RF5152 [RFMD]

3V TO 3.6V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER; 3V至3.6V , 2.4GHz至2.5GHz线性功率放大器
RF5152
型号: RF5152
厂家: RF MICRO DEVICES    RF MICRO DEVICES
描述:

3V TO 3.6V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER
3V至3.6V , 2.4GHz至2.5GHz线性功率放大器

放大器 射频 微波 功率放大器
文件: 总10页 (文件大小:342K)
中文:  中文翻译
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RF5152  
3V TO 3.6V, 2.4GHz TO 2.5GHz  
LINEAR POWER AMPLIFIER  
Package Style: QFN, 16-Pin, 3 mm x 3 mm  
16  
15  
14  
13  
RF OUT/  
VC3  
NC  
RF IN  
RF IN  
NC  
1
2
3
4
12  
Features  
„ Single Power Supply 3.0V to  
3.6V  
Match  
11 RF OUT  
10 RF OUT  
„ 34dB Typical Small Signal Gain  
Match  
Match  
„ 50Ω Input and Interstage Match-  
ing  
„ 2400MHz to 2500MHz Fre-  
quency Range  
Bias  
„ +18dBm, 2.5%EVM (typ.),  
130mA@VCC=3.3V  
9
PDETECT  
5
6
7
8
Applications  
„ IEEE802.11b/g/n WLAN Applica-  
tions  
Functional Block Diagram  
„ 2.5GHz ISM Band Applications  
Product Description  
„ Commercial and Consumer Sys-  
The RF5152 is a linear, medium-power, high-efficiency, three-stage amplifier IC  
designed specifically for battery-powered WLAN applications such as PC cards, mini  
PCI, and compact flash applications. The device is manufactured on an advanced  
InGaP Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has  
been designed for use as the final RF amplifier in 2.5GHz OFDM and other spread-  
spectrum transmitters. The device is provided in a 3mmx3mm, 16-pin, QFN with a  
backside ground. The RF5152 is designed to maintain linearity over a wide range of  
supply voltages and power outputs.  
tems  
„ Portable Battery-Powered Equip-  
ment  
„ Spread-Spectrum and MMDS  
Systems  
Ordering Information  
RF5152  
3V to 3.6V, 2.4GHz to 2.5GHz Linear Power Amplifier  
RF5152PCBA-41X Fully Assembled Evaluation Board  
Optimum Technology Matching® Applied  
GaAs HBT  
GaAs MESFET  
InGaP HBT  
SiGe BiCMOS  
Si BiCMOS  
SiGe HBT  
GaAs pHEMT  
Si CMOS  
Si BJT  
GaN HEMT  
9
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-  
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
Rev A10 DS061221  
1 of 10  
RF5152  
Absolute Maximum Ratings  
Parameter  
Rating  
Unit  
Caution! ESD sensitive device.  
Supply Voltage  
-0.5 to +5.0  
V
The information in this publication is believed to be accurate and reliable. How-  
ever, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use,  
nor for any infringement of patents, or other rights of third parties, resulting  
from its use. No license is granted by implication or otherwise under any patent  
or patent rights of RFMD. RFMD reserves the right to change component cir-  
cuitry, recommended application circuitry and specifications at any time without  
prior notice.  
Power Control Voltage (V  
)
-0.5 to +3.5  
V
DC  
REG  
DC Supply Current  
Input RF Power  
600  
+5  
mA  
dBm  
°C  
Operating Ambient Temperature  
Storage Temperature  
-10 to +85  
-40 to +150  
JEDEC Level 2  
RoHS status based on EUDirective2002/95/EC (at time of this document revi-  
sion).  
°C  
Moisture Sensitivity  
Specification  
Parameter  
Overall  
Unit  
Condition  
Min.  
Typ.  
Max.  
