RP124L123B1-TR [RICOH]
Fixed Positive LDO Regulator,;
| 型号： | RP124L123B1-TR |
| 厂家： | 
RICOH ELECTRONICS DEVICES DIVISION |
| 描述： | Fixed Positive LDO Regulator, |
| 文件： | 总36页 (文件大小：3138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RP124x Series
100 mA Ultra-low Supply Current (0.3 µA) LDO Regulator with Battery Monitor
No. EA-503-191025
OVERVIEW
The RP124x is an LDO regulator with a battery monitor (BM) featuring ultra-low supply current.
The battery monitor has a function which divides the input voltage (VIN) into 1/3 or 1/4. The battery
charge remaining can be monitored by MCU. The buffering output enables directly inputting a signal
into the low voltage A/D converter (ADC) with built-in MCU.
KEY BENEFITS
● Achieving Low Supply Current of 0.3 µA, Longer Battery Life and Downsizing
● Requiring Only Three External Capacitors and Suitable for Space-saving Mounting for the Smaller Packages
PACKAGES
KEY SPECIFICATIONS
LDO Section
● Input Voltage Range: 1.7 V to 5.5 V
● Supply Current: Typ. 0.2 μA
● Output Voltage Accuracy: ±0.8%
● Output Current: 100 mA
● Ceramic Capacitor Compatible: 1.0 μF or more
BM Section
DFN1212-6
SOT-23-5
● Output Voltage: VIN/3 (RP124xxx3x)
VIN/4 (RP124xxx4x)
1.2 mm x 1.2 mm x 0.4 mm
2.9 mm x 2.8 mm x 1.1 mm
● Supply Current: Typ. 0.1 μA
● Ceramic Capacitor Compatible: 0.1 μF to 0.22 μF
TYPICAL APPLICATIONS
•
RP124
MCU
VDD
LDO
VOUT
BM
VCC
ADC
CIN
Battery
Monitor
CE
CE control
Battery
BM
COUT
C
GND
GND
The diagram is assumed to be used for RP124xxxxE.
APPLICATIONS
• Battery powered IoT devices
• Energy harvesting devices
• Low power wireless communication modules including: Bluetooth® LE, Zigbee, and LPWA
• Low power consumption CPUs, memories, and sensors
1
RP124x
No. EA-503-191025
SELECTION GUIDE
The LDO set output voltage, the divided ratio of BM output voltage, the CE pin function and the auto-discharge
function are user-selectable options.
Selection Guide
Product Name
RP124Lxx#∗-TR
RP124Nxx#∗-TR-FE
Package
DFN1212-6
SOT-23-5
Quantity per Reel
5,000 pcs
Pb Free
Yes
Halogen Free
Yes
Yes
3,000 pcs
Yes
xx: Specify the LDO set output voltage (VSET).
1.2 V (12) / 1.5 V (15) / 1.8 V (18) / 2.1 V (21) / 2.2 V (22) / 2.3 V (23) / 2.4 V (24) / 2.5 V (25) /
2.7 V (27) / 2.8 V (28) / 3.0 V (30) / 3.1 V (31) / 3.3 V (33) / 3.6 V (36)
Contact Ricoh sales representatives for other voltages.
#: Specify the divided ratio of BM output voltage.
3: VIN/3
4: VIN/4
∗: Specify the CE pin and the auto-discharge option.
CE pin
Auto-discharge
∗
LDO
BM
No
No
B
Controlling LDO with the CE pin (Active-high)
LDO
BM
Yes
No
D
E
Controlling LDO with the CE pin (Active-high)
Controlling BM with the CE pin (Active-high)
LDO
BM
No
Yes
2
RP124x
No. EA-503-191025
BLOCK DIAGRAMS
RP124xxxxB Block Diagram
RP124xxxxD Block Diagram
3
RP124x
No. EA-503-191025
RP124xxxxE Block Diagram
4
RP124x
No. EA-503-191025
PIN DESCRIPTIONS
Top View
Bottom View
5
4
6
5
4
4
5
6
(mark side)
(1)
1
2
3
3
2
1
1
2
3
1
RP124L (DFN1212-6) Pin Configuration
RP124N (SOT-23-5) Pin Configuration
RP124L (DFN1212-6) Pin Description
Pin No.
