ZSSC3138BA1B [RENESAS]
Sensor Signal Conditioner for Ceramic Sensor Applications;型号: | ZSSC3138BA1B |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | Sensor Signal Conditioner for Ceramic Sensor Applications |
文件: | 总26页 (文件大小:424K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ZSSC3138
Sensor Signal Conditioner for
Ceramic Sensor Applications
Datasheet
Brief Description
Benefits
The ZSSC3138 is a member of the ZSSC313x
product family of CMOS integrated circuits designed
for automotive/ industrial sensor applications. All
family members are well suited for highly accurate
amplification and sensor-specific correction of
resistive bridge sensor signals. An internal 16-bit
RISC microcontroller running a correction algorithm
compensates sensor offset, sensitivity, temperature
drift, and non-linearity of the connected sensor
element. The required calibration coefficients are
stored by the one-pass calibration procedure on chip
(EEPROM).
•
Family approach offers the best fitting IC selec-
tion to build cost-optimized applications
•
•
•
No external trimming components required
Low number of external components needed
PC-controlled configuration and one-pass/
end-of-line calibration via I²C™* or ZACwire™
interface: simple, cost efficient, quick, and precise
•
•
High accuracy (0.25% FSO** @ -25 to +85°C;
0.5% FSO @ -40 to +125°C)
Optimized for automotive/industrial environments
due to robust protection circuitries, excellent
electromagnetic compatibility and AEC-Q100
qualification
The ZSSC3138 offers a maximum analog gain of
420 and two offset compensation features. These fit
perfectly with the requirements of ceramic thick-film-
based sensor elements as well as strain gauges.
The high amplification in combination with the offset
compensation offers the capability to set up ceramic
thick-film-based sensor applications without laser
trimming, which leads to better long-term stability.
Available Support
•
•
•
Evaluation Kits
Application Notes
Mass Calibration System
Physical Characteristics
Features
•
•
Supply voltage 4.5 to 5.5 V
•
Adjustable to nearly all resistive bridge sensor
types, analog gain of 420, maximum overall gain
of 1680
Operation temperature: -40°C to +125°C
(-40°C to +150°C extended temperature range
depending on product version)
•
•
•
•
•
Enhanced sample rate: 7.8 kHz maximum
High ADC resolution 15/16 bit
•
Available in RoHS-compliant JEDEC-SSOP14
package or delivery as die
Safety functionality sensor connection
Internal temperature compensation
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
ZSSC3138 Minimum Application Requirements
•
Output options: ratiometric analog voltage output
(5 - 95% maximum, 12.4 bit resolution) or
ZACwireTM (digital One-Wire Interface (OWI))
VCC
Sensor
Module
•
•
•
•
•
Sensor biasing by voltage
High voltage protection up to 33 V
Supply current: 5.5mA maximum
Reverse polarity and short circuit protection
OUT
ZSSC3138
Wide operation temperature range between
-40 to +150°C
•
Traceability by user-defined EEPROM entries
GND
*
Note: I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
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January 25, 2016
ZSSC3138
Sensor Signal Conditioner for
Ceramic Sensor Applications
Datasheet
ZSSC3138 Application Example
Out / OWI
GND
C2
100nF
8
7
6
5
4
3
2
1
VSSE
AOUT
VBN
VDDE
VDD
n.c.
VSUPP
+4.5V to +5.5V
C3
47nF
9
Sensor Bridge
10
11
12
13
14
VBR_B
VBP
SCL
SCL
SDA
Serial Interface
SDA
VBR_T
N.C.
VSSA
VDDA
C4
C5
C1
100nF
Ordering Information (See data sheet section 8 for complete delivery options.)
Product Sales Code
Description
Package
ZSSC3138BE1
ZSSC3138 die – tested; temperature range -40 to +150°C
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
ZSSC3138BA1
ZSSC3138BE2
ZSSC3138BA2
ZSSC313xKITV1.1
ZSSC3138 die – tested; temperature range -40 to +125°C
ZSSC3138 SSOP14 – temperature range -40 to +150°C
ZSSC3138 SSOP14 – temperature range -40 to +125°C
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
Tube: add “T” to sales code
Tape & Reel: add “R”
Tube: add “T” to sales code
Tape & Reel: add “R”
ZSSC313x Evaluation Kit, version 1.1, including Evaluation
Board, ZSSC3138 IC samples, USB cable
Kit
ZSSC313x Mass
Calibration System V1.1
Modular Mass Calibration System (MSC) for ZSSC313x
including MCS boards, cable, connectors
Kit
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January 25, 2016
Contents
1
Electrical Characteristics...............................................................................................................................5
1.1. Absolute Maximum Ratings....................................................................................................................5
1.2. Operating Conditions..............................................................................................................................5
1.3. Electrical Parameters .............................................................................................................................6
1.3.1. Supply Current and System Operation Conditions..........................................................................6
1.3.2. Analog Front-End (AFE) Characteristics .........................................................................................6
1.3.3. Temperature Measurement .............................................................................................................6
1.3.4. A/D Conversion................................................................................................................................6
1.3.5. Sensor Check...................................................................................................................................7
1.3.6. DAC and Analog Output ..................................................................................................................7
1.3.7. System Response............................................................................................................................8
1.4. Interface Characteristics and EEPROM.................................................................................................9
1.4.1. I²CTM Interface..................................................................................................................................9
1.4.2. ZACwire™ One-Wire Interface (OWI) .............................................................................................9
1.4.3. EEPROM..........................................................................................................................................9
Circuit Description .......................................................................................................................................10
2.1. Signal Flow ...........................................................................................................................................10
2.2. Application Modes ................................................................................................................................11
2.3. Analog Front-End (AFE).......................................................................................................................11
2.3.1. Programmable Gain Amplifier (PGA).............................................................................................12
2.3.2. Offset Compensation .....................................................................................................................12
2.3.3. Measurement Cycle .......................................................................................................................13
