RF3809PCK-412 [RFMD]
GaAs HBT PRE-DRIVER AMPLIFIER; 砷化镓HBT预驱动放大器
| 型号： | RF3809PCK-412 |
| 厂家： | 
RF MICRO DEVICES |
| 描述： | GaAs HBT PRE-DRIVER AMPLIFIER |
| 文件： | 总18页 (文件大小：1223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RF3809
GaAs HBT PRE-DRIVER AMPLIFIER
0
RoHS Compliant & Pb-Free Product
Typical Applications
• GaAs Pre-Driver for Basestation Amplifiers
• Class AB Operation for NMT, GSM, DCS, PCS,
• PA Stage for Commercial Wireless Infrastructure and UMTS Transceiver Applications
Product Description
-A-
0.157
0.150
0.004
0.002
0.0192
0.0138
The RF3809 is a GaAs pre-driver power amplifier, specifi-
cally designed for wireless infrastructure applications.
Using a highly reliable GaAs HBT fabrication process,
0.196
this high-performance single-stage amplifier achieves
0.189
high output power over a broad frequency range. The
RF3809 also provides excellent efficiency and thermal
stability through the use of a thermally-enhanced surface-
mount plastic-slug package. Ease of integration is accom-
plished through the incorporation of an optimized evalua-
tion board design provided to achieve proper 50Ω
operation. Various evaluation boards are available to
address a broad range of wireless infrastructure applica-
tions: NMT 450MHz; GSM850MHz; GSM900MHz;
DCS1800MHz; PCS1900MHz; and, UMTS2200MHz.
0.050
0.244
0.230
0.066
0.056
Shaded lead is pin 1.
EXPOSED
DIE FLAG
8° MAX
0° MIN
0.126
0.088
0.0098
0.0075
0.035
0.016
0.099
0.061
Optimum Technology Matching® Applied
Package Style: SOIC-8
Si BJT
GaAs HBT
SiGe HBT
GaN HEMT
GaAs MESFET
9
Si Bi-CMOS
InGaP/HBT
Si CMOS
Features
SiGe Bi-CMOS
• High Output Power of 2.0W P1dB
• High Linearity
• High Power-Added Efficiency
• Thermally-Enhanced Packaging
VREF
NC
VBIAS
1
2
3
4
8
7
6
5
Bias
Circuit
• Broadband Platform Design Approach,
450MHz to 2500MHz
RFOUT/VCC
RFOUT/VCC
NC
RFIN
NC
Ordering Information
RF3809
GaAs HBT Pre-Driver Amplifier
PACKAGE BASE
GND
RF3809PCK-410
RF3809PCK-411
RF3809PCK-412
RF3809PCK-413
RF3809PCK-414
RF3809PCK-415
Fully Assembled Evaluation Board, 450MHz
Fully Assembled Evaluation Board, 869MHz to 894MHz
Fully Assembled Evaluation Board, 920MHz to 960MHz
Fully Assembled Evaluation Board, 1800MHz to 1880MHz
Fully Assembled Evaluation Board, 1930MHz to 1990MHz
Fully Assembled Evaluation Board, UMTS
RF Micro Devices, Inc.
7628 Thorndike Road
Tel (336) 664 1233
Fax (336) 664 0454
Greensboro, NC 27409, USA
http://www.rfmd.com
Functional Block Diagram
Rev A3 060607
4-623
RF3809
Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage
9.0
See below
750
4:1
-40 to +85
-40 to +105
V
Caution! ESD sensitive device.
