ADUC816BCPZ_技术文档

®

MicroConverter , Dual-Channel

16-Bit ADCs with Embedded Flash MCU

a

ADuC816

FUNCTIONAL BLOCK DIAGRAM

FEATURES

High-Resolution Sigma-Delta ADCs

Dual 16-Bit Independent ADCs

Programmable Gain Front End

16-Bit No Missing Codes, Primary ADC

13-Bit p-p Resolution @ 20 Hz, 20 mV Range

16-Bit p-p Resolution @ 20 Hz, 2.56 V Range

Memory

8 Kbytes On-Chip Flash/EE Program Memory

640 Bytes On-Chip Flash/EE Data Memory

Flash/EE, 100 Year Retention, 100 Kcycles Endurance

256 Bytes On-Chip Data RAM

AVDD

ADuC816

AIN1

AIN2

PRIMARY

16-BIT ꢁ-ꢂ ADC

PGA

BUF

MUX

CURRENT

SOURCE

MUX

IEXC1

IEXC2

AGND

AIN3

AIN4

AIN5

12-BIT

VOLTAGE O/P

DAC

AUXILIARY

16-BIT ꢁ-ꢂ ADC

MUX

DAC

BUF

8051-BASED MCU WITH ADDITIONAL

PERIPHERALS

TEMP

SENSOR

8 KBYTES FLASH/EE PROGRAM MEMORY

640 BYTES FLASH/EE DATA MEMORY

256 BYTES USER RAM

INTERNAL

BANDGAP

VREF

PROG.

CLOCK

DIVIDER

8051-Based Core

ON-CHIP MONITORS

POWER SUPPLY

MONITOR

3 ꢀ 16 BIT

TIMER/COUNTERS

1 ꢀ TIME INTERVAL

COUNTER

8051-Compatible Instruction Set (12.58 MHz Max)

32 kHz External Crystal, On-Chip Programmable PLL

Three 16-Bit Timer/Counters

WATCHDOG TIMER

OSC

&

PLL

EXTERNAL

VREF

DETECT

2

I C-COMPATIBLE

UART AND SPI

SERIAL I/O

4 ꢀ PARALLEL

PORTS

26 Programmable I/O Lines

11 Interrupt Sources, Two Priority Levels

Power

REFIN– REFIN+ XTAL1 XTAL2

Specified for 3 V and 5 V Operation

Normal: 3 mA @ 3 V (Core CLK = 1.5 MHz)

Power-Down: 20 ꢃA (32 kHz Crystal Running)

On-Chip Peripherals

On-Chip Temperature Sensor

12-Bit Voltage Output DAC

Dual Excitation Current Sources

Reference Detect Circuit

Time Interval Counter (TIC)

intended for the measurement of wide dynamic range, low

frequency signals, such as those in weigh scale, strain gauge,

pressure transducer, or temperature measurement applications.

The ADC output data rates are programmable and the ADC

output resolution will vary with the programmed gain and

output rate.

The device operates from a 32 kHz crystal with an on-chip PLL

generating a high-frequency clock of 12.58 MHz. This clock is,

in turn, routed through a programmable clock divider from which

the MCU core clock operating frequency is generated. The

microcontroller core is an 8052 and therefore 8051-instruction-

set-compatible. The microcontroller core machine cycle consists

of 12 core clock periods of the selected core operating frequency.

8 Kbytes of nonvolatile Flash/EE program memory are provided

on-chip. 640 bytes of nonvolatile Flash/EE data memory and

256 bytes RAM are also integrated on-chip.

UART Serial I/O

I²C^®-Compatible and SPI^®Serial I/O

Watchdog Timer (WDT), Power Supply Monitor (PSM)

APPLICATIONS

Intelligent Sensors (IEEE1451.2-Compatible)

Weigh Scales

Portable Instrumentation

Pressure Transducers

4–20 mA Transmitters

The ADuC816 also incorporates additional analog functionality

with a 12-bit DAC, current sources, power supply monitor,

and a bandgap reference. On-chip digital peripherals include a

watchdog timer, time interval counter, three timers/counters,

and three serial I/O ports (SPI, UART, and I²C-compatible).

GENERAL DESCRIPTION

The ADuC816 is a complete smart transducer front-end, inte-

grating two high-resolution sigma-delta ADCs, an 8-bit MCU,

and program/data Flash/EE Memory on a single chip. This low

power device accepts low-level signals directly from a transducer.

On-chip factory firmware supports in-circuit serial download and

debug modes (via UART), as well as single-pin emulation mode

via the EA pin. A functional block diagram of the ADuC816 is

shown above with a more detailed block diagram shown in

Figure 12.

The two independent ADCs (Primary and Auxiliary) include a

temperature sensor and a PGA (allowing direct measurement of

low-level signals). The ADCs with on-chip digital filtering are

The part operates from a single 3 V or 5 V supply. When operating

MicroConverter is a registered trademark of Analog Devices, Inc.

SPI is a registered trademark of Motorola, Inc.

from 3 V supplies, the power dissipation for the part is below

10 mW. The ADuC816 is housed in 52-lead MQFP and 56-lead

10 mW. The ADuC816 is housed in a 52-lead MQFP package.

I²C is a registered trademark of Philips Semiconductors, Inc.

LFCSP packages.

