ADG802BRT-REEL7 [ROCHESTER]
1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO6, MO-178AB, SOT-23, 6 PIN;
| 型号： | ADG802BRT-REEL7 |
| 厂家： | 
Rochester Electronics |
| 描述： | 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO6, MO-178AB, SOT-23, 6 PIN 光电二极管 |
| 文件： | 总17页 (文件大小：1060K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
<0.4 Ω CMOS 1.8 V to 5.5 V
SPST Switches
ADG801/ADG802
FUNCTIONAL BLOCK DIAGRAM
FEATURES
0.4 Ω maximum on resistance @ 125°C
0.08 Ω maximum on resistance flatness @ 125°C
1.8 V to 5.5 V single supply
ADG801
S
D
Automotive temperature range from −40°C to +125°C
400 mA current-carrying capability
Tiny 6-lead SOT-23, 8-lead MSOP, and 6-ball WLCSP packages
35 ns switching times
IN
ADG802
Low power consumption
TTL-/CMOS-compatible inputs
S
D
Pin compatible with ADG701/ADG702
APPLICATIONS
IN
Power routing
Cellular phones
Modems
PCMCIA cards
SWITCHES SHOWN FOR
A LOGIC 1 INPUT
Figure 1.
Hard drives
Data acquisition systems
Communications systems
Relay replacement
Battery-powered systems
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG801 and ADG802 are monolithic CMOS, single-pole,
single throw (SPST) switches with on resistance of less than
0.4 Ω. These switches are designed using an advanced
submicron process that provides extremely low on resistance,
high switching speed, and low leakage currents.
1. Low on resistance (0.25 Ω typical).
2. 1.8 V to 5.5 V single-supply operation.
3. Tiny 6-lead SOT-23, 8-lead MSOP, and 6-ball WLCSP
packages.
4. 400 mA current-carrying capability.
The low on resistance of <0.4 Ω makes these parts ideal for
applications where low on resistance switching is critical.
5. Automotive temperature range from −40°C to +125°C.
6. Pin compatible with ADG701 (ADG801) and ADG702
(ADG802).
The ADG801 switch is normally open (NO), while the ADG802
is normally closed (NC). Each switch conducts equally well in
both directions when on.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2002–2007 Analog Devices, Inc. All rights reserved.
ADG801/ADG802
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions..............................6
Terminology.......................................................................................7
Typical Performance Characteristics ..............................................8
Test Circuits..................................................................................... 10
Outline Dimensions....................................................................... 12
Ordering Guide .......................................................................... 14
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
REVISION HISTORY
3/07—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Added 6-Ball WLCSP Package (Text and Figures) ........Universal
Replaced Typical Performance Characteristics Section .............. 8
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 14
5/02—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG801/ADG802
SPECIFICATIONS
VDD = 5 V 10%, GND = 0 V, unless otherwise noted. The automotive temperature range is −40°C to +125°C.
Table 1.
