ADM1385ARS-REEL7 [ROCHESTER]
DUAL LINE TRANSCEIVER, PDSO20, MO-150AE, SSOP-20;
| 型号： | ADM1385ARS-REEL7 |
| 厂家： | 
Rochester Electronics |
| 描述： | DUAL LINE TRANSCEIVER, PDSO20, MO-150AE, SSOP-20 光电二极管 |
| 文件： | 总13页 (文件大小：1172K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Power, 3.3 V, RS-232
Line Drivers/Receivers
ADM3202/ADM3222/ADM1385
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
+3.3V INPUT
460 kbps data rate
Specified at 3.3 V
+3.3V TO +6.6V
VOLTAGE
+
C1+
C1–
V
CC
+
+
0.1µF
10V
C3
+
C5
0.1µF
V+
Meets EIA-232E specifications
0.1 μF charge pump capacitors
Low power shutdown (ADM3222 and ADM1385)
PDIP, SOIC_N, SOIC_W, SSOP, and TSSOP options
Upgrade for MAX3222/MAX3232 and LTC1385
ESD protection to IEC 1000-4-2 (801.2)
on RS-232 pins (ADM3202 only)
8 kV: contact discharge
DOUBLER
0.1µF
6.3V
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2+
C2–
V–
0.1µF
10V
C4
+
0.1µF
10V
T1
T2
T1
T1
IN
OUT
OUT
CMOS
EIA/TIA-232
OUTPUTS
INPUTS
T2
T2
IN
R1
R2
R1
R1
R2
OUT
OUT
IN
IN
CMOS
OUTPUTS
EIA/TIA-232
INPUTS*
R2
15 kV: air gap discharge
ADM3202
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT
APPLICATIONS
Figure 1.
General-purpose RS-232 data link
Portable instruments
+3.3V INPUT
Printers, palmtop computers, PDAs
+3.3V TO +6.6V
+
C1+
C1–
V
CC
+
0.1µF
10V
C3
+
VOLTAGE
DOUBLER
C5
0.1µF
V+
0.1µF
6.3V
GENERAL DESCRIPTION
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2+
C2–
V–
+
0.1µF
10V
C4
+
The ADM3202/ADM3222/ADM1385 transceivers are high
speed, 2-channel RS-232/V.28 interface devices that operate
from a single 3.3 V power supply. Low power consumption and
a shutdown facility (ADM3222/ADM1385) make them ideal for
battery-powered portable instruments.
0.1µF
10V
T1
T2
T1
T1
IN
OUT
CMOS
EIA/TIA-232
OUTPUTS
INPUTS
T2
T2
IN
OUT
R1
R2
R1
R1
R2
OUT
OUT
IN
IN
CMOS
OUTPUTS
EIA/TIA-232
INPUTS*
R2
The ADM3202/ADM3222/ADM1385 parts conform to the
EIA-232E and CCITT V.28 specifications and operate at data
rates up to 460 kbps.
EN
SD
ADM3222
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT
Four external 0.1 μF charge pump capacitors are used for the
voltage doubler/inverter, permitting operation from a single
3.3 V supply.
Figure 2.
+3.3V INPUT
+3.3V TO +6.6V
+
C1+
C1–
V
CC
+
0.1µF
10V
The ADM3222 contains additional enable and shutdown
VOLTAGE
DOUBLER
C5
0.1µF
+
V+
C3
EN
0.1µF
6.3V
circuitry. The
SD
input can be used to three-state the receiver
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2+
C2–
V–
+
0.1µF
10V
C4
outputs. The
input is used to power down the charge pump
+
0.1µF
10V
and transmitter outputs, reducing the quiescent current to less
than 0.5 μA. The receivers remain enabled during shutdown
T1
T2
T1
T1
IN
OUT
OUT
CMOS
INPUTS
EIA/TIA-232
OUTPUTS
T2
T2
EN
unless disabled using
.
IN
R1
R2
R1
R1
R2
OUT
OUT
IN
IN
CMOS
OUTPUTS
EIA/TIA-232
INPUTS*
The ADM1385 contains a driver disable mode and a complete
shutdown mode.
