RT9715CA [RICHTEK]

Reverse Blocking Current;
RT9715CA
型号: RT9715CA
厂家: RICHTEK TECHNOLOGY CORPORATION    RICHTEK TECHNOLOGY CORPORATION
描述:

Reverse Blocking Current

文件: 总12页 (文件大小:240K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
RT9715CA  
90mΩ, 1.5A High-Side Power Switches with Flag  
General Description  
Features  
90mΩ (typ.) N-MOSFET Switch  
Operating Range : 2.7V to 5.5V  
Reverse Blocking Current  
Under Voltage Lockout  
The RT9715CA is a cost-effective, low-voltage, single  
N-MOSFET high-side Power Switch IC for USB application.  
Low switch-on resistance (typ. 90mΩ) and low supply  
current (typ. 50μA) are realized in this IC.  
Deglitched Fault Report (FLG)  
Thermal Protection with Foldback  
Over Current Protection  
The RT9715CAintegrates an over-current protection circuit,  
a short fold back circuit, a thermal shutdown circuit and  
an under-voltage lockout circuit for overall protection.  
Besides, a flag output is available to indicate fault  
conditions to the local USB controller. Furthermore, the  
chip also integrates an embedded delay function to prevent  
miss-operation from happening due to inrush-current. The  
RT9715CAis an ideal solution for USB power supply and  
can support in package SOT-23-5.  
Short Circuit Protection  
UL ApprovedE219878  
Nemko ApprovedNO49621  
RoHS Compliant and Halogen Free  
Applications  
USB Peripherals  
Notebook PCs  
Ordering Information  
RT9715CA  
Pin Configurations  
Package Type  
B : SOT-23-5  
(TOP VIEW)  
Lead Plating System  
VIN  
EN  
G : Green (Halogen Free and Pb Free)  
5
4
Note :  
2
3
Richtek products are :  
RoHS compliant and compatible with the current require-  
ments of IPC/JEDEC J-STD-020.  
Suitable for use in SnPb or Pb-free soldering processes.  
VOUT GND FLG  
SOT-23-5  
Marking Information  
4R= : Product Code  
4R=DNN  
DNN : Date Code  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS9715CA-00 April 2015  
www.richtek.com  
1
RT9715CA  
Typical Application Circuit  
Pull-Up Resistor (10k to 100k)  
USB Controller  
Over -Current  
Supply Voltage  
2.7V to 5.5V  
FLG  
VIN  
C
1µF  
IN  
RT9715CA  
VOUT  
GND  
V
BUS  
Enable  
EN  
D+  
C
10µF  
OUT  
150µF  
D-  
GND  
Ferrite  
Beads  
Data  
Note : A low-ESR 150μF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to meet the  
330mV maximum droop requirement in the hub VBUS. (see Application Information Section for further details)  
Functional Pin Description  
Pin No.  
Pin Name  
Pin Function  
1
2
3
4
5
VOUT  
Output Voltage.  
GND  
Ground.  
Fault FLAG Output.  
Chip Enable (Active High).  
Power Input Voltage.  
FLG  
EN  
VIN  
Function Block Diagram  
VIN  
Bias  
EN  
Current  
Limiting  
UVLO  
Gate  
Charge  
Control  
Pump  
Oscillator  
Output Voltage  
Detection  
VOUT  
FLG  
Thermal  
Protection  
Delay  
GND  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
2
DS9715CA-00 April 2015  
RT9715CA  
Absolute Maximum Ratings (Note 1)  
Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 6V  
ENVoltage -------------------------------------------------------------------------------------------------------------- 0.3V to 6V  
FLAGVoltage ---------------------------------------------------------------------------------------------------------- 6V  
Power Dissipation, PD @ TA = 25°C  
SOT-23-5 ---------------------------------------------------------------------------------------------------------------- 0.3W  
Package Thermal Resistance (Note 2)  
SOT-23-5, θJA ----------------------------------------------------------------------------------------------------------- 250°C/W  
Junction Temperature ------------------------------------------------------------------------------------------------- 150°C  
Lead Temperature (Soldering, 10 sec.)--------------------------------------------------------------------------- 260°C  
Storage Temperature Range ---------------------------------------------------------------------------------------- 65°C to 150°C  
ESD Susceptibility (Note 3)  
HBM (Human Body Mode) ------------------------------------------------------------------------------------------ 2kV  
MM (Machine Mode) -------------------------------------------------------------------------------------------------- 200V  
Recommended Operating Conditions (Note 4)  
Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 2.7V to 5.5V  
ENVoltage -------------------------------------------------------------------------------------------------------------- 0V to 5.5V  
Junction Temperature Range---------------------------------------------------------------------------------------- 40°C to 100°C  
Ambient Temperature Range---------------------------------------------------------------------------------------- 40°C to 85°C  
Electrical Characteristics  
(VIN = 5V, CIN = 1μF, COUT = 10μF, TA = 25°C, unless otherwise specified)  
Parameter  
Input Quiescent Current  
Input Shutdown Current  
Switch On Resistance  
Current Limit  
Symbol  
Test Conditions  
Min  
--  
Typ  
50  
0.1  
90  
2
Max  
70  
Unit  
I
I
Switch On, V  
Switch Off, V  
= Open  
= Open  
Q
OUT  
OUT  
A  
--  
1
SHDN  
V
V
V
= 5V, I  
= 1.3A  
--  
110  
2.8  
m  
IN  
OUT  
I
I
= 4V  
1.5  
A
LIM  
OUT  
= 0V, Measured Prior to  
Thermal Shutdown  
OUT  
Short Current  
--  
1.4  
--  
A
V
SC_FB  
Logic_High Voltage  
Logic_Low Voltage  
V
V
I
V
V
V
V
= 2.7V to 5.5V  
= 2.7V to 5.5V  
= 5V  
2
--  
--  
--  
--  
--  
--  
--  
--  
--  
0.8  
0.1  
1
IH  
IL  
IN  
EN  
Threshold  
IN  
EN Input Current  
0.01  
0.5  
200  
20  
A  
A  
s  
EN  
EN  
EN  
Output Leakage Current  
Output Turn-On Rise Time  
I
= 0V, R  
= 0  
LOAD  
LEAKAGE  
T
10% to 90% of V  
Rising  
OUT  
--  
ON_RISE  
I
= 1mA  
= 5V  
--  
R
FLG  
SINK  
FLG Output Resistance  
FLG Off Current  
I
0.01  
1
A  
FLG_OFF  
V
FLG  
From fault condition to FLG  
assertion  
T
D
5
12  
20  
ms  
FLG Delay Time  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS9715CA-00 April 2015  
www.richtek.com  
3
RT9715CA  
Parameter  
Under-Voltage Lockout  
Under-Voltage Hysteresis  
Symbol  
Test Conditions  
Rising  
Min  
1.3  
--  
Typ  
1.7  
0.1  
120  
100  
20  
Max  
--  
Unit  
V
V
UVLO  
V
V
V
V
V
IN  
V  
Decreasing  
--  
V
UVLO  
IN  
> 1V  
= 0V  
= 0V  
--  
--  
°C  
°C  
°C  
OUT  
OUT  
OUT  
Thermal Shutdown Protection  
Thermal Shutdown Hysteresis  
T
SD  
--  
--  
--  
--  
Note 1. Stresses beyond those listed Absolute Maximum Ratingsmay cause permanent damage to the device. These are  
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the  
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect  
device reliability.  
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.  
Note 3. Devices are ESD sensitive. Handling precaution is recommended.  
Note 4. The device is not guaranteed to function outside its operating conditions.  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
4
DS9715CA-00 April 2015  
RT9715CA  
Typical Operating Characteristics  
On Resistance vs. Temperature  
On Resistance vs. Input Voltage  
125  
120  
115  
110  
105  
100  
95  
108  
IOUT = 2A  
VIN = 5V, IOUT = 2A  
106  
104  
102  
100  
98  
90  
96  
85  
94  
80  
92  
75  
70  
90  
-40  
-25  
-10  
5
20  
35  
50  
65  
80  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
5.5  
5.5  
5.5  
Temperature (°C)  
Input Voltage (V)  
Quiescent Current vs. Input Voltage  
Quiescent Current vs. Temperature  
60  
58  
56  
54  
52  
50  
48  
46  
44  
42  
40  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
No Load  
VIN = 5V, No Load  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
-40 -25 -10  
5
20 35 50 65 80 95 110  
Temperature (°C)  
Input Voltage (V)  
Shutdown Current vs. Input Voltage  
Shutdown Current vs. Temperature  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
No Load  
VIN = 5V  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
-40 -25 -10  
5
20 35 50 65 80 95 110  
Temperature (°C)  
Input Voltage (V)  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS9715CA-00 April 2015  
www.richtek.com  
5
RT9715CA  
Output Voltage vs. Output Current  
UVLO Threshold vs. Temperature  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
VIN = 5V  
Rising  
Falling  
VIN = 3.3V  
0
0.25 0.5 0.75  
1
1.25 1.5 1.75  
2
2.25 2.5  
-40 -25 -10  
5
20 35 50 65 80 95 110  
Temperature (°C)  
Output Current (A)  
Current Limit vs. Input Voltage  
Current Limit vs. Temperature  
2.4  
2.3  
2.2  
2.1  
2.0  
1.9  
1.8  
1.7  
1.6  
2.40  
2.35  
2.30  
2.25  
2.20  
2.15  
2.10  
2.05  
2.00  