2.3.4. Analog-to-Digital Converter............................................................................................................14
2.4. Temperature Measurement..................................................................................................................16
2.5. System Control and Conditioning Calculation......................................................................................16
2.5.1. General Working Modes ................................................................................................................16
2.5.2. Startup Phase ...............................................................................................................................17
2.5.3. Conditioning Calculation ................................................................................................................17
2.6. Analog or Digital Output .......................................................................................................................18
2.7. Serial Digital Interface ..........................................................................................................................18
2.8. Failsafe Features..................................................................................................................................18
2.9. High Voltage, Reverse Polarity, and Short Circuit Protection ..............................................................19
Application Circuit Examples.......................................................................................................................20
Pin Configuration and Package...................................................................................................................21
ESD Protection............................................................................................................................................22
Quality and Reliability..................................................................................................................................22
Customization..............................................................................................................................................22
Ordering Information ...................................................................................................................................22
2
3
4
5
6
7
8
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January 25, 2016
9
Related Documents.....................................................................................................................................23
10 Glossary ......................................................................................................................................................24
11 Document Revision History.........................................................................................................................25
List of Figures
Figure 2.1 Block Diagram of the ZSSC3138...................................................................................................10
Figure 2.2 Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement........14
Figure 3.1 Application with On-Chip Diode Temperature Sensor...................................................................20
Figure 4.1 ZSSC3138 SSOP14 Pin Diagram .................................................................................................21
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 3.1
Table 4.1
Absolute Maximum Ratings.............................................................................................................5
Operating Conditions .......................................................................................................................5
Electrical Parameters.......................................................................................................................6
Interface Characteristics and EEPROM ..........................................................................................9
Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges .........................12
Extended Analog Zero Compensation Ranges (XZC) ..................................................................13
ADC Resolution versus Output Resolution and Sample Rate.......................................................16
External Components for Application Circuit Examples ................................................................20
Pin Configuration and Definition ....................................................................................................21
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January 25, 2016
1
Electrical Characteristics
1.1. Absolute Maximum Ratings
Parameters apply in operation temperature range and without time limitations.
Table 1.1
No.
Absolute Maximum Ratings
Parameter
Symbol
Conditions
Min
Max
Unit
1.1.1
Supply voltage 1)
VDDEAMR
To VSSE, refer to
section 3 for application
circuits
-33
33
VDC
1.1.2
1.1.3
Potential at AOUT pin 1)
Analog supply voltage 1)
VOUT
Referenced to VSSE
-33
33
VDC
VDC
VDDAAMR
Referenced to VSSA,
VDDE - VDDA < 0.35V
-0.3
6.5
1.1.4
Voltage at all analog and
digital IO pins
VA_IO
VD_IO
Referenced to VSSA
-0.3
-55
VDDA + 0.3
150
VDC
1.1.5
Storage temperature
TSTG
°C
1)
Refer to the ZSSC313x High Voltage Protection Description for specification and detailed conditions.
1.2. Operating Conditions
All voltages are referenced to VSSA.
Table 1.2
No.
Operating Conditions
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.2.1
Ambient temperature 1) 2)
TAMB_TQE
Extended Temperature
Range (TQE)
-40
150
°C
TAMB_TQA
Advanced-Performance
Temperature Range
(TQA)
-40
125
85
°C
°C
TAMB_TQI
Best-Performance
Temperature Range (TQI)
-25
1.2.2
1.2.3
Supply voltage
Bridge resistance 3) 4)
VDDE
RBR
4.5
2
5.0
5.5
25
VDC
kΩ
1)
2)
3)
4)
Maximum operation temperature range depends on product version (refer to section 8).
See the temperature profile description in the ZSSC313x Dice Package Document.
No measurement in mass production, parameter is guaranteed by design and/or quality observation.
Symmetric behavior and identical electrical properties (especially the low pass characteristic) of both sensor inputs of the ZSSC3138 are required.
Unsymmetrical conditions of the sensor and/or external components connected to the sensor input pins of the ZSSC3138 can generate a failure in
signal operation.
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January 25, 2016
1.3. Electrical Parameters
All parameter values are valid under the operating conditions specified in section 1.2 (special definitions
excluded). All voltages referenced to VSSA.
Note: See important notes at the end of Table 1.3.
Table 1.3
Electrical Parameters
No.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3.1. Supply Current and System Operation Conditions
1.3.1.1 Supply current
IS
Without bridge and load
current, fOSC ≤ 3 MHz
5.5
4
mA
1.3.1.2 Oscillator frequency 1)
fOSC
Adjustment guaranteed for
whole temperature range
(TAMB_TQE)
2
3
MHz
1.3.2. Analog Front-End (AFE) Characteristics
1.3.2.1 Input span
VIN_SP
Analog gain: 105 to 2.8
Analog gain: 420 to 2.8
8
1
275
275
10
mV/V
mV/V
nA
1.3.2.2 Parasitic differential input
IIN_OFF
Temperature range
TAMB_TQE
-10
1)
offset current
Temperature range
TAMB_TQI
-2
2
nA
1.3.2.3 Common mode
input range
VIN_CM
Depends on gain adjust;
XZC off (refer to section
2.3.1)
0.29
0.65
VDDA
1.3.2.4 Analog offset
compensation range
Depends on gain
adjustment; refer to
section 2.3.2
-300
300
% VIN_SP
1.3.3. Temperature Measurement
(Refer to section 2.4.)