Temperature=+25°C, V =3.3V,  
CC  
V
=2.8V, Frequency=2450MHz,  
pulsed at 1% to 100% duty cycle,  
REG  
circuit per evaluation board schematic  
2.40  
2.50  
3.3  
GHz  
IEEE802.11g  
IEEE802.11n  
Frequency  
Output Power  
18  
IEEE802.11g modulation, 54Mbit/s, 64QAM,  
OFDM modulation  
RMS, mean  
EVM*  
2.5  
33  
34  
%
dBm  
dB  
IP3  
Gain  
32  
49  
37  
1.5  
51  
-11dBm Pin  
Gain Variance  
Input Impedance  
Output VSWR  
Power Detector (P_detect)  
±dB  
Ω
-15°C to +85°C  
50  
Internally Matched Input and Interstage  
The PA is stable, no spurs above -43dBm  
10:1  
P
=8dBm  
0.2  
0.9  
0.3  
1.1  
V
V
OUT  
DC  
DC  
P
=18dBm  
0.7  
OUT  
Power Supply  
Operating Voltage  
3.0  
2.7  
3.3  
2.8  
3.6  
3.0  
V
V
(Bias) Voltage (VB1/VB2,  
V
DC  
REG  
VB3)  
Current Consumption  
85  
130  
170  
mA  
RF P  
=+18dBm, V =3.3V,  
OUT CC  
54Mbps OFDM <2.5% EVM  
Quiescent Current  
45  
1
75  
2
105  
6
mA  
mA  
V
=+3.3V ; RF In=OFF; V  
OFF  
CC  
CC  
DC  
REG  
V
(Bias) Current (Total)  
V
=3.3V  
REG  
Input Return Loss  
Turn-on Time**  
Notes:  
-15  
-10  
dB  
nS  
300  
700  
1000  
Output stable to within 90% of final gain  
*The EVM specification is obtained with a signal generator that has an EVM floor of less than 0.7%.  
**The PA must operate with gated bias voltage input at 1% to 99% duty cycles without any EVM or other parameter degradation.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
2 of 10  
Rev A10 DS061221  
RF5152  
Pin  
1
Function  
NC  
Description  
Not connected. May be connected to ground (GND).  
Interface Schematic  
RF input. See evaluation board schematic for details.  
RF input. See evaluation board schematic for details.  
2
3
4
RF IN  
RF IN  
NC  
Not connected. Note: Connection of VC1 at this pin will not damage the  
RF5152 or adversely affect RF5152 performance.  
Supply voltage for the bias reference and control circuits. May be con-  
nected with VC1, VC2 and VC3 with a single-supply voltage as long as V  
5
VCC  
CC  
does not exceed 3.3V in this configuration.  
DC  
Bias current control voltage for the first and second stages.  
Bias current control voltage for the third stage.  
Not connected.  
6
7
8
VB1/VB2  
VB3  
NC  
Provides an output voltage proportional to the output RF level.  
9
10  
PDETECT  
RF OUT  
RF output. The output requires external matching components which con-  
sist of a one or two shunt capacitors and a series capacitor for DC blocking.  
RF OUT  
BIAS  
Same as pin 10.  
See pin 10.  
See pin 10.  
11  
12  
RF OUT  
RF OUT/  
VC3  
RF output and bias for the output stage. The power supply for the output  
transistor needs to be supplied to this pin. This can be done through a  
quarter-wave (λo/4) length microstrip line that is RF grounded at the other  
end, or through an RF inductor that supports the required DC current. See  
evaluation board schematic.  
Not connected. May be connected to ground (GND).  
13  
14  
NC  
VC2  
Second stage power supply input. Connect as shown on evaluation board  
schematic.  
Not connected. May be connected to ground (GND).  
15  
16  
NC  
VC1  
First stage power supply input. Connect as shown on evaluation board  
schematic.  
Ground connection. The back side of the package should be connected to  
the ground plane through as short a connection as possible (e.g., PCB vias  
under the device are required).  
Pkg  
Base  
GND  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
Rev A10 DS061221  
3 of 10  
RF5152  
Package Drawitng  
0.10  
2 PLCS  
C
A
0.05 C  
-A-  
3.00  
0.90  
0.85  
1.50 TYP  
0.70  
0.65  
0.05  
0.00  
2 PLCS  
0.10  
C
B
3.00  
12°  
MAX  
2 PLCS  
0.10  
C
B
-B-  
SEATING  
PLANE  
-C-  
1.37 TYP  
2.75 SQ  
2 PLCS  
0.10  
C
A
0.10 M C A  
B
0.60  
0.24  
TYP  
0.30  
0.18  
PIN 1 ID  
R.20  
1.65  
SQ.  
1.35  
0.50  
0.30  
Dimensions in mm.  
Shaded lead is pin 1.  