VIN = 5V  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
5.5  
-40 -25 -10  
5
20 35 50 65 80 95 110  
Temperature (°C)  
Input Voltage (V)  
Short Current vs. Input Voltage  
Short Current vs. Temperature  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
VIN = 5V  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
5.5  
-40 -25 -10  
5
20 35 50 65 80 95 110  
Temperature (°C)  
Input Voltage (V)  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
6
DS9715CA-00 April 2015  
RT9715CA  
FLG Delay Time vs. Input Voltage  
FLG Delay Time vs. Temperature  
12  
11  
10  
9
12.0  
11.5  
11.0  
10.5  
10.0  
9.5  
VIN = 5V  
8
7
6
9.0  
5
8.5  
4
8.0  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
5.5  
-40 -25 -10  
5
20 35 50 65 80 95 110  
Temperature (°C)  
Input Voltage (V)  
Power On from VIN  
Power Off from VIN  
EN = 5V, No Load  
EN = 5V, No Load  
VIN  
(2V/Div)  
VIN  
(2V/Div)  
VOUT  
(2V/Div)  
VOUT  
(2V/Div)  
Time (25ms/Div)  
Time (25ms/Div)  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS9715CA-00 April 2015  
www.richtek.com  
7
RT9715CA  
Applications Information  
The RT9715CA is a single N-MOSFET high-side power  
switches with enable input, optimized for self-powered and  
bus-powered Universal Serial Bus (USB) applications. The  
RT9715CA is equipped with a charge pump circuitry to  
drive the internal N-MOSFET switch; the switch's low  
RDS(ON), 90mΩ, meets USB voltage drop requirements;  
and a flag output is available to indicate fault conditions  
to the local USB controller.  
soft-startfeature effectively isolates the power source  
from extremely large capacitive loads, satisfying the USB  
voltage droop requirements.  
Fault Flag  
The RT9715CA series provides a FLG signal pin which is  
anN-Channel open drain MOSFET output. This open drain  
output goes low when current limit or the die temperature  
exceeds 120°C approximately. The FLGoutput is capable  
of sinking a 10mA load to typically 200mV above ground.  
The FLGpin requires a pull-up resistor, this resistor should  
be large in value to reduce energy drain.A100kΩ pull-up  
resistor works well for most applications. In the case of  
an over-current condition, FLGwill be asserted only after  
the flag response delay time, tD, has elapsed. This ensures  
that FLGis asserted only upon valid over-current conditions  
and that erroneous error reporting is eliminated.  
Input and Output  
VIN (input) is the power source connection to the internal  
circuitry and the drain of the MOSFET. VOUT (output) is  
the source of the MOSFET. In a typical application, current  
flows through the switch from VIN to VOUT toward the load.  
If VOUT is greater than VIN, current will flow from VOUT to  
VIN since the MOSFET is bidirectional when on.  
Unlike a normal MOSFET, there is no parasitic body diode  
between drain and source of the MOSFET, the RT9715CA  
prevents reverse current flow if VOUT is externally forced  
to a higher voltage than VIN when the chip is disabled  
(VEN < 0.8V).  
For example, false over-current conditions may occur  
during hot-plug events when extremely large capacitive  
loads are connected and causes a high transient inrush  
current that exceeds the current limit threshold. The FLG  
response delay time tD is typically 12ms.  
S
D
Under-Voltage Lockout  
S
D
Under-voltage lockout (UVLO) prevents the MOSFET  
switch from turning on until input the voltage exceeds  
approximately 1.7V. If input voltage drops below  
approximately 1.3V, UVLO turns off the MOSFET switch.  
Under-voltage detection functions only when the switch  
is enabled.  
G
G
Normal MOSFET  
RT9715CA  
Chip Enable Input  
The switch will be disabled when the EN pin is in a logic  
low condition. During this condition, the internal circuitry  
and MOSFET will be turned off, reducing the supply current  
to 0.1μA typical. Floating the EN may cause unpredictable  
operation. EN should not be allowed to go negative with  
respect to GND. The EN pin may be directly tied to VIN  
(GND) to keep the part on.  
Current Limiting and Short-Circuit Protection  
The current limit circuitry prevents damage to the MOSFET  
switch and the hub downstream port but can deliver load  
current up to the current limit threshold of typically 1.5A  