1.3.3.1 Internal temperature diode
sensitivity
STTSI
Raw values,
without conditioning
700
13
2700
ppm FS
/ K
1.3.4. A/D Conversion
1.3.4.1 A/D resolution 1)
1.3.4.2 DNL 1)
rADC
16
Bit
DNLADC
rADC=13bit, fOSC=3MHz,
best fit, complete AFE,
range according to 1.3.4.5
0.95
LSB
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January 25, 2016
No.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3.4.3 INL TQA
INLADC
rADC=13bit, fOSC=3MHz,
best fit, complete AFE,
range according to 1.3.4.5
4
LSB
1.3.4.4 INL TQE
INLADC_TQE rADC=13bit, fOSC=3MHz,
best fit, complete AFE,
5
LSB
range according to 1.3.4.5,
temperature range TAMB_TQE
1.3.4.5 ADC input range
1.3.5. Sensor Check
VADC_IN
0.1
0.9
VDDA
1.3.5.1 Sensor connection loss
1.3.5.2 Sensor input short
RSCC_min
Detection threshold
100
0
kΩ
RSSC_short
Short detection
guaranteed
50
Ω
1.3.5.3 Sensor input no short
RSSC_pass
Corresponds with
minimum sensor output
resistance
1000
Ω
1.3.6. DAC and Analog Output
1.3.6.1 D/A resolution
rDAC
Analog output, 10-90%
12
Bit
mA
1.3.6.2 Output current sink and
source for VDDE=5V
IOUT_SRC/SINK VOUT: 5-95%, RLOAD ≥ 2kΩ
VOUT: 10-90%, RLOAD ≥1kΩ
2.5
5
mA
1.3.6.3 Short circuit current
1.3.6.4 Output signal range
IOUT_max
To VDDE/VSSE 2)
With RLOAD ≥ 2kΩ
With RLOAD ≥ 1kΩ
CLOAD < 50nF
-25
0.05
0.1
25
mA
VOUT_RANGE
0.95
0.90
VDDE
VDDE
V/µs
Ω
1.3.6.5 Output slew rate 1)
SROUT
0.1
1.3.6.6 Output resistance in
diagnostic mode
ROUT_DM
Diagnostic range:
<4 to 96>%, RLOAD ≥ 2kΩ
<8 to 92>%, RLOAD ≥ 1kΩ
82
1.3.6.7 Load capacitance 1)
CLOAD
C3 + CLOAD
150
nF
(refer to section 3)
1.3.6.8 DNL
DNLOUT
INLOUT
-1.5
-5
1.5
5
LSB
LSB
LSB
1.3.6.9 INL TQA
1.3.6.10 INL TQE
Best fit, rDAC=12bit
INLOUT_TQE Best fit, rDAC=12bit,
temperature range TAMB_TQE
-8
8
1.3.6.11 Output leakage current
at 150°C
IOUT_LEAK
In case of power or
ground loss
-25
25
µA
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January 25, 2016
No.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3.7. System Response
1) 3)
1.3.7.1 Startup time
tSTARTUP
1-step ADC, fOSC=3MHz
rADC=14bit)
35
ms
(To 1st output, ROM check
disabled)
2-step ADC, fOSC=3MHz,
rADC=14bit)
5
ms
ms
1.3.7.2 Response time 1)
tRESPONSE
1-step ADC, fOSC=4MHz,
rADC=13bit
8.7
13.1
384
17.4
(100% input step; refer to
Table 2.3)
2-step ADC, fOSC=4MHz,
rADC=13bit
256
512
µs
1.3.7.3 Bandwidth 1)
BW
1-step ADC
2-step ADC
200
7.8
Hz
(In comparison to an
equivalent analog SSC.
Refer to Table 2.3)
kHz
1.3.7.4 Analog output noise
VNOISE_PP
Shorted inputs
10
3
mV
mV
1)
peak-to-peak
bandwidth ≤ 10kHz
1.3.7.5 Analog output noise
RMS 1)
VNOISE_RMS Shorted inputs
bandwidth ≤ 10kHz
1.3.7.6 Ratiometricity error
RE
Maximum error for
1000
ppm
VDDE=5V to 4.5/5.5V
1.3.7.7 Overall failure 4)
FOVERALL_TQI fOSC≤3MHz, rADC=13bit,
0.25
(0.1)
% FS
temperature range TAMB_TQI
Deviation from ideal line
including INL, gain, offset
and temperature errors.
FOVERALL_TQA fOSC≤3MHz, rADC=13bit,
0.5
% FS
% FS
temperature range TAMB_TQA
(0.25)
No sensor-caused effects.
FOVERALL_TQE fOSC≤3MHz, rADC=13bit,
1.0
Failure for digital readout
shown in parenthesis.
temperature range TAMB_TQE
(0.5)
1)
2)
3)
4)
No measurement in mass production, parameter is guaranteed by design and/or quality observation.