0.50  
Pin Out  
16  
15  
14  
13  
NC  
1
2
3
4
12 RF OUT/VCC3  
11 RF OUT  
RF IN  
RF IN  
NC  
10 RF OUT  
9
PDETECT  
5
6
7
8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
4 of 10  
Rev A10 DS061221  
RF5152  
Theory of Operation and Application Information  
The RF5152 is a three-stage power amplifier (PA) with a minimum gain of 32dB (34dB typical) in the 2.4GHz to 2.5GHz Indus-  
trial, Scientific, and Medical (ISM) band. The RF5152 has a 50Ω internal input and interstage match. Only the RF5152 output  
stage requires matching. The RF5152 is designed primarily for IEEE802.11g/n wireless local area network (WLAN) applica-  
tions where the available supply voltage and current are limited. This amplifier will operate to and below the lowest expected  
voltage made available by a typical PC Card (PCMCIA or CardBus) slot in a laptop personal computer (PC). The RF5152 main-  
tains required linearity at decreased supply voltages.  
The RF5152 operates from a single supply voltage of 3.0VDC to 3.6VDC to deliver specified performance. Power control is pro-  
vided through two (2) bias control input pins (VB1/VB2 and VB3). In most applications these two (2) bias control input pins are  
connected together and employed as a single control input. The RF5152 has been primarily characterized with a VB voltage of  
2.8VDC. However, the RF5152 will operate from a wide range of bias control voltages and within a wide range of frequencies  
(typically 1800MHz to 2800MHz). If a bias control voltage other than 2.8VDC is preferred or if a different frequency range  
(other than 2.4GHz to 2.5GHz) is desired, please contact RFMD Sales or Applications Engineering for assistance.  
Though not difficult to implement to achieve state-of the-art performance, the RF5152 is employed at frequencies greater than  
2GHz, where care in circuit layout and component selection is advisable. Of primary concern with RF5152 PCB layout is the  
selection and placement of output matching components (RF5152PCBA bill of materials (BOM) is available upon request).  
High-Q (quality factor) capacitors and inductors are not required in every RF5152 based design; however, it is highly recom-  
mended that the RF5152PCBA evaluation board BOM be followed exactly for all initial end product designs. Upon initial base-  
line of RF5152 based PCB performance, less costly (Lower-Q) output matching circuit components may be substituted and  
evaluated against the initial design performance. RFMD experience indicates that end product FTY improvements more than  
offset the cost difference between “High-Q” and “Low-Q” components.  
There is no required matching on the RF5152 input or interstage circuits. Only the RF5152 output stage requires matching  
allowing the RF5152 to be implemented in applications requiring the fewest end product bill of materials (BOM) parts count  
and lowest BOM cost. The input stage requires a DC-blocking capacitor. In most cases the capacitor used as part of the  
RF5152 output matching circuit is also employed to accomplish DC-blocking. The RF5152PCBA evaluation board (available  
from RF Micro Devices, Inc. (RFMD)) is optimized for 3.3VDC supply input. The output matching capacitor is C10 which is  
located approximately 120mils from the IC (as shown on the RF5152PCBA Evaluation Board Schematic). The capacitor C10 is  
selected in value and positioned with reference to 50Ω transmission line segment TL1. Transmission line segment TL1 should  
be duplicated as closely as possible in specified length and thickness in any customer PCB layout. Due to PCB material varia-  
tion (e.g., FR4) and PCB manufacturer variations, the customer may benefit from small adjustments made to the length of TL1  
when the RF5152PCBA evaluation board is duplicated to produce an end product PCB design. The initial PCB layout should  
include exposed ground area near C10 to allow ease of RF5152 output circuit optimization. Smith Chart-based design tools  
may be used to assist in determining the desired capacitor value and transmission line physical characteristics. Note that the  
use of a single capacitor output circuit match will result in a more sensitive match and slightly reduced RF5152 bandwidth. In  
this configuration the RF5152 will exhibit sufficient output spectrum bandwidth to meet IEEE802.11b/g requirements when  
matched properly.  