RF - Input Power
Operating Current
Load VSWR
Operating Temperature
Storage Temperature
mA
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. RoHS marking based on EUDirective2002/95/EC
(at time of this printing). However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
°C
°C
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Overall - 450MHz
Frequency
420
480
MHz
I
=15mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+32.0
+33.0
+34.5
24.0
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
38.0
37.0
14
-32
-38
-20
-6.5
45.0
44.0
13
-27
-36
-16
-5.5
53.0
52.0
12
-19
-30
-11
-4.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
43.0
44.0
44.5
45.0
46.5
48.0
50.0
48.0
48.0
51.0
53.0
52.0
dBm
dBm
dBm
dBm
19dBm/tone
21dBm/tone
23dBm/tone
25dBm/tone
4-624
Rev A3 060607
RF3809
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Overall - GSM800
Frequency
869
894
MHz
I
=15mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+34.5
+35.5
+36.5
24
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
48.0
47.0
13.0
-32.0
-44.0
-26.0
-20.0
50.5
49.5
13.5
-28.0
-38.0
-18.0
-13.0
55.0
54.0
14.5
-26.0
-35.0
-12.0
-9.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
44.5
45.0
46.0
46.0
45.5
46.5
47.0
48.0
48.0
48.0
49.0
51.0
dBm
dBm
dBm
dBm
19dBm/tone
21dBm/tone
23dBm/tone
25dBm/tone
Overall - GSM900
Frequency
920
960
MHz
I
=14mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+34.0
+34.5
+35.0
24
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
43.0
42.0
13.0
-30.0
-44.0
-29.0
-9.5
49.0
48.0
13.5
-28.0
-29.5
-21.0
-8.0
54.0
53.0
14.0
-26.5
-37.0
-9.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
-7.0
46.5
46.0
45.0
46.0
48.5
48.0
47.0
47.5
50.5
51.0
50.0
49.0
dBm
dBm
dBm
dBm
19dBm/tone
21dBm/tone
23dBm/tone
25dBm/tone
Rev A3 060607
4-625
RF3809
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Overall - DCS1800
Frequency
1805
1880
MHz
I
=15mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+32.5
+34.0
+35.0
26
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
47.5
46.5
10.5
-32.0
-58.0
-25.0
-20.0
50.0
49.0
11.5
-24.0
-48.0
-15.0
-12.0
55.0
54.0
12.5
-20.0
-44.0
-8.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
-7.0
44.0
44.5
45.5
45.5
45.5
46.5
47.0
48.0
48.0
49.0
49.0
51.0
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
Overall - PCS1900
Frequency
1930
1990
MHz
I
=15mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+32.0
+32.5
+34.0
26
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
46.0
45.0
10.0
-35.0
-85.0
-28.0
-12.0
47.5
46.5
10.5
-26.0
-65.0
-12.0
-9.0
55.0
54.5
11.5
-21.0
-55.0
-8.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
-6.0
43.5
44.0
44.5
46.5
45.5
45.5
46.0
48.0
48.0
48.0
49.0
51.0
dBm
dBm
dBm
dBm
19dBm/tone
21dBm/tone
23dBm/tone
25dBm/tone
4-626
Rev A3 060607
RF3809
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
UMTS 2100
Frequency
2110
2170
MHz
I
=15mA, V =8V, V
=8V, V =8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+32.0
+32.5
+33.5
26
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
41.5
40.5
9.5
-35.0
-56.0
-25.0
-20.0
47.5
46.5
10.5
-32.0
-52.0
-15.0
-11.0
51.5
50.5
11.0
-26.5
-42.0
-8.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
-6.0
43.5
44.0
44.5
43.5
44.5
44.5
45.5
46.5
46.0
46.0
47.0
49.0
dBm
dBm
dBm
dBm
19dBm/tone
21dBm/tone
23dBm/tone
25dBm/tone
Power Supply
Power Supply Voltage
7
8
9
V
Supply Current (I +I
)
245
270
316
mA
I
for best IP3 and efficiency
CCQ
CC BIAS
Control Current (I
)
14
15
16
30
mA
V
V
=8V, V =8V
REF
REF
REF
CC
Power Down Current
μA
=0V, V =8V
CC
Rev A3 060607
4-627
RF3809
Pin
1
Function
VREF
Description
Control input to internal bias circuitry.
No connection.
Input for RF signal.
No connection.
No connection.
2
3
4
5
NC
RFIN
NC
NC
RF output pin and V supply pin.
6
7
8
RFOUT/VCC
RFOUT/VCC
VBIAS
GND
CC
RF output pin and V supply pin.
CC
RF supply to internal bias circuitry.
Backside of package should be connected to a short path to ground.
