory and takes a minimum of t
WR
to complete. The transfer can occur between one of the
four potentiometers and one of its associated registers;
or it may occur globally, where the transfer occurs
between all potentiometers and one associated register.
capability to the host. For each SCL clock pulse (t
)
HIGH
while SDA is HIGH, the selected wiper will move one
resistor segment towards the R terminal. Similarly, for
H
each SCL clock pulse while SDA is LOW, the selected
wiper will move one resistor segment towards the R
terminal.
Four instructions require a two-byte sequence to
complete. These instructions transfer data between the
host and the X9269; either between the host and one of
the data registers or directly between the host and the
Wiper Counter Register. These instructions are:
L
See Instruction format for more details.
FN8173 Rev.4.00
April 17, 2007
Page 11 of 24
X9269
Figure 3. Two-Byte Instruction Sequence
SCL
SDA
0
1
0
1
ID3 ID2 ID1 ID0
S
A2 A1 A0
S
T
A
R
T
A3
A I3 I2 I1
P0
I0
RB RA 0
A
C
K
C
K
T
O
P
External
Address
Instruction
Opcode
Register
Address
Pot/WCR
Address
Device ID
Figure 4. Three-Byte Instruction Sequence
SCL
SDA
0
1
0
1
0
0
S
T
A
R
T
I3
A
C
K
I1
P0
A
C
K
D7 D6 D5 D4 D3 D2 D1 D0
A
C
K
S
T
ID3 ID2
ID0
I2
I0 RB RA
ID1
A3 A2 A1 A0
O
P
External
Address
Device ID
WCR[7:0]
or
Data Register D[7:0]
Instruction
Opcode
Register
Address
Pot/WCR
Address
Figure 5. Increment/Decrement Instruction Sequence
SCL
0
1
0
1
SDA
0
ID3 ID2 ID1 ID0
Device ID
I1
A3 A2 A1 A0
I3
I2
I0
RB RA 0
P0
S
T
A
R
T
A
C
K
A
C
K
I
I
D
E
C
1
S
T
I
D
N
C
1
N
C
2
N
C
n
E
C
n
External
Address
Instruction
Opcode
Pot/WCR
Address
Register
Address
O
P
Figure 6. Increment/Decrement Timing Limits
INC/DEC
CMD
Issued
t
WRID
SCL
SDA
Voltage Out
R
W
FN8173 Rev.4.00
April 17, 2007
Page 12 of 24
X9269
INSTRUCTION FORMAT
Read Wiper Counter Register (WCR)
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
Wiper Position
(Sent by X9269 on SDA)
S
T
A
R
T
S
A
C
K
S
A
C
K
M S
A T
C O
K P
W
C
R
W
C
R
7
W W W W W W
C C C C C C
R R R R R R
0
1
0
1 A3 A2 A1 A0
1
0
0
1
0
0
0
P0
5
4 3 2 1 0
6
Write Wiper Counter Register (WCR)
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
Wiper Position
(Sent by Master on SDA)
S
T
A
R
T
S
A
C
K
S
A
C
K
S S
A T
C O
K P
W
C
W
C
R
7
W W W W W W
C C C C C C
R R R R R R
0
1
0
1 A3 A2 A1 A0
1
0
1
0
0
0
0
P0
R
5
4 3 2 1 0
6
Read Data Register (DR)
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
Wiper Position
(Sent by X9269 on SDA)
S
T
A
R
T
S
A
C
K
S
A
C
K
M S
A T
C O
K P
W
C
W
C
R
7
W W W W W W
C C C C C C
R R R R R R
0
1
0
1
A3 A2 A1 A0
1
0
1
1 RB RA
0
P0
R
5
4 3 2 1 0
6
Write Data Register (DR)
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
Wiper Position
(Sent by Master on SDA)
S
T
A
R
T
S
A
C
K
S
S S
A T
C O
K P
A
C
K
W
C
W
C
R
7
W W W W W W
C C C C C C
R R R R R R
0
1
0
1 A3 A2 A1 A0
1
1
0
0 RB RA
0
P0
R
5
4 3 2 1 0
6
Global XFR Data Register (DR) to Wiper Counter Register (WCR)
S
T
A
R
T
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
S
A
C
K
S S
A
T
C O
K P
0
1
0
1
A3 A2 A1 A0
0
0
0
1
RB RA
0
0
FN8173 Rev.4.00
April 17, 2007
Page 13 of 24
X9269
Global XFR Wiper Counter Register (WCR) to Data Register (DR)
S
T
A
R
T
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
S
A
C
K
S S
A T
C O
K P
HIGH-VOLTAGE
WRITE CYCLE
0
1
0
1
A3 A2 A1 A0
1
0
0
0 RB RA 0
0
Transfer Wiper Counter Register (WCR) to Data Register (DR)
S
T
A
R
T
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
S
A
C
K
S S
A T HIGH-VOLTAGE
C O WRITE CYCLE
P0
K P
0
1
0
1
A3 A2 A1 A0
1
1
1
0 RB RA
0
Transfer Data Register (DR) to Wiper Counter Register (WCR)
S
T
A
R
T
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
S
A
C
K
S S
A T
C O
K P
0
1
0
1
A3 A2 A1 A0
1
1
0
1 RB RA
0
P0
Increment/Decrement Wiper Counter Register (WCR)
S Device Type
Device
Addresses
Instruction
Opcode
DR/WCR
Addresses
Increment/Decrement
(Sent by Master on SDA)
S
A
C
K
S
A
C
K
S
T
O
P
T
A
R
T
Identifier
0
1
0
1 A3 A2 A1 A0
0
0
1
0
0
0
0
P0
I/D I/D
.
