RP112K241D [RICOH]
Low Noise 150mA LDO REGULATOR;型号: | RP112K241D |
厂家: | RICOH ELECTRONICS DEVICES DIVISION |
描述: | Low Noise 150mA LDO REGULATOR |
文件: | 总32页 (文件大小:888K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RP112x SERIES
Low Noise 150mA LDO REGULATOR
OUTLINE
NO.EA-258-131024
The RP112x Series are CMOS-based voltage regulator (LDO) ICs, which have been developed using the
CMOS process technology, with high output voltage accuracy, low-supply current, low On-resistance transistor,
low noise output voltage and high ripple rejection. Each of the ICs is composed of the followings: a voltage
reference unit, an error amplifier, a resistor-net for output voltage setting, a current limit circuit, and a chip enable
circuit.
The RP112x features ultra low noise and its Ripple Rejection is as low as 80dB at f=1kHz, 75dB at f=10kHz
and 65dB at f=100kHz. The Output Noise is also as low as Typ. 10μVrms. It is kept the low level at any Output
Voltage. RP112x is suitable for the power source for the portable music player and RF module that demands for
higher level of noise reduction. SOT-23-5 and SC-88A packages, a 1mm square DFN(PLP)1010-4 package are
available.
FEATURES
• Supply Current......................................................Typ. 75μA
• Standby Current....................................................Typ. 0.1μA
• Dropout Voltage ....................................................Typ. 0.20V (IOUT=150mA, VOUT=2.8V)
• Ripple Rejection....................................................Typ. 80dB (f=1kHz)
Typ. 75dB (f=10kHz)
Typ. 65dB (f=100kHz)
• Output Voltage Accuracy.......................................±1.0%
• Output Voltage Temperature Coefficient...............Typ. ±30ppm/°C
• Line Regulation.....................................................Typ. 0.02%/V
• Packages ..............................................................DFN(PLP)1010-4, SC-88A, SOT-23-5
• Input Voltage Range .............................................2.0V to 5.25V
• Output Voltage Range...........................................1.2V to 4.8V (0.1V steps)
(For other voltages, please refer to MARK INFORMATIONS.)
• Short Current Limit................................................Typ. 40mA
• Built-in Foldback Protection Circuit
• Output Noise.........................................................Typ. 10μVrms
• Ceramic capacitors are recommended to be used with this IC .....1.0μF or more
APPLICATIONS
• Power source for portable communication equipment.
• Power source for electrical appliances such as cameras,VCRs and camcorders.
• Power source for battery-powered equipments.
• Power source for electrical home appliances.
• Power source for the portable music player
• Power source for RF module
1
RP112x
NO.EA-258-131024
BLOCK DIAGRAMS
RP112xxxxB
RP112xxxxD
VDD
VDD
VOUT
VOUT
Noise
Noise
Reduction
Reduction
Vref
Vref
Current
Limit
Current
Limit
CE
CE
GND
GND
SELECTION GUIDE
The output voltage, auto discharge function, package for the ICs can be selected at the user’s request.
Product Name
RP112Kxx1∗-TR
Package
DFN(PLP)1010-4
SC-88A
Quantity per Reel
10,000 pcs
Pb Free
Yes
Halogen Free
Yes
Yes
Yes
3,000 pcs
Yes
RP112Qxx2∗-TR-FE
RP112Nxx1∗-TR-FE
SOT-23-5
3,000 pcs
Yes
xx: Output voltage (VOUT) is selectable from 1.2V to 4.8V in 0.1V steps.
The second decimal point of the voltage is described as below.
1.25V: RP112x12x∗5
1.85V: RP112x18x∗5
2.85V: RP112x28x∗5
∗: Selections of CE pin polarity and Auto-discharge function are as shown below:
(B) CE pin polarity: “H” active, Auto-discharge function: No
(D) CE pin polarity: “H” active, Auto-discharge function: Yes
2
RP112x
NO.EA-258-131024
PIN CONFIGURATIONS
•
DFN(PLP)1010-4
•
SC-88A
•
SOT-23-5
Top View
Bottom View
5
4
5
4
4
3
3
2
4
1
∗
(mark side)
(mark side)
1
2
1
2
3
1
2
3
PIN DESCRIPTIONS
• DFN(PLP)1010-4
Pin No.
Symbol
VOUT
Description
1
2
3
4
Output Pin
Ground Pin
GND
CE
Chip Enable Pin ("H" Active)
Input Pin
VDD
∗) Tab is GND level. (They are connected to the reverse side of this IC.)
The tab is better to be connected to the GND, but leaving it open is also acceptable.
• SC-88A
Pin No
Symbol
VDD
Pin Description
1
2
3
4
5
Input Pin
GND
CE
Ground Pin
Chip Enable Pin ("H" Active)
No Connection
NC
VOUT
Output Pin
• SOT-23-5
Pin No
Symbol
VDD
Pin Description
1
2
3
4
5
Input Pin
GND
CE
Ground Pin
Chip Enable Pin ("H" Active)
No Connection
Output Pin
NC
VOUT
3
RP112x
NO.EA-258-131024
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
6.0
Unit
V
VIN
Input Voltage
VCE
Input Voltage (CE Pin)
Output Voltage
Output Current
6.0
V
VOUT
IOUT
V
−0.3 to VIN + 0.3
180
mA
Power Dissipation (DFN(PLP)1010-4)∗
Power Dissipation (SC-88A)∗
400
PD
mW
380
Power Dissipation (SOT-23-5)∗
Operating Temperature Range
Storage Temperature Range
420
Topt
Tstg
−40 to 85
−55 to 125
°C
°C
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field. The functional operation at or over these absolute maximum ratings is not assured.