For best results, the RF5152PCBA evaluation board circuit layout should be copied as closely as possible. In particular, the  
RF5152PCBA evaluation board ground layout, ground vias, and output matching components and location should be copied  
without deviation. Other PCB layout configurations may provide acceptable RF5152 performance; however, the end product  
design process will be faster and manufacturing first time yield (FTY) better if the RF5152PCBA evaluation board design is fol-  
lowed. RFMD provides RF5152PCBA design and Gerber files upon request.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
Rev A10 DS061221  
5 of 10  
RF5152  
Evaluation Board Schematic - IEEE802.11b/g  
VCC  
P2  
1
VCC  
P2-1  
PDETECT  
GND  
C6  
1 nF  
R1  
L5  
2
P2-3  
P2-4  
VREG3  
VREG1/2  
3
4
C4  
1 μF  
L4  
10 nH 22 nH  
C9  
1 nF  
HDR_1x4  
P3  
1
P3-1  
VCC  
BANANA JACK  
P4  
L6  
6.8 nH Coilcraft  
16  
15  
14  
13  
1
GND  
140 mils  
1
2
3
4
12  
11  
10  
9
BANANA JACK  
207 mils from C10  
J2  
RF OUT  
J1  
RF IN  
C12  
C10  
C11  
10 pF  
2.0 pF  
0.7 pF  
PDETECT  
C5  
330 pF  
5
6
7
8
P1  
5152400 r-  
C3  
1000 pF  
C13  
1000 pF  
P1-1  
1
2
VCC  
GND  
R1  
Application  
BT, 802.11 b  
0
R2  
R3  
56 Ω  
100 Ω  
27 Above and 802.11g  
HDR_1X2  
Notes:  
1. Populate to tie VREG1/2 and VREG3 together for one power supply.  
All measurements are edge to edge from the IC.  
Components labeled with a “*” may not be needed on the eval board.  
VCC  
VREG1/2 VREG3  
*
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
6 of 10  
Rev A10 DS061221  
RF5152  
Evaluation Board Layout  
Board Size 2.0” x 2.0”  
Board Thickness 0.031”, Board Material FR-4, Multi-Layer  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
Rev A10 DS061221  
7 of 10  
RF5152  
PCB Design Requirements  
PCB Surface Finish  
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch  
to 8μinch gold over 180μinch nickel.  
PCB Land Pattern Recommendation  
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown  
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate  
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is  
recommended.  
PCB Metal Land Pattern  
A = 0.64 x 0.28 (mm) Typ.  
B = 0.28 x 0.64 (mm) Typ.  
C = 1.50 (mm) Sq.  
Dimensions in mm.  
1.50 Typ.  
0.50 Typ.  
Pin 16  
B
B
B
B
Pin 1  
Pin 12  
A
A
A
A
A
A
A
A
0.50 Typ.  
0.55 Typ.  
0.75 Typ.  
1.50  
Typ.  
C
B
B
B
B
Pin 8  
0.55 Typ.  
0.75 Typ.  
Figure 1. PCB Metal Land Pattern (Top View)  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
8 of 10  
Rev A10 DS061221  
RF5152  
PCB Solder Mask Pattern  
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB  
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The  
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be  
provided in the master data or requested from the PCB fabrication supplier.  
A = 0.74 x 0.38 (mm) Typ.  
B = 0.38 x 0.74 (mm) Typ.  
C = 1.60 (mm) Sq.  
Dimensions in mm.  
1.50  
Typ.  
0.50  
Typ.  
Pin 16  
B
B
B
B
Pin 1  
Pin 12  
A
A
A
A
A
A
A
A
0.50  
Typ.  
0.75  
Typ.  
1.50  
Typ.  
C
0.55  
Typ.  
B
B
B
B
Pin 8  
0.55  
Typ.  
0.75  
Typ.  
Figure 2. PCB Solder Mask Pattern (Top View)  
Thermal Pad and Via Design  
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.  
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been  
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing  
strategies.  
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a  
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the  
quantity of vias be increased by a 4:1 ratio to achieve similar results.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
Rev A10 DS061221  
9 of 10  
RF5152  
ACP versus POUT  
PDETECT versus POUT  
-20.0  
-25.0  
-30.0  
-35.0  
-40.0  
-45.0  
-50.0  
-55.0  
-60.0  
-65.0  
-70.0  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
ACP1 2400MHz  
ACP1 2450MHz  
ACP1 2500MHz  
2400MHz ACP2  
2450MHz ACP2  
2500MHz ACP2  
2400MHz  
2450MHz  
2500MHz  
0.0  
5.0  
10.0  
15.0  
20.0  
10.0  
12.0  
14.0  
16.0  
18.0  
20.0  
22.0  
24.0  
Output Power (dBm)  
Output Power (dBm)  
Operating Current versus POUT  
EVM versus POUT  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0.16  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
2400MHz  
2450MHz  
2500MHz  
2400MHz  
2450MHz  
2500MHz  
0.0  
5.0  
10.0  
15.0  
20.0  
0.00  
5.00  
10.00  
15.00  
20.00  
Output Power (dBm)  
Output Power (dBm)  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
10 of 10  
Rev A10 DS061221  

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