Pkg
Base
4-628
Rev A3 060607
RF3809
Evaluation Board Schematic
400MHz (RF3809410)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
220 pF
BANANA
JACK
R1
R2
R3
R4
R5
750 Ω
750 Ω
Open
Open
Open
C16
C17
C18
C19
220 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
100 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
220 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
47 nH
C11
220 pF
L2
3.9 nH
C2
220 pF
50 Ω μstrip
L1
8.2 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
2 pF
C5
Open
C6
Open
C7
Open
C8
8.2 pF
C9
Open
C10
100 pF
C1
Open
C3
12 pF
PACKAGE BASE
GND
3809400-
Evaluation Board Schematic
800MHz to 1000MHz (CDMA800, ISM, EGSM)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
33 pF
BANANA
JACK
R1
R2
R3
R4
R5
750 Ω
750 Ω
Open
Open
Open
C16
C17
C18
C19
33 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
36 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
33 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
33 nH
C11
6.2 pF
L2
2.2 nH
C2
22 pF
50 Ω μstrip
L1
2.7 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
2 pF
C5
Open
C6
2 pF
C7
Open
C8
Open
C9
Open
C10
Open
C1
Open
C3
5.1 pF
PACKAGE BASE
GND
3809401-
Rev A3 060607
4-629
RF3809
Evaluation Board Schematic
869MHz to 894MHz (GSM800) (RF3809411)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
33 pF
BANANA
JACK
R1
R2
R3
R4
R5
750 Ω
750 Ω
Open
Open
Open
C16
C17
C18
C19
33 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
36 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
33 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
47 nH
C11
6.2 pF
L2
2.2 nH
C2
22 pF
50 Ω μstrip
L1
2.7 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1 pF
C5
Open
C6
3.9 pF
C7
Open
C8
Open
C9
Open
C10
Open
C1
Open
C3
6.2 pF
PACKAGE BASE
GND
3809401-
Evaluation Board Schematic
920MHz to 960MHz (GSM900) (RF3809412)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
33 pF
BANANA
JACK
R1
R2
R3
R4
R5
750 Ω
750 Ω
Open
Open
Open
C16
C17
C18
C19
33 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
33 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
33 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
47 nH
C11
10 pF
L2
1.8 nH
C2
10 pF
50 Ω μstrip
L1
2.2 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
0.5 pF
C5
Open
C6
3.3 pF
C7
Open
C8
Open
C9
Open
C10
Open
C1
1 pF
C3
5.1 pF
PACKAGE BASE
GND
3809402-
4-630
Rev A3 060607
RF3809
Evaluation Board Schematic
1805MHz to 1880MHz (DCS1800) (RF3809413)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 Ω
Open
Open
Open
C16
C17
C18
C19
10 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
10 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
10 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
24 nH
C31
5.6 pF
C11
3.9 pF
C2
10 pF
C30
4.3 pF
50 Ω μstrip
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1.1 pF
C5
Open
C6
Open
C7
Open
C8
0.5 pF
C9
Open
C10
1 pF
C1
Open
C3
3.9 pF
PACKAGE BASE
GND
3809403-
Evaluation Board Schematic
1930MHz to 1990MHz (PCS1900) (RF3809414)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 Ω
Open
Open
Open
C16
C17
C18
C19
10 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
10 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
10 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
24 nH
C31
5.1 pF
C11
2.4 pF
C2
12 pF
C30
3.3 pF
50 Ω μstrip
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1.1 pF
C5
Open
C6
Open
C7
Open
C8
0.5 pF
C9
Open
C10
1 pF
C1
Open
C3
3.9 pF
PACKAGE BASE
GND
3809404-
Rev A3 060607
4-631
RF3809
Evaluation Board Schematic
UMTS (RF3809415)
VREF
P1
C15
0.1 μF
P1-1
P2-1
1
VREF
VCC
BANANA
JACK
C14
10 μF
P2
1
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
750 Ω
750 Ω
Open
Open
Open
C16
C17
C18
C19
10 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
10 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
10 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
24 nH
C31
4.3 pF
C11
2.4 pF
C2
5.6 pF
C30
2.7 pF
50 Ω μstrip
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
0.5 pF
C5
Open
C6
1.1 pF
C7
Open
C8
Open
C9
Open
C10
0.5 pF
C1
Open
C3
3 pF
PACKAGE BASE
GND
3809405-
4-632
Rev A3 060607
RF3809
Evaluation Board Layout
Board Size 2.0” x 2.0”
Board Thickness 0.023”, Board Material Rogers 4530
Rev A3 060607
4-633
RF3809
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern
shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to
accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful
process development is recommended.
