ADG936BCP-REEL7 [ROCHESTER]
DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, QCC20, 4 X 4 MM, MO-220VGGD-1, LFCSP-20;
| 型号： | ADG936BCP-REEL7 |
| 厂家： | 
Rochester Electronics |
| 描述： | DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, QCC20, 4 X 4 MM, MO-220VGGD-1, LFCSP-20 光电二极管 |
| 文件： | 总17页 (文件大小：1175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Wideband 4 GHz, 36 dB Isolation at 1 GHz,
CMOS, 1.65 V to 2.75 V, Dual SPDT
ADG936/ADG936-R
FUNCTIONAL BLOCK DIAGRAMS
FEATURES
Wideband switch: −3 dB @ 4 GHz
ADG936 absorptive dual SPDT
RF1A
RF1A
ADG936-R reflective dual SPDT
RFCA
INA
RFCA
INA
50Ω
High off isolation (36 dB @ 1 GHz)
Low insertion loss (0.9 dB dc to 1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
RF2A
RF2A
ADG936-R
50Ω
ADG936
20-lead TSSOP and 4 mm × 4 mm LFCSP packages
Low power consumption (1 μA maximum)
RF1B
RF2B
RF1B
RF2B
RFCB
INB
RFCB
INB
50Ω
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
50Ω
Figure 1.
Figure 2.
Tuner modules
Antenna diversity switching
GENERAL DESCRIPTION
compatible. The low power consumption of these CMOS
devices makes them ideally suited for wireless applications and
general-purpose high frequency switching.
The ADG936/ADG936-R are wideband analog switches that
comprise two independently selectable SPDT switches using a
CMOS process to provide high isolation and low insertion loss
to 1 GHz. The ADG936 is an absorptive/matched dual SPDT
with 50 Ω terminated shunt legs; the ADG936-R is a reflective
dual SPDT. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, eliminating the need for external controlling
circuitry. The control inputs are both CMOS and LVTTL
PRODUCT HIGHLIGHTS
1. –36 dB off isolation @ 1 GHz.
2. 0.9 dB insertion loss @ 1 GHz.
3. 20-lead TSSOP and 4 mm × 4 mm LFCSP packages.
–10
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0
V
= 2.5V
DD
= 25°C
T
A
–20
–30
–40
–50
–60
–70
–80
V
= 2.5V
DD
S21
S12
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Off Isolation vs. Frequency
Figure 4. Insertion Loss vs. Frequency
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
© 2005 Analog Devices, Inc. All rights reserved.
ADG936/ADG936-R
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................7
Test Circuits........................................................................................9
Applications..................................................................................... 11
Absorptive vs. Reflective ........................................................... 11
Filter Selection ............................................................................ 11
Tx/Rx Switching ......................................................................... 11
Antenna Diversity Switch.......................................................... 11
Evaluation Board ............................................................................ 12
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 14
Applications....................................................................................... 1
Functional Block Diagrams............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Terminology ...................................................................................... 6
REVISION HISTORY
8/05—Rev. 0 to Rev. A
Changes to Table 1............................................................................ 3
Changes to Figure 6.......................................................................... 5
Changes to Ordering Guide .......................................................... 14
7/04—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG936/ADG936-R
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted.1
Table 1.