Minimum output voltage to VDDE or maximum output voltage to VSSE.
Depends on resolution and configuration. Start routine begins approximately 0.8ms after power on.
If XZC is active, additional overall failure of 25ppm/K for XZC=31 maximum. Failure decreases linearly for XZC<31.
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January 25, 2016
1.4. Interface Characteristics and EEPROM
Table 1.4
Interface Characteristics and EEPROM
No.
Parameter Symbol
Conditions
Min
Typ
Max
Unit
1.4.1. I²CTM Interface
(Refer to the ZSSC313x Functional Description for timing details)
1.4.1.1 I²C voltage level HIGH
VI²C,HIGH
0.8
VDDA
VDDA
VDDA
pF
1.4.1.2 I²C voltage level LOW 1)
1.4.1.3 Slave output level LOW 1)
1.4.1.4 SDA load capacitance 1)
1.4.1.5 SCL clock frequency 1)
1.4.1.6 Internal pull-up resistor 1)
VI²C,LOW
0.2
0.15
400
400
100
VI²C,LOW_OUT Open drain, IOL<2mA
CSDA
fI²C
fOSC≥2MHz
kHz
RI²C,PULLUPI
25
kΩ
1.4.2. ZACwire™ One-Wire Interface (OWI)
(Refer to the ZSSC313x Functional Description for timing details)
1.4.2.1 OWI voltage level HIGH 1)
1.4.2.2 OWI voltage level LOW 1)
1.4.2.3 Slave output level LOW 1)
1.4.2.4 Start window 1)
VOWI,HIGH
0.75
VDDA
VDDA
VDDA
ms
VOWI,LOW
0.2
0.15
455
VOWI,LOW_OUT Open drain, IOL<2mA
tOWI,STARTWIN At fOSC=3MHz
96
175
1.4.3. EEPROM
1.4.3.1 Ambient temperature for
EEPROM programming 1)
TAMB_EEP
-40
150
°C
1.4.3.2 Write cycles 1)
nEEP_WRI
Write <= 85°C
Write up to 150°C
≤175°C
100 000
100
8 * 108
1.4.3.3 Read cycles 1) 2)
1.4.3.4 Data retention 1) 3)
nEEP_READ
tEEP_RETENTION 1300h at 175°C
( = 3000h at 150°C
15
a
+ 27000h at 125°C
+ 100000h at 55°C)
1.4.3.5 Programming time 1)
tEEP_WRI
Per written word
12
ms
1)
2)
3)
No measurement in mass production, parameter is guaranteed by design and/or quality observation.
Valid for the dice. Note that the package and the temperature version causes additional restrictions.
Over lifetime and valid for the dice. Use the calculation sheet IDT Temperature Profile Calculation Sheet for temperature stress calculation. Note that
the package and the temperature version causes additional restrictions.
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January 25, 2016
2
Circuit Description
2.1. Signal Flow
The ZSSC3138’s signal path is partly analog and partly digital. The analog section is differential – this means the
differential bridge sensor signal is internally handled via two signal lines that are rejected symmetrically around an
internal common mode potential (analog ground = VDDA/2).
As a result of the differential design, it is possible to amplify positive and negative input signals that are within the
common mode range of the signal input.
Figure 2.1
Block Diagram of the ZSSC3138
ZACwire
™
Digital
Data I/O
EEPROM
RAM
I2C™
*
Analog
Output
PGA
TS
ADC
CMC
DAC
BAMP
ROM
Analog Domain
Digital Domain
ZSSC3138
* Note: I2C™ is a trademark of NXP.
PGA
Programmable Gain Amplifier
TS
On-chip Temperature Sensor (pn-junction)
Multiplexer
MUX
ADC
Analog-to-Digital Converter
Calibration Microcontroller
CMC
ROM
RAM
EEPROM
DAC
Read-Only Memory for Correction Formula and Algorithm
Volatile Memory for Calibration Parameters and Configuration
Non-volatile Memory for Calibration Parameters and Configuration
Digital-to-Analog Converter
BAMP
Output Buffer Amplifier
The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The
multiplexer (MUX) transmits the signals from either the bridge sensor or the internal temperature sensor to the
analog-to-digital converter (ADC) in a specific sequence. The ADC converts these signals into digital values.
10
January 25, 2016
The digital signal conditioning is processed by the calibration microcontroller (CMC). It is based on a correction
formula that uses sensor-specific coefficients determined during calibration. The formula is located in ROM, and
the sensor-specific coefficients are stored in EEPROM. Depending on the programmed output configuration, the
conditioned sensor signal is output as an analog signal, or alternatively can be readout via a digital serial interface
(I²C™ or ZACwire™). The configuration data and the correction parameters must also be programmed into the
EEPROM via the digital interfaces.
2.2. Application Modes
For each application, a configuration set must be established by programming the on-chip EEPROM for the
following modes:
•
Sensor channel
. Input range: The gain adjustment of the analog front-end (AFE) with respect to the maximum sensor
signal span and the zero point of the A/D conversion must be selected.
. Extended analog offset compensation (XZC): If required, this compensates large sensor offsets; e.g., if
the sensor offset voltage is near to or larger than the sensor span.
. Resolution/response time: The A/D converter must be configured for resolution. The ADC order (first or
second order) must also be configured. These settings influence the sampling rate and the signal
integration time, and thus, the noise immunity.