Symbol
VOUT
GND
BM
Description
1
2
3
4
5
6
Output Pin
Ground Pin
Battery Monitoring Output Pin
Chip Enable Pin, Active-high
No Connection
CE
NC
VDD
Input Pin
RP124N (SOT-23-5) Pin Description
Pin No.
Symbol
VDD
GND
CE
Description
1
2
3
4
5
Input Pin
Ground Pin
Chip Enable Pin, Active-high
Battery Monitoring Output Pin
Output Pin
BM
VOUT
(1) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate
level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating.
5
RP124x
No. EA-503-191025
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
VIN
Item
Rating
−0.3 to 6.5
−0.3 to 6.5
−0.3 to VIN + 0.3
−0.3 to VIN + 0.3
130
Unit
V
Input Voltage
VCE
CE Pin Voltage
VOUT Pin Voltage
BM Pin Voltage
Output Current
V
VOUT
VBM
V
V
IOUT
mA
mW
mW
°C
°C
DFN1212-6 (JEDEC STD. 51-7 Test Land Pattern)
SOT-23-5 (JEDEC STD. 51-7 Test Land Pattern)
850
Power
PD
Dissipation(1)
660
Tj
Junction Temperature Range
Storage Temperature Range
−40 to 125
−55 to 125
Tstg
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage
and may degrade the life time and safety for both device and system using the device in the field. The functional
operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Item
Rating
1.7 to 5.5
2.4 to 5.5
−40 to 85
Unit
V
RP124xxx3x
RP124xxx4x
VIN
Input Voltage
Ta
Operating Temperature
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1) Refer to POWEWR DISSIPATION for detailed information.
6
RP124x
No. EA-503-191025
ELECTRICAL CHARACTERISTICS
VIN = VSET + 1.0 V, IOUT = 1.5 mA, CIN = COUT = 1.0 μF, unless otherwise noted.
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP124x Electrical Characteristics: LDO Section
(Ta = 25°C)
Symbol
Parameters
Output Voltage
Output Current
Test Conditions
Min. Typ. Max.
Unit
x0.992
x0.987
−16
x1.008
x1.013
16
VSET > 2.0 V
V
VOUT
mV
VSET ≤ 2.0 V
−26
26
IOUT
100
mA
%
Output Voltage
Deviation
When Switching Mode
VSET > 2.0 V
−1
1
∆VOUT
1 µA ≤ IOUT ≤ IOUTH
−20
20
mV
VSET ≤ 2.0 V
∆VOUT
/∆IOUT
Load Regulation
Dropout Voltage
−40
2
40
mV
1.5 mA ≤ IOUT ≤ 100 mA
Refer to Product-specific
Electrical Characteristics
VDIF
ISS
IOUTH
IOUTL
IOUT = 100 mA
0.2
0.42
0.5
µA
µA
Supply Current
VCE = VIN, IOUT = 0 mA
Fast Mode
Switching Current
IOUT = From Light Load to Heavy Load,
VIN = 5.0 V
0.5
mA
mA
Low Power Mode
Switching Current
IOUT = From Heavy Load to Light Load,
VIN = 5.0 V
0.08
1.0
∆VOUT
/∆VIN
Line Regulation
VSET + 0.5 V ≤ VIN ≤ 5.5 V
VOUT = 0 V
0.02
65
0.2
0.4
%/V
mA
V
ISC
Short Current Limit
CE Pin Input Voltage,
high
VCEH
RP124xxxxB/D
CE Pin Input Voltage,
low
VCEL
RP124xxxxB/D
V
Auto-discharge NMOS
On-resistance
RDISN
VIN = 4.0 V, VCE = 0 V, RP124xxxxD
50
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition Tj ≈ Ta = 25°C.
7
RP124x
No. EA-503-191025
ELECTRICAL CHARACTERISTICS (continued)
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP124x Product-specific Electrical Characteristics: LDO Section
VOUT [V]
VDIF [V]
Typ.
Product
Name
Ta = 25°C
Typ.