4
RP112x
NO.EA-258-131024
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, VIN=5.25V(VOUT ≥ 4.1V), VIN=Set VOUT+1.0V(1.5V < VOUT < 4.1V),
VIN=2.5V(VOUT ≤ 1.5V), IOUT=1mA, CIN=COUT=1.0μF.
The specifications surrounded by
are guaranteed by Design Engineering at - 40°C ≤ Ta ≤85°C.
• RP112xxxxB/D
Ta=25°C
Symbol
Item
Conditions
Min.
×0.99
−20
Typ.
Max.
×1.01
+20
Unit
V
VOUT ≥ 2.0V
Ta=25°C
VOUT < 2.0V
VOUT ≥ 2.0V
VOUT < 2.0V
mV
V
VOUT
Output Voltage
×
0.985
−30
150
-14
×1.015
−
40°C ≤ Ta ≤ 85°C
mV
mA
mV
+30
IOUT
ΔVOUT/ΔIOUT
VDIF
Output Current
Load Regulation
Dropout Voltage
0
14
1mA ≤ IOUT ≤ 150mA
Please refer to “Dropout Voltage”.
VOUT ≥ 4.1V
80
75
ISS
Supply Current
Standby Current
100
1.0
IOUT=0mA
VCE=0V
μA
μA
VOUT < 4.1V
Istandby
0.1
Set VOUT+0.3 ≤
VIN ≤ 5.25V
VOUT ≥ 4.1V
Line Regulation
0.02
0.10
%/V
ΔVOUT/ΔVIN
Set VOUT+0.5V ≤
VIN ≤ 5.0V
1.7V
≤
V
OUT
≤ 4.1V
2.2V ≤ VIN
≤ 5.0V VOUT < 1.7V
Ripple 0.2Vp-p,
IOUT=30mA,
VIN=5.25V
(VOUT ≥ 4.1V),
VIN=Set VOUT+1.0V
(VOUT < 4.1V)
80
75
65
f =1kHz
RR
Ripple Rejection
Input Voltage∗
dB
V
f =10kHz
f =100kHz
VIN
2.0
1.0
5.25
ppm
/°C
Output Voltage
Temperature Coefficient
ΔVOUT/ΔTopt
−40°C ≤ Ta ≤ 85°C
VOUT=0V
±30
ISC
IPD
Short Current Limit
CE Pull-down Current
CE Input Voltage "H"
CE Input Voltage "L"
40
mA
μA
V
0.3
0.6
0.4
VCEH
VCEL
V
BW=10Hz~100kHz,
IOUT=30mA
en
Output Noise
10
60
μ
Vrms
Auto-discharge Nch Tr.
ON Resistance
(D version)
RLOW
VIN=4.0V, VCE=0V
Ω
All test categories were tested on the products under the pulse load condition (Tj≈Ta=25ºC) except Output
Noise, Ripple Rejection, and Output Voltage Temperature Coefficient.
*1) The maximum input voltage (Electrical Characteristics) is 5.25V. If, for any reason the maximum input voltage
exceeds 5.25V, it has to be no more than 5.5V with 500hrs of the total operating time.
5
RP112x
NO.EA-258-131024
The specifications surrounded by
are guaranteed by Design Engineering at - 40°C ≤ Ta ≤85°C.
• Dropout Voltage
Ta=25°C
Dropout Voltage VDIF (V)
Output Voltage
VOUT (V)
Condition
Typ.
0.39
0.37
0.34
0.32
0.29
0.25
0.22
0.20
Max.
0.80
0.70
0.60
0.50
0.41
0.36
0.31
0.28
1.2V ≤ VOUT < 1.3V
1.3V ≤ VOUT < 1.4V
1.4V ≤ VOUT < 1.5V
1.5V ≤ VOUT < 1.7V
1.7V ≤ VOUT < 2.0V
2.0V ≤ VOUT < 2.5V
2.5V ≤ VOUT < 2.8V
2.8V ≤ VOUT ≤ 4.8V
IOUT=150mA
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
6
RP112x
NO.EA-258-131024
TYPICAL APPLICATIONS
VOUT
V
DD
VOUT
RP112x
Series
C1
C2
CE
GND
External Parts Example:
C1, C2: Ceramic Capacitor 1.0µF, Murata, GRM155B31A105KE15
TECHNICAL NOTES
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a 1.0μF or more capacitor C2.
In case of using a tantalum capacitor, the output may be unstable due to inappropriate ESR. Therefore, the full
range of operating conditions for the capacitor in the application should be considered.
PCB Layout
The high impedances of VDD and GND could be a reason for the noise pickup and unstable operation.
Therefore, it is imperative that the impedances of VDD and GND be the lowest possible. Also, place a 1.0µF or
more capacitor (C1) between VDD pin and GND pin as close as possible to each other.
As for C2 output capacitor that is used for phase compensation, place it between VOUT pin and GND as close
as possible to each other (Refer to TYPICAL APPLICATIONS).