•
Temperature
. Temperature measurement
2.3. Analog Front-End (AFE)
The analog front-end (AFE) consists of the three-stage programmable gain amplifier (PGA), the multiplexer
(MUX), and the analog-to-digital converter (ADC).
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January 25, 2016
2.3.1.
Programmable Gain Amplifier (PGA)
Table 2.1 shows the adjustable gains, the sensor signal spans, and the valid common mode range.
Table 2.1
Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges
Input Common Mode Range
VIN_CM [% VDDA] 2)
XZC = Off
PGA Gain
aIN
Maximum Span
VIN_SP [mV/V] 1)
XZC = On
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
45 to 55
Not applicable
420
280
210
140
105
70
1.8
2.7
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
29 to 65
32 to 57
3.6
5.4
7.1
10.7
14.3
21.4
28.5
53.75
80
52.5
35
26.3
14
9.3
7
107
267
2.8
1)
2)
Recommended maximum internal signal range is 75% of supply voltage.
Span is calculated by the following formula: Span = 0.75 (VBR_T – VBR_B) / Gain.
Refer to section 2.3.2 for an explanation of the extended analog zero compensation (XZC).
2.3.2.
Offset Compensation
The ZSSC3138 processes a sensor-offset correction during the digital signal conditioning by the calibration
microcontroller (CMC).
The ZSSC3138 also supports an extended analog zero compensation (XZC) for large offsets up to a maximum of
approximately 300% of signal span, depending on the gain adjustment (Table 2.2). This prevents overdriving the
analog signal path in the case of a large sensor offset by adding a compensation voltage to the second
amplification stage.
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January 25, 2016
Table 2.2
PGA Gain
Extended Analog Zero Compensation Ranges (XZC)
Maximum Span
VIN_SP [mV/V]
Offset Shift / XZC Step
Maximum Offset Shift
[mV/V]
Maximum Shift (XZC =
±31)
aIN
[% VIN_SP]
[% VIN_SP
388%
237%
388%
237%
388%
237%
388%
237%
161%
388%
237%
161%
26%
]
420
280
210
140
105
70
1.8
2.7
12.5 %
7.6 %
7.8
7.1
15.5
14.2
31
3.6
12.5 %
7.6 %
5.4
7.1
12.5 %
7.6 %
10.7
14.3
21.4
28.5
53.75
80
28
52.5
35
12.5 %
7.6 %
32
57
26.3
14
5.2 %
52
12.5 %
7.6 %
194
189
161
72
9.3
7
107
267
5.2 %
2.8
0.83 %
2.3.3.
Measurement Cycle
The measurement cycle is controlled by the CMC. Depending on EEPROM settings, the multiplexer (MUX)
selects the following input signals in a defined sequence:
•
•
•
Pre-amplified bridge sensor signal
Temperature sensor signal
Internal offset of the input channel (VOFF
)
The cycle diagram in Figure 2.2 shows the basic structure of the measurement cycle. After power-on, the startup
routine is processed, which performs all required measurements to expedite acquiring an initial valid conditioned
sensor output. After the startup routine, the normal measurement cycle runs.
13
January 25, 2016
Figure 2.2
Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement
Measurement Cycle with Bridge Signal Output
CTAZ CT BRAZ
CFGAPP:BRCNT = 0
Startup
(1 bridge sensor signal measurement per special measurement)
12
BR CTAZ BR
CT
BR
CMV
BR SSCP BR SSCN BR BRAZ
Measurements
per Cycle
Measurement Cycle
Measurement Cycle Phases
Main Signals Measurement
Safety Functions Measurement *
Analog Output Updated
Bridge Sensor
BR
Calibration Temperature
Measurement
Sensor Short Check
Positive-Biased Measurement
Sensor Common Mode Voltage
Measurement
Bridge Sensor Signal
CT
SSCP
SSCN
CMV
Measurement
Bridge Sensor
BRAZ
Calibration Temperature
Auto-Zero Measurement
Sensor Short Check
Negative-Biased Measurement
CTAZ
* Not available for all ZSSC313x products. See Table 1.1
in the ZSSC313x Functional Description.
Auto-Zero Measurement
2.3.4.
Analog-to-Digital Converter
The A/D converter is implemented using full-differential switched-capacitor technique.
•
Programmable ADC resolutions are rADC=<13, 14>bit. The ZSSC3138 supports <15, 16>bit resolution with
range zooming.
The A/D conversion is integrating, inherently monotone, and insensitive to short and long term instability of the
clock frequency. The conversion time tADC depends on the desired resolution and can be roughly calculated by
equation (1):
2rADC
tADC
=
f
(1)
OSC
2
Where
rADC
fOSC
Resolution of A/D conversion
Frequency of internal oscillator (refer to 1.3.1)
14
January 25, 2016
The ZSSC3138 supports a high sample rate ADC mode (2-step conversion) with the advantage of a much shorter
conversion time but with the drawback of a lower noise immunity caused by the shorter signal integration time.
The conversion time tADC,2step in this mode is roughly calculated by equation (2):
2(r
ADC +3 2
)
tADC,2-step
=
f
(2)
OSC
2
Refer to the ZSSC313x Bandwidth Calculation Sheet for a detailed calculation of sampling time and bandwidth.
