RF5373_1 [RFMD]
1.8V TO 3.6V IEEE802.11b/g/n AND BLUETOOTH DRIVER/AMPLIFIER; 1.8V至3.6V的IEEE802.11b / g / n的蓝牙驱动器/放大器
| 型号： | RF5373_1 |
| 厂家： | 
RF MICRO DEVICES |
| 描述： | 1.8V TO 3.6V IEEE802.11b/g/n AND BLUETOOTH DRIVER/AMPLIFIER |
| 文件： | 总14页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RF5373
1.8V TO 3.6V IEEE802.11b/g/n
AND BLUETOOTH DRIVER/AMPLIFIER
Package Style: QFN, 8-Pin, 2.2mmx2.2mmx0.6mm
Features
Single Power Supply 1.8V to
3.6V
8
7
RF IN
N/C
1
2
6
5
N/C
Very Low Current (see table for
all modes)
Bias
DET
4
>5dBm 11g POUT@<1% and
10dBm 11g POUT@<4%
RF OUT
POUT=19dBm Meeting Class 1
3
BT
Gain: 28dB Typ 11b/g/BT
Applications
IEEE802.11b/g/n Driver/Ampli-
fier
Functional Block Diagram
Product Description
General Purpose Amplification
The RF5373 is a linear driver/amplifier that meets the FCC and ETSI
requirements for operation in the 2.4GHz to 2.5GHz (IEEE802.11b/g/n
and BT Class 1) bands. Operating from a single 1.8V to 3.6V supply, the
amplifier will easily be incorporated into WLAN designs with minimal exter-
nal components. The device is manufactured on an advanced InGaP Gal-
lium Arsenide Heterojunction Bipolar Transistor (HBT) process. The device
is provided in a 2.2mmx2.2mmx0.6mm, 8-pin, QFN with a backside
ground.
Class 1 Bluetooth Power Ampli-
fier
Driver Amplifier for TX Power
Amplifier
Ordering Information
RF5373
1.8V to 3.6V IEEE802.11b/g/n and Bluetooth Driver/Ampli-
fier
RF5373PCBA-41X Fully Assembled Evaluation Board
RF5373PCBA-410 IEEE802.11b/g 2.4GHz to 2.5GHz Operation
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
9
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
1 of 14
RF5373
Absolute Maximum Ratings
Caution! ESD sensitive device.
Parameter
Supply Voltage
Rating
-0.5 to +3.6
90
Unit
V
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
DC Supply Current
RF - Input Power
mA
dBm
°C
15
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
Operating Temperature
Storage Temperature
Moisture Sensitivity
-30 to +85
-40 to +100
JEDEC Level 3
600
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
°C
ESD Human Body Model
(EIA/JESD22-114-A)
V
V
ESD Machine Model (EIA/JESD22-
115-A)
100
Specification
Parameter
IEEE802.11b
Unit
Condition
Min.
Typ.
Max.
Nominal conditions: V =3.1V, V
=1.75V,
REG
CC
Freq=2.45GHz, Temp=+25°C, unless other-
wise specified.
Frequency
2.4
25
2.5
16
GHz
Output Power
12
dBm
Meeting IEEE802.11b spectral mask require-
ments
Gain
28
dB
2.4GHz to 2.5GHz
2.4GHz to 2.5GHz
Gain Variance Over Temperature
-30°C to +85°C
1.0
±dB
Second Harmonic
-27
dBm
Fundamental frequency is between 2400MHz
to 2500MHz (RFP =+12dBm), see note 2
OUT
802.11b Adjacent Channel Power
Alternate Channel Power
-38
-56
-32
-52
-43
dBc
dBc
P
P
=12dBm at nominal conditions
=12dBm at nominal conditions
OUT
OUT
IEEE802.11b Spectral Mask per
FCC Part 15.205
dBm
Amplifier setup for best IEEE802.11g perfor-
mance; FC=2412MHz; RFP =+12dBm;
OUT
IEEE802.11b CCK 11Mbps modulation;
T=+25°C; measured at FC-25MHz
-43
dBm
mA
Amplifier setup for best IEEE802.11g perfor-
mance; FC=2462MHz; RFP =+12dBm;
OUT
IEEE802.11b CCK 11Mbps modulation;
T=+25°C; measured at FC+25MHz
Operating Current
Idle Current
50
P
=12dBm at nominal conditions
OUT
45
mA
mA
At nominal conditions with no RF
I
Current
5.5
6.5
10
REG
Shutdown Current
Power Detector
μA
P
=+10dBm
=+12dBm
0.5
0.6
0.7
V
V
OUT
P
0.52
0.65
0.75
OUT
Input Capacitance
Bandwidth
5
8
pF
MHz
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support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
2 of 14
Rev A6 DS070521
RF5373
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Nominal conditions: V =3.1V, V
=1.75V
REG
CC
pulsed at 1% to 100% duty cycle,
Freq=2.45GHz, Temp=+25°C, unless other-
wise specified.