.
.
.
I/D I/D
Notes: (1) “MACK”/”SACK”: stands for the acknowledge sent by the master/slave.
(2) “A3 ~ A0”: stands for the device addresses sent by the master.
(3) “X”: indicates that it is a “0” for testing purpose but physically it is a “don’t care” condition.
(4) “I”: stands for the increment operation, SDA held high during active SCL phase (high).
(5) “D”: stands for the decrement operation, SDA held low during active SCL phase (high).
FN8173 Rev.4.00
April 17, 2007
Page 14 of 24
X9269
ABSOLUTE MAXIMUM RATINGS
COMMENT
Temperature under bias.................... -65C to +135C
Storage temperature ......................... -65C to +150C
Voltage on SCL, SDA any address input
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; the functional operation of
the device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
with respect to V ................................. -1V to +7V
SS
V = | (V - V ) |...................................................5.5V
H
L
Lead temperature (soldering, 10 seconds)........ 300C
(10 seconds) .................................................±6mA
I
W
RECOMMENDED OPERATING CONDITIONS
(4)
Temp
Min.
0C
-40C
Max.
+70C
+85C
Device
X9261
Supply Voltage (V
CC
)
Limits
Commercial
Industrial
5V 10%
2.7V to 5.5V
X9261-2.7
POTENTIOMETER CHARACTERISTICS (Over recommended industrial (2.7V) operating conditions unless otherwise stated.)
Limits
Symbol
Parameter
End to End Resistance
End to End Resistance
Min.
Typ.
100
50
Max.
Units
k
Test Conditions
T version
R
TOTAL
R
k
U version
TOTAL
End to End Resistance
Tolerance
±20
%
Power Rating
50
±3
mW
mA
25C, each pot
I
Wiper Current
W
R
R
Wiper Resistance
Wiper Resistance
300
150
I
I
= 3mA @ V
= 3mA @ V
= 3V
= 5V
W
W
W
CC
CC
W
V
Voltage on any R or R Pin
V
V
V
V
= 0V
TERM
H
L
SS
CC
SS
Ref: 1V
Noise
-120
0.4
dBV
%
Resolution
(1)
(2)
(3)
(5)
Absolute Linearity
Relative Linearity
±1
MI
R
R
- R
w(n)(actual)
- [R
w(n)(expected)
(5)
(3)
MI
±0.6
]
w(n) + MI
w(n + 1)
Temperature Coefficient of
300
ppm/C
R
TOTAL
Ratiometric Temp. Coefficient
Potentiometer Capacitances
20
ppm/°C
pF
C /C /C
W
10/10/25
0.1
See Macro model
Device in stand by.
H
L
I
R , R , R Leakage
10.0
µA
al
W
H
L
Vin = V to V
SS CC
Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a
potentiometer.
(2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a
potentiometer. It is a measure of the error in step size.
(3) MI = RTOT / 255 or (R - R ) / 255, single pot
H
L
(4) During power-up V
> V , V , and V .
CC
(5) n = 0, 1, 2, …,255; m =0, 1, 2, …, 254.