B Version
Parameter
Symbol
Conditions
Min
Typ2
Max
Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3
3 dB Frequency4
DC
2
4
7
16
0.5
0.8
1.25
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
ns
ns
ns
dBm
dBm
mV p-p
Input Power4
0 V dc bias
0.5 V dc bias
DC to 100 MHz; VDD = 2.5 V 10%
500 MHz; VDD = 2.5 V 10%
1000 MHz; VDD = 2.5 V 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
Insertion Loss
S21, S12
S21, S12
S21, S12
S11, S22
S11, S22
0.4
0.6
0.9
60
47
36
69
45
37
25
23
24
24
23
21
11
10
6.1
6
Isolation—RFCx to RF1x/RF2x
Crosstalk—RF1x to RF2x
Return Loss (On Channel)4
Return Loss (Off Channel)4
52
40
31
53
42
34
20
19
16
18
17
16
1000 MHz
On Switching Time4
Off Switching Time4
Rise Time4
Fall Time4
1 dB Compression4
tON
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
14
13
8
tOFF
tRISE
tFALL
P–1 dB
8
16
32
3
Third-Order Intermodulation Intercept IP3
Video Feedthrough5
900 MHz/901 MHz, 4 dBm
27.5
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
VINH
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
0 ≤ VIN ≤ 2.75 V
1.7
0.65 VCC
V
V
V
V
VINH
VINL
VINL
II
Input Low Voltage
0.7
0.35 VCC
1
Input Leakage Current
CAPACITANCE4
0.1
μA
RF Port On Capacitance
Digital Input Capacitance
POWER REQUIREMENTS
VDD
CRF ON
CDIG
f = 1 MHz
f = 1 MHz
2.5
2
pF
pF
1.65
2.75
1
V
μA
Quiescent Power Supply Current
IDD
Digital inputs = 0 V or VDD
0.1
1 Temperature range of B Version: −40°C to +85°C.
2 Typical values are at VDD = 2.5 V and 25°C, unless otherwise noted.
3 Operating frequency is the point at which insertion loss degrades by 1 dB.
4 Guaranteed by design, not subject to production test.
5 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or from low to high in a 50 Ω test
setup, measured with 1 ns rise time pulses and a 500 MHz bandwidth.
Rev. A | Page 3 of 16
ADG936/ADG936-R
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
VDD to GND
Inputs to GND
Continuous Current
Input Power
–0.5 V to +4 V
–0.5 V to VDD + 0.3 V1
30 mA
18 dBm
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
TSSOP Package
–40°C to +85°C
–65°C to +150°C
150°C
Only one absolute maximum rating may be applied at any one
time.
θJA Thermal Impedance
LFCSP Package
θJA Thermal Impedance (4-Layer Board)
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
143°C/W
Table 3. Truth Table
INx
30.4°C/W
300°C
235°C
1 kV
RF1x
Off
On
RF2x
On
Off
0
1
1 RF1x/RF2x off port inputs to ground = –0.5 V to VDD – 0.5 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 4 of 16
ADG936/ADG936-R
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
RFCA
1
2
20 GND
19 INA
V
DD
GND
RF1A
GND
GND
RF1B
GND
GND
3
4
5
6
7
8
9
18 GND
ADG936
15 GND
GND 1
RF1A 2
GND 3
GND 4
RF1B 5
ADG936-R 17 RF2A
ADG936
14 RF2A
13 GND
12 GND
11 RF2B
16 GND
15 GND
14 RF2B
13 GND
12 INB
TOP VIEW
(Not to Scale)
ADG936-R
TOP VIEW
(Not to Scale)
RFCB 10
11 GND
NOTES
1. EXPOSED PAD TIED TO SUBSTATE, GND.
Figure 5. 20-Lead TSSOP (RU-20)
Figure 6. 20-Lead 4 mm × 4 mm LFCSP (CP-20-1)
Table 4. Pin Function Descriptions
Pin No.
20-Lead
20-Lead
TSSOP
LFCSP
Mnemonic
Description
1
2
18
19
RFCA
VDD
Common RF Port for Switch A.
Power Supply Input. These parts can operate from 1.65 V to 2.75 V. VDD should be decoupled
to GND.
3, 5, 6, 8, 9, 1, 3, 4, 6, 7, GND
Ground Reference Point for All Circuitry on the Part.
11, 13, 15,
16, 18, 20
9, 12, 13,
15, 17, 20
4
7
2
5
8
10
11
14
16
RF1A
RF1B
RFCB
INB
RF2B
RF2A
INA
RF1A Port.
RF1B Port.
Common RF Port for Switch B.
Logic Control Input.
RF2B Port.
10
12
14
17
19
RF2A Port.
Logic Control Input.
Rev. A | Page 5 of 16
ADG936/ADG936-R
TERMINOLOGY
Table 5.
Parameter
Description
VDD
Most Positive Power Supply Potential.
IDD
Positive Supply Current.
GND
INx
Ground (0 V) Reference.
Logic Control Input.