−40°C ≤ Ta ≤ 85°C
Min.
1.184
1.484
1.784
2.084
2.183
2.282
2.381
2.480
2.679
2.778
2.976
3.076
3.274
3.572
Max.
1.216
1.516
1.816
2.116
2.217
2.318
2.419
2.520
2.721
2.822
3.024
3.124
3.326
3.628
Min.
1.174
1.474
1.774
2.073
2.172
2.271
2.369
2.468
2.665
2.764
2.961
3.060
3.258
3.554
Typ.
Max.
1.226
1.526
1.826
2.127
2.228
2.329
2.431
2.532
2.735
2.836
3.039
3.140
3.342
3.646
Max.
0.975
0.660
0.380
0.285
RP124x12xx
RP124x15xx
RP124x18xx
RP124x21xx
RP124x22xx
RP124x23xx
RP124x24xx
RP124x25xx
RP124x27xx
RP124x28xx
RP124x30xx
RP124x31xx
RP124x33xx
RP124x36xx
1.200
1.500
1.800
2.100
2.200
2.300
2.400
2.500
2.700
2.800
3.000
3.100
3.300
3.600
1.200
1.500
1.800
2.100
2.200
2.300
2.400
2.500
2.700
2.800
3.000
3.100
3.300
3.600
0.640
0.410
0.230
0.150
0.130
0.110
0.100
0.090
0.230
0.180
0.160
0.145
8
RP124x
No. EA-503-191025
ELECTRICAL CHARACTERISTICS (continued)
CIN = 1.0 μF, CBM = 0.22 μF, unless otherwise noted.
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP124x Electrical Characteristics: Battery Monitor Section
(Ta = 25°C)
Symbol
Parameters
Test Conditions
Min.
Typ.
Max.
Unit
VIN/3−20 VIN/3 VIN/3+20
VIN/3−25 VIN/3 VIN/3+25
VIN/4−20 VIN/4 VIN/4+20
VIN/4−25 VIN/4 VIN/4+25
1.7 V ≤ VIN ≤ 5.5 V,
RP124xxx3x
VBM
Output Voltage
−10 μA ≤ IBM ≤ 10 μA
mV
2.4 V ≤ VIN ≤ 5.5 V,
RP124xxx4x
1.7 V ≤ VIN ≤ 5.5 V, RP124xxx3x
2.4 V ≤ VIN ≤ 5.5 V, RP124xxx4x
VIN = VCE = 3.6 V , IBM = 0 μA
IBM
Output Current
−10
10
µA
µA
V
ISSBM Supply Current
0.1
0.2
1.7 V ≤ VIN ≤ 5.5 V, RP124xxx3E
2.4 V ≤ VIN ≤ 5.5 V, RP124xxx4E
1.7 V ≤ VIN ≤ 5.5 V, RP124xxx3E
2.4 V ≤ VIN ≤ 5.5 V, RP124xxx4E
CE Pin Input
VCEHBM
1.0
Voltage, high
CE Pin Input
VCELBM
0.4
V
Voltage, low
Auto-discharge
RDISNBM NMOS On-
resistance
VIN = 4.0 V, VCE = 0 V, RP124xxxxE
50
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition Tj ≈ Ta = 25°C.
9
RP124x
No. EA-503-191025
APPLICATION INFORMATION
TYPICAL APPLICATION
MCU
VIN
VOUT
Power Management IC
VCC
RP124xxxxB/D
VDD
ADC
Battery
Monitor
BM
GND
CIN
CE
LDO
GND
VDD
VOUT
CE control
Peripheral
(Sensor)
Battery
CBM
COUT
RP124xxxxB/D Typical Application Circuit
RP124xxxxE
MCU
VDD
CE
LDO
VOUT
BM
VCC
Battery
Monitor
CIN
ADC
GND
CE control
Battery
COUT
CBM
GND
RP124xxxxE Typical Application Circuit
10
RP124x
No. EA-503-191025
VIN
VCE
tW
tW
VBM
ADC
Sampling
Timing Chart Example of RP124xxxxE Circuit
The above diagram shows the example of using the RP124xxxxE typical application circuit and its timing chart.