H L W
FN8173 Rev.4.00
April 17, 2007
Page 15 of 24
X9269
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)
Limits
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
= 400kHz; V = +6V;
SDA = Open; (for 2-Wire, Active, Read and
I
I
I
V
supply current
(active)
400
µA
f
SCL
CC1
CC2
SB
CC
CC
Volatile Write States only)
V
supply current
1
5
5
mA
f
= 400kHz; V
= +6V;
CC
CC
(nonvolatile write)
SCL
SDA = Open; (for 2-Wire, Active,
Nonvolatile Write State only)
V
current (standby)
A
V
= +6V; V = V or V ; SDA = V ;
IN SS CC CC
CC
CC
(for 2-Wire, Standby State only)
I
I
Input leakage current
Output leakage cur-
Input HIGH voltage
Input LOW voltage
Output LOW voltage
Output HIGH voltage
Output HIGH voltage
10
10
A
A
V
V
V
= V to V
SS CC
LI
IN
= V to V
SS CC
LO
OUT
V
V
V
V
V
V
x 0.7
V
+ 1
IH
CC
-1
CC
x 0.3
V
V
IL
CC
0.4
V
I
I
I
= 3mA
OL
OH
OH
OL
OH
OH
V
V
- 0.8
V
= -1mA, V
CC
= -0.4mA, V
CC
+3V
+3V
CC
CC
- 0.4
V
ENDURANCE AND DATA RETENTION
Parameter
Minimum endurance
Data retention
Min.
Units
100,000
100
Data changes per bit per register
years
CAPACITANCE
Symbol
Test
Input / Output capacitance (SDA)
Input capacitance (SCL, WP, A3, A2, A1 and A0)
Max.
Units
pF
Test Conditions
= 0V
(6)
C
C
8
6
V
IN/OUT
(6)
OUT
V = 0V
IN
pF
IN
POWER-UP TIMING
Symbol
Parameter
Power-up rate
Min.
Max.
50
Units
V/ms
ms
(6)
t V
CC
V
0.2
r
CC
Power-up to initiation of read operation
(7)
t
1
PUR
POWER-UP AND DOWN REQUIREMENTS
The are no restrictions on the power-up or power-down conditions of V
and the voltages applied to the poten-
V , V , V . The
CC
is always more positive than or equal to V , V , and V , i.e., V
tiometer pins provided that V
CC
power-up timing spec is always in effect.
H
L
W
CC
H
L
W
V
CC
A.C. TEST CONDITIONS
Input Pulse Levels
V
x 0.1 to V x 0.9
CC
CC
Input rise and fall times
Input and output timing level
10ns
V
x 0.5
CC
Notes: (6) This parameter is not 100% tested
(7) t and t are the delays required from the time the (last) power supply (V -) is stable until the specific instruction can be issued.
PUR
PUW
CC
These parameters are periodically sampled and not 100% tested.
FN8173 Rev.4.00
April 17, 2007
Page 16 of 24
X9269
EQUIVALENT A.C. LOAD CIRCUIT
5V
3V
867
SPICE Macromodel
1533
R
TOTAL
R
R
L
H
SDA pin
SDA pin
C
C
W
C
L
L
10pF
100pF
100pF
25pF
10pF
R
W
AC TIMING
Symbol
Parameter
Min.
Max.
Units
kHz
ns
f
t
t
t
t
t
t
t
t
t
t
t
t
Clock Frequency
400
SCL
Clock Cycle Time
2500
600
1300
600
600
600
100
30
CYC
Clock High Time
ns
HIGH
LOW
SU:STA
HD:STA
SU:STO
SU:DAT
HD:DAT
R
Clock Low Time
ns
Start Setup Time
ns
Start Hold Time
ns
Stop Setup Time
ns
SDA Data Input Setup Time
SDA Data Input Hold Time
SCL and SDA Rise Time
SCL and SDA Fall Time
ns
ns
300
300
0.9
ns
ns
F
SCL Low to SDA Data Output Valid Time
SDA Data Output Hold Time
s
ns
AA
0
50
1200
0
DH
T
Noise Suppression Time Constant at SCL and SDA inputs
Bus Free Time (Prior to Any Transmission)
A0, A1, A2, A3 Setup Time
ns
I
t
t
t
ns
BUF
ns
SU:WPA
HD:WPA
A0, A1, A2, A3 Hold Time
0
ns
FN8173 Rev.4.00
April 17, 2007
Page 17 of 24
X9269
HIGH-VOLTAGE WRITE CYCLE TIMING
Symbol
Parameter
Typ.
Max.