PCB Metal Land Pattern
A = 1.14 x 0.71
B = 1.02 x 0.71 Typ.
C = 3.96 x 4.44
Dimensions in mm.
5.93
Pin 1
A
B
B
B
B
B
B
B
1.27 Typ.
1.90
C
3.81 Typ.
3.00
5.99 Typ.
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 1.30 x 0.86
B = 1.17 x 0.86 Typ.
C = 4.11 x 4.60
Dimensions in mm.
5.93
Pin 1
A
B
B
B
B
B
B
B
1.27 Typ.
1.90
C
3.81 Typ.
3.00
5.99 Typ.
4-634
Rev A3 060607
RF3809
Thermal Pad and Via Design
The DUT must be connected to the PCB backside ground through a low inductance, low thermal resistance path. The
required interface is achieved with the via pattern shown below for both low inductance as well as low thermal resistance.
The footprint provided below worked well on the RFMD 20mil thick Rogers 4350 PCB and also standard FR4. The vias
are 8mil vias that are partially plated through and are finished to 8mils±2mils with a minimum plating of 1.5mil. Failure to
place these vias within the DUT mounting area on the PCB in this prescribed manner may result in electrical perfor-
mance and/or reliability degradation.
Rev A3 060607
4-635
RF3809
Tape and Reel Information
Carrier tape basic dimensions are based on EIA481. The pocket is designed to hold the part for shipping and loading
onto SMT manufacturing equipment, while protecting the boyd and the solder terminals from damaging stresses. The
individual pocket design can vary from vendor to vendor, but wide and pitch will be consistent.
Carrier tape is wound or placed on a shipping reel with a diameter of either 330mm (13inches) or 178mm (7inches). The
center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary
stress on the parts.
Prior to shipping, moisture sensitive parts (MSL level 2a to 5a) are baked and placed into the pockets of the carrier tape.
A cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier, ESD
bag, which is placed in a cardboard shipping box. It is important to note that unused moisture sensitive parts need to be
resealed in the moisture barrier bag. If the reels exceed the exposure limit and need to be rebaked, most carrier tape and
shipping reels are not rate as bakeable at 125°C. If baking is required, devices may be baked according to section 4,
table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A.
The following table provides useful information for carrier tape and reels used for shipping the devices described in this
document.
Reel
Diameter
Inch (mm)
13 (330)
Hub
Diameter
Inch (mm)
4 (102)
Width
(mm)
Pocket Pitch
(mm)
Units per
Reel
RFMD Part Number
Feed
RF3809TR13
RF3809TR7
12
12
8
8
Single
Single
2500
750
7 (178)
2.4 (61)
Carrier Tape Drawing with Part Orientation
Notes:
Ao = 6.70 ± 0.10
Bo = 5.40 ± 0.10
F = 5.50 ± 0.05
Ko = 2.10 ± 0.10
P = 8.00 ± 0.10
1. All dimensions are in millimeters (mm).
2. Unless otherwise specified, all dimension tolerances per EIA-481.
W = 12.00 +0.30/-0.10
4.00 ± 0.10
Ø1.50±.10
2.00 ± 0.05
15 inch Trailer
Pin 1
0.292
±.013
1.75±.10
Top View
15 inch Leader
Location
Sprocket holes toward
rear of reel
F
W
PART NUMBER
YYWW
PART NUMBER
YYWW
PART NUMBER
YYWW
PART NUMBER
YYWW
Bo
Trace Code
Trace Code
Trace Code
Trace Code
P
Ao
Ko
Direction of Feed
4-636
Rev A3 060607
RF3809
CDMA2K ACPR Performance for RS SMIQ03HD Sig Gen & FSU8
Spec Analyzer (1960 MHz, 882 MHz, & 450 MHz Source Signals)
W-CDMA ACPR Performance for RS SMIQ03HD Sig Gen &
FSU8 Spec Analyzer (2140 MHz & 882 MHz Source Signals)
-50.0
-52.0
-54.0
-56.0
-58.0
-60.0
-62.0
-64.0
-66.0
-68.0
-70.0
-72.0
-74.0
-76.0
-78.0
-80.0
-40.0
-42.0
-44.0
-46.0
-48.0
-50.0
-52.0
-54.0
-56.0
-58.0
-60.0
-62.0
-64.0
-66.0
-68.0
-70.0
-72.0
-74.0
-76.0
-78.0
-80.0
(No DUT in Place)
ACPR @ 0.75 MHz 1960 MHz source
ACPR @ 0.75 MHz 882 MHz source
ACPR @ 0.75 MHz 450 MHz source
ACPR @ 5MHz 2140 MHz source
ACPR @ 5MHz 882 MHz source
-6 -5 -4 -3 -2 -1
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
-6 -5 -4 -3 -2 -1
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
Output Power (dBm)
Output Power (dBm)
RF3809410 @ 450 MHz CDMA2K
SR1 and 9 Channels
RF3809411@ 882 MHz CDMA2K
SR1 and 9 Channels
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
-80.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
-80.0
-85.0
-90.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
ACPR @ 750 KHz
ACPR @ 750 KHz
Efficiency (%)
Efficiency (%)
0.0
0.0
11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Output Power (dBm)
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
X Axis Label (units)
3809411 @ 882 MHz W-CDMA
64 Channels and No Clipping
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
ACPR @ 5MHz
Efficiency (%)
0.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
26.0
Output Power (dBm)
Rev A3 060607
4-637
RF3809
RF3809412 @ 940 MHz
EDGE EVM
RF3809413 @ 1840 MHz
EDGE EVM
20.0
18.0
16.0
14.0
12.0
10.0
8.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
EVM_rms(%)
EVM_peak(%)
EVM_rms(%)
EVM_peak(%)
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
Output Power (dBm)
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Output Power (dBm)
RF3809414 @ 1960 MHz CDMA2K
RF3809415 @ 2140 MHz W-CDMA UMTS
SR1 and 9 Channels
64 Channels and No Clipping
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
-80.0
-85.0
-90.0
50.0
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
20.0
ACPR @ 750 KHz
45.0
Efficiency (%)
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
15.0
10.0
5.0
ACPR @ 5MHz
Efficiency (%)
0.0
0.0
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Output Power (dBm)
16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0
Output Power (dBm)
4-638
Rev A3 060607
RF3809
RF3809410 Evaluation Board S-Parameters
RF3809411 Evaluation Board S-Parameters
25.0
20.0
15.0
10.0
5.0
25.0
20.0
15.0
10.0
5.0
S21
S21
0.0
0.0
-5.0
S22
S11
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
S22
S11
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
S12
S12
420.0
430.0
440.0
450.0
460.0
470.0
480.0
869.0
874.0
879.0
884.0
889.0
894.0
Frequency (MHz)
Frequency (MHz)
RF3809412 Evaluation Board S-Parameters
RF3809413 Evaluation Board S-Parameters
25.0
20.0
15.0
10.0
5.0
25.0
20.0
15.0
10.0
5.0
S21
S21
0.0
0.0
-5.0
-5.0
S22
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
S22
S11
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
S11
S12
S12
910.0
920.0
930.0
940.0
950.0
960.0
970.0
1800.0 1810.0 1820.0 1830.0 1840.0 1850.0 1860.0 1870.0 1880.0
Frequency (MHz)
Frequency (MHz)
RF3809414 Evaluation Board S-Parameters
RF3809415 Evaluation Board S-Parameters
25.0
20.0
15.0
10.0
5.0
25.0
20.0
15.0
10.0
5.0
S21
S21
0.0
0.0
-5.0
S22
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
S22
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
S11
S12
S11
S12
1930.0
1940.0
1950.0
1960.0
1970.0
1980.0
1990.0
2110.0
2120.0
2130.0
2140.0
2150.0
2160.0
2170.0
Frequency (MHz)
Frequency (MHz)
Rev A3 060607
4-639
RF3809
RF3809415 Junction Temperature at 2140 MHz
Thermal Resistance of RF3809 @ 2.14 GHz
170.0
160.0
150.0
140.0
130.0
120.0
110.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
13.0
18.0
23.0
28.0
33.0
38.0
POUT (dBm)
POUT (dBm)
4-640
Rev A3 060607
相关型号：
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