Connecting BM pin and ADC input pin of MCU enables monitoring the battery voltage. Controlling the start-up
and stop of Battery Monitor with CE pin by the timing based on the ADC sampling reduces power consumption
of the entire system. When monitoring the battery voltage, set the waiting time (tW) in order to stabilize
waveform after the CE input voltage is set to “H”. It is recommended to set tW ≥ 10 ms for this product.
Notes on External Components
•
Phase compensation is provided to secure stable operation even when the load current is varied. For this
purpose, use a 1.0-µF or more output capacitor (COUT) between the VOUT and GND pins, and a 0.1-µF
to 0.22-µF capacitor (CBM) between the BM and GND pins with shortest-distance wiring. In case of using
a tantalum type capacitor with a large ESR (Equivalent Series Resistance), the output might become
unstable. Evaluate your circuit including consideration of frequency characteristics.
•
Connect a 1.0-µF or more input capacitor (CIN) between the VDD and GND pins with shortest-distance
wiring.
11
RP124x
No. EA-503-191025
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed its rated voltage, rated current or
rated power. When designing a peripheral circuit, please be fully aware of the following points.
•
•
The high impedance of the wirings may result in noise pickup and unstable operation of the device.
Reduce the impedance of the VDD and GND wirings.
When an intermediate voltage other than VIN or GND is input to the CE pin, a supply current may be
increased with a through current of a logic circuit in the IC. The CE pin is neither pulled up nor pulled
down, therefore an operation is not stable at open.
12
RP124x
No. EA-503-191025
TYPICAL CHARACTERISTICS
Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) LDO Output Voltage vs. Temperature (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF)
RP124x12xx, VIN = 2.2 V, IOUT = 1.5 mA
RP124x18xx, VIN = 2.8 V, IOUT = 1.5 mA
RP124x28xx, VIN = 3.8 V, IOUT = 1.5 mA
RP124x36xx, VIN = 4.6 V, IOUT = 1.5 mA
2) LDO Supply Current vs. Temperature (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF)
RP124x12xx, VIN = 2.2 V RP124x18xx, VIN = 2.8 V
13
RP124x
No. EA-503-191025
RP124x28xx, VIN = 3.8 V
RP124x36xx, VIN = 4.6 V
3) BM Supply Current vs. Temperature (CIN = Ceramic 1.0 µF, CBM = Ceramic 0.1 µF)
RP124xxx3x, VIN = 3.6 V RP124xxx4x, VIN = 3.6 V
4) BM Output Voltage vs. Input Voltage (CIN = Ceramic 1.0 µF, CBM = Ceramic 0.1 µF, Ta = 25°C)
RP124xxx3x RP124xxx4x
14
RP124x
No. EA-503-191025
5) BM Output Voltage vs. Temperature (CIN = Ceramic 1.0 µF, CBM = Ceramic 0.1 µF)
RP124xxx3x, VIN = 3.6 V RP124xxx4x, VIN = 3.6 V
6) BM Supply Current vs. Input Voltage (CIN = Ceramic 1.0 µF, CBM = Ceramic 0.1 µF, Ta = 25°C)
RP124xxx3x RP124xxx4x
7) LDO Dropout Voltage vs. Temperature (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF)
RP124x12xx RP124x18xx
15
RP124x
No. EA-503-191025
RP124x28xx
RP124x36xx
8) LDO Dropout Voltage vs. Output Current (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF)
RP124x12xx RP124x18xx
RP124x28xx
RP124x36xx
16
RP124x
No. EA-503-191025