Units
t
High-voltage write cycle time (store instructions)
5
10
ms
WR
XDCP TIMING
Symbol
Parameter
Min. Max. Units
t
t
Wiper response time after the third (last) power supply is stable
Wiper response time after instruction issued (all load instructions)
5
5
10
10
s
s
WRPO
WRL
SYMBOL TABLE
WAVEFORM
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A
Center Line
is High
Impedance
FN8173 Rev.4.00
April 17, 2007
Page 18 of 24
X9269
TIMING DIAGRAMS
Start and Stop Timing
(START)
(STOP)
t
t
F
R
SCL
t
t
t
SU:STO
SU:STA
HD:STA
t
t
F
R
SDA
Input Timing
t
t
CYC
HIGH
SCL
SDA
t
LOW
t
t
t
BUF
SU:DAT
HD:DAT
Output Timing
SCL
SDA
t
t
DH
AA
FN8173 Rev.4.00
April 17, 2007
Page 19 of 24
X9269
XDCP Timing (for All Load Instructions)
(STOP)
SCL
SDA
VWx
LSB
t
WRL
Write Protect and Device Address Pins Timing
(START)
(STOP)
SCL
...
(Any Instruction)
...
SDA
...
t
t
SU:WPA
HD:WPA
WP
A0, A1
FN8173 Rev.4.00
April 17, 2007
Page 20 of 24
X9269
APPLICATIONS INFORMATION
Basic Configurations of Electronic Potentiometers
+V
R
V
R
RW
I
Three terminal Potentiometer;
Variable voltage divider
Two terminal Variable Resistor;
Variable current
Application Circuits
Noninverting Amplifier
Voltage Regulator
V
+
–
S
V
V
V (REG)
O
317
O
IN
R
1
R
2
I
adj
R
R
1
2
V
= (1+R /R )V
V
(REG) = 1.25V (1+R /R )+I
R
adj 2
O
2
1
S
O
2
1
Offset Voltage Adjustment
Comparator with Hysterisis
R
R
2
1
V
–
+
S
V
V
S
O
100k
–
+
V
O
TL072
10k
R
R
1
2
10k
10k
+12V
V
CC
V
= {R /(R +R )} V (max)
1 1 2 O
UL
RL = {R /(R +R )} V (min)
10k
-12V
L
1
1
2
O
10k
FN8173 Rev.4.00
April 17, 2007
Page 21 of 24
X9269
Application Circuits (continued)
Attenuator
Filter
C
V
+
–
S
R
V
R
R
2
O
1
3
–
+
R
V
O
V
S
R
2
R
4
R = R = R = R = 10k
1
2
3
4
R
1
G
= 1 + R /R
2 1
V
= G V
S
O
O
fc = 1/(2RC)
-1/2 G +1/2
Inverting Amplifier
Equivalent L-R Circuit
R
R
2
1
V
S
R
2
C
1
–
+
V
+
–
S
V
O
R
R
1
Z
IN
V
= G V
S
O
G = - R /R
2
1
3
Z
= R + s R (R + R ) C = R + s Leq
2 2 1 3 1 2
IN
(R + R ) >> R
1
3
2
Function Generator
C
R
R
1
2
–
+
–
+
R
R
}
A
}
B
frequency R , R , C
1
2
amplitude R , R
A
B
FN8173 Rev.4.00
April 17, 2007
Page 22 of 24
X9269
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.020
-
0.30
-
1
2
3
L
0.51
9
SEATING PLANE
A
0.0091
0.5985
0.2914
0.0125
0.32
-
-A-
0.6141 15.20
15.60
7.60
3
h x 45°
D
0.2992
7.40
4
-C-
0.05 BSC
1.27 BSC
-
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
24
24
7
0°
8°
0°
8°
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 4/06
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
FN8173 Rev.4.00
April 17, 2007
Page 23 of 24
X9269
Thin Shrink Small Outline Package Family (TSSOP)
MDP0044
0.25 M C A B
N
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
D
A
(N/2)+1
MILLIMETERS
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
A
A1
A2
b
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
Max
±0.05
PIN #1 I.D.
E
E1
±0.05
+0.05/-0.06
+0.05/-0.06
±0.10
0.20 C B A
2X
1
(N/2)
c
N/2 LEAD TIPS
B
D
TOP VIEW
E
Basic
E1
e
±0.10
Basic
0.05
H
e
L
±0.15
C
L1
Reference
Rev. F 2/07
SEATING
PLANE
NOTES:
0.10 M C A B
b
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
0.10 C
N LEADS
SIDE VIEW
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
SEE DETAIL “X”
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
END VIEW
L1
A2
A
GAUGE
PLANE
0.25
L
A1
0° - 8°
DETAIL X
© Copyright Intersil Americas LLC 2005-2007. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8173 Rev.4.00
April 17, 2007
Page 24 of 24
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