The result of the A/D conversion is a relative counter result Z corresponding to the following equation:
VADC_DIFF
r
ADC
Z = 2
⋅(
− RS)
(3)
VADC_REF
Where
rADC
Resolution of A/D conversion
VADC_DIFF
VADC_REF
RS
Differential ADC input voltage
ADC reference voltage (VVBR_T-VVBR_B or VVDDA-VVSSA, if BRREF=1)
Digital ADC Range Shift (RS = 1/16, 1/8, 1/4, 1/2; controlled by the EEPROM contents)
With the RS value, a sensor input signal can be shifted in the optimal input range of the ADC.
The condition required for ensuring the specified accuracy, stability, and non-linearity parameters of the analog
front-end is that the differential ADC input voltage VADC_DIFF does not exceed the range of 10% to 90% of the ADC
reference voltage VADC_REF. This requirement must be met for the whole temperature range and for all sensor
tolerances.
15
January 25, 2016
Table 2.3
ADC Resolution versus Output Resolution and Sample Rate
Output Resolution 1) Sample Rate 2)
ADC Adjustment
Averaged Bandwidth 2)
ADC
Sample
Rate Mode
rADC
[bit]
Digital
[bit]
Analog
[bit]
fOSC=3MHz
[Hz]
fOSC=4MHz
[Hz]
fOSC=3MHz
[Hz]
fOSC=4MHz
[Hz]
13
14
15
16
13
14
15
16
13
14
14
14
13
14
14
14
12
12
12
12
12
12
12
12
345
178
460
237
130
67
172
89
Normal
High
90
120
34
45
45
61
17
23
5859
3906
2930
1953
7813
5208
3906
2604
2203
1469
1101
734
2937
1958
1468
979
1)
2)
Output resolution does not exceed ADC resolution. PGA gain should be such that the differential ADC input signal uses at least 50% of ADC input
range to ensure maximum achievable output resolution.
Refer to the ZSSC313x Bandwidth Calculation Sheet for a detailed calculation of sampling time and bandwidth.
2.4. Temperature Measurement
The ZSSC3138 supports acquiring temperature data needed for conditioning of the sensor signal using an
internal pn-junction temperature sensor.
Refer to the ZSSC313x Functional Description for a detailed explanation of temperature sensor adaptation and
adjustment.
2.5. System Control and Conditioning Calculation
The system control supports the following tasks/features:
•
•
•
Managing the startup sequence
Controlling the measurement cycle regarding to the EEPROM-stored configuration data
Sensor signal conditioning (calculation of the 16-bit correction for each measurement signal using the
EEPROM-stored conditioning coefficients and the ROM-based formulas)
Processing communication requests received via the digital interfaces
Performing failsafe tasks and message detected errors by setting diagnostic states
•
•
2.5.1.
General Working Modes
ZSSC3138 supports three different working modes:
•
•
•
Normal Operation Mode (NOM) – for continuous processing of signal conditioning
Command Mode (CM) – for calibration and access to all internal registers
Diagnostic Mode (DM) – for failure messages
16
January 25, 2016
1
2.5.2.
Startup Phase
After power-on, the startup phase is processed, which includes
•
Internal supply voltage settling including reset of the circuitry by the power-on reset block (POR).
Refer to the ZSSC313x High Voltage Protection Description for power-on/off thresholds.
Duration (beginning with VVDDA-VVSSA=0V): 500µs to 2ms; AOUT: high impedance.
•
•
System start and configuration, EEPROM readout, and signature check.
Duration: ~200µs; AOUT: lower diagnostic range (LDR).
Processing the measurement cycle start routine.
Duration: 5x A/D conversion time; AOUT behavior depends on configured one-wire communication mode
(refer to section 2.6):
OWIANA or OWIDIS AOUT: lower diagnostic range (LDR)
OWIWIN or OWIENA AOUT: tri-state
If an error is detected during the startup phase, the Diagnostic Mode (DM) is activated and the analog output at
the AOUT pin remains in the lower diagnostic range.
After the startup phase, the continuous running measurement and sensor signal conditioning cycle is started, and
analog or digital output of the conditioned sensor signal is activated. If the one-wire communication mode
OWIWIN is selected, the OWI startup window expires before analog output is available.
2.5.3.
Conditioning Calculation
The digitalized value for the bridge signal is processed with a conditioning formula to remove offset and
temperature dependency and to compensate nonlinearity up to 3rd order. The result is a non-negative 15-bit value
for the measured bridge sensor signal in the range [0; 1). This value is available for readout via I²C or OWI
communication. For the analog output, the value is clipped to the programmed output limits.
Note: The extent of signal deviation that can be compensated by the conditioning calculation depends on the
specific sensor signal characteristics. For a rough estimation, assume the following: offset compensation
and gain correction are not limited. Notice that resolution of the digitally gained signal is determined by
the ADC resolution in respect to the dynamic input range used. The temperature correction includes first
and second order terms and should be adequate for all practically relevant cases. The non-linearity
correction of the sensor signal is possible for second-order up to about 30% FS regarding ideal fit and for
third-order up to about 20% FS. Overall, the conditioning formula applied is able to reduce the non-
linearity of the sensor signal by a factor of 10.
1
All timing values are roughly estimated for an oscillator frequency fOSC=3MHz and are proportional to that frequency.
17
January 25, 2016
2.6. Analog or Digital Output
The AOUT pin is used for analog output and for one-wire communication (OWI). The latter can be used for digital
readout of the conditioned sensor signal and for end-of-line sensor module calibration. The ZSSC3138 supports
different modes for the analog output in interaction with OWI communication:
•
•
OWIENA:
OWIWIN:
Analog output is deactivated; OWI readout of the signal data is enabled.