VINL
Maximum Input Voltage for Logic 0.
VINH
Minimum Input Voltage for Logic 1.
IINL (IINH
)
Input Current of the Digital Input.
CIN
Digital Input Capacitance.
tON
tOFF
tRISE
tFALL
Delay Between Applying the Digital Control Input and the Output Switching On.
Delay Between Applying the Digital Control Input and the Output Switching Off.
Rise Time. Time for the RF signal to rise from 10% of the on level to 90% of the on level.
Fall Time. Time for the RF signal to fall from 90% of the on level to 10% of the on level.
Off Isolation
The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the Off
Condition.
Insertion Loss
The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the On
Condition.
Crosstalk
P–1 dB
Measure of Unwanted Signal Coupled Through from One Channel to Another as a Result of Parasitic Capacitance.
1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level
value. P–1 dB is a measure of how much power the on switch can handle before the insertion loss increases by 1 dB.
IP3
Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced
tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
Return Loss
The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By
measuring return loss, the voltage standing wave ratio (VSWR) can be calculated from conversion charts. VSWR
indicates the degree of matching present at a switch RF port.
Video Feedthrough Spurious Signals Present at the RF Ports of the Switch When the Control Voltage Is Switched from High to Low or from
Low to High Without an RF Signal Present.
Rev. A | Page 6 of 16
ADG936/ADG936-R
TYPICAL PERFORMANCE CHARACTERISTICS
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0
V
= 2.75V
DD
V
= 2.50V
DD
V
= 2.25V
DD
T
= 25°C
V
= 2.5V
A
DD
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 7. Insertion Loss vs. Frequency over Supplies
(S12 and S21)
Figure 10. Insertion Loss vs. Frequency over Temperature
(S12 and S21)
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–10
–20
–30
–40
–50
–60
–70
–80
V
= 1.65V TO 2.75V
DD
= 25°C
T
A
V
V
= 2.75V
= 2.50V
DD
DD
S21
S12
V
= 2.25V
DD
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8. Insertion Loss vs. Frequency over Supplies
(S12 and S21) (Zoomed Figure 7)
Figure 11. Isolation vs. Frequency over Supplies
–0.3
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0
V
= 2.5V
DD
V
V
V
= 1.95V
= 1.80V
= 1.65V
DD
DD
DD
T
= +85°C
A
T
= +25°C
A
T
= –40°C
A
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 9. Insertion Loss vs. Frequency over Supplies
(S12 and S21)
Figure 12. Isolation vs. Frequency over Temperature
Rev. A | Page 7 of 16
ADG936/ADG936-R
[
]
T
T
TEK RUN
TRIG'D
0
Δ : 2.20mV
V
= 2.5V
DD
T
= 25°C
A
INx
–5
–10
–15
–20
–25
–30
1
3
RFCx
OFF SWITCH
ON SWITCH
10M
CH1 1.00VΩ
CH3 1.00mVΩ
20.0ns
10k
100k
1M
100M
1G
10G
FREQUENCY (Hz)
Figure 16. Video Feedthrough
Figure 13. Return Loss vs. Frequency ( S11)
35
30
25
20
15
10
5
–10
–20
–30
–40
–50
–60
–70
–80
–90
V
= 2.5V
= 25°C
DD
V
= 2.5V
= 25°C
DD
T
A
T
A
0
100
200
300
400
500
600
700
800
900
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (MHz)
FREQUENCY (Hz)
Figure 17. IP3 vs. Frequency
Figure 14. Crosstalk vs. Frequency (S12 and S21)
TEK RUN: 5.00GS/s ET ENVELOPE
[
]
T
18
16
14
12
10
8
INx
1
3
RFx
6
4
2
V
= 2.5V
DD
T
= 25°C
A
0
CH1
CH3 100mV
1.00V
CH2 100mV
5.00ns
0
250
500
750
1000
1250
1500
FREQUENCY (MHz)
Figure 15. Switch Timing
Figure 18. P–1 dB vs. Frequency
Rev. A | Page 8 of 16
ADG936/ADG936-R
TEST CIRCUITS
Similar setup for the ADG936. Additional pins omitted for clarity.