Parameter
25°C
−40°C to +85°C
−40°C to +125°C1
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
0 V to VDD
0.4
V
0.25
0.3
0.05
Ω typ
Ω max
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA; Test Circuit 1
VS = 0 V to VDD, IS = 100 mA; Test Circuit 1
VS = 0 V to VDD, IS = 100 mA
0.35
0.07
On Resistance Flatness (RFLAT(ON)
)
0.08
LEAKAGE CURRENTS
VDD = 5.5 V
Source Off Leakage, IS (Off)
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test
Circuit 2
VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test
Circuit 2
VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test
Circuit 2
VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test
Circuit 2
3
30
Drain Off Leakage, ID (Off)
3
3
30
30
Channel On Leakage, ID, IS (On)
0.01
0.25
nA typ
nA max
VS = VD = 1 V, or 4.5 V; Test Circuit 3
VS = VD = 1 V, or 4.5 V; Test Circuit 3
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
IINL or IINH
0.005
5
μA typ
μA max
pF typ
VIN = VINL or VINH
0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS2
tON
35
45
9
15
50
ns typ
ns max
ns typ
ns max
pC typ
RL = 50 Ω, CL = 35 pF
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF
VS = 3 V; Test Circuit 4
VS = 2.5 V, RS = 0 Ω; CL = 1 nF;
Test Circuit 5
50
18
55
21
tOFF
Charge Injection
Off Isolation
−61
dB typ
RL = 50 Ω, CL = 5 pF; f = 100 kHz;
Test Circuit 6
Bandwidth −3 dB
CS (Off)
CD (Off)
12
MHz typ
pF typ
pF typ
pF typ
RL = 50 Ω, CL = 5 pF; Test Circuit 7
f = 1 MHz
f = 1 MHz
180
180
420
CD, CS (On)
f = 1 MHz
POWER REQUIREMENTS
IDD
VDD = 5.5 V
Digital inputs = 0 V or 5.5 V
0.001
μA typ
1.0
2.0
μA max
1 On resistance parameters tested with IS = 10 mA.
2 Guaranteed by design, not subject to production test.
Rev. A | Page 3 of 16
ADG801/ADG802
VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted. The automotive temperature range is −40°C to +125°C.
Table 2.
Parameter
25°C
−40°C to +85°C −40°C to +125°C1 Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
0 V to VDD
V
0.4
0.6
0.1
Ω typ
Ω max
Ω typ
VS = 0 V to VDD, IS = 100 mA; Test Circuit 1
VS = 0 V to VDD, IS = 100 mA; Test Circuit 1
VS = 0 V to VDD, IS = 100 mA
0.65
0.1
0.7
0.1
On Resistance Flatness (RFLAT(ON)
)
LEAKAGE CURRENTS
VDD = 3.6 V
Source Off Leakage, IS (Off)
0.01
0.25
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
nA typ
nA max
VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2
VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2
VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2
VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2
VS = VD = 1 V, or 3.3 V; Test Circuit 3
VS = VD = 1 V, or 3.3 V; Test Circuit 3
3
3
3
30
30
30
Drain Off Leakage, ID (Off)
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
IINL or IINH
0.005
5
μA typ
μA max
pF typ
VIN = VINL or VINH
0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS2
tON
40
55
9
15
10
−61
ns typ
ns max
ns typ
ns max
pC typ
dB typ
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; Test Circuit 4
VS = 1.5 V, RS = 0 Ω, CL = 1 nF; Test Circuit 5
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 6
60
18
65
21
tOFF
Charge Injection
Off Isolation
Bandwidth −3 dB
CS (Off)
CD (Off)
12
MHz typ RL = 50 Ω, CL = 5 pF; Test Circuit 7
180
180
420
pF typ
pF typ
pF typ
f = 1 MHz
f = 1 MHz
f = 1 MHz
CD, CS (On)
POWER REQUIREMENTS
IDD
VDD = 3.6 V
Digital inputs = 0 V or 3.6 V
0.001
μA typ
1.0
2.0
μA max
1 On resistance parameters tested with IS = 10 mA.
2 Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 16
ADG801/ADG802
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Parameter
Rating
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
VDD to GND
Analog Inputs1
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
−0.3 V to VDD + 0.3 V or
Digital Inputs1
30 mA, whichever occurs first
Continuous Current, Pin S or Pin D 400 mA
Peak Current, Pin S or Pin D
800 mA, pulsed at 1 ms,
10% duty cycle max
−40°C to +125°C
Table 3. Truth Table
ADG801 (Pin IN) ADG802 (Pin IN) Switch Condition
Operating Temperature Range
Automotive
Storage Temperature Range
0
1
1
0
Off
On
−65°C to +150°C
150°C
(TJMAX – TA)/θJA
Junction Temperature (TJMAX
Package Power Dissipation
MSOP
)
ESD CAUTION
θJA Thermal Impedance
θJC Thermal Impedance
SOT-23 (4-Layer Board)
θJA Thermal Impedance
θJC Thermal Impedance
WLCSP (4-Layer Board)
θJA Thermal Impedance
206°C/W
44°C/W
119°C/W
91.99°C/W
120°C/W
300°C
Lead Temperature, Soldering
(10 sec)
IR Reflow, Peak Temperature
(<20 sec)
235°C
Reflow Soldering (Pb-Free)
PeakTemperature
260(+0/−5)°C
Time at PeakTemperature
10 sec to 40 sec
1 Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes.
