SBB-1000 [RFMD]

50MHZ TO 1000MHZ, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER; 50MHz至1000MHz ,可级联的有源偏置的InGaP HBT MMIC放大器
SBB-1000
型号: SBB-1000
厂家: RF MICRO DEVICES    RF MICRO DEVICES
描述:

50MHZ TO 1000MHZ, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER
50MHz至1000MHz ,可级联的有源偏置的InGaP HBT MMIC放大器

放大器 射频 微波
文件: 总6页 (文件大小:205K)
中文:  中文翻译
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SBB-1000  
50MHz to  
1000MHz,  
Cascadable  
Active Bias  
InGaP HBT  
MMIC Ampli-  
fier  
Preliminary  
SBB-1000  
50MHZ TO 1000MHZ, CASCADABLE ACTIVE  
BIAS InGaP HBT MMIC AMPLIFIER  
Package: Bare Die  
Product Description  
Features  
RFMD’s SBB-1000 is a high performance InGaP HBT MMIC amplifier utilizing a Darlington con-  
figuration with an active bias network. The active bias network provides stable current over tem-  
OIP3=42dBm @ 250MHz  
perature and process Beta variations. Its efficient operation from a single 5V supply and its P1dB=20dBm @ 500MHz  
compact size (0.59mmx0.70mm) make it ideal for high-density multi-chip module applica-  
tions. It is well-suited for high linearity 5V gain block applications and it is internally matched to  
50Ω.  
Single Fixed 5V Supply  
Compact Die Size  
(0.59mmx0.70mm)  
RFMD can provide 100% DC screening, visual inspection, and Hi-Rel wafer qualification. Die  
can be delivered at the wafer level or picked to gel or waffle paks.  
Patented Thermal Design and  
Bias Circuit  
Gain and Return Loss versus Frequency  
VS=5V, IS=90mA  
Optimum Technology  
Matching® Applied  
Low Thermal Resistance  
30.0  
20.0  
10.0  
0.0  
GaAs HBT  
Applications  
GaAs MESFET  
PA Driver Amp  
GSG Probe Data with Bias  
InGaP HBT  
Tees ZS=ZL=50 Ohms, T=25°C  
RF Pre-driver and RF Receive  
Path  
SiGe BiCMOS  
Si BiCMOS  
SiGe HBT  
GaAs pHEMT  
Si CMOS  
-10.0  
-20.0  
-30.0  
-40.0  
Military Communications  
Test and Instrumentation  
IRL  
Gain  
ORL  
Si BJT  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
GaN HEMT  
RF MEMS  
Frequency (GHz)  
Specification  
Typ.  
Parameter  
Unit  
Condition  
Min.  
50  
Max.  
1000  
Frequency of Operation  
Small Signal Gain  
Output Power at 1dB Compression  
MHz  
dB  
dBm  
dBm  
dBm  
dBm  
15.5  
21.5  
20.0  
19.0  
42.0  
Freq=250MHz, 500MHz, 1000MHz  
Freq=250MHz  
Freq=500MHz  
Freq=1000MHz  
Freq=250MHz  
Output IP  
3
40.5  
35.5  
>25  
18.5  
90  
dBm  
dBm  
dB  
dB  
mA  
Freq=500MHz  
Freq=1000MHz  
Freq=500MHz  
Freq=500MHz  
Input Return Loss  
Output Return Loss  
Current  
Noise Figure  
3.4  
dB  
Freq=500MHz  
Thermal Resistance  
48.8  
°C/W  
Junction to lead (89 pkg)  
Test Conditions: Z =50Ω, V =5V, I =90mA, T=25°C, OIP3 Tone Spacing=1MHz, P /tone=0dBm. GSG Probe Data with Bias Tees.  
0
D
D
OUT  
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-  
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
EDS-106098 Rev A  
1 of 6  
Preliminary  
SBB-1000  
Absolute Maximum Ratings  
Parameter  
Caution! ESD sensitive device.  
Rating  
110  
Unit  
mA  
V
Exceeding any one or a combination of the Absolute Maximum Rating conditions may  
cause permanent damage to the device. Extended application of Absolute Maximum  
Rating conditions to the device may reduce device reliability. Specified typical perfor-  
mance or functional operation of the device under Absolute Maximum Rating condi-  
tions is not implied.  
Total Current (I )  
D
Device Voltage (V )  
5.5  
D
Power Dissipation  
0.61  
W
RoHS status based on EUDirective2002/95/EC (at time of this document revision).  
Operating Lead Temperature (T )  
-40 to +85  
°C  
L
The information in this publication is believed to be accurate and reliable. However, no  
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any  
infringement of patents, or other rights of third parties, resulting from its use. No  
license is granted by implication or otherwise under any patent or patent rights of  