7
RP112x
NO.EA-258-131024
PACKAGE INFORMATION
• Power Dissipation (DFN(PLP)1010-4)
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
measurement at the conditions below:
Measurement Conditions
Standard Test land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double sided)
40mm x 40mm x 1.6mm
Top side: Approx. 50%, Back side: Approx. 50%
φ 0.54mm x 24pcs
Through-holes
Measurement Result:
(Ta=25°C)
Standard Test Land Pattern
400mW (Tjmax=125°C)
500mW (Tjmax=150°C)
Power Dissipation
θja=(125-25°C)/0.4W=250 °C/W
θjc=67 °C/W
Thermal Resistance
600
40
500
500
400
400
300
200
100
0
Measurement Board Pattern
0
25
50
75 85 100
125
150
Ambient Temperature (Cº)
IC Mount Area (Unit: mm)
Power Dissipation
The above graph shows that the power dissipation of the package under the conditions of
Tjmax=125°C and Tjmax=150°C. The use under the diagonal line in the graph might have an affect
on the ICs’ lifetime. Please use the ICs within the limited operating time and estimated years as
described below.
Operating Time
13,000 hours
Estimated Years (4hrs/day)
9 years
8
RP112x
NO.EA-258-131024
• Package Dimensions (DFN(PLP)1010-4)
0.48
±0.05
0.65
1.00
B
A
3
4
X4
※
0.05
45°
INDEX
0.48
1
3-C0.18
2
±0.05
0.25±0.05
0.05 M S AB
Bottom View
(Unit : mm)
0.05 S
S
※) The tab on the reverse side of the IC is in GND
level. It should be connected to GND pin
(recommended) or should be left open.
• Mark Specification (DFN(PLP)1010-4)
cd: Product Code … Refer to “RP112K Series Mark Specification Table” .
ef: Lot Number … Alphanumeric Serial Number
①②
③④
9
RP112x
NO.EA-258-131024
• RP112K Series Mark Specification Table (DFN(PLP)1010-4)
RP112Kxx1B
Product Name
RP112K121B
RP112K131B
RP112K141B
RP112K151B
RP112K161B
RP112K171B
RP112K181B
RP112K191B
RP112K201B
RP112K211B
RP112K221B
RP112K231B
RP112K241B
RP112K251B
RP112K261B
RP112K271B
RP112K281B
RP112K291B
RP112K301B
RP112K311B
RP112K321B
RP112K331B
RP112K341B
RP112K351B
RP112K361B
RP112K371B
RP112K381B
RP112K391B
RP112K401B
RP112K411B
RP112K421B
RP112K431B
RP112K441B
RP112K451B
RP112K461B
RP112K471B
RP112K481B
RP112K121B5
RP112K181B5
RP112K281B5
RP112Kxx1D
Product Name
RP112K121D
RP112K131D
RP112K141D
RP112K151D
RP112K161D
RP112K171D
RP112K181D
RP112K191D
RP112K201D
RP112K211D
RP112K221D
RP112K231D
RP112K241D
RP112K251D
RP112K261D
RP112K271D
RP112K281D
RP112K291D
RP112K301D
RP112K311D
RP112K321D
RP112K331D
RP112K341D
RP112K351D
RP112K361D
RP112K371D
RP112K381D
RP112K391D
RP112K401D
RP112K411D
RP112K421D
RP112K431D
RP112K441D
RP112K451D
RP112K461D
RP112K471D
RP112K481D
RP112K121D5
RP112K181D5
RP112K281D5
cd
1A
1C
1D
1E
1F
1G
1H
1K
1L
VSET
cd
3A
3C
3D
3E
3F
3G
3H
3K
3L
VSET
1.2V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
3.7V
3.8V
3.9V
4.0V
4.1V
4.2V
4.3V
4.4V
4.5V
4.6V
4.7V
4.8V
1.25V
1.85V
2.85V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
3.7V
3.8V
3.9V
4.0V
4.1V
4.2V
4.3V
4.4V
4.5V
4.6V
4.7V
4.8V
1.25V
1.85V
2.85V
1M
1N
1P
1Q
1R
1S
1T
1U
1W
1X
1Y
1Z
2A
2B
2C
2D
2E
2F
2G
2H
2J
3M
3N
3P
3Q
3R
3S
3T
3U
3W
3X
3Y
3Z
4A
4B
4C
4D
4E
4F
4G
4H
4J
2K
2L
4K
4L
2M
2N
2P
2Q
2R
1B
1J
4M
4N
4P
4Q
4R
3B
3J
1V
3V
10
RP112x
NO.EA-258-131024
• Power Dissipation (SC-88A)
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
measurement at the conditions below:
Measurement Conditions:
Standard Test Land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double Layers)
40mm × 40mm × 1.6mm
Top side: Approx. 50%, Back side: Approx. 50%
φ 0.5mm x 44pcs
Through-hole
Measurement Result:
(Ta=25°C)
Standard Test Land Pattern
Free Air
380mW (Tjmax=125°C)
475mW (Tjmax=150°C)
Power Dissipation
150mW
θja=(125-25°C)/0.38W=263°C/W θja=(125-25°C)/0.15W=667°C/W
Thermal Resistance
θjc=75°C/W
-
40
600
475
500
Standard Test Land Pattern
Free Air
400
380
300
150
200
100
0
Measurement Board Pattern
0
25
50
75 85 100
125
150
Ambient Temperature (ºC)
IC Mount Area (Unit: mm)
Power Dissipation
The above graph shows that the power dissipation of the package under the conditions of
Tjmax=125°C and Tjmax=150°C. The use under the diagonal line in the graph might have an affect
on the ICs’ lifetime. Please use the ICs within the limited operating time and estimated years as
described below.