Current should be limited to the maximum ratings provided.
Rev. A | Page 5 of 16
ADG801/ADG802
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
D
1
2
3
6
5
4
V
DD
AD801/
ADG802
TOP VIEW
S
NC
IN
(Not to Scale)
GND
NC = NO CONNECT
Figure 2. 6-Lead SOT-23
(RJ-6)
D
NC
NC
1
2
3
4
8
7
6
5
S
ADG801/
ADG802
TOP VIEW
GND
IN
(Not to Scale)
V
NC
DD
NC = NO CONNECT
Figure 3. 8-Lead MSOP
(RM-8)
BALL A1
INDICATOR
A
B
VDD
D
1
2
3
NC
IN
S
GND
ADG801/
ADG802
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
NC = NO CONNECT
Figure 4. 6-Ball 2 ×3 WLCSP
(CB-6-1)
Table 4. Pin Function Descriptions
Pin Number
Mnemonic
Description
SOT-23
MSOP
WLCSP
B1
B2
B3
A3
1
2
3
4
5
6
1
8
7
6
D
S
GND
IN
NC
VDD
Drain Terminal. Can be an input or an output.
Source Terminal. Can be an input or an output.
Ground (0 V) Reference.
Logic Control Input.
Most Positive Power Supply Potential.
Most Positive Power Supply Potential.
2, 3, 5
4
A2
A1
Rev. A | Page 6 of 16
ADG801/ADG802
TERMINOLOGY
IINL (IINH
Input current of the digital input.
)
VDD
The most positive power supply potential.
CS (Off)
IDD
The off switch source capacitance is measured with reference
to ground.
Positive supply current.
GND
CD (Off)
Ground (0 V) reference.
The off switch drain capacitance is measured with reference
to ground.
S
The source terminal can be an input or an output.
CD, CS (On)
D
The on switch capacitance is measured with reference
to ground.
The drain terminal can be an input or an output.
IN
CIN
Logic control input.
Digital input capacitance.
VD (VS)
tON
Analog voltage on Terminal D and Terminal S.
The delay between applying the digital control input and when
the output switches on. See Figure 17.
RON
Ohmic resistance between Terminal D and Terminal S.
tOFF
RFLAT(ON)
The delay between applying the digital control input and when
The difference between the maximum and minimum value of
the output switches off.
on resistance as measured over the specified analog signal range.
Charge Injection
IS (Off)
A measure of the glitch impulse transferred from the digital
Source leakage current with the switch off.
input to the analog output during switching.
ID (Off)
Off Isolation
Drain leakage current with the switch off.
A measure of unwanted signal coupling through an off switch.
ID, IS (On)
Bandwidth
Channel leakage current with the switch on.
The frequency at which the output is attenuated by 3 dB.
VINL
On Response
Maximum input voltage for Logic 0.
The frequency response of the on switch.
VINH
Insertion Loss
Minimum input voltage for Logic 1.
The loss due to the on resistance of the switch.