R2
DD
SD
The ADM3202 is available in a 16-lead PDIP, SOIC_W, and
SOIC_N, as well as a space-saving 16-lead TSSOP. The ADM3222
is available in 18-lead PDIP and SOIC_W and in 20-lead SSOP
and TSSOP. The ADM1385 is available in a 20-lead SSOP,
which is pin-compatible with the LTC1385 CG.
ADM1385
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT
Figure 3.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2006 Analog Devices, Inc. All rights reserved.
ADM3202/ADM3222/ADM1385
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configurations (N, RN, RU, and RW Packages)................5
Pin Configurations (RS and RU Packages)................................5
Typical Performance Characteristics ..............................................6
General Description..........................................................................8
Circuit Description .......................................................................8
High Baud Rate..............................................................................9
Outline Dimensions....................................................................... 10
Ordering Guide .......................................................................... 12
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagrams............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
REVISION HISTORY
8/06—Rev. C to Rev. D
12/01—Rev. A to Rev. B
Changes to Table 1............................................................................ 3
Updated Outline Dimensions....................................................... 10
Changes to Ordering Guide .......................................................... 12
Changes to Specifications Page........................................................2
9/05—Rev. B to Rev. C
Updated Outline Dimensions....................................................... 10
Changes to Ordering Guide .......................................................... 12
Rev. D | Page 2 of 12
ADM3202/ADM3222/ADM1385
SPECIFICATIONS
VCC = 3.3 V 0.3 V, C1 to C4 = 0.1 μF. All specifications TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
Min
Typ Max Unit Test Conditions/Comments
DC CHARACTERISTICS
Operating Voltage Range
VCC Power Supply Current
3.0
3.3
1.3
8
5.5
3
12
V
mA
mA
μA
No load
RL = 3 kΩ to GND
Shutdown Supply Current
LOGIC
0.01 0.5
Input Logic Threshold Low, VINL
Input Logic Threshold High, VINH
CMOS Output Voltage Low, VOL
CMOS Output Voltage High, VOH
Logic Pull-Up Current
0.8
V
V
V
V
μA
μA
TIN
TIN
2.0
0.4
IOUT = 1.6 mA
IOUT = −1 mA
TIN = GND to VCC
VCC − 0.6
1
5
10
±10
Output Leakage Current
RS-232 RECEIVER
Receivers disabled
EIA-232 Input Voltage Range
EIA-232 Input Threshold Low
EIA-232 Input Threshold High
EIA-232 Input Hysteresis
EIA-232 Input Resistance
RS-232 TRANSMITTER
−30
0.6
+30
2.4
7
V
V
V
V
1.2
1.6
0.4
5
3
kΩ
Output Voltage Swing (RS-232)
Output Voltage Swing (RS-562)
Transmitter Output Resistance
RS-232 Output Short-Circuit Current
Output Leakage Current
±5.0
±3.7
300
±5.2
±15
V
V
Ω
mA
μA
VCC = 3.3 V, all transmitter outputs loaded with 3 kΩ to ground
VCC = 3.0 V
VCC = 0 V, VOUT = ±2 V
±25
SD = low, VOUT = 12 V
TIMING CHARACTERISTICS
Maximum Data Rate
460
kbps VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, one
Tx switching
Receiver Propagation Delay
TPHL
TPLH
Transmitter Propagation Delay
Receiver Output Enable Time
Receiver Output Disable Time
Transmitter Skew
0.4
0.4
0.3
200
200
30
1
1
1.2
μs
μs
μs
ns
ns
ns
ns
RL = 3 kΩ, CL = 1000 pF
Receiver Skew
Transition Region Slew Rate
300
10
5.5
30
V/μs Measured from +3 V to −3 V or −3 V to +3 V, VCC = +3.3 V;