9) LDO Dropout Voltage vs. Set Output Voltage (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25℃)
10) LDO Output Voltage vs. Output Current (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25℃)
RP124x12xx RP124x18xx
RP124x28xx
RP124x36xx
17
RP124x
No. EA-503-191025
11) LDO Output Voltage vs. Input Voltage (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25℃)
RP124x12xx
RP124x18xx
RP124x28xx
RP124x36xx
12) LDO Supply Current vs. Input Voltage (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25℃)
RP124x12xx
0.25
0.2
0.15
0.1
0.05
0
0
1
2
3
4
5
6
Input Voltage[V]
18
RP124x
No. EA-503-191025
RP124x18xx (10µA/div)
RP124x18xx (0.05µA/div)
45
40
35
30
25
20
15
10
5
0.25
0.2
0.15
0.1
0.05
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage[V]
Input Voltage[V]
RP124x28xx (10µA/div)
RP124x28xx (0.05µA/div)
RP124x36xx (10µA/div)
RP124x36xx (0.05µA/div)
19
RP124x
No. EA-503-191025
13) LDO Supply Current vs. Output Current (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xx
RP124x18xx
RP124x28xx
RP124x36xx
14) Ripple Rejection vs. Frequency (CIN = none, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xx, VIN = 2.2 V RP124x18xx, VIN = 2.8 V
20
RP124x
No. EA-503-191025
RP124x28xx, VIN = 3.8V
RP124x36xx, VIN = 4.6V
15) Ripple Rejection vs. Input Voltage (CIN = none, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xx, IOUT = 100 µA RP124x18xx, IOUT = 100 µA
RP124x28xx, IOUT = 100µA
RP124x36xx, IOUT = 100µA
21
RP124x
No. EA-503-191025
RP124x12xx, IOUT = 30mA
RP124x18xx, IOUT = 30mA
RP124x28xx, IOUT = 30mA
RP124x36xx, IOUT = 30mA
16) LDO Input Transient Response (CIN = Ceramic 0.1 µF, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xx, IOUT = 100 µA, tR = tF = 5 µs RP124x12xx, IOUT = 30 mA, tR = tF = 5 µs
22
RP124x
No. EA-503-191025
RP124x18xx, IOUT = 100 µA, tR = tF = 5 µs
RP124x28xx, IOUT = 100 µA, tR = tF = 5 µs
RP124x36xx, IOUT = 100 µA, tR = tF = 5 µs
RP124x18xx, IOUT = 30 mA, tR = tF = 5 µs
RP124x28xx, IOUT = 30 mA, tR = tF = 5 µs
RP124x36xx, IOUT = 30 mA, tR = tF = 5 µs
23
RP124x
No. EA-503-191025
17) LDO Load Transient Response (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xx
RP124x12xx
VIN = 2.2 V, IOUT = 1 µA <=> 10 mA, tR = tF = 5 µs
VIN = 2.2 V, IOUT = 1.5 mA <=> 10 mA, tR = tF = 5 µs
RP124x12xx
VIN = 2.2 V, IOUT = 10 mA <=> 30 mA, tR = tF = 5 µs
RP124x18xx
RP124x18xx
VIN = 2.8 V, IOUT = 1 µA <=> 10 mA, tR = tF = 5 µs
VIN = 2.8 V, IOUT = 1.5 mA <=> 10 mA, tR = tF = 5 µs
24
RP124x
No. EA-503-191025
RP124x18xx
VIN = 2.8 V, IOUT = 10 mA <=> 30 mA, tR = tF = 5 µs
RP124x28xx
VIN = 3.8 V, IOUT = 1 µA <=> 10 mA, tR = tF = 5 µs
RP124x28xx
VIN = 3.8 V, IOUT = 1.5 mA <=> 10 mA, tR = tF = 5 µs
RP124x28xx
VIN = 3.8 V, IOUT = 10 mA <=> 30 mA, tR = tF = 5 µs
25
RP124x
No. EA-503-191025
RP124x36xx
RP124x36xx
VIN = 4.6 V, IOUT = 1 µA <=> 10 mA, tR = tF = 5 µs
VIN = 4.6 V, IOUT = 1.5 mA <=> 10 mA, tR = tF = 5 µs
RP124x36xx
RP124x364x
VIN = 4.6 V, IOUT = 10 mA <=> 30 mA, tR = tF = 5 µs
VIN = 4.6 V, IOUT = 1 µA <=> 10 mA, tR = tF = 5 µs
18) LDO Turning-on with CE Pin (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xD, VIN = 2.2 V, VCE = 0 V => 2.2 V RP124x18xD, VIN = 2.8 V, VCE = 0 V => 2.8 V