Operating Time
13,000 hours
Estimated Years (4hrs/day)
9 years
11
RP112x
NO.EA-258-131024
• Package Dimensions (SC-88A)
2.0±0.2
0.15±0.07
B
A
1.3±0.2
4
3
5
1
0.15
0~14°
2
+0.1
-0.05
0.65
0.2
0.10 S AB
Unit : mm
0.10 S
S
• Mark Specification (SC-88A)
cdef: Product Code …Refer to “RP112Q Series Mark Specification Table” .
: Lot Number … Alphanumeric Serial Number
gh
5
4
①②③
④⑤⑥
1
2
3
12
RP112x
NO.EA-258-131024
• RP112Q Series Mark Specification Table (SC-88A)
RP112Qxx2B
Product Name
RP112Q122B
RP112Q132B
RP112Q142B
RP112Q152B
RP112Q162B
RP112Q172B
RP112Q182B
RP112Q192B
RP112Q202B
RP112Q212B
RP112Q222B
RP112Q232B
RP112Q242B
RP112Q252B
RP112Q262B
RP112Q272B
RP112Q282B
RP112Q292B
RP112Q302B
RP112Q312B
RP112Q322B
RP112Q332B
RP112Q342B
RP112Q352B
RP112Q362B
RP112Q372B
RP112Q382B
RP112Q392B
RP112Q402B
RP112Q412B
RP112Q422B
RP112Q432B
RP112Q442B
RP112Q452B
RP112Q462B
RP112Q472B
RP112Q482B
RP112Q122B5
RP112Q182B5
RP112Q282B5
RP112Qxx2D
VSET
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
3.7V
3.8V
3.9V
4.0V
4.1V
4.2V
4.3V
4.4V
4.5V
4.6V
4.7V
4.8V
1.25V
1.85V
2.85V
Product Name
RP112Q122D
RP112Q132D
RP112Q142D
RP112Q152D
RP112Q162D
RP112Q172D
RP112Q182D
RP112Q192D
RP112Q202D
RP112Q212D
RP112Q222D
RP112Q232D
RP112Q242D
RP112Q252D
RP112Q262D
RP112Q272D
RP112Q282D
RP112Q292D
RP112Q302D
RP112Q312D
RP112Q322D
RP112Q332D
RP112Q342D
RP112Q352D
RP112Q362D
RP112Q372D
RP112Q382D
RP112Q392D
RP112Q402D
RP112Q412D
RP112Q422D
RP112Q432D
RP112Q442D
RP112Q452D
RP112Q462D
RP112Q472D
RP112Q482D
RP112Q122D5
RP112Q182D5
RP112Q282D5
VSET
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
3.7V
3.8V
3.9V
4.0V
4.1V
4.2V
4.3V
4.4V
4.5V
4.6V
4.7V
4.8V
1.25V
1.85V
2.85V
cdef
AU12
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AU01
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cdef
AV12
AV13
AV14
AV15
AV16
AV17
AV18
AV19
AV20
AV21
AV22
AV23
AV24
AV25
AV26
AV27
AV28
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AV30
AV31
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AV33
AV34
AV35
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AV37
AV38
AV39
AV40
AV41
AV42
AV43
AV44
AV45
AV46
AV47
AV48
AV01
AV02
AV03
13
RP112x
NO.EA-258-131024
• Power Dissipation (SOT-23-5)
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
measurement at the conditions below:
(Power Dissipation (SOT-23-5) is a substitution of SOT-23-6.)
Measurement Conditions
Standard Test Land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double sided)
40mm x 40mm x 1.6mm
Top side: Approx. 50%, Back side: Approx. 50%
φ 0.5mm x 44pcs
Through-holes
Measurement Result:
(Ta=25°C)
Standard Test Land Pattern
Free Air
420mW (Tjmax=125°C)
525mW (Tjmax=150°C)
θja=(125-25°C)/0.42W=238°C/W
Power Dissipation
250mW (Tjmax=125°C)
400°C/W
Thermal Resistance
40
600
525
Standard Test Land Pattern
Free Air
500
420
250
400
300
200
100
0
Measurement Board Pattern
0
25
50
75 85 100
125
150
Ambient Temperature (Cº)
IC Mount Area (Unit: mm)
Power Dissipation
The above graph shows that the power dissipation of the package under the conditions of
Tjmax=125°C and Tjmax=150°C. The use under the diagonal line in the graph might have an affect on
the ICs’ lifetime. Please use the ICs within the limited operating time and estimated years as described
below.
Operating Time
13,000 hours
Estimated Years (4hrs/day)
9 years
14
RP112x
NO.EA-258-131024
• Package Dimensions (SOT-23-5)
2.9±0.2
1.9±0.2
1.1±0.1
0.8±0.1
(0.95) (0.95)
5
4
0~0.1
1
2
3
+0.1
0.15-0.05
0.4±0.1
Unit : mm
• Mark Specification (SOT-23-5)
cde: Product Code …Refer to “RP112N Series Mark Specification Table” .