IEEE802.11g
Frequency
Output Power
EVM
2.4
25
2.5
12
4
GHz
dBm
%
10
2.4GHz to 2.5GHz
Gain
28
dB
2.4GHz to 2.5GHz
2.4GHz to 2.5GHz
Gain Variance Over Temperature
-30°C to +85°C
1.0
±dB
Second Harmonic
-27
-43
dBm
dBm
Fundamental frequency is between 2400MHz
to 2500MHz (RFP =+10dBm), see note 2
OUT
IEEE802.11g Spectral Mask per
FCC Part 15.205
Amplifier setup for best IEEE802.11g perfor-
mance; FC=2412MHz; RFP =+10dBm;
OUT
IEEE802.11b CCK 11Mbps modulation;
T=+25°C; measured at FC-25MHz
-43
dBm
mA
Amplifier setup for best IEEE802.11g perfor-
mance; FC=2462MHz; RFP =+10dBm;
OUT
IEEE802.11b CCK 11Mbps modulation;
T=+25°C; measured at FC+25MHz
Operating Current
Idle Current
50
P
=+10dBm at nominal conditions
OUT
45
mA
mA
At nominal conditions with no RF
I
Current
5.5
REG
Shutdown Current
Power Detector
10
μA
P
=+10dBm
0.40
0.55
0.7
V
OUT
Input Capacitance
Bandwidth
5
8
pF
MHz
μS
Turn-On Time
1.5
1.8
Output stable to within 90% of final gain, see
note 1.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
3 of 14
RF5373
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Nominal conditions: V =3.1V, V
=1.75V,
REG
CC
Bluetooth Class 1
Freq=2.45GHz, Temp=+25°C, unless other-
wise specified.
Frequency
2.4
2.5
GHz
Output Power BT version 1.2
19
16
28
dBm
Meeting Class 1 Bluetooth version 1.2 specifi-
cation
Output Power BT version 2.0
Large Signal Gain
Meeting Class 1 Bluetooth version 2.0 specifi-
cation
25
dB
Measured at rated output power; nominal con-
ditions
Second Harmonic
-27
10
dBm
Fundamental frequency is between 2400MHz
to 2500MHz (RFP =+16dBm), see note 2
OUT
Operating Current
Idle Current
65
mA
P
=16dBm at nominal conditions
OUT
45
mA
mA
At nominal conditions with no RF
I
Current
5.5
REG
Shutdown Current
μA
Power Supply
V
Supply Voltage
1.8
1.6
3.1
3.6
V
V
CC
V
Voltage
1.75
1.85
REG
Note 1: The PA must operate with gated bias at 1% to 99% duty cycles without any EVM or other parameter degradation with R1=56Ω.
Note 2: For best harmonic rejection please refer to the harmonic rejection application schematic.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
4 of 14
Rev A6 DS070521
RF5373
Pin
1
Function
RF IN
Description
RF input pin. See evaluation board schematic for details.
Interface Schematic
No Connect, this pin may be left as a no connect or connected to ground.
Bias current control voltage for the first and second stages.
Provides an output voltage proportional to the output RF level.