26
RP124x
No. EA-503-191025
RP124x28xD, VIN = 3.8 V, VCE = 0 V => 3.8 V
RP124x36xD, VIN = 4.6 V, VCE = 0 V => 4.6 V
19) LDO Turning-off with CE Pin (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, Ta = 25°C)
RP124x12xD, VIN = 2.2 V, VCE = 2.2 V => 0 V RP124x18xD, VIN = 2.8 V, VCE = 2.8 V => 0 V
RP124x28xD, VIN = 3.8 V, VCE = 3.8 V => 0 V
RP124x36xD, VIN = 4.6 V, VCE = 4.6 V => 0 V
27
RP124x
No. EA-503-191025
RP124x364D, VIN = 4.6 V, VCE = 0 V <=> 4.6 V
20) BM Turning-on/off with CE Pin (CIN = Ceramic 1.0 µF, CBM = Ceramic 0.1 µF, 0.22 µF, Ta = 25°C)
RP124xxx3x, VIN = 3.6 V, VCE = 0 V <=> 3.6 V
RP124xxx4x, VIN = 3.6 V, VCE = 0 V <=> 3.6 V
RP124xxx3x, VIN = 5.5 V, VCE = 0 V <=> 5.5 V
RP124xxx4x, VIN = 5.5 V, VCE = 0 V <=> 5.5 V
28
RP124x
No. EA-503-191025
21) Inrush Current at CE Pin’s Activation (CIN = Ceramic 0.1 µF, Ta = 25°C)
RP124x12xx, VIN = 2.2 V, VCE = 0 V => 2.2 V ②
RP124x12xx, VIN = 2.2 V, VCE = 0 V => 2.2 V ①
RP124x18xx, VIN = 2.8 V, VCE = 0 V => 2.8 V ①
RP124x28xx, VIN = 3.8 V, VCE = 0 V => 3.8 V ①
RP124x18xx, VIN = 2.8 V, VCE = 0 V => 2.8 V ②
RP124x28xx, VIN = 3.8 V, VCE = 0 V => 3.8 V ②
29
RP124x
No. EA-503-191025
RP124x36xx, VIN = 4.6 V, VCE = 0 V => 4.6 V ①
RP124x36xx, VIN = 4.6 V, VCE = 0 V => 4.6 V ②
22) ESR vs. Output Current (CIN = Ceramic 1.0 µF, COUT = Ceramic 1.0 µF, CBM = Ceramic 0.1 µF)
Measuring Frequency：10 Hz to 2 MHz、Ambient Temperature：-40°C to 5°C
LDO
BM
RP124x12xx, VIN= 1.7V to 5.5V
RP124xxx3x, VIN= 1.7V to 5.5V
LDO
BM
RP124x28xx, VIN = 2.8 V to 5.5 V
RP124xxx4x, VIN = 2.4 V to 5.5 V
30
RP124x
No. EA-503-191025
LDO
RP124x36xx, VIN = 3.6 V to 5.5 V
31
POWER DISSIPATION
DFN1212-6
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Environment
Board Material
Board Dimensions
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Copper Ratio
Through-holes
0.2 mm × 14 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
850 mW
Thermal Resistance (ja)
ja = 117°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 50°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1000
900
850
800
700
600
500
400
300
200
100
0
85
0
25
50
75
100
125
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
DFN1212-6
Ver. B
DFN1212-6 Package Dimensions
∗ The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the
ground plane on the board, or otherwise be left floating.
i
POWER DISSIPATION
SOT-23-5
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Environment
Board Material
Board Dimensions
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
0.3 mm × 7 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
660 mW
Thermal Resistance (ja)
ja = 150°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
SOT-23-5
Ver. A
2.9±0.2
1.9±0.2
1.1±0.1
0.8±0.1
(0.95)
(0.95)
5
4
3
0～0.1
1
2
+0.1
0.15-0.05
0.4±0.1
SOT-23-5 Package Dimensions
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
Halogen Free
April 1, 2012.
Official website
https://www.e-devices.ricoh.co.jp/en/
Contact us
https://www.e-devices.ricoh.co.jp/en/support/
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