fg : Lot Number … Alphanumeric Serial Number
5
4
cdefg
2
1
3
15
RP112x
NO.EA-258-131024
• RP112N Series Mark Specification Table (SOT-23-5)
RP112Nxx1B
Product Name
RP112N121B
RP112N131B
RP112N141B
RP112N151B
RP112N161B
RP112N171B
RP112N181B
RP112N191B
RP112N201B
RP112N211B
RP112N221B
RP112N231B
RP112N241B
RP112N251B
RP112N261B
RP112N271B
RP112N281B
RP112N291B
RP112N301B
RP112N311B
RP112N321B
RP112N331B
RP112N341B
RP112N351B
RP112N361B
RP112N371B
RP112N381B
RP112N391B
RP112N401B
RP112N411B
RP112N421B
RP112N431B
RP112N441B
RP112N451B
RP112N461B
RP112N471B
RP112N481B
RP112N121B5
RP112N181B5
RP112N281B5
RP112Nxx1D
cde
K12
K13
K14
K15
K16
K17
K18
K19
K20
K21
K22
K23
K24
K25
K26
K27
K28
K29
K30
K31
K32
K33
K34
K35
K36
K37
K38
K39
K40
K41
K42
K43
K44
K45
K46
K47
K48
K01
K02
K03
VSET
Product Name
RP112N121D
RP112N131D
RP112N141D
RP112N151D
RP112N161D
RP112N171D
RP112N181D
RP112N191D
RP112N201D
RP112N211D
RP112N221D
RP112N231D
RP112N241D
RP112N251D
RP112N261D
RP112N271D
RP112N281D
RP112N291D
RP112N301D
RP112N311D
RP112N321D
RP112N331D
RP112N341D
RP112N351D
RP112N361D
RP112N371D
RP112N381D
RP112N391D
RP112N401D
RP112N411D
RP112N421D
RP112N431D
RP112N441D
RP112N451D
RP112N461D
RP112N471D
RP112N481D
RP112N121D5
RP112N181D5
RP112N281D5
cde
L12
L13
L14
L15
L16
L17
L18
L19
L20
L21
L22
L23
L24
L25
L26
L27
L28
L29
L30
L31
L32
L33
L34
L35
L36
L37
L38
L39
L40
L41
L42
L43
L44
L45
L46
L47
L48
L01
L02
L03
VSET
1.2V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
3.7V
3.8V
3.9V
4.0V
4.1V
4.2V
4.3V
4.4V
4.5V
4.6V
4.7V
4.8V
1.25V
1.85V
2.85V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
3.7V
3.8V
3.9V
4.0V
4.1V
4.2V
4.3V
4.4V
4.5V
4.6V
4.7V
4.8V
1.25V
1.85V
2.85V
16
RP112x
NO.EA-258-131024
TEST CIRCUIT
VDD
VOUT
RP112x
Series
V
C1
C2
I
OUT
VOUT
CE
GND
C1=Ceramic 1.0μF
C2=Ceramic 1.0μF
Basic Test Circuit
VOUT
V
DD
V
OUT
RP112x
Series
A
C1
C2
ISS
CE GND
C1=Ceramic 1.0μF
C2=Ceramic 1.0μF
Test Circuit for Supply Current
Pulse
Generator
V
DD
V
OUT
RP112x
Series
C2
IOUT
P.G.
CE GND
C2=Ceramic 1.0μF
Test Circuit for Ripple Rejection
VOUT
VDD
VOUT
RP112x
Series
C1
C2
CE
GND
IOUTa
IOUTb
C1=Ceramic 1.0μF
C2=Ceramic 1.0μF
Test Circuit for Load Transient Response
17
RP112x
NO.EA-258-131024
Typical Characteristics
1) Output Voltage vs. Output Current (C1=Ceramic1.0μF, C2=Ceramic 1.0μF, Topt=25°C)
RP112x12xx
RP112x28xx
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
VIN=2.0V
VIN=3.0V
VIN=4.0V
VIN=5.25V
VIN=3.1V
VIN=3.8V
VIN=4.1V
VIN=4.8V
VIN=5.25V
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Output Current IOUT (mA)
Output Current IOUT (mA)
RP112x40xx
RP112x48xx
5.4
4.8
4.2
3.6
3.0
2.4
1.8
1.2
0.6
0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VIN=4.3V
VIN=4.5V
VIN=4.8V
VIN=5.25V
VIN=5.25V
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Output Current IOUT (mA)
Output Current IOUT (mA)
2) Output Voltage vs. Input Voltage (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF, Topt=25°C)
RP112x12xx RP112x28xx
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
IOUT=1mA
IOUT=30mA
IOUT=50mA
IOUT=1mA
IOUT=30mA
IOUT=50mA
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
18
RP112x
NO.EA-258-131024
RP112x40xx
RP112x48xx
5.4
4.8
4.2
3.6
3.0
2.4
1.8
1.2
0.6
0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
IOUT=1mA
IOUT=30mA
IOUT=50mA
IOUT=1mA
IOUT=30mA
IOUT=50mA
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
3) Supply Current vs. Input Voltage (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF, Topt=25°C)
RP112x12xx
RP112x28xx
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
RP112x40xx
RP112x48xx
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
19
RP112x
NO.EA-258-131024
4) Output Voltage vs. Temperature (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF, IOUT=1mA)
RP112x12xx
RP112x28xx
VIN=2.2V
VIN=3.8V
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
2.85
2.84
2.83
2.82
2.81
2.80
2.79
2.78
2.77
2.76
2.75
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature Topt ( C)
Temperature Topt ( C)
゚
゚
RP112x40xx
