ADG821BRM [ROCHESTER]
DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187AA, MSOP-8;
| 型号： | ADG821BRM |
| 厂家： | 
Rochester Electronics |
| 描述： | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187AA, MSOP-8 光电二极管 |
| 文件： | 总13页 (文件大小：1123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
<1 Ω CMOS, 1.8 V to 5.5 V,
Dual SPST Switches
ADG821/ADG822/ADG823
FUNCTIONAL BLOCK DIAGRAMS
FEATURES
0.8 Ω maximum on resistance @ 125°C
0.3 Ω maximum on resistance flatness @ 125°C
1.8 V to 5.5 V single supply
200 mA current carrying capability
Automotive temperature range: −40°C to +125°C
Rail-to-rail operation
ADG821
ADG822
S1
D1
S1
D1
IN1
IN1
D2
S2
D2
S2
IN2
IN2
8-lead MSOP
33 ns switching times
Typical power consumption: <0.01 μW
TTL-/CMOS-compatible inputs
SWITCHES SHOWN FOR
A LOGIC 0 INPUT.
SWITCHES SHOWN FOR
A LOGIC 0 INPUT.
Figure 1.
Figure 2.
Pin-compatible with the ADG721/ADG722/ADG723
ADG823
APPLICATIONS
S1
D1
IN1
Power routing
Battery-powered systems
Communication systems
Data acquisition systems
Audio and video signal routing
Cellular phones
D2
S2
IN2
SWITCHES SHOWN FOR
A LOGIC 0 INPUT.
Modems
Figure 3.
PCMCIA cards
Hard drives
Relay replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG821/ADG822/ADG823 are monolithic CMOS single-
pole, single-throw (SPST) switches. These switches are designed
on an advanced submicron process that provides low power
dissipation, yet gives high switching speed, low on resistance,
and low leakage currents.
1. Very Low On Resistance: 0.5 Ω typ.
2. On Resistance Flatness (RFLAT(ON)): 0.15 Ω typ.
3. Automotive Temperature Range: −40°C to +125°C.
4. Current Carrying Capability: 200 mA.
5. Low Power Dissipation. CMOS construction ensures low
power dissipation.
The ADG821/ADG822/ADG823 are designed to operate from
a single 1.8 V to 5.5 V supply, making them ideal for use in
battery-powered instruments.
6. 8-Lead MSOP.
Each switch of the ADG821/ADG822/ADG823 conducts
equally well in both directions when on. The ADG821/
ADG822/ADG823 contain two independent SPST switches.
The ADG821 and ADG822 differ only in that both switches are
normally open and normally closed, respectively. In the ADG823,
Switch 1 is normally open and Switch 2 is normally closed. The
ADG823 exhibits break-before-make switching action.
The ADG821/ADG822/ADG823 are available in an
8-lead MSOP.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2002–2008 Analog Devices, Inc. All rights reserved.
ADG821/ADG822/ADG823
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions..............................6
Typical Performance Characteristics ..............................................7
Test Circuits........................................................................................9
Terminology.................................................................................... 11
Outline Dimensions....................................................................... 12
Ordering Guide .......................................................................... 12
Applications....................................................................................... 1
Functional Block Diagrams............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
REVISION HISTORY
4/08—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Added Table 6.................................................................................... 6
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 12
8/02—Revision 0: Initial Version
Rev. A | Page 2 of 12
ADG821/ADG822/ADG823
SPECIFICATIONS
VDD = 5 V 10%, GND = 0 V; TA = −40°C to +125°C, unless otherwise noted.
Table 1.
