MSDM-10
更新时间:2024-09-18 07:37:47
品牌:RHOMBUS-IND
描述:MSDM Series FAST / TTL Buffered Triple Independent Delays
MSDM-10 概述
MSDM Series FAST / TTL Buffered Triple Independent Delays MSDM系列FAST / TTL缓冲三自主延误 延迟线
MSDM-10 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Active |
零件包装代码: | DIP | 包装说明: | DIP, DIP8/14,.3 |
针数: | 14 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.7 |
Is Samacsys: | N | 其他特性: | LG_MAX; WD_MAX |
系列: | MSDM | JESD-30 代码: | R-PDIP-T8 |
长度: | 20.57 mm | 负载电容(CL): | 10 pF |
逻辑集成电路类型: | ACTIVE DELAY LINE | 功能数量: | 3 |
抽头/阶步数: | 1 | 端子数量: | 8 |
最高工作温度: | 70 °C | 最低工作温度: | |
输出极性: | TRUE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装等效代码: | DIP8/14,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
最大电源电流(ICC): | 95 mA | 可编程延迟线: | NO |
认证状态: | Not Qualified | 座面最大高度: | 6.99 mm |
最大供电电压 (Vsup): | 5.25 V | 最小供电电压 (Vsup): | 4.75 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | TTL | 温度等级: | COMMERCIAL |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 总延迟标称(td): | 10 ns |
宽度: | 10.16 mm | Base Number Matches: | 1 |
MSDM-10 数据手册
通过下载MSDM-10数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载MSDM Series FAST / TTL Buffered Triple Independent Delays
Electrical Specifications at 25OC
14-Pin Package Commercial
and Mil-Grade Versions
FAST/TTL Logic Buffered
14 Pin DIL TTL Buffered
Triple Independent Delays
Delay
Tolerance
(ns)
Commercial
Part Number
MIL-Grade
Part Number
3 Independent Equal Delay Lines
*** Unique Delays Per Line are Available ***
MSDM-5
MSDM-6
MSDM3-5M
MSDM3-6M
MSDM3-7M
MSDM3-8M
MSDM3-9M
MSDM3-10M
MSDM3-15M
MSDM3-20M
MSDM3-25M
MSDM3-30M
MSDM3-35M
MSDM3-40M
MSDM3-45M
MSDM3-50M
MSDM3-60M
MSDM3-70M
MSDM3-75M
MSDM3-80M
MSDM3-90M
MSDM3-100M
5 ± 1.00
6 ± 1.00
Operating Temperature Ranges
0OC to +70OC, or -55OC to +125OC
7 ± 1.00
MSDM-7
MSDM-8
8 ± 1.00
8-pin DIP/SMD Versions: FAM3D Series
14-pin DIP/SMD Versions: FAI3D Series
9 ± 1.00
MSDM-9
10 ± 1.50
15 ± 2.00
20 ± 2.00
25 ± 2.00
30 ± 2.00
35 ± 2.00
40 ± 2.00
45 ± 2.25
50 ± 2.50
60 ± 3.00
70 ± 3.50
75 ± 3.75
80 ± 4.00
90 ± 4.50
100 ± 5.0
MSDM-10
MSDM-15
MSDM-20
MSDM-25
MSDM-30
MSDM-35
MSDM-40
MSDM-45
MSDM-50
MSDM-60
MSDM-70
MSDM-75
MSDM-80
MSDM-90
MSDM-100
MSDM 14-Pin Schematic
OUT
12
OUT
10
OUT
8
Vcc
14
1
2
3
1
3
5
7
IN
IN
IN
GND
1
2
3
TEST CONDITIONS -- FAST / TTL
Dimensions in Inches (mm)
VCC Supply Voltage ................................................ 5.00VDC
Input Pulse Voltage ................................................... 3.20V
Input Pulse Rise Time....................................... 3.0 ns max.
Input Pulse Width / Period .......................... 1000 / 2000 ns
1. Measurements made at 25OC
Commercial Grade 14-Pin Package with Unused Leads Removed
as per Schematic. (For Mil-Grade MSDM3 the Height is 0.335")
.810
(20.57)
MAX.
.400
(10.16)
MAX.
2. Delay Times measured at 1.50V level of leading edge.
3. Rise Times measured from 0.75V to 2.40V.
4. 10pf probe and fixture load on output under test.
.245
(6.22)
TYP.
.275
(6.99)
MAX.
OPERATING SPECIFICATIONS
VCC Supply Voltage ................................... 5.00 ± 0.25 VDC
ICC Supply Current .......................... 45 mA typ, 95 mA max.
Logic“1”Input: VIH ....................... 2.00 V min., 5.50 V max.
IIH ............................... 20 µA max. @ 2.70V
.120
(3.05)
MIN.
.010
(0.25)
TYP.
.300
(7.62)
Logic “0” Input: VIL ........................................... 0.80 V max.
IIL ............................................ -0.6 mA mA
.200
(5.08)
TYP.
.050
(1.27)
TYP.
.020
(0.51)
TYP.
VOH Logic “1” Voltage Out .................................. 2.40 V min.
VOL Logic “0” Voltage Out ................................ 0.50 V max.
PWI Input Pulse Width........................... 100% of Delay min.
Operating Temperature Range ........................... 0O to 70OC
Storage Temperature Range ..................... -65O to +150OC
MIL-GRADE: MSDM3 Military Grade delay lines use inte-
grated circuits screened to MIL-STD-883B with an operating
temperature range of -55 to +125OC. These devices have a
package height of .335"
P/ N De sc rip tion
MSDM - XXX X
Buffered Triple Delays:
14-pin Com'l: MSDM
14-pin MIL: MSDM3
Total Delay in nanoseconds (ns)
Auto-Insertable DIP and Surface Mount Versions:
Refer to FAI3D Series, same 14-pin footprint.
For space saving, refer to FAM3D 8-pin Series
Temp. Range Blank = Commercial
M = Mil-Grade
Examples: MSDM-25 =
25ns (25ns per Line)
74F, 14-Pin Thru-hole
MSDM3-50M = 50ns (50ns per Line)
74F, 14-Pin, Mil-Grade
For other values & Custom Designs, contact factory.
Specifications subject to change without notice.
MSDM 9901
15801 Chemical Lane, Huntington Beach, CA 92649-1595
Phone: (714) 898-0960 • FAX: (714) 896-0971
www.rhombus-ind.com • email: sales@rhombus-ind.com
Rhombus
Industries Inc.
MSDM-10 相关器件
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MSDM-35 | RHOMBUS-IND | MSDM Series FAST / TTL Buffered Triple Independent Delays | 获取价格 | |
MSDM-40 | RHOMBUS-IND | MSDM Series FAST / TTL Buffered Triple Independent Delays | 获取价格 | |
MSDM-45 | RHOMBUS-IND | MSDM Series FAST / TTL Buffered Triple Independent Delays | 获取价格 | |
MSDM-5 | RHOMBUS-IND | MSDM Series FAST / TTL Buffered Triple Independent Delays | 获取价格 | |
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