RL = 3 kΩ, CL = 1000 pF, TA = 25°C
1 ADM1385: Input leakage current typically −10 μA when TIN = GND.
Rev. D | Page 3 of 12
ADM3202/ADM3222/ADM1385
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter
Rating
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
VCC
V+
V−
−0.3 V to +6 V
(VCC − 0.3 V) to +14 V
+0.3 V to –14 V
Input Voltages
TIN
RIN
−0.3 V to (V+, +0.3 V)
±30 V
Output Voltages
TOUT
±15 V
ROUT
−0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TOUT
Continuous
Power Dissipation N-16/N-18
(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Power Dissipation RW-16/RN-16
(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Power Dissipation RU-16
(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Power Dissipation RW-18
(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Power Dissipation RS-20
(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Power Dissipation RU-20
(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Operating Temperature Range
Industrial (A Version)
Storage Temperature Range
450 mW
117°C/W
450 mW
158°C/W
500 mW
158°C/W
450 mW
158°C/W
450 mW
158°C/W
450 mW
158°C/W
−40°C to +85°C
−65°C to +150°C
Lead Temperature
(Soldering, 10 sec)
JEDEC industry standard
J-STD-020
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. D | Page 4 of 12
ADM3202/ADM3222/ADM1385
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
PIN CONFIGURATIONS (N, RN, RU, AND RW PACKAGES)
1
2
3
4
5
6
7
8
9
EN
C1+
V+
18
17
16
15
14
13
12
11
10
SD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V+
V
CC
GND
T1
V
CC
GND
T1
ADM3202
ADM3222
C1–
C2+
C2–
V–
OUT
C1–
C2+
C2–
V–
TOP VIEW
TOP VIEW
OUT
R1
R1
(Not to Scale)
(Not to Scale)
IN
R1
R1
IN
OUT
IN
OUT
IN
T1
T2
T1
T2
T2
OUT
IN
T2
OUT
IN
R2
R2
OUT
R2
R2
IN
IN
OUT
Figure 5. N and RW Packages Pin Configuration
Figure 4. N, RN, RU, and RW Packages Pin Configuration
PIN CONFIGURATIONS (RS AND RU PACKAGES)
1
2
20
19
18
17
16
15
14
13
12
11
EN
C1+
V+
SD
V
CC
DD
C1+
V+
1
2
3
4
5
6
7
8
9
20 SD
19
18 GND
17 T1
3
GND
T1
ADM3222
V
CC
4
C1–
C2+
C2–
V–
OUT
(SSOP/TSSOP)
ADM1385
TOP VIEW
(Not to Scale)
5
R1
R1
IN
C1–
C2+
C2–
V–
OUT
(SSOP)
6
16 R1
15 R1
TOP VIEW
(Not to Scale)
IN
OUT
OUT
IN
7
NC
14 T1
13 T2
8
T2
T1
T2
OUT
IN
IN
T2
OUT
IN
9
R2
IN
R2
12 R2
IN
NC 10
OUT
11 NC
10
R2
NC
OUT
NC = NO CONNECT
NC = NO CONNECT
Figure 7. RS Package Pin Configuration
Figure 6. RS and RU Packages Pin Configuration
Table 3. Pin Function Descriptions
Mnemonic Description
VCC
Power Supply Input (3.3 V ± 0.3 V).
V+
V–
GND
C1+, C1–
Internally Generated Positive Supply (+6 V nominal).
Internally Generated Negative Supply (−6 V nominal).
Ground Pin. Must be connected to 0 V.
External Capacitor 1 is connected between these pins. A 0.1 μF capacitor is recommended but larger capacitors up to 47 μF
can be used.
C2+, C2–
External Capacitor 2 is connected between these pins. A 0.1 μF capacitor is recommended but larger capacitors up to 47 μF
can be used.
TxIN
TxOUT
RxIN
RxOUT
EN
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels.
Transmitter (Driver) Outputs. These are RS-232 signal levels (typically ±± V).
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on each input.
Receiver Outputs. These are CMOS output logic levels.
(ADM3222 only) Receiver Enable. Active low. When low, the receiver outputs are enabled. When high, they are three-stated.
SD
(ADM3222 only) Shutdown Control. Active low. When low, the charge pump is shut down and the transmitter outputs
are disabled.
SD
(ADM1385 only) Shutdown Control. When low, the charge pump is shut down and all transmitters and receivers are disabled.
DD
(ADM1385 only) Driver Disable. When low, the charge pump is turned off and the transmitters are disabled. The receivers
remain active.
NC
No Connect.
Rev. D | Page 5 of 12
ADM3202/ADM3222/ADM1385
TYPICAL PERFORMANCE CHARACTERISTICS
8
8
6
T
(HIGH)
OUT
6
4
V+
4
2
2
0
0
–2
–4
–6
–8
–2
–4
–6
–8
V–
T
(LOW)
OUT
0
200
400
600
800
1000
1200
0
2
4
6
8
10
12
LOAD CAPACITANCE (pF)
LOAD CURRENT (mA)
Figure 8. Transmitter Output Voltage High/Low vs.