Rev. A | Page 7 of 16
ADG801/ADG802
TYPICAL PERFORMANCE CHARACTERISTICS
0.50
3.5
3.0
T
= 25°C
V
= 2.7V
A
DD
V
= 5V, 3V
DD
0.45
V
= 3.0V
DD
0.40
0.35
V
= 3.3V
V
DD
2.5
2.0
= 4.5V
DD
0.30
0.25
0.20
0.15
I , I (ON)
S
D
1.5
1.0
V
= 5.5V
DD
I
(OFF)
D
V
= 5.0V
DD
0.5
0
0.10
0.05
0
I
(OFF)
120
S
–0.5
0
1.0
2.0
3.0
(V ) (V)
4.0
5.0 5.5
0
20
40
60
80
100
V
TEMPERATURE (°C)
D
S
Figure 5. On Resistance vs. VD (VS)
Figure 8. Leakage Current vs. Temperature
0.50
400
300
V
= 5V
DD
T
= 25°C
A
0.45
0.40
V
= 5V
DD
+125°C
+85°C
0.35
0.30
200
100
0
V
= 3V
DD
0.25
0.20
0.15
0.10
0.05
+25°C
–40°C
–100
–200
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
0.5
1.0
1.5
2.0
2.5
(V)
3.0
3.5
4.0
4.5
5.0
V
(V ) (V)
D
S
V
S
Figure 6. On Resistance vs. VD (VS) for Different Temperatures
Figure 9. Charge Injection vs. Source Voltage
0.50
50
45
40
35
V
= 3V
DD
0.45
0.40
V
= 3V
DD
+125°C
+85°C
tON
V
= 5V
DD
0.35
0.30
30
25
20
15
0.25
+25°C
0.20
0.15
0.10
0.05
–40°C
V
= 3V, 5V
DD
tOFF
10
5
0
0
–40
0
0.5
1.0
1.5
(V ) (V)
2.0
2.5
3.0
–20
0
20
40
60
80
100
120
V
TEMPERATURE (°C)
D
S
Figure 10. tON/tOFF Times vs. Temperature
Figure 7. On Resistance vs. VD (VS) for Different Temperatures
Rev. A | Page 8 of 16
ADG801/ADG802
–10
–20
–30
–40
1.8
1.6
T
V
= 25°C
A
= 3V, 5V
DD
1.4
1.2
1.0
V
RISING
IN
V
FALLING
IN
0.8
–50
–60
–70
0.6
0.4
0.2
0
0.1
1
10
0
1
2
3
4
5
6
FREQUENCY (MHz)
V
(V)
DD
Figure 13. Logic Threshold Voltage vs. Supply Voltage
Figure 11. Off Isolation vs. Frequency
0
–1
–2
–3
–4
–5
–6
–7
T
V
= 25°C
A
–8
–9
= 3V, 5V
DD
0.2
1
10
20
FREQUENCY (MHz)
Figure 12. On Response vs. Frequency
Rev. A | Page 9 of 16
ADG801/ADG802
TEST CIRCUITS
I
(ON)
I
IS (OFF)
A
ID (OFF)
A
D
DS
S
D
S
D
NC
V1
V
D
V
D
NC = NO CONNECT
S
D
V
R
= V1/I
DS
S
ON
Figure 14. On Resistance
Figure 15. Off Leakage
Figure 16. On Leakage
V
DD
0.1µF
V
V
IN
IN
50%
50%
50%
50%
ADG801
ADG802
V
DD
V
L
OUT
S
D
R
50Ω
C
L
V
S
35pF
IN
90%
90%
V
OUT
GND
tOFF
tON
Figure 17. Switching Times
V
DD
V
V
DD
IN
ADG801
ON
OFF
R
S
D
S
V
OUT
V
C
L
1nF
S
V
IN
ADG802
IN
V
OUT
ΔV
OUT
GND
Q
= C × ΔV
L OUT
INJ
Figure 18. Charge Injection
Rev. A | Page 10 of 16
ADG801/ADG802
V
DD
0.1µF
NETWORK
ANALYZER
V
DD
S
50Ω
50Ω
IN
V
S
D
V
OUT
V
IN
R
L
50Ω
GND
V
OUT
OFF ISOLATION = 20 log
V
S
Figure 19. Off Isolation
V
V
DD
DD
0.1µF
NETWORK
ANALYZER
S
50Ω
IN
V
S
D
V
OUT
V
IN
R
L
50Ω
GND
V
WITH SWITCH
OUT
INSERTION LOSS = 20 log
V
WITHOUT SWITCH
OUT
Figure 20. Bandwidth
Rev. A | Page 11 of 16
ADG801/ADG802
OUTLINE DIMENSIONS
2.90 BSC
6
1
5
2
4
3
2.80 BSC
1.60 BSC
PIN 1
INDICATOR
0.95 BSC
1.90
BSC
1.30
1.15
0.90
1.45 MAX
0.22
0.08
10°
4°