through the switch for RT9715CA. When a heavy load or  
short circuit is applied to an enabled switch, a large  
transient current may flow until the current limit circuitry  
responds. Once this current limit threshold is exceeded,  
the device enters constant current mode until the thermal  
shutdown occurs or the fault is removed.  
Soft-Start for Hot Plug-In Applications  
In order to eliminate the upstream voltage droop caused  
by the large inrush current during hot-plug events, the  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
8
DS9715CA-00 April 2015  
RT9715CA  
Thermal Shutdown  
any set of conditions can be estimated by the following  
thermal equation :  
Thermal protection limits the power dissipation in  
RT9715CA. When the operation junction temperature  
exceeds 120°C, the OTP circuit starts the thermal  
shutdown function and turns the pass element off. The  
pass element turn on again after the junction temperature  
cools to 80°C. The RT9715CA lowers its OTP trip level  
from 120°C to 100°C when output short circuit occurs  
(VOUT < 1V) as shown in Figure 1.  
PD (MAX) = ( TJ (MAX) T ) / θJA  
A
Where TJ (MAX) is the maximum junction temperature of  
the die (100°C) andTA is the maximum ambient temperature.  
The junction to ambient thermal resistance (θJA) for  
SOT-23-5 package at recommended minimum footprint  
are 250°C/W (θJA is layout dependent).  
V
Short to GND  
Universal Serial Bus (USB) & Power Distribution  
OUT  
The goal of USB is to enable device from different vendors  
to interoperate in an open architecture. USB features  
include ease of use for the end user, a wide range of  
workloads and applications, robustness, synergy with the  
PC industry, and low-cost implementation. Benefits  
include self-identifying peripherals, dynamically attachable  
and reconfigurable peripherals, multiple connections  
(support for concurrent operation of many devices), support  
for as many as 127 physical devices, and compatibility  
with PC Plug-and-Play architecture.  
1V  
V
OUT  
I
OUT  
Thermal  
Shutdown  
120C  
100 C  
OTP Trip Point  
100 C  
80 C  
IC Temperature  
The Universal Serial Bus connects USB devices with a  
USB host: each USB system has one USB host. USB  
devices are classified either as hubs, which provide  
additional attachment points to the USB, or as functions,  
which provide capabilities to the system (for example, a  
digital joystick). Hub devices are then classified as either  
Bus-Power Hubs or Self-Powered Hubs.  
Figure 1. Short Circuit Thermal Folded Back Protection  
when Output Short Circuit Occurs (Patent)  
Power Dissipation  
The junction temperature of the RT9715CA series depend  
on several factors such as the load, PCB layout, ambient  
temperature and package type. The output pin of the  
RT9715CA can deliver the current of up to 1.5A  
(RT9715CA) over the full operating junction temperature  
range. However, the maximum output current must be  
decreased at higher ambient temperature to ensure the  
junction temperature does not exceed 100°C. With all  
possible conditions, the junction temperature must be  
within the range specified under operating conditions.  
Power dissipation can be calculated based on the output  
current and the RDS(ON) of the switch as below.  
ABus-Powered Hub draws all of the power to any internal  
functions and downstream ports from the USB connector  
power pins. The hub may draw up to 500mA from the  
upstream device. External ports in a Bus-Powered Hub  
can supply up to 100mAper port, with a maximum of four  
external ports.  
Self-Powered Hub power for the internal functions and  
downstream ports does not come from the USB, although  
the USB interface may draw up to 100mA from its  
upstream connect, to allow the interface to function when  
the remainder of the hub is powered down. The hub must  
be able to supply up to 500mA on all of its external  
downstream ports. Please refer to Universal Serial  
Specification Revision 2.0 for more details on designing  
compliant USB hub and host systems.  
2
PD = RDS(ON) x IOUT  
Although the device is rated for 1.5A of output current,  
but the application may limit the amount of output current  
based on the total power dissipation and the ambient  