RFMD. RFMD reserves the right to change component circuitry, recommended appli-  
cation circuitry and specifications at any time without prior notice.  
RF Input Power  
+12(TBR)*  
-55 to +150  
+150  
dBm  
°C  
Storage Temperature Range  
Operating Junction Temp (T )  
°C  
J
ESD Rating - Human Body Model  
(HBM)  
Class 1C  
* TBR=To Be Reviewed  
Operation of this device beyond any one of these limits may cause permanent  
damage. For reliable continuous operation, the device voltage and current  
must not exceed the maximum operating values specified in the table on  
page one.  
Bias Conditions should also satisfy the following expression:  
I V <(T -T )/R , j-l  
D
D
J
L
TH  
Typical Performance (GSG Probe Data with Bias Tees) VD=5V, ID=90mA, T=25°C, Z=50Ω  
Parameter  
Units 50MHz 100MHz 250MHz 500MHz 750MHz 1000MHz  
Small Signal Gain  
dB  
15.8  
15.6  
15.5  
15.5  
15.5  
15.5  
Output 3rd Order Intercept Point (see  
note 1)  
dBm  
42.0  
40.5  
38.0  
35.5  
Output Power at 1dB Compression  
Input Return Loss  
dBm  
dB  
21.5  
34.0  
21.5  
18.5  
3.4  
20.0  
38.0  
18.5  
18.0  
3.4  
19.5  
32.0  
15.5  
18.0  
3.6  
19.0  
29.0  
13.5  
18.0  
3.6  
17.0  
15.0  
17.0  
3.4  
24.0  
19.0  
18.0  
Output Return Loss  
dB  
Reverse Isolation  
dB  
Noise Figure  
dB  
Note 1: 0dBm/tone, 1MHz spacing.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
2 of 6  
EDS-106098 Rev A  
Preliminary  
SBB-1000  
Typical Performance (GSG Probe Data with Bias Tees) VD=5.0V, ID=90mA  
P1dB versus Frequency  
OIP3 versus Frequency  
(0dBm/tone, 1MHz spacing)  
22.0  
21.0  
20.0  
19.0  
18.0  
44.0  
42.0  
40.0  
38.0  
36.0  
34.0  
32.0  
-20°C  
25°C  
85°C  
-20°C  
25°C  
85°C  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
Frequency (GHz)  
Frequency (GHz)  
Current versus Voltage  
Noise Figure versus Frequency  
120.0  
110.0  
100.0  
90.0  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
80.0  
-20°C  
25°C  
85°C  
70.0  
25°C  
85°C  
60.0  
4.8  
4.9  
5.0  
5.1  
5.2  
5.3  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
VD (V)  
Frequency (GHz)  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
EDS-106098 Rev A  
3 of 6  
Preliminary  
SBB-1000  
Typical Performance (GSG Probe Data with Bias Tees) VD=5.0V, ID=90mA  
S11 versus Frequency  
S21 versus Frequency  
0.0  
-5.0  
18.0  
17.0  
16.0  
15.0  
14.0  
13.0  
12.0  
-20°C  
25°C  
85°C  
-10.0  
-15.0  
-20.0  
-25.0  
-30.0  
-35.0  
-40.0  
-20°C  
25°C  
85°C  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
Frequency (GHz)  
Frequency (GHz)  
S12 versus Frequency  
S22 versus Frequency  
0.0  
-5.0  
0.0  
-5.0  
-10.0  
-15.0  
-20.0  
-25.0  
-30.0  
-35.0  
-40.0  
-10.0  
-15.0  
-20.0  
-25.0  
-30.0  
-20°C  
25°C  
85°C  
-20°C  
25°C  
85°C  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
Frequency (GHz)  
Frequency (GHz)  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
4 of 6  
EDS-106098 Rev A  
Preliminary  
SBB-1000  
Die Dimensions  
Bond Pad Description  
Bond Pad Function/Description  
RF IN  
This pad is DC coupled and matched to 50Ω. An external DC block is required.  
This pad is DC coupled and matched to 50Ω. DC bias is applied through this pad.  
Die backside must be connected to RF/DC ground using silver filled conductive epoxy.  
RF OUT  
DIE  
BACKSIDE  
Notes:  
1. All dimensions in inches [millimeters].  
2. Die Thickness is 0.004 [0.100].  
3. Typical bond pad is 0.004 (0.100) square.  
4. Backside metallization: Gold.  
5. Bond pad metallization: Gold.  
6. Backside is ground.  
Device Assembly  
Ordering Information  
Part Number  
Description  
Devices/Container  
SBB-1000  
Bare Die  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
EDS-106098 Rev A  
5 of 6  
Preliminary  
SBB-1000  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.  
6 of 6  
EDS-106098 Rev A  

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