Load Capacitance @ 460 kbps
Figure 11. Charge Pump V+, V− vs. Load Current
350
300
250
200
150
100
50
8
6
Tx O/P HIGH
V+ (IMPEDANCE)
V– (IMPEDANCE)
4
2
0
–2
–4
–6
–8
Tx O/P LOW
0
2.7
2.9
3.1
V
3.3
3.5
2.7
2.9
3.1
V
3.3
3.5
(V)
(V)
CC
CC
Figure 9. Transmitter Output Voltage vs. VCC
Figure 12. Charge Pump Impedance vs. VCC
8
20
18
16
14
12
10
8
6
4
I
@ 460kbps
Tx O/P HIGH
CC
2
I
@ 230kbps
CC
0
–2
–4
–6
–8
6
4
Tx O/P LOW
2
0
0
1000
2000
3000
0
2
4
6
8
10
12
LOAD CAPACITANCE (pF)
LOAD CURRENT (mA)
Figure 10. Transmitter Output Voltage Low/High vs. Load Current
Figure 13. Power Supply Current vs. Load Capacitance
Rev. D | Page 6 of 12
ADM3202/ADM3222/ADM1385
1
2
T
T
CH 1 5.00V
CH 2
5.00V
M1.00µs
CH1
0V
Figure 14. 460 kbps Data Transmission
Rev. D | Page 7 of 12
ADM3202/ADM3222/ADM1385
GENERAL DESCRIPTION
+3.3V INPUT
The ADM3202/ADM3222/ADM1385 are RS-232 line drivers/
receivers. Step-up voltage converters coupled with level-shifting
transmitters and receivers allow RS-232 levels to be developed
while operating from a single 3.3 V supply.
+3.3V TO +6.6V
VOLTAGE
+
C1+
C1–
V
+
+
CC
V+
0.1µF
10V
C3
+
C5
0.1µF
0.1µF
6.3V
DOUBLER
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2+
C2–
V–
0.1µF
10V
C4
+
0.1µF
10V
CMOS technology is used to keep the power dissipation to an
absolute minimum, allowing maximum battery life in portable
applications.
T1
T2
T1
T1
IN
OUT
CMOS
EIA/TIA-232
OUTPUTS
INPUTS
T2
T2
IN
OUT
R1
R2
R1
R1
R2
OUT
OUT
IN
IN
CMOS
OUTPUTS
EIA/TIA-232
INPUTS*
The ADM3202/ADM3222/ADM1385 are modifications,
enhancements, and improvements of the AD230 to AD241
family and derivatives. They are essentially plug-in compatible
and do not have any materially different applications.
R2
EN
SD
ADM3222
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT
CIRCUIT DESCRIPTION
Figure 16. ADM3222 Typical Operating Circuit
The internal circuitry consists of these main sections:
+3.3V INPUT
•
•
•
A charge pump voltage converter
3.3 V logic to EIA-232 transmitters
EIA-232 to 5 V logic receivers
+3.3V TO +6.6V
+
C1+
C1–
V
CC
+
+
0.1µF
10V
VOLTAGE
DOUBLER
C5
0.1µF
+
V+
C3
0.1µF
6.3V
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2+
C2–
V–
0.1µF
10V
C4
+
0.1µF
10V
Charge Pump DC to DC Voltage Converter
T1
T2
T1
T1
IN
OUT
OUT
CMOS
EIA/TIA-232
OUTPUTS
The charge pump voltage converter consists of a 200 kHz
oscillator and a switching matrix. The converter generates a
6.6 V supply from the input 3.3 V level. This is done in two
stages by using a switched capacitor technique as illustrated in
Figure 18 and Figure 19. First, the 3.3 V input supply is doubled
to 6.6 V by using Capacitor C1 as the charge storage element.
The +6.6 V level is then inverted to generate −6.6 V using C2
as the storage element. C3 is shown connected between V+ and
INPUTS
T2
T2
IN
R1
R1
R1
R2
OUT
OUT
IN
IN
CMOS
OUTPUTS
EIA/TIA-232
INPUTS*
R2
R2
DD
SD
ADM1385
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT
Figure 17. ADM1385 Typical Operating Circuit
V
CC but is equally effective if connected between V+ and GND.