RP112x48xx
VIN=5.25V
VIN=5.0V
4.85
4.84
4.83
4.82
4.81
4.80
4.79
4.78
4.77
4.76
4.75
4.05
4.04
4.03
4.02
4.01
4.00
3.99
3.98
3.97
3.96
3.95
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature Topt ( C)
Temperature Topt ( C)
゚
゚
5) Supply Current vs. Temperature (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF,IOUT=0mA)
RP112x12xx RP112x28xx
VIN=2.2V
VIN=3.8V
80
75
70
65
60
55
50
80
75
70
65
60
55
50
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature Topt ( C)
Temperature Topt ( C)
゚
゚
20
RP112x
NO.EA-258-131024
RP112x40xx
RP112x48xx
VIN=5.25V
VIN=5.0V
100
95
90
85
80
75
70
65
60
55
50
80
75
70
65
60
55
50
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature Topt ( C)
Temperature Topt ( C)
゚
゚
6) Dropout Voltage vs. Output Current (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF)
RP112x12xx RP112x28xx
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
85 C
85 C
゚
゚
25 C
゚
25 C
゚
-40 C
-40 C
゚
゚
0
0
0
50
100
150
0
50
100
150
Output Current IOUT (mA)
Output Current IOUT (mA)
RP112x40xx
RP112x48xx
200
180
160
140
120
100
80
250
200
150
100
50
85 C
85 C
゚
゚
25 C
゚
25 C
゚
-40 C
゚
-40 C
゚
60
40
20
0
0
0
50
100
150
0
50
100
150
Output Current IOUT (mA)
Output Current IOUT (mA)
21
RP112x
NO.EA-258-131024
7) Dropout Voltage vs. Set Output Voltage (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF, Topt=25°C)
400
350
150mA
50mA
300
30mA
1mA
250
200
150
100
50
0
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2
Set Output Voltage VREG (V)
8) Dropout Voltage vs. Temperature (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF)
RP112x12xx
RP112x28xx
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
150mA
100mA
50mA
150mA
100mA
50mA
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature Topt ( C)
Temperature Topt ( C)
゚
゚
RP112x40xx
RP112x48xx
200
180
160
140
120
100
80
250
200
150
100
50
150mA
100mA
50mA
150mA
100mA
50mA
60
40
20
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature Topt ( C)
Temperature Topt ( C)
゚
゚
22
RP112x
NO.EA-258-131024
9) Ripple Rejection vs. Input Voltage (C1
=
none, C2
=
Ceramic 1.0
μ
F, Ripple=0.2Vp-p, Topt=25°C)
RP112x12xx
RP112x12xx
I
OUT=1mA
I
OUT=30mA
120
110
100
90
80
70
60
50
40
30
20
10
0
120
110
100
90
80
70
60
50
40
30
20
10
0
f=100Hz
f=1kHz
f=100Hz
f=1kHz
f=10kHz
f=100kHz
f=10kHz
f=100kHz
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Input Voltage VIN (V)
RP112x28xx
RP112x28xx
IOUT=30mA
I
OUT=1mA
120
110
100
90
80
70
60
50
40
30
20
10
0
120
110
100
90
80
70
60
50
40
30
20
10
0
f=100Hz
f=1kHz
f=100Hz
f=1kHz
f=10kHz
f=100kHz
f=10kHz
f=100kHz
2.5
3.0
3.5
4.0
4.5
5.0
2.5
3.0
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
Input Voltage VIN (V)
RP112x40xx
RP112x40xx
IOUT=1mA
I
OUT=30mA
120
110
100
90
80
70
60
50
40
30
20
10
0
120
110
100
90
80
70
60
50
40
30
20
10
0
f=100Hz
f=100Hz
f=1kHz
f=1kHz
f=10kHz
f=100kHz
f=10kHz
f=100kHz
4.0
4.3
4.6
4.9
5.2
4.0
4.3
4.6
4.9
5.2
Input Voltage VIN (V)
Input Voltage VIN (V)
23
RP112x
NO.EA-258-131024
10) Ripple Rejection vs. Output Current (C1
=
none, C2
=Ceramic 1.0μF, Ripple=0.2Vp-p, Topt=25°C)
RP112x12xx
RP112x28xx
VIN=3.8V
VIN=2.2V
120
110
100
90
80
70
60
50
40
30
20
10
0
110
100
90
80
70
60
50
40
30
20
10
0
f=100Hz
f=1kHz
f=10kHz
f=100kHz
f=100Hz
f=1kHz
f=10kHz
f=100kHz
0
50
100
150
0
50
100
150
Output Current IOUT (mA)
Output Current IOUT (mA)
RP112x40xx
VIN=5.0V
110
100
90
80
70
60
50
40
30
20
10
0
f=100Hz
f=1kHz
f=10kHz
f=100kHz
0
50
100
150
Output Current IOUT (mA)
11) Ripple Rejection vs. Frequency (C1=none, C2=Ceramic 1.0μF, Ripple=0.2Vp-p, Topt=25°C)
RP112x12xx RP112x28xx
VIN=2.2V
VIN=3.8V
120
110
100
90
80
70
60
50
40
30
20
10
0
120
110
100
90
80
70
60
50
40
30
20
10
0
1mA
30mA
50mA
100mA
150mA
1mA
30mA
50mA
100mA
150mA
0.1
1
10
Frequency f (kHz)
100
1000
0.1
1
10
Frequency f (kHz)
100
1000
24
RP112x
NO.EA-258-131024
RP112x40xx
VIN=5.0V
120
110
100
90
80
70
60
50
40
30
20
10
0
1mA
30mA
50mA
100mA
150mA
0.1
1
10
Frequency f (kHz)
100
1000
12) Output Spectral Noise Density vs. Frequency (C1=none, C2=Ceramic 1.0μF, Topt=25°C)