Analog output starts after the startup phase and after the OWI startup window if OWI
communication is not initiated; OWI communication for configuration or for end-of-line
calibration can be started during the OWI startup window (maximum ~500ms) by sending the
START_CM command.
•
•
OWIANA:
OWIDIS:
Analog output starts after the startup phase; OWI communication for configuration or for end-
of-line calibration can be started during the OWI startup window (maximum ~500ms) by
sending the START_CM command; for command transmission, the driven analog output at
the AOUT pin must be overwritten by the external communication master (AOUT drive
capability is current-limited).
Analog output starts after the startup phase; OWI readout of the signal data is disabled.
The analog output signal is driven by an offset compensated, rail-to-rail output buffer that is current-limited to
prevent damage to the ZSSC3138 from a short circuit between the analog output and power supply or ground.
Output resolution of at least 12-bit in the range of 10% to 90% FS is ensured by a 12.4-bit resistor string DAC.
2.7. Serial Digital Interface
The ZSSC3138 includes a serial digital I²CTM interface and a ZACwireTM interface for one-wire communication
(OWI). The digital interfaces allow configuration and calibration of the sensor module. OWI communication can be
used to perform an end-of-line calibration via the analog output pin AOUT of a completely assembled sensor
module. The interfaces also provide the readout of the conditioned sensor signal data during normal operation.
Refer to the ZSSC313x Functional Description for a detailed description of the serial interfaces and the
communication protocols.
2.8. Failsafe Features
The ZSSC3138 detects various failures. When a failure is detected, Diagnostic Mode (DM) is activated. DM is
indicated by setting the output pin AOUT to the Lower Diagnostic Range (LDR). When using digital serial
communication protocols (I²C™ or OWI) to read conditioning results data, the error status is indicated by a
specific error code.
A watchdog timer controls the proper operation of the microcontroller. The operation of the internal oscillator is
monitored by an oscillator-failure detection circuit. EEPROM and RAM content are checked when accessed.
Control registers are parity protected.
The sensor connection is checked with regard to broken wires or short circuits (sensor connection check, sensor
short check).
Refer to the ZSSC313x Functional Description for a detailed description of failsafe features and methods of error
indication.
18
January 25, 2016
2.9. High Voltage, Reverse Polarity, and Short Circuit Protection
The ZSSC3138 is designed for 5V power supply operation.
The ZSSC3138 and the connected sensor are protected from overvoltage and reverse polarity damage by an
internal supply voltage limiter. The analog output AOUT can be connected (short circuit, overvoltage, and reverse
polarity) with all potentials in the protection range under all potential conditions at the pins VDDE and VSSE.
To guarantee this operation, all external components (see application circuit in section 3) are required. The
protection is not time-limited.
Refer to the ZSSC313x High Voltage Protection Description for a detailed description of protection cases and
conditions.
19
January 25, 2016
3
Application Circuit Examples
The application circuits contain external components that are needed for overvoltage, reverse polarity, and short
circuit protection.
Note:
Table 3.1
Symbol
C1
Also check the ZSSC313x application notes for application examples and board layout.
External Components for Application Circuit Examples
Component
Capacitor
Capacitor
Capacitor
Min
100
100
4
Typ 2)
Max
Unit Remarks
470
nF
nF
C2
C3 1)
47
160
10
nF
Value includes the load capacitor C3 and the
capacitance of the connection cable.
C4, C5 1)
Capacitor
0
nF
Recommended to increase EMI immunity.
Value includes the filter capacitor C4 and C5
and the sensor connection line capacitance.
1)
2)
Increasing capacitors C3, C4, and C5 increases EMI immunity.
Dimensioning is only for example and must be adapted to the requirements of the application.
Figure 3.1
Application with On-Chip Diode Temperature Sensor
Out / OWI
GND
C2
100nF
8
7
6
5
4
3
2
1
VSSE
AOUT
VBN
VDDE
VDD
n.c.
VSUPP
+4.5V to +5.5V
C3
47nF
9
Sensor Bridge
10
11
12
13
14
VBR_B
VBP
SCL
SCL
SDA
Serial Interface
SDA
VBR_T
n.c.
VSSA
VDDA
C4
C5
C1
100nF
20
January 25, 2016
4
Pin Configuration and Package
Table 4.1
Pin Configuration and Definition
Pin No Pin Name Description
Remarks
1
2
3
4
5
6
7
8
9
VDDA
VSSA
SDA
Positive Analog Supply Voltage
Negative Analog Supply Voltage
I²C™ Serial Data
Internal analog supply
Internal analog ground
Digital I/O; internal pull-up to VDDA
Digital input; internal pull-up to VDDA
SCL
I²C™ Clock
N.C.
Not connected
VDD
Positive Digital Supply Voltage
Positive External Supply Voltage
Negative External Supply Voltage
Internal digital supply
High voltage analog supply
Ground
VDDE
VSSE
AOUT
Analog Output
High voltage analog I/O
and ZACwireTM Serial Data
10
11
VBN
Negative Input from Sensor Bridge
Analog input
Analog I/O
VBR_B
Negative Sensor Bridge Supply Voltage
Depending on application circuit, short to VSSA
12
13
VBP
Positive Input from Sensor Bridge
Analog input
VBR_T
Positive Sensor Bridge Supply Voltage
Analog I/O
Depending on application circuit, short to VDDA
14
N.C.