2
3
4
N/C
VREG
PDETECT
or NC*
*In applications where the P
is not desired, this pin may be left
DETECT
unconnected.
RF output.
5
6
7
RF OUT
N/C
VCC
No Connect, this pin may be left as a no connect or connected to ground.
Power supply for both the first and second stage. Connect as shown on the
evaluation board schematic.
No Connect, this pin may be left as a no connect or connected to ground.
8
N/C
Ground connection for the device “die flag”. The backside of the package
should be soldered to a top side ground pad which is connected to the PC
board ground plane through multiple vias.
Pkg
Gnd
GND
Package Drawing
0.63
0.53
2 PLCS
0.10 C
0.152
REF
INDEX
AREA
0.10 C
2 PLCS
2.20
0.05
0.00
SEATING
B
A
2.20
C
PLANE
0.65
0.10
MAX
1.20
1.00
TYP
0.31
0.21
0.28
0.18
Dimensions in mm.
Shaded lead is pin 1.
0.10 M C A B
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
5 of 14
RF5373
Theory of Operation
The RF5373 is a linear driver/amplifier that is designed for the 2.4GHz to 2.5GHz (IEEE802.11b/g and BT Class 1) band. Oper-
ating from a single 1.8V to 3.6V supply, the amplifier will easily be incorporated into WLAN designs with minimal external com-
ponents. The device is provided in a 2.2mmx2.2mmx0.6mm, 8-pin, QFN with a backside ground.
The RF5373 is a two-stage device with a nominal gain of 28dB to 29dB in the 2.4GHz to 2.5GHz ISM band. The RF5373 is
designed for multiple applications in the 2.4GHz to 2.5GHz band. The RF5373 requires only a single positive supply of 1.8V to
3.6V to operate to full specification. Power control is provided through one bias control input pin (VREG) which can range from
1.6V nominal and 1.85V maximum. The PA circuit layout from the evaluation board should be copied as closely as possible,
particularly the ground layout and ground vias. Other configurations may also work, but the design process is much easier and
quicker if the layout is copied from the RF5373 evaluation board. Gerber files of our designs are available on request.
There are multiple applications where the RF5373 may be implemented, including IEEE802.11b/g and Bluetooth. Please
review the RF5373 schematics for the optimum layout for a specific band. In order to obtain the best performance for an
802.11g application where the PA will be pulsed at <99% duty cycle, R1 must be populated with a 56Ω resistor. For all other
applications where pulsing is not needed, R1 can be substituted with a 0Ω or a trace line.
An application schematic for 2.5GHz operation is included that has two additional components, one shunt inductor, and one
shunt capacitor, on the output for improved second harmonic rejection. This layout provides ~20dB rejection at 5GHz with a
minimal BOM count.
The RF5373 is not a difficult part to implement, but care in circuit layout and component selection is always advisable when
designing circuits to operate at 2.5GHz. The RF5373 evaluation board layout and schematic is also available using 0201 com-
ponents which will help shrink the six of the total area of the power amplifier and matching components on the intended
design.
Please contact RFMD Sales or Applications Engineering for additional data and guidance.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
6 of 14
Rev A6 DS070521
RF5373
Pin Out
8
7
RF IN
N/C
1
2
6
5
N/C
RF OUT
3
4
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
7 of 14
RF5373
Application Schematic
IEEE802.11b/g and Bluetooth Class
Low Band Application Schematic for Harmonics Rejection
VCC
R1
0.1 μF
1.5 nH
1 μF
8
7
10 pF
RF IN
1
2
6
5
3.6 nH
Bias
1.2 nH
0201
DET
8 pF
RF OUT
2.2 pF*
0201
3
4
5373401, r.3
*The 2.2 pF cap can be placed at the same point
as the 1.2 nH inductor which should be as close as
possible to the DC blocking cap (8 pF) or it can be
placed up to 25 mils away from the inductor for the
best linear performance.
750 Ω
1 nF
330 pF
R1
0
Application
BT, 802.11 b
56 Above and 802.11g
VREG PDETECT
NOTES:
1. For VREG that is higher than the nominal voltage specified, a resistor bridge can be used to drop the voltage for VREG
to the appropriate level needed at the pins.