Capacitors C3 and C4 are used to reduce the output ripple.
Their values are not critical and can be increased, if desired.
Capacitor C3 is shown connected between V+ and VCC. It is
also acceptable to connect this capacitor between V+ and GND.
S1
S3
S4
V
V+ = 2V
CC
CC
+
+
C1
C3
S2
V
GND
CC
INTERNAL
OSCILLATOR
If desired, larger capacitors (up to 10 μF) can be used for
Capacitors C1 to C4.
Figure 18. Charge Pump Voltage Doubler
+3.3V INPUT
+3.3V TO +6.6V
VOLTAGE
+
C1+
C1–
V
CC
+
+
0.1µF
10V
S1
S3
S4
C3
+
C5
0.1µF
V+
DOUBLER
0.1µF
6.3V
V
GND
+
FROM
VOLTAGE
DOUBLER
+
+
+6.6V TO –6.6V
VOLTAGE
INVERTER
C2+
C2–
V–
C2
C4
0.1µF
10V
C4
+
S2
0.1µF
V– = –(V+)
GND
10V
T1
T2
T1
T1
IN
OUT
OUT
CMOS
INPUTS
EIA/TIA-232
OUTPUTS
INTERNAL
OSCILLATOR
T2
T2
IN
Figure 19. Charge Pump Voltage Inverter
R1
R2
R1
R1
R2
OUT
OUT
IN
IN
CMOS
OUTPUTS
EIA/TIA-232
INPUTS*
R2
ADM3202
GND
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT
Figure 15. ADM3202 Typical Operating Circuit
Rev. D | Page 8 of 12
ADM3202/ADM3222/ADM1385
Transmitter (Driver) Section
HIGH BAUD RATE
The drivers convert 3.3 V logic input levels into RS-232 output
levels. With VCC = 3.3 V and driving an RS-232 load, the output
voltage swing is typically 6 V.
The ADM3202/ADM3222 feature high slew rates permitting
data transmission at rates well in excess of the EIA/RS-232E
specifications. RS-232 voltage levels are maintained at data rates
up to 460 kbps even under worst-case loading conditions. This
allows high speed data links between two terminals and is
suitable for the new generation ISDN modem standards that
require data rates of 230 kbps. The slew rate is internally
controlled to less than 30 V/μs to minimize EMI interference.
Receiver Section
The receivers are inverting level-shifters that accept RS-232
input levels and translate them into 3 V logic output levels. The
inputs have internal 5 kΩ, pull-down resistors to ground and are
protected against overvoltages up to 30 V. Unconnected inputs
are pulled to 0 V by the internal 5 kΩ, pull-down resistor. This
results in a Logic 1 output level for unconnected inputs or for
inputs connected to GND.
The receivers have Schmitt-trigger inputs with a hysteresis level
of 0.4 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.
Rev. D | Page ± of 12
ADM3202/ADM3222/ADM1385
OUTLINE DIMENSIONS
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
16
1
9
8
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
10.00 (0.3937)
9.80 (0.3858)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.100 (2.54)
BSC
9
8
16
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
0.060 (1.52)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.210 (5.33)
MAX
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
PLANE
1.27 (0.0500)
BSC
0.50 (0.0197)
0.25 (0.0098)
⋅
45°
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
0.25 (0.0098)
0.10 (0.0039)
8°
0°
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.430 (10.92)
MAX
0.005 (0.13)
MIN
COPLANARITY
0.10
SEATING
PLANE
1.27 (0.0500)
0.40 (0.0157)
0.51 (0.0201)
0.31 (0.0122)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
0.25 (0.0098)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AC
COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 20. 16-Lead Plastic Dual In-Line Package [PDIP]
Figure 22. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(N-16)
Narrow Body
(RN-16)
Dimensions shown in inches and (millimeters)
Dimensions shown in millimeters and (inches)
10.50 (0.4134)
10.10 (0.3976)
5.10
5.00
4.90
16
1
9
8
7.60 (0.2992)
7.40 (0.2913)
16
9
4.50
4.40
4.30
10.65 (0.4193)
10.00 (0.3937)
6.40
BSC
1
8
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
BSC
45°
2.65 (0.1043)
PIN 1