temperature. The final operating junction temperature for  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS9715CA-00 April 2015  
www.richtek.com  
9
RT9715CA  
Over-Current protection devices such as fuses and PTC  
resistors (also called polyfuse or polyswitch) have slow  
trip times, high on-resistance, and lack the necessary  
circuitry for USB-required fault reporting.  
Voltage Drop  
The USB specification states a minimum port-output  
voltage in two locations on the bus, 4.75V out of a Self-  
Powered Hub port and 4.40V out of a Bus-Powered Hub  
port. As with the Self-Powered Hub, all resistive voltage  
drops for the Bus-Powered Hub must be accounted for to  
guarantee voltage regulation (see Figure 7-47 of Universal  
Serial Specification Revision 2.0).  
The faster trip time of the RT9715CA power distribution  
allows designers to design hubs that can operate through  
faults. The RT9715CA provides low on-resistance and  
internal fault-reporting circuitry to meet voltage regulation  
and fault notification requirements.  
The following calculation determines VOUT (MIN) for multi-  
ple ports (NPORTS) ganged together through one switch (if  
using one switch per port, NPORTS is equal to 1) :  
Because the devices are also power switches, the designer  
of self-powered hubs has the flexibility to turn off power to  
output ports. Unlike a normal MOSFET, the devices have  
controlled rise and fall times to provide the needed inrush  
current limiting required for the bus-powered hub power  
switch.  
VOUT (MIN) = 4.75V [ II x ( 4 x RCONN + 2 x RCABLE ) ] −  
(0.1A x NPORTS x RSWITCH ) VPCB  
Where  
RCONN = Resistance of connector contacts  
(two contacts per connector)  
Supply Filter/Bypass Capacitor  
A 1μF low-ESR ceramic capacitor from VIN to GND,  
located at the device is strongly recommended to prevent  
the input voltage drooping during hot-plug events. However,  
higher capacitor values will further reduce the voltage droop  
on the input. Furthermore, without the bypass capacitor,  
an output short may cause sufficient ringing on the input  
(from source lead inductance) to destroy the internal  
control circuitry. The input transient must not exceed 6V  
of the absolute maximum supply voltage even for a short  
duration.  
RCABLE = Resistance of upstream cable wires  
(one 5V and one GND)  
RSWITCH = Resistance of power switch  
(90mΩ typical for RT9715CA)  
VPCB = PCB voltage drop  
The USB specification defines the maximum resistance  
per contact (RCONN) of the USB connector to be 30mΩ  
and the drop across the PCB and switch to be 100mV.  
This basically leaves two variables in the equation: the  
resistance of the switch and the resistance of the cable.  
Output Filter Capacitor  
A low-ESR 150μF aluminum electrolytic or tantalum  
between VOUT andGNDis strongly recommended to meet  
the 330mV maximum droop requirement in the hub VBUS  
(Per USB 2.0, output ports must have a minimum 120μF  
of low-ESR bulk capacitance per hub). Standard bypass  
methods should be used to minimize inductance and  
resistance between the bypass capacitor and the  
downstream connector to reduce EMI and decouple voltage  
droop caused when downstream cables are hot-insertion  
transients. Ferrite beads in series with VBUS, the ground  
line and the 0.1μF bypass capacitors at the power  
connector pins are recommended for EMI and ESD  
protection. The bypass capacitor itself should have a low  
dissipation factor to allow decoupling at higher frequencies.  
If the hub consumes the maximum current (II) of 500mA,  
the maximum resistance of the cable is 90mΩ.  
The resistance of the switch is defined as follows :  
RSWITCH = { 4.75V 4.4V [ 0.5A x ( 4 x 30mΩ + 2 x  
90mΩ) ] VPCB   
}
( 0.1A x NPORTS  
( 0.1A x NPORTS  
)
)
= (200mV V  
)
PCB  
If the voltage drop across the PCB is limited to 100mV,  
the maximum resistance for the switch is 250mΩ for four  
ports ganged together. The RT9715CA, with its maximum  
110mΩ on-resistance over temperature, can fit the demand  
of this requirement.  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
10  
DS9715CA-00 April 2015  
RT9715CA  
Thermal Considerations  
Layout Consideration  
For continuous operation, do not exceed absolute  
maximum operation junction temperature. The maximum  