0°
0.60
0.45
0.30
0.50
0.30
0.15 MAX
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-178-AB
Figure 21. 6-Lead Small Outline Transistor Package [SOT-23]
(RJ-6)
Dimensions shown in inches and (millimetes)
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.80
0.60
0.40
8°
0°
0.15
0.00
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 22. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Rev. A | Page 12 of 16
ADG801/ADG802
0.67
0.57
0.47
1.34
1.14
0.94
0.44
0.36
0.28
0.50
0.32
SEATING
PLANE
0.32 NOM
0.50
BALL PITCH
BALL 1
IDENTIFIER
2.38
2.18
1.98
0.59
0.24 MAX
COPLANARITY
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
Figure 23. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-1)
Dimensions shown in millimeters
Rev. A | Page 13 of 16
ADG801/ADG802
ORDERING GUIDE
Model
ADG801BCB-REEL7
ADG801BCBZ-REEL72
ADG801BRM
ADG801BRM-REEL
ADG801BRM-REEL7
ADG801BRMZ2
ADG801BRMZ-REEL2
ADG801BRMZ-REEL72
ADG801BRT-R2
ADG801BRT-500RL7
ADG801BRT-REEL
ADG801BRT-REEL7
ADG801BRTZ-500RL72
ADG801BRTZ-REEL2
ADG801BRTZ-REEL72
ADG802BCB-REEL7
ADG802BCBZ-REEL72
ADG802BRM-R2
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
Package Option
CB-6-1
CB-6-1
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RJ-6
RJ-6
RJ-6
RJ-6
RJ-6
RJ-6
RJ-6
Branding1
SLB
S06
SLB
SLB
SLB
S06
S06
S06
SLB
SLB
SLB
SLB
S06
S06
S06
6-Ball Wafer Level Chip Scale Package [WLCSP]
6-Ball Wafer Level Chip Scale Package [WLCSP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Ball Wafer Level Chip Scale Package [WLCSP]
6-Ball Wafer Level Chip Scale Package [WLCSP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
CB-6-1
CB-6-1
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RJ-6
SMB
S0F
SMB
SMB
SMB
SMB
S0F
S0F
S0F
SMB
SMB
SMB
S0F
ADG802BRM
ADG802BRM-REEL
ADG802BRM-REEL7
ADG802BRMZ2
ADG802BRMZ-REEL2
ADG802BRMZ-REEL72
ADG802BRT-500RL7
ADG802BRT-REEL
ADG802BRT-REEL7
ADG802BRTZ-500RL72
ADG802BRTZ-REEL2
ADG802BRTZ-REEL72
RJ-6
RJ-6
RJ-6
RJ-6
S0F
S0F
RJ-6
1 Branding on SOT-23 and MSOP packages is limited to three characters due to space constraints.
2 Z = RoHS Compliant Part.
3
Rev. A | Page 14 of 16
ADG801/ADG802
NOTES
Rev. A | Page 15 of 16
ADG801/ADG802
NOTES
©2002–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02800-0-3/07(A)
Rev. A | Page 16 of 16
相关型号：
ADG802BRTZ-500RL7
1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO6, ROHS COMPLIANT, MO-178AB, SOT-23, 6 PIN
ROCHESTER
ADG802BRTZ-REEL7
1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO6, ROHS COMPLIANT, MO-178AB, SOT-23, 6 PIN
ROCHESTER
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