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
1.20
MAX
COPLANARITY
0.10
0.15
0.05
SEATING
PLANE
0.20
0.09
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 21. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Figure 23. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters
Dimensions shown in millimeters and (inches)
Rev. D | Page 10 of 12
ADM3202/ADM3222/ADM1385
0.920 (23.37)
0.900 (22.86)
0.880 (22.35)
6.60
6.50
6.40
18
1
10
9
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
20
11
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
4.50
4.40
4.30
0.100 (2.54)
BSC
0.060 (1.52)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
6.40 BSC
10
0.210 (5.33)
MAX
1
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
PLANE
PIN 1
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.65
BSC
SEATING
PLANE
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
1.20 MAX
0.20
0.15
0.05
0.430 (10.92)
MAX
0.005 (0.13)
MIN
0.09
0.75
0.60
0.45
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
8°
0°
0.30
0.19
COPLANARITY
0.10
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-001
COMPLIANT TO JEDEC STANDARDS MO-153-AC
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 26. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Figure 24. 18-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-18)
Dimensions shown in millimeters
Dimensions shown in inches and (millimeters)
7.50
7.20
6.90
11.75 (0.4626)
11.35 (0.4469)
18
1
10
9
7.60 (0.2992)
7.40 (0.2913)
11
20
5.60
5.30
5.00
10.65 (0.4193)
10.00 (0.3937)
8.20
7.80
7.40
1
10
0.75 (0.0295)
0.25 (0.0098)
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
0.25
0.09
1.85
1.75
1.65
COPLANARITY
0.10
2.00 MAX
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
1.27
(0.0500)
BSC
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
8°
4°
0°
0.95
0.75
0.55
0.38
0.22
0.05 MIN
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-013-AB
COPLANARITY
0.10
0.65 BSC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MO-150-AE
Figure 27. 20-Lead Shrink Small Outline Package [SSOP]
(RS-20)
Figure 25. 18-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-18)
Dimensions shown in millimeters
Dimensions shown in millimeters and (inches)
Rev. D | Page 11 of 12
ADM3202/ADM3222/ADM1385
ORDERING GUIDE
Model
ADM3202AN
ADM3202ANZ1
Temperature Range
Package Description
Package Option
N-16
N-16
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
ADM3202ARN
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
18-Lead Plastic Dual In-Line Package [PDIP]
RN-16
RN-16
RN-16
RN-16
RN-16
RN-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
N-18
ADM3202ARN-REEL
ADM3202ARN-REEL7
ADM3202ARNZ1
ADM3202ARNZ-REEL1
ADM3202ARNZ-REEL71
ADM3202ARU
ADM3202ARU-REEL
ADM3202ARU-REEL7
ADM3202ARUZ1
ADM3202ARUZ-REEL1
ADM3202ARUZ-REEL71
ADM3202ARW
ADM3202ARW-REEL
ADM3202ARW-REEL7
ADM3202ARWZ1
ADM3202ARWZ-REEL1
ADM3202ARWZ-REEL71
ADM3222AN
ADM3222ANZ1
ADM3222ARS
18-Lead Plastic Dual In-Line Package [PDIP]
N-18
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
RS-20
RS-20
RS-20
RS-20
RS-20
RS-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RW-18
RW-18
RW-18
RW-18
RW-18
RW-18
RS-20
RS-20
RS-20
RS-20
RS-20
RS-20
ADM3222ARS-REEL
ADM3222ARS-REEL7
ADM3222ARSZ1
ADM3222ARSZ-REEL1
ADM3222ARSZ-REEL71
ADM3222ARU
ADM3222ARU-REEL
ADM3222ARU-REEL7
ADM3222ARUZ1
ADM3222ARUZ-REEL1
ADM3222ARUZ-REEL71
ADM3222ARW
ADM3222ARW-REEL
ADM3222ARW-REEL7
ADM3222ARWZ1
ADM3222ARWZ-REEL1
ADM3222ARWZ-REEL71
ADM1385ARS
ADM1385ARS-REEL
ADM1385ARS-REEL7
ADM1385ARSZ1
ADM1385ARSZ-REEL1
ADM1385ARSZ-REEL71
1 Z = Pb-free part.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00071-0-8/06(D)
Rev. D | Page 12 of 12
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