V
DD
10μF
V
V
DD
OUT
10μF
R
50Ω
L
ADG936-R
V
DD
V
RF1x
RF2x
NETWORK
ANALYZER
DD
50Ω
RFCx
V
OUT
RFx
RFCx
50%
50%
R
V
L
INx
50Ω
V
INx
S
50Ω
V
INx
S
90%
10%
V
OUT
GND
V
GND
INx
V
V
OUT
INSERTION LOSS = 20log
tON
Figure 19. Switch Timing: tON, tOFF
tOFF
S
Figure 22. Insertion Loss
V
DD
10μF
V
NETWORK
ANALYZER
DD
ADG936-R
V
DD
10μF
RF1x
RF2x
50Ω
V
S
V
DD
RFCx
50Ω
V
OUT
RFx
RFCx
50%
50%
V
OUT
V
INx
R
L
INx
R
50Ω
L
50Ω
V
S
90% 90%
INx
10%
10%
V
OUT
GND
V
INx
GND
V
V
OUT
CROSSTALK = 20log
tRISE
tFALL
S
Figure 23. Crosstalk
Figure 20. Switch Timing: tRISE, tFALL
V
DD
V
V
DD
10μF
10μF
50Ω
V
S
ADG936-R
V
DD
ADG936-R
DD
V
OUT
RF1x
R
L
50Ω
NC
NC
RF1x
RF2x
RFC
INx
RFCx
INx
OSCILLOSCOPE
NETWORK
ANALYZER
RF2x
50Ω
GND
V
INx
V
INx
GND
V
OUT
OFF ISOLATION = 20log
V
S
Figure 21. Off Isolation
Figure 24. Video Feedthrough
Rev. A | Page 9 of 16
ADG936/ADG936-R
V
V
V
DD
DD
10μF
10μF
V
ADG936-R
ADG936-R
DD
DD
RF1x
RF2x
RF1x
RF2x
50Ω
RF
SOURCE
50Ω
RFCx
INx
SPECTRUM
ANALYZER
RFCx
INx
SPECTRUM
ANALYZER
RF
COMBINER
SOURCE
V
S
RF
SOURCE
V
GND
V
INx
GND
INx
Figure 25. IP3
Figure 26. P–1 dB
Rev. A | Page 10 of 16
ADG936/ADG936-R
APPLICATIONS
The ADG936/ADG936-R are ideal solutions for low power,
high frequency applications. The low insertion loss, high
isolation between ports, low distortion, and low current
consumption of these parts make them excellent solutions for
many high frequency switching applications. They can be used
in applications such as switchable filters, transmitters and
receivers for radar systems, and communication systems from
base stations to cell phones.
FILTER SELECTION
The ADG936 and ADG936-R can be used to switch high
frequency signals between different filters and to multiplex the
signal to the output. These dual SPDT switches are also ideal for
high speed signal routing and for switching high speed differential
signals.
RF1A
RF2A
RF1B
RF2B
RF1A
RF2A
RF1B
RF2B
The ADG9xx family of wideband switches is designed to meet
the demands of devices transmitting at ISM band frequencies to
1 GHz and higher. The low insertion loss, high isolation
between ports, single pin control interface, no requirement for
dc blocking capacitors, and TTL interface compatibility make
them cost-effective and easy-to-integrate switching solutions for
many high frequency switching and low power applications,
because the parts can handle up to 16 dBm of power.
RF
RF
RF
RF
IN
IN
OUT
OUT
RFCA
RFCB
RFCA
RFCB
ADG936
ADG936
Figure 27. Filter Selection
Tx/Rx SWITCHING
ABSORPTIVE VS. REFLECTIVE
The low insertion loss and high isolation between ports ensure
that the ADG936/ADG936-R are suitable transmit/receive
switches for all ISM band and wireless LAN applications,
providing the required isolation between the transmit and
receive signals.
The ADG936 is an absorptive (matched) switch with 50 Ω
terminated shunt legs; the ADG936-R is a reflective switch with
0 Ω terminated shunts to ground. The ADG936 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a
need for a good VSWR that is looking into the port but not
passing the through-signal to the common port. The ADG936
is, therefore, ideal for applications that require minimum
reflections back to the RF source. It also ensures that the
maximum power is transferred to the load.