power dissipation depends on the thermal resistance of  
IC package, PCB layout, the rate of surroundings airflow  
and temperature difference between junction to ambient.  
The maximum power dissipation can be calculated by  
following formula :  
In order to meet the voltage drop, droop, and EMI  
requirements, careful PCB layout is necessary. The  
following guidelines must be followed :  
Locate the ceramic bypass capacitors as close as  
possible to the VIN pins of the RT9715CA.  
Place a ground plane under all circuitry to lower both  
resistance and inductance and improveDC and transient  
performance (Use a separate ground and power plans if  
possible).  
PD(MAX) = (TJ(MAX) TA) / θJA  
Where TJ(MAX) is the maximum operation junction  
temperature 100°C, TAis the ambient temperature and the  
θJA is the junction to ambient thermal resistance.  
Keep all VBUS traces as short as possible and use at  
least 50-mil, 2 ounce copper for all VBUS traces.  
For recommended operating conditions specification of  
RT9715CA, where TJ(MAX) is the maximum junction  
temperature of the die (100°C) and TA is the maximum  
ambient temperature. The junction to ambient thermal  
resistance θJA is layout dependent. For SOT-23-5 package,  
the thermal resistance θJA is 250°C/W on the standard  
JEDEC 51-3 single-layer thermal test board. The maximum  
power dissipation at TA = 25°C can be calculated by  
following formula :  
Avoid vias as much as possible. If vias are necessary,  
make them as large as feasible.  
Place cuts in the ground plane between ports to help  
reduce the coupling of transients between ports.  
Locate the output capacitor and ferrite beads as close  
to the USB connectors as possible to lower impedance  
(mainly inductance) between the port and the capacitor  
and improve transient load performance.  
Locate the RT9715CAas close as possible to the output  
PD(MAX) = (100°C 25°C) / (250°C/W) = 0.3W for  
port to limit switching noise.  
SOT-23-5 package  
The input capacitor should  
be placed as close as  
possible to the IC.  
The maximum power dissipation depends on the operating  
ambient temperature for fixed TJ(MAX) and thermal  
resistance, θJA. The derating curve in Figure 2 of derating  
curves allows the designer to see the effect of rising  
ambient temperature on the maximum power allowed.  
V
V
V
BUS  
OUT  
IN  
0.5  
Single Layer PCB  
GND  
0.4  
0.3  
0.2  
0.1  
0.0  
GND_BUS  
EN  
FLG  
V
IN  
Figure 3  
0
10 20 30 40 50 60 70 80 90 100  
Ambient Temperature (°C)  
Figure 2. Derating Curve of Maximum PowerDissipation  
Copyright 2015 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS9715CA-00 April 2015  
www.richtek.com  
11  
RT9715CA  
Outline Dimension  
H
D
L
B
C
A
b
A1  
e
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min  
Max  
Min  
Max  
A
A1  
B
0.889  
0.000  
1.397  
0.356  
2.591  
2.692  
0.838  
0.080  
0.300  
1.295  
0.152  
1.803  
0.559  
2.997  
3.099  
1.041  
0.254  
0.610  
0.035  
0.000  
0.055  
0.014  
0.102  
0.106  
0.033  
0.003  
0.012  
0.051  
0.006  
0.071  
0.022  
0.118  
0.122  
0.041  
0.010  
0.024  
b
C
D
e
H
L
SOT-23-5 Surface Mount Package  
Richtek Technology Corporation  
14F, No. 8, Tai Yuen 1st Street, Chupei City  
Hsinchu, Taiwan, R.O.C.  
Tel: (8863)5526789  
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should  
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot  
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be  
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third  
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.  
www.richtek.com  
12  
DS9715CA-00 April 2015  

相关型号:

RT9715CGB

Operating Range : 2.7V to 5.5V, Reverse Blocking Current
RICHTEK

RT9715CGBG

IC PWR SWITCH USB 1.5A SOT23-5
RICHTEK

RT9715CGBR

IC PWR SWITCH USB 1.5A SOT23-5
RICHTEK

RT9715CGF

IC PWR SWITCH USB 1.5A 8MSOP
RICHTEK

RT9715CGQW

IC PWR SWITCH USB 1.5A 8WDFN
RICHTEK

RT9715CGS

IC PWR SWITCH USB 1.5A 8SOP
RICHTEK

RT9715DGBG

IC PWR SWITCH USB 1.5A SOT23-5
RICHTEK

RT9715DGBR

IC PWR SWITCH USB 1.5A SOT23-5
RICHTEK

RT9715DGF

IC PWR SWITCH USB 1.5A 8MSOP
RICHTEK

RT9715DGQW

IC PWR SWITCH USB 1.5A 8WDFN
RICHTEK

RT9715EGB

IC PWR SWITCH USB 1.1A SOT23-5
RICHTEK

RT9715EGBR

IC PWR SWITCH USB 1.1A SOT23-5
RICHTEK