RP112x12xx
RP112x28xx
V
IN=3.8V
VIN=2.2V
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
150mA
30mA
150mA
30mA
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Frequency f (kHz)
Frequency f (kHz)
RP112x40xx
RP112x48xx
V =5.0V
IN
V =5.25V
IN
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
150mA
30mA
150mA
30mA
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Frequency f (kHz)
Frequency f (kHz)
25
RP112x
NO.EA-258-131024
13) Input Transient Response (C1=none, C2=Ceramic 1.0μF, IOUT=30mA, tr=tf=5.0μs, Topt=25°C)
RP112x12xx
RP112x28xx
3.5
3.0
2.5
2.0
1.5
1.0
5.0
4.5
4.0
3.5
3.0
2.5
Input Voltage
Input Voltage
2.2V
3.2V
3.8V
4.8V
⇔
⇔
1.205
1.200
1.195
1.190
1.185
2.805
2.800
2.795
2.790
2.785
Output Voltage
Output Voltage
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
RP112x40xx
RP112x48xx
5.5
5.0
4.5
4.0
3.5
3.0
5.5
5.0
4.5
4.0
3.5
3.0
Input Voltage
Input Voltage
5.0V
5.25V
⇔
4.5V
5.25V
⇔
4.005
4.000
3.995
3.990
3.985
4.805
4.800
4.795
4.790
4.785
Output Voltage
Output Voltage
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
14) Load Transient Response (C1=Ceramic 1.0μF,C2=Ceramic 1.0μF, tr=tf=0.5μs,Topt=25°C)
RP112x12xx
RP112x12xx
VIN=2.2V
VIN=2.2V
150
100
50
300
150
0
Output Current
1mA 150mA
⇔
Output Current
50mA
100mA
⇔
1.25
1.20
1.15
1.10
1.22
1.20
1.18
1.16
0
Output Voltage
Output Voltage
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
0
20 40 60 80 100 120 140 160 180 200
Time t (µs)
26
RP112x
NO.EA-258-131024
RP112x28xx
RP112x28xx
VIN=3.8V
300
VIN=3.8V
150
100
50
Output Current
1mA 150mA
150
0
⇔
Output Current
50mA
100mA
⇔
2.85
2.80
2.75
2.70
2.82
2.80
2.78
2.76
0
Output Voltage
Output Voltage
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
0
20 40 60 80 100 120 140 160 180 200
Time t (µs)
RP112x40xx
RP112x40xx
VIN=5.0V
VIN=5.0V
300
150
Output Current
1mA 150mA
150
0
100
50
0
⇔
Output Current
50mA 100mA
⇔
4.05
4.00
3.95
3.90
4.02
4.00
3.98
3.96
Output Voltage
Output Voltage
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
0
20 40 60 80 100 120 140 160 180 200
Time t (µs)
RP112x48xx
RP112x48xx
VIN=5.25V
VIN=5.25V
300
150
Output Current
1mA 150mA
150
0
100
50
0
⇔
Output Current
50mA 100mA
⇔
4.85
4.80
4.75
4.70
4.85
4.80
4.75
4.70
Output Voltage
Output Voltage
0
20 40 60 80 100 120 140 160 180 200
Time t (µs)
0
10 20 30 40 50 60 70 80 90 100
Time t (µs)
27
RP112x
NO.EA-258-131024
15) Turn on Speed with CE pin (C1=Ceramic 1.0μF, C2=Ceramic 1.0μF, Topt=25°C)
RP112x12xx
RP112x28xx
VIN=2.2V
VIN=3.8V
3
2
1
0
6
4
2
0
CE Input Voltage
0V 2.2V
CE Input Voltage
⇒
0V
3.8V
⇒
3.0
2.4
1.8
1.2
0.6
1.6
1.2
0.8
0.4
Output Voltage
Output Voltage
IOUT=0mA
IOUT=0mA
IOUT=30mA
IOUT=150mA
IOUT=30mA
IOUT=150mA
0
0
0
50
100
Time t (µs)
150
200
250
0
50
100
Time t (µs)
150
200
250
RP112x40xx
RP112x48xx
VIN=5.0V
VIN=5.25V
6
4
2
0
6
4
2
0
CE Input Voltage
CE Input Voltage
0V
5.25V
⇒
0V
5.0V
⇒
5
4
3
2
1
0
5
4
3
2
1
0
Output Voltage
Output Voltage
IOUT=0mA
IOUT=0mA
IOUT=30mA
IOUT=150mA
IOUT=30mA
IOUT=150mA
0
50
100
Time t (µs)
150
200
250
0
50
100
Time t (µs)
150
200
250
16) Turn off Speed with CE pin (B Version) (C1
=
Ceramic 1.0
μ
F, C2
=
Ceramic 1.0μF, Topt=25°C)
RP112x12xx
RP112x28xx
VIN=2.2V
3
VIN=3.8V
6
4
2
0
2
CE Input Voltage
CE Input Voltage
3.8V 0V
2.2V
0V
1
0
⇒
⇒
3.0
2.4
1.8
1.2
0.6
1.6
1.2
0.8
0.4
Output Voltage
Output Voltage
IOUT=0mA
IOUT=0mA
IOUT=30mA
IOUT=150mA
IOUT=30mA
IOUT=150mA
0
0
0
40
80
120
160
200
0
40
80
120
160
200
Time t (s)
Time t (s)
28
RP112x
NO.EA-258-131024
RP112x40xB
VIN=5.0V
6
4
2
0
CE Input Voltage
5.0V 0V
⇒
5
4
3
2
1
0
Output Voltage
IOUT=0mA
IOUT=30mA
IOUT=150mA
0
40
80
120
160
200
Time t (s)
17) Turn off Speed with CE pin (D Version) (C1
=
Ceramic 1.0
μ
F, C2
=
Ceramic 1.0μF, Topt=25°C)
RP112x12xD
RP112x28xD
VIN=2.2V
3
VIN=3.8V
6
4
2
0
2
CE Input Voltage
CE Input Voltage
3.8V 0V
2.2V
0V
⇒
1
0
⇒
3.0
2.4
1.8
1.2
0.6
1.6
1.2
0.8
0.4
Output Voltage
Output Voltage
IOUT=0mA
IOUT=0mA
IOUT=30mA
IOUT=150mA
IOUT=30mA
IOUT=150mA
0
0
0
200 400 600 800 1000 1200
Time t (µs)
0