Not connected
The standard package of the ZSSC3138 is an RoHS-compliant SSOP14 “green” package (5.3mm body width)
with a lead pitch of 0.65 mm.
Figure 4.1
ZSSC3138 SSOP14 Pin Diagram
VSSE
AOUT
VBN
VDDE
VDD
N.C.
VBR_B
VBP
SCL
SDA
B
Revision
VBR_T
N.C.
VSSA
VDDA
PPPP
Product and Package Code
LLLLLLLL Lot Number
YYWW Date Code (Year, Work Week)
21
January 25, 2016
5
ESD Protection
All pins have an ESD protection of >2000V according to the Human Body Model (HBM). The pins VDDE, VSSE
and AOUT have an additional ESD protection of >4000V (HBM).
ESD protection is tested with devices in SSOP14 packages during product qualification. The ESD test follows the
Human Body Model with 1.5kOhm/100pF based on MIL 883, Method 3015.7.
6
Quality and Reliability
The ZSSC3138 is qualified according to the AEC-Q100 standard, operating temperature grade 0.
A fit rate <5fit (T=55°C, S=60%) is guaranteed. A typical fit rate of the semiconductor technology used is 2.5fit.
7
Customization
For high-volume applications that require an upgraded or downgraded functionality compared to the ZSSC3138,
IDT can customize the circuit design by adding or removing certain functional blocks.
Please contact IDT for further information.
8
Ordering Information
Product Sales Code
ZSSC3138BA2T
Description
Package
Tube
ZSSC3138 SSOP14 – temperature range -40 to +125°C
ZSSC3138 SSOP14 – temperature range -40 to +125°C
ZSSC3138 die – temperature range -40 to +125°C
ZSSC3138BA2R
ZSSC3138BA1B
Reel
Tested dice on unsawn
wafer
ZSSC3138BA1C
ZSSC3138BE2T
ZSSC3138BE2R
ZSSC3138BE1B
ZSSC3138BE1C
ZSSC313xKITV1.1
ZSSC3138 die – temperature range -40 to +125°C
ZSSC3138 SSOP14 – temperature range -40 to +150°C
ZSSC3138 SSOP14 – temperature range -40 to +150°C
ZSSC3138 die – temperature range -40 to +150°C
ZSSC3138 die – temperature range -40 to +150°C
Tested dice on frame
Tube
Reel
Tested dice on unsawn wafer
Tested dice on frame
ZSSC313x Evaluation Kit, revision 1.1, including Evaluation Board, Kit
ZSSC3138 IC samples, USB cable
ZSSC313x Mass
Modular Mass Calibration System (MSC) for ZSSC313x including
Kit
Calibration System V1.1 MCS boards, cable, connectors
22
January 25, 2016
9
Related Documents
Document
ZSSC3135 Feature Sheet
ZSSC313x Functional Description
ZSSC313x Evaluation Kit Description
ZSSC313x Technical Note—EMC Design
Guidelines*
ZSSC313x Technical Note—High Voltage
Protection*
ZSSC313x Technical Note Die & Package
Dimensions**
ZSSC313x Temperature Profile Calculation
Spread Sheet
ZSSC313x Bandwidth Calculation Spread Sheet**
Visit the ZSSC3138 product page (www.IDT.com/ZSSC3138) or contact your nearest sales office for the latest version of
these documents.
* Documents marked with an asterisk (*) require a login account for access on the web.
** Documents marked with a double asterisk (**) are available only on request.
23
January 25, 2016
10 Glossary
Term
ADC
AEC
AFE
Description
Analog-to-Digital Converter
Automotive Electronics Council
Analog Front-end
AOUT
BAMP
BR
Analog Output
Buffer Amplifier
Bridge Sensor Signal
CM
Command Mode
CMC
CMOS
DAC
DM
Calibration Microcontroller
Complementary Metal Oxide Semiconductor
Digital-to-Analog Converter
Diagnostic Mode
EEPROM
ESD
LDR
MUX
NOM
OWI
PGA
POR
RAM
RISC
ROM
SCC
SSC
T
Electrically Erasable Programmable Read-Only Memory
Electrostatic Device
Lower Diagnostic Range
Multiplexer
Normal Operation Mode
One-Wire Communication
Programmable Gain Amplifier
Power-on Reset
Random-Access Memory
Reduced Instruction Set Computer
Read-Only Memory
Sensor Connection Check
Sensor Signal Conditioner or Sensor Short Check depending on context.
Temperature Sensor Signal
TS
Temperature Sensor
XZC
eXtended Zero Compensation
24
January 25, 2016
11 Document Revision History
Revision
1.00
Date
Description
October 18, 2011
January 20, 2012
September 25, 2012
February 15, 2013
First released revision.
Full revision.
1.10
1.20
Minor edits. Update for IDT contact information.
1.21
Updates to specifications 1.3.7.1, 1.3.7.2, and 1.3.7.3.
Addition of RS factor (ADC Range Shift) to equation (2).
Minor edits. Update for ZMD America contact information.
1.22
1.23
1.24
October 22, 2013
April 21, 2014
Updates for contact information and imagery for cover and headers.
Updates for related documents.
Update for available part codes and kit contents listed in ordering tables.
Corrections for part ordering table on page 3.
Update for cover imagery.
Update for contact information.
April 10, 2015
Update for contact info.
January 25. 2016
Changed to IDT branding.
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