−40°C to
+85°C
−40°C to
+125°C1
Parameter
25°C
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
0.8
V
On Resistance (RON
)
0.5
0.6
0.16
0.2
0.15
0.23
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA, see Figure 17
VS = 0 V to VDD, IS = 100 mA
0.7
On Resistance Match Between
Channels (ΔRON
)
0.25
0.26
0.28
On Resistance Flatness (RFLAT(ON)
)
VS = 0 V to VDD, IS = 100 mA
0.3
LEAKAGE CURRENTS
VDD = 5.5 V
Source Off Leakage, IS (Off)
0.01
0.25
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
nA typ
nA max
VS = 4.5 V/1 V, VD = 1 V/4.5 V, see Figure 18
3
3
3
25
25
25
Drain Off Leakage, ID (Off)
VS = 4.5 V/1 V, VD = 1 V/4.5 V, see Figure 18
VS = VD = 1 V, or VS = VD = 4.5 V, see Figure 19
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
IINL or IINH
0.005
4
μA typ
μA max
pF typ
VIN = VINL or VINH
0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS2
tON
33
45
11
16
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
RL = 50 Ω, CL = 35 pF, VS = 3 V, see Figure 20
RL = 50 Ω, CL = 35 pF, VS = 3 V, see Figure 20
48
19
52
21
1
tOFF
Break-Before-Make Time Delay, tBBM 32
(ADG823 Only)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Bandwidth −3 dB
CS (Off)
RL = 50 Ω, CL = 35 pF, VS1 = VS2 = 3 V,
see Figure 21
VS = 2.5 V; RS = 0 Ω, CL = 1 nF, see Figure 22
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 23
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 24
15
−52
−82
24
85
98
MHz typ RL = 50 Ω, CL = 5 pF, see Figure 25
pF typ
pF typ
pF typ
f = 1 MHz
f = 1 MHz
f = 1 MHz
CD (Off)
CD, CS (On)
230
POWER REQUIREMENTS
IDD
VDD = 5.5 V, digital inputs = 0 V or 5.5 V
0.001
μA typ
1.0
2.0
ꢀA max
1 On resistance parameters tested with IS = 10 mA.
2 Guaranteed by design, not subject to production test.
Rev. A | Page 3 of 12
ADG821/ADG822/ADG823
VDD = 2.7 V to 3.6 V, GND = 0 V, TA = −40°C to +125°C, unless otherwise noted.
Table 2.
−40°C to
+85°C
−40°C to
+125°C1
Parameter
25°C
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
1.6
V
On Resistance (RON
)
0.7
1.4
0.16
0.2
0.3
Ω typ
Ω max
Ω typ
Ω max
Ω typ
VS = 0 V to VDD, IS = 100 mA, see Figure 17
VS = 0 V to VDD, IS = 100 mA
1.5
On Resistance Match Between
Channels (ΔRON
)
0.25
0.28
0.33
On Resistance Flatness (RFLAT(ON)
)
VS = 0 V to VDD, IS = 100 mA
VDD = 3.6 V
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
0.01
0.25
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
nA typ
nA max
VS = 3.3 V/1 V, VD = 1 V/3.3 V, see Figure 18
3
3
3
15
25
25
Drain Off Leakage, ID (Off)
VS = 3.3 V/1 V, VD = 1 V/3.3 V, see Figure 18
VS = VD = 1 V, or 3.3 V, see Figure 19
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
IINL or IINH
0.005
4
ꢀA typ
ꢀA max
pF typ
VIN = VINL or VINH
0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS2
tON
48
67
12
18
40
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
MHz typ
pF typ
pF typ
pF typ
RL = 50 Ω, CL = 35 pF, VS = 1.5 V, see Figure 20
RL = 50 Ω, CL = 35 pF, VS = 1.5 V, see Figure 20
74
20
78
23
1
tOFF
Break-Before-Make Time Delay, tBBM
(ADG823 Only)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Bandwidth −3 dB
CS (Off)
RL = 50 Ω, CL = 35 pF, VS1 = VS2 = 1.5 V,
see Figure 21
2
VS = 1.5 V; RS = 0 Ω, CL = 1 nF, see Figure 22
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 23
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 24
RL = 50 Ω, CL = 5 pF, see Figure 25
f = 1 MHz
−52
−82
24
85
98
CD (Off)
CD, CS (On)
f = 1 MHz
f = 1 MHz
230
POWER REQUIREMENTS
IDD
VDD = 3.6 V, digital inputs = 0 V or 3.6 V
0.001
ꢀA typ
1.0
2.0
ꢀA max
1 On resistance parameters tested with IS = 10 mA.
2 Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 12
ADG821/ADG822/ADG823
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V or 30 mA,
whichever occurs first
−0.3 V to VDD + 0.3 V or 30 mA,
whichever occurs first
Analog Inputs1
Digital Inputs1
Table 4. Truth Table for the ADG821/ADG822
ADG821 INx
ADG822 INx
Switch x Condition
Peak Current, S or D
400 mA (pulsed at 1 ms,
10% duty cycle maximum)
200 mA
0
1
1
0
Off
On
Continuous Current, S or D
Operating Temperature Range
Automotive
Storage Temperature Range
Junction Temperature (TJ max)
Package Power Dissipation
8-Lead MSOP Thermal Impedance
θJA
−40°C to +125°C
−65°C to +150°C
150°C
Table 5. Truth Table for the ADG823
IN1
IN2
Switch S1
Switch S2
On
0
0
Off
(TJ max − TA)/θJA
0
1
Off
Off
On
Off
1
0
On
206°C/W
44°C/W
300°C
1
1
On
θJC
Lead Temperature,
Soldering (10 sec)
ESD CAUTION
IR Reflow, Peak Temperature (<20 235°C
sec)
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Rev. A | Page 5 of 12
ADG821/ADG822/ADG823
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
8
7
6
5
S1
D1
V
DD
ADG821/
ADG822/
ADG823
IN1
D2
S2
IN2
TOP VIEW
(Not to Scale)
GND
Figure 4. Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
4
5
6
7
8
S1
D1
IN2
GND
S2
D2
IN1
VDD
Source Terminal. This pin can be an input or output.