2. This evaluation board schematic and layout are also available using 0201 components. Please contact RFMD applications engineering for
more information.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
8 of 14
Rev A6 DS070521
RF5373
Evaluation Board Schematic
IEEE802.11b/g and Bluetooth Class 1,
High Pass Output Match Tune
R1
VCC
P1
1
C1
0.1 μF
GND
VCC
VCC
P1-2
P1-3
2
L1
1.5 nH
3
CON3
C2
1 μF
C3
8
7
10 pF
J3
RF IN
L2
3.6 nH
1
2
6
5
Bias
DET
4
J4
RF OUT
P2
1
50 Ω μstrip
C4
8 pF
GND
3
P2-2
P2-3
2
PDETECT
VREG
5373401, r.3
R1
0
Application
BT, 802.11 b
3
R2
0 Ω
R3
750 Ω
CON3
56 Above and 802.11g
C5
C6
1 nF
330 pF
VREG
PDETECT
NOTES:
1. For VREG that is higher than the nominal voltage specified, a resistor bridge can be used to drop the voltage for VREG
to the appropriate level needed at the pins.
2. This evaluation board schematic and layout are also available using 0201 components. Please contact RFMD applications engineering for
more information.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
9 of 14
RF5373
Evaluation Board Layout
Board Size 1.2”x1.2”
Board Thickness 0.032”, Board Material FR-4
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
10 of 14
Rev A6 DS070521
RF5373
EVM versus POUT
ACP versus POUT
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
ACP1 2400MHz
ACP1 2450MHz
ACP1 2500MHz
2400MHz ACP2
2450MHz ACP2
2500MHz ACP2
2400MHz
2450MHz
2500MHz
-1.0
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
10.0
11.0 12.0
13.0 14.0
15.0 16.0
17.0 18.0
19.0 20.0
Output Power (dBm)
Output Power (dBm)
PDETECT versus POUT
Operating Current versus POUT
1.2
1.0
0.8
0.6
0.4
0.2
0.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
2400MHz
2450MHz
2500MHz
2400MHz
2450MHz
2500MHz
-1.0
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
-1.0
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
Output Power (dBm)
Output Power (dBm)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
11 of 14
RF5373
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.44 x 0.28 Typ.
B = 0.28 x 0.44 Typ.
C = 1.30 Sq.
Dimensions in
mm.
0.65
Typ.
Pin 8
B
B
Pin 1
Pin 6
A
A
A
A
0.32 Typ.
C
0.65 Typ.
0.68 Typ.
B
B
Pin 4
0.68
Typ.
0.32 Typ.
PCB Solder Mask Pattern
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
12 of 14
Rev A6 DS070521
RF5373
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
A = 0.57 x 0.41 Typ.
B = 0.41 x 0.57 Typ.
C = 1.20 Sq.
Dimensions in
mm.
0.65
Typ.
Pin 8
B
B
Pin 1
Pin 6
A
A
A
A
0.32 Typ.
C
0.65 Typ.
0.68 Typ.
B
B
Pin 4
0.68
Typ.
0.32 Typ.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS070521
13 of 14
RF5373
RoHS* Banned Material Content
RoHS Compliant:
Yes
0.008
N/A
A
Package total weight in grams (g):
Compliance Date Code:
Bill of Materials Revision:
Pb Free Category:
e3
Parts Per Million (PPM)
Bill of Materials
Pb
0
Cd
0
Hg
0
Cr VI
PBB
0
PBDE
Die
0
0
0
0
0
0
0
0
0
0
0
0
Molding Compound
Lead Frame
Die Attach Epoxy
Wire
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Solder Plating
0
0
0
0
This RoHS banned material content declaration was prepared solely on information, including analytical
data, provided to RFMD by its suppliers, and applies to the Bill of Materials (BOM) revision noted
* DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the
use of certain hazardous substances in electrical and electronic equipment
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
14 of 14
Rev A6 DS070521
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