200 400 600 800 1000 1200
Time t (µs)
RP112x40xD
VIN=5.0V
6
4
2
0
CE Input Voltage
5.0V 0V
⇒
5
4
3
2
1
0
Output Voltage
IOUT=0mA
IOUT=30mA
IOUT=150mA
0
200 400 600 800 1000 1200
Time t (µs)
29
RP112x
NO.EA-258-131024
18) Inrush Current (C1=Ceramic 1.0μF, IOUT=0mA, Topt=25°C)
RP112x12xx
RP112x28xx
VIN=2.2V
VIN=3.8V
4.2
3.5
2.8
2.1
1.4
0.7
0
2.4
2.0
1.6
1.2
0.8
0.4
0
CE Input Voltage
CE Input Voltage
0V 2.2V
0V
3.8V
⇒
⇒
Output Voltage
Output Voltage
CE
CE
C2=1.0µF
C2=1.5µF
C2=2.2µF 300
C2=3.3µF
C2=1.0µF
C2=1.5µF
C2=2.2µF
300
200
100
0
200
100
0
Inrush Current
Inrush Current
0
30
60
90
120 150
0
30
60 90 120 150
Time t (µs)
Time t (µs)
RP112x40xx
RP112x48xx
VIN=5.0V
VIN=5.25V
6
5
4
3
2
1
0
6
5
4
3
2
1
0
CE Input Voltage
0V 5.25V
⇒
CE Input Voltage
0V
5.0V
⇒
Output Voltage
Output Voltage
CE
CE
C2=1.0µF
C2=1.5µF
C2=2.2µF
C2=1.0µF
C2=1.5µF
C2=2.2µF
300
200
100
0
300
200
100
0
Inrush Current
Inrush Current
0
30
60
Time t (µs)
90
120 150
0
30
60
Time t (µs)
90
120 150
30
RP112x
NO.EA-258-131024
ESR vs.Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below.
The conditions when the white noise level is under 40μV (Avg.) are marked as the hatched area in the graph.
Measurement Conditions
Frequency Band : 10Hz to 2MHz
Temperature
Hatched Area
C1,C2
: −40゚C to 85゚C
: Noise level is under 40μV(Avg.)
: 1.0μF or more
RP112x12xx
RP112x28xx
VIN=2.8V to 5.25V
VIN=2.0V to 5.25V
1000
100
10
1000
100
10
1
1
0.1
0.01
0.1
0.01
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Output Current IOUT (mA)
Output Current IOUT (mA)
RP112x40xx
VIN=4.0V to 5.25V
1000
100
10
1
0.1
0.01
0
25
50
75
100
125
150
Output Current IOUT (mA)
31
1.The products and the product specifications described in this document are subject to change or
discontinuation of production without notice for reasons such as improvement. Therefore, before
deciding to use the products, please refer to Ricoh sales representatives for the latest information
thereon.
2.The materials in this document may not be copied or otherwise reproduced in whole or in part without
prior written consent of Ricoh.
3.Please be sure to take any necessary formalities under relevant laws or regulations before exporting or
otherwise taking out of your country the products or the technical information described herein.
4.The technical information described in this document shows typical characteristics of and example
application circuits for the products. The release of such information is not to be construed as a
warranty of or a grant of license under Ricoh's or any third party's intellectual property rights or any
other rights.
5.The products listed in this document are intended and designed for use as general electronic
components in standard applications (office equipment, telecommunication equipment, measuring
instruments, consumer electronic products, amusement equipment etc.). Those customers intending to
use a product in an application requiring extreme quality and reliability, for example, in a highly specific
application where the failure or misoperation of the product could result in human injury or death
(aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first
contact us.
6.We are making our continuous effort to improve the quality and reliability of our products, but
semiconductor products are likely to fail with certain probability. In order to prevent any injury to
persons or damages to property resulting from such failure, customers should be careful enough to
incorporate safety measures in their design, such as redundancy feature, fire containment feature and
fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from
misuse or inappropriate use of the products.
7.Anti-radiation design is not implemented in the products described in this document.
8.Please contact Ricoh sales representatives should you have any questions or comments concerning
the products or the technical information.
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
Halogen Free
April 1, 2012.
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