Drain Terminal. This pin can be an input or output.
Logic Control Input.
Ground (0 V) Reference.
Source Terminal. This pin can be an input or output.
Drain Terminal. This pin can be an input or output.
Logic Control Input.
Most Positive Power Supply Potential.
Rev. A | Page 6 of 12
ADG821/ADG822/ADG823
TYPICAL PERFORMANCE CHARACTERISTICS
0.8
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
T
= 25°C
A
V
= 2.7V
DD
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
V
= 3.0V
= 3.3V
DD
+125°C
+85°C
V
DD
V
= 4.5V
DD
+25°C
V
= 5.0V
–40°C
DD
V
V
= 5.5V
DD
V
= 3V
DD
0
1
2
3
4
5
0
0.5
1.0
1.5
V , V (V)
D
2.0
2.5
3.0
, V (V)
D
S
S
Figure 5. On Resistance vs. VD, VS
Figure 8. On Resistance vs. VD, VS for Different Temperatures, VDD = 3 V
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
8
T
= 25°C
V
DD
= 5V, 3V
A
7
6
I , I (ON)
S
D
5
V
= 1.8V
DD
4
I
(OFF)
D
3
2
1
0
I
(OFF)
S
–1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
20
40
60
80
100
120 125
V
, V (V)
TEMPERATURE (°C)
D
S
Figure 6. On Resistance vs. VD, VS; VDD = 1.8 V
Figure 9. Leakage Current vs. Temperature
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
200
150
100
50
T
= 25°C
V
= 5V
A
DD
+125°C
+85°C
V
= 3V
DD
0
V
= 5V
DD
–50
–100
–150
–200
+25°C
–40°C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
0.5
1.0
1.5
2.0
2.5
(V)
3.0
3.5
4.0
4.5
5.0
V
, V (V)
V
D
S
S
Figure 7. On Resistance vs. VD, VS for Different Temperatures, VDD = 5 V
Figure 10. Charge Injection vs. Source Voltage
Rev. A | Page 7 of 12
ADG821/ADG822/ADG823
60
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
T
= 25°C
A
V
= 3V
DD
50
40
30
20
10
0
V
= 5V
tON
DD
V
= 3V, 5V
tOFF
DD
–40
–20
0
20
40
60
80
100
120
0.1
1
10
100
TEMPERATURE (°C)
FREQUENCY (MHz)
Figure 11. tON/tOFF vs. Temperature
Figure 14. Crosstalk vs. Frequency
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
–10
–20
–30
–40
–50
–60
–70
V
= 3V, 5V
DD
= 25°C
T
A
V
RISING
IN
V
FALLING
IN
0
1
2
3
4
5
6
0.2
1
10
100
V
(V)
FREQUENCY (MHz)
DD
Figure 12. Off Isolation vs. Frequency
Figure 15. Logic Threshold Voltage vs. Supply Voltage
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
V
= 5V
S
V p-p = 2V
= 600Ω
R
L
V
= 3V, 5V
= 25°C
DD
T
A
0.1
1
10
100
20
100
1k
10k
FREQUENCY (MHz)
FREQUENCY (Hz)
Figure 16. THD vs. Frequency
Figure 13. On Response vs. Frequency
Rev. A | Page 8 of 12
ADG821/ADG822/ADG823
TEST CIRCUITS
I
DS
V1
I
(ON)
A
I
(OFF)
A
I
(OFF)
A
D
S
D
S
D
S
D
S
D
NC
V
V
D
V
V
D
R
= V1/I
S
S
ON
DS
NC = NO CONNECT
Figure 17. On Resistance
Figure 18. Off Leakage
Figure 19. On Leakage
V
DD
DD
0.1µF
ADG821
ADG822
V
50%
50%
50%
IN
V
V
L
OUT
S
D
V
50%
90%
IN
R
50ꢀ
C
L
V
S
35pF
IN
90%
V
OUT
GND
tOFF
tON
Figure 20. Switching Times
V
DD
V
0.1µF
IN
50%
50%
0V
0V
V
90%
90%
DD
V
V
OUT1
OUT2
S1
D1
D2
V
V
V
S1
OUT1
C
R
L1
35pF
L1
50ꢀ
S2
V
S2
OUT2
C
R
90%
90%
L2
35pF
L2
50ꢀ
0V
IN1,
IN2
V
IN
GND
tBBM
tBBM
Figure 21. Break-Before-Make Time Delay, tBBM (ADG823 only)
V
DD
DD
V
SW ON
SW OFF
V
R
OUT
S
S
D
V
IN
C
1nF
L
V
S
IN
V
OUT
ΔV
GND
OUT
Q
= C × ΔV
L
OUT
INJ
Figure 22. Charge Injection
Rev. A | Page 9 of 12
ADG821/ADG822/ADG823
V
V