LNA
ANTENNA
PA
RFCA
ADG936
RF1B
RF2B
RF1B
RF2B
RFCB
The ADG936-R reflective switch is suitable for applications in
which high off-port VSWR does not matter. The switch also has
some other desired performance features. It can be used in
many applications, including high speed filter selection. In most
cases, an absorptive switch can be used instead of a reflective
switch, but not vice versa.
Figure 28. Tx/Rx Switching
ANTENNA DIVERSITY SWITCH
The ADG936/ADG936-R are ideal for use as antenna diversity
switches, switching in different antennas to the tuner. The low
insertion loss, which ensures minimum signal loss and high
isolation between channels, makes these dual SPDT switches
suitable for switching applications in tuner modules and set-top
boxes.
Rev. A | Page 11 of 16
ADG936/ADG936-R
EVALUATION BOARD
The ADG936 and ADG936-R evaluation board allows
designers to evaluate these high performance wideband
switches with minimal effort.
To prove that these devices meet the user’s requirements, only a
power supply and a network analyzer, along with the evaluation
board, are required. An application note available with the
evaluation board gives complete information on operating the
evaluation board.
The RFCA port is connected through a 50 Ω transmission line
to SMA Connector J3. The RFCB port is connected through a
50 Ω transmission line to SMA Connector J4. RF1A, RF2A,
RF1B, and RF2B are connected through 50 Ω transmission lines
to SMA Connectors J5, J6, J7, and J8, respectively. A through
transmission line connects J9 and J10; this transmission line is
used to estimate the loss of the PCB over the environmental
conditions being evaluated.
The board is constructed of a 4-layer FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062 in.
Two ground layers with grounded planes provide ground for
the RF transmission lines. The transmission lines were designed
using a coplanar waveguide with a ground plane model using a
trace width of 0.024 in, a clearance to ground plane of 0.008 in,
a dielectric thickness of 0.02 in, and a metal thickness of
0.0021 in.
Figure 29. ADG936 and ADG936-R Evaluation Board Top View
Rev. A | Page 12 of 16
ADG936/ADG936-R
OUTLINE DIMENSIONS
6.60
6.50
6.40
20
11
10
4.50
4.40
4.30
6.40 BSC
1
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
COPLANARITY
0.10
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.60
MAX
4.00
BSC SQ
PIN 1
INDICATOR
0.60
MAX
20
1
16
15
PIN 1
INDICATOR
2.25
2.10 SQ
1.95
TOP
VIEW
3.75
BCS SQ
11
10
5
6
0.75
0.55
0.35
0.25 MIN
0.80 MAX
0.65 TYP
0.30
0.23
0.18
12° MAX
1.00
0.85
0.80
0.05 MAX
0.02 NOM
0.20
REF
SEATING
PLANE
COPLANARITY
0.08
0.50
BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
Rev. A | Page 13 of 16
ADG936/ADG936-R
ORDERING GUIDE
Model
ADG936BRU
ADG936BRU-500RL7
ADG936BRU-REEL
ADG936BRU-REEL7
ADG936BRUZ1
ADG936BRUZ-REEL1
ADG936BRUZ-REEL71
ADG936BCP
ADG936BCP-500RL7
ADG936BCP-REEL
ADG936BCP-REEL7
ADG936BCPZ1
ADG936BCPZ-REEL1
ADG936BCPZ-REEL71
EVAL-ADG936EB
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-20
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
ADG936BRU-R
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
RU-20
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-20
ADG936BRU-R-500RL7
ADG936BRU-R-REEL
ADG936BRU-R-REEL7
ADG936BCP-R
ADG936BCP-R-500RL7
ADG936BCP-R-REEL
ADG936BCP-R-REEL7
EVAL-ADG936REB
1 Z = PB-free part.
Rev. A | Page 14 of 16
ADG936/ADG936-R
NOTES
Rev. A | Page 15 of 16
ADG936/ADG936-R
NOTES
©
2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04503–0–8/05(A)
Rev. A | Page 16 of 16
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