MSDM-10

更新时间:2024-09-18 07:37:47
品牌:RHOMBUS-IND
描述:MSDM Series FAST / TTL Buffered Triple Independent Delays

MSDM-10 概述

MSDM Series FAST / TTL Buffered Triple Independent Delays MSDM系列FAST / TTL缓冲三自主延误 延迟线

MSDM-10 规格参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:DIP包装说明:DIP, DIP8/14,.3
针数:14Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.7
Is Samacsys:N其他特性:LG_MAX; WD_MAX
系列:MSDMJESD-30 代码:R-PDIP-T8
长度:20.57 mm负载电容(CL):10 pF
逻辑集成电路类型:ACTIVE DELAY LINE功能数量:3
抽头/阶步数:1端子数量:8
最高工作温度:70 °C最低工作温度:
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP8/14,.3
封装形状:RECTANGULAR封装形式:IN-LINE
最大电源电流(ICC):95 mA可编程延迟线:NO
认证状态:Not Qualified座面最大高度:6.99 mm
最大供电电压 (Vsup):5.25 V最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:TTL温度等级:COMMERCIAL
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL总延迟标称(td):10 ns
宽度:10.16 mmBase Number Matches:1

MSDM-10 数据手册

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MSDM Series FAST / TTL Buffered Triple Independent Delays  
Electrical Specifications at 25OC  
14-Pin Package Commercial  
and Mil-Grade Versions  
FAST/TTL Logic Buffered  
14 Pin DIL TTL Buffered  
Triple Independent Delays  
Delay  
Tolerance  
(ns)  
Commercial  
Part Number  
MIL-Grade  
Part Number  
3 Independent Equal Delay Lines  
*** Unique Delays Per Line are Available ***  
MSDM-5  
MSDM-6  
MSDM3-5M  
MSDM3-6M  
MSDM3-7M  
MSDM3-8M  
MSDM3-9M  
MSDM3-10M  
MSDM3-15M  
MSDM3-20M  
MSDM3-25M  
MSDM3-30M  
MSDM3-35M  
MSDM3-40M  
MSDM3-45M  
MSDM3-50M  
MSDM3-60M  
MSDM3-70M  
MSDM3-75M  
MSDM3-80M  
MSDM3-90M  
MSDM3-100M  
5 ± 1.00  
6 ± 1.00  
Operating Temperature Ranges  
0OC to +70OC, or -55OC to +125OC  
7 ± 1.00  
MSDM-7  
MSDM-8  
8 ± 1.00  
8-pin DIP/SMD Versions: FAM3D Series  
14-pin DIP/SMD Versions: FAI3D Series  
9 ± 1.00  
MSDM-9  
10 ± 1.50  
15 ± 2.00  
20 ± 2.00  
25 ± 2.00  
30 ± 2.00  
35 ± 2.00  
40 ± 2.00  
45 ± 2.25  
50 ± 2.50  
60 ± 3.00  
70 ± 3.50  
75 ± 3.75  
80 ± 4.00  
90 ± 4.50  
100 ± 5.0  
MSDM-10  
MSDM-15  
MSDM-20  
MSDM-25  
MSDM-30  
MSDM-35  
MSDM-40  
MSDM-45  
MSDM-50  
MSDM-60  
MSDM-70  
MSDM-75  
MSDM-80  
MSDM-90  
MSDM-100  
MSDM 14-Pin Schematic  
OUT  
12  
OUT  
10  
OUT  
8
Vcc  
14  
1
2
3
1
3
5
7
IN  
IN  
IN  
GND  
1
2
3
TEST CONDITIONS -- FAST / TTL  
Dimensions in Inches (mm)  
VCC Supply Voltage ................................................ 5.00VDC  
Input Pulse Voltage ................................................... 3.20V  
Input Pulse Rise Time....................................... 3.0 ns max.  
Input Pulse Width / Period .......................... 1000 / 2000 ns  
1. Measurements made at 25OC  
Commercial Grade 14-Pin Package with Unused Leads Removed  
as per Schematic. (For Mil-Grade MSDM3 the Height is 0.335")  
.810  
(20.57)  
MAX.  
.400  
(10.16)  
MAX.  
2. Delay Times measured at 1.50V level of leading edge.  
3. Rise Times measured from 0.75V to 2.40V.  
4. 10pf probe and fixture load on output under test.  
.245  
(6.22)  
TYP.  
.275  
(6.99)  
MAX.  
OPERATING SPECIFICATIONS  
VCC Supply Voltage ................................... 5.00 ± 0.25 VDC  
ICC Supply Current .......................... 45 mA typ, 95 mA max.  
Logic1Input: VIH ....................... 2.00 V min., 5.50 V max.  
IIH ............................... 20 µA max. @ 2.70V  
.120  
(3.05)  
MIN.  
.010  
(0.25)  
TYP.  
.300  
(7.62)  
Logic “0” Input: VIL ........................................... 0.80 V max.  
IIL ............................................ -0.6 mA mA  
.200  
(5.08)  
TYP.  
.050  
(1.27)  
TYP.  
.020  
(0.51)  
TYP.  
VOH Logic “1” Voltage Out .................................. 2.40 V min.  
VOL Logic “0” Voltage Out ................................ 0.50 V max.  
PWI Input Pulse Width........................... 100% of Delay min.  
Operating Temperature Range ........................... 0O to 70OC  
Storage Temperature Range ..................... -65O to +150OC  
MIL-GRADE: MSDM3 Military Grade delay lines use inte-  
grated circuits screened to MIL-STD-883B with an operating  
temperature range of -55 to +125OC. These devices have a  
package height of .335"  
P/ N De sc rip tion  
MSDM - XXX X  
Buffered Triple Delays:  
14-pin Com'l: MSDM  
14-pin MIL: MSDM3  
Total Delay in nanoseconds (ns)  
Auto-Insertable DIP and Surface Mount Versions:  
Refer to FAI3D Series, same 14-pin footprint.  
For space saving, refer to FAM3D 8-pin Series  
Temp. Range Blank = Commercial  
M = Mil-Grade  
Examples: MSDM-25 =  
25ns (25ns per Line)  
74F, 14-Pin Thru-hole  
MSDM3-50M = 50ns (50ns per Line)  
74F, 14-Pin, Mil-Grade  
For other values & Custom Designs, contact factory.  
Specifications subject to change without notice.  
MSDM 9901  
15801 Chemical Lane, Huntington Beach, CA 92649-1595  
Phone: (714) 898-0960 FAX: (714) 896-0971  
www.rhombus-ind.com email: sales@rhombus-ind.com  
Rhombus  
Industries Inc.  

MSDM-10 相关器件

型号 制造商 描述 价格 文档
MSDM-100 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-15 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-20 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-25 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-30 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-35 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-40 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-45 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-5 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格
MSDM-50 RHOMBUS-IND MSDM Series FAST / TTL Buffered Triple Independent Delays 获取价格

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