DD
DD
0.1µF
0.1µF
NETWORK
ANALYZER
NETWORK
ANALYZER
V
V
DD
DD
S
S
50ꢀ
50ꢀ
50ꢀ
IN
IN
V
S
V
S
D
D
V
V
OUT
OUT
V
V
IN
IN
R
50ꢀ
R
50ꢀ
L
L
GND
GND
V
WITH SWITCH
V
OUT
OUT
INSERTION LOSS = 20 log
OFF ISOLATION = 20 log
V
WITHOUT SWITCH
V
S
OUT
Figure 23. Off Isolation
Figure 25. Bandwidth
V
DD
0.1µF
NETWORK
ANALYZER
V
DD
V
OUT
S1
R
L
50ꢀ
D
R
50ꢀ
S2
IN
50ꢀ
V
S
GND
V
OUT
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
S
Figure 24. Channel-to-Channel Crosstalk
Rev. A | Page 10 of 12
ADG821/ADG822/ADG823
TERMINOLOGY
IINL (IINH
Input current of the digital input.
)
VDD
Most positive power supply potential.
CS (Off)
Off switch source capacitance.
GND
Ground (0 V) reference.
CD (Off)
Off switch drain capacitance.
IDD
Positive supply current.
CD, CS (On)
On switch capacitance.
S
Source terminal. May be an input or output.
tON
D
Delay between applying the digital control input and the output
switching on.
Drain terminal. May be an input or output.
IN
tOFF
Logic control input.
Delay between applying the digital control input and the output
switching off.
RON
Ohmic resistance between Terminal D and Terminal S.
tBBM
ΔRON
Off time or on time measured between the 90% points of both
switches, when switching from one address state to another.
On resistance match between any two channels (that is,
RON max − RON min).
Charge Injection
Charge injection is a measure of the glitch impulse transferred
from the digital input to the analog output during switching.
RFLAT(ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
Crosstalk
Crosstalk is a measure of unwanted signal that is coupled
through from one channel to another as a result of parasitic
capacitance.
IS (Off)
Source leakage current with the switch off.
ID (Off)
Off Isolation
Drain leakage current with the switch off.
A measure of unwanted signal coupling through an off switch.
ID, IS (On)
Bandwidth
Channel leakage current with the switch on.
The frequency at which the output is attenuated by −3 dBs.
VD, VS
On Response
The frequency response of the on switch.
Analog voltage on Terminal D and Terminal S.
VINL
Insertion Loss
The loss due to the on resistance of the switch.
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
Rev. A | Page 11 of 12
ADG821/ADG822/ADG823
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.80
0.60
0.40
8°
0°
0.15
0.00
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 26. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG821BRM
Temperature Range
Package Description
Package Option
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
Branding
SQB
SQB
S0P
S0P
SRB
SRB
SRB
S1J
S1J
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
ADG821BRM-REEL
ADG821BRMZ1
ADG821BRMZ-REEL71
ADG822BRM
ADG822BRM-REEL
ADG822BRM-REEL7
ADG822BRMZ1
ADG822BRMZ-REEL71
ADG823BRM
SSB
SSB
SSB#
SSB#
ADG823BRM-REEL
ADG823BRMZ1
ADG823BRMZ-REEL71
RM-8
1 Z = RoHS Compliant Part, # denotes RoHS compliant product may be top or bottom marked.
©2002–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02851-0-4/08(A)
Rev. A | Page 12 of 12
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