REV. 0

REV. A

Information furnished by Analog Devices is believed to be accurate and

reliable. However, no responsibility is assumed by Analog Devices for its

use, nor for any infringements of patents or other rights of third parties

which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700

www.analog.com

Tel: 781/329-4700 World Wide Web Site: http://www.analog.com

Fax: 781/326-8703 © Analog Devices, Inc., 2001

ADuC816

TABLE OF CONTENTS

Using the Flash/EE Memory Interface . . . . . . . . . . . . . . . . . . . . 40

Erase-All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Program a Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

USER INTERFACE TO OTHER ON-CHIP ADuC816

FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . 18

ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . 19

ADuC816 BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 21

MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

OVERVIEW OF MCU-RELATED SFRS . . . . . . . . . . . . . . . . . . 23

Accumulator SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

B SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Stack Pointer SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Data Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Program Status Word SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Power Control SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

SPECIAL FUNCTION REGISTERS . . . . . . . . . . . . . . . . . . . . . 24

SFR INTERFACE TO THE PRIMARY AND

AUXILIARY ADCs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

ADCSTAT (ADC Status Register) . . . . . . . . . . . . . . . . . . . . . . 25

ADCMODE (ADC Mode Register) . . . . . . . . . . . . . . . . . . . . . 26

ADC0CON (Primary ADC Control Register) . . . . . . . . . . . . . . 27

ADC1CON (Auxiliary ADC Control Register) . . . . . . . . . . . . . 28

SF (Sinc Filter Register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

ICON (Current Sources Control Register) . . . . . . . . . . . . . . . . 29

ADC0H/ADC0M (Primary ADC Conversion Result

Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

ADC1H/ADC1L (Auxiliary ADC Conversion Result

Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

OF0H/OF0M (Primary ADC Offset Calibration

Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

OF1H/OF1L (Auxiliary ADC Offset Calibration

Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

GN0H/GN0M (Primary ADC Gain Calibration

Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

GN1H/GN1L (Auxiliary ADC Gain Calibration

Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

PRIMARY AND AUXILIARY ADC CIRCUIT

DESCRIPTION OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Primary ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Auxiliary ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

PRIMARY AND AUXILIARY ADC NOISE

PERFORMANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Analog Input Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Primary and Auxiliary ADC Inputs . . . . . . . . . . . . . . . . . . . . . . 33

Analog Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Programmable Gain Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Bipolar/Unipolar Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Burnout Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Excitation Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Reference Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Reference Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Sigma-Delta Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Digital Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

ADC Chopping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

NONVOLATILE FLASH/EE MEMORY . . . . . . . . . . . . . . . . . . 37

Flash/EE Memory Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Flash/EE Memory and the ADuC816 . . . . . . . . . . . . . . . . . . . . 37

ADuC816 Flash/EE Memory Reliability . . . . . . . . . . . . . . . . . . 37

Using the Flash/EE Program Memory . . . . . . . . . . . . . . . . . . . . 38

Flash/EE Program Memory Security . . . . . . . . . . . . . . . . . . . . . 38

Using the Flash/EE Data Memory . . . . . . . . . . . . . . . . . . . . . . . 39

ECON–Flash/EE Memory Control SFR . . . . . . . . . . . . . . . . . . 39

Flash/EE Memory Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

On-Chip PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Time Interval Counter (TIC) . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Power Supply Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

SERIAL PERIPHERAL INTERFACE . . . . . . . . . . . . . . . . . . . . . 48

MISO (Master In, Slave Out Data I/O Pin), Pin 14 . . . . . . . . . 48

MOSI (Master Out, Slave In Pin), Pin 27 . . . . . . . . . . . . . . . . . 48

SCLOCK (Serial Clock I/O Pin), Pin 26 . . . . . . . . . . . . . . . . . . 48

SS (Slave Select Input Pin), Pin 13 . . . . . . . . . . . . . . . . . . . . . . 48

Using the SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

SPI Interface—Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

SPI Interface—Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

I²C-COMPATIBLE INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . 50

8051-COMPATIBLE ON-CHIP PERIPHERALS . . . . . . . . . . . . 51

Parallel I/O Ports 0–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Timers/Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

TIMER/COUNTER 0 AND 1 OPERATING MODES . . . . . . . . 54

Mode 0 (13-Bit Timer/Counter) . . . . . . . . . . . . . . . . . . . . . . . . 54

Mode 1 (16-Bit Timer/Counter) . . . . . . . . . . . . . . . . . . . . . . . . 54

Mode 2 (8-Bit Timer/Counter with Autoreload) . . . . . . . . . . . . 54

Mode 3 (Two 8-Bit Timer/Counters) . . . . . . . . . . . . . . . . . . . . 54

Timer/Counter 2 Data Registers . . . . . . . . . . . . . . . . . . . . . . . . 55

TH2 and TL2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

RCAP2H and RCAP2L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Timer/Counter 2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . 56

16-Bit Autoreload Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

16-Bit Capture Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

UART SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

SBUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Mode 0: 8-Bit Shift Register Mode . . . . . . . . . . . . . . . . . . . . . . 58

Mode 1: 8-Bit UART, Variable Baud Rate . . . . . . . . . . . . . . . . 58

Mode 2: 9-Bit UART with Fixed Baud Rate . . . . . . . . . . . . . . . 58

Mode 3: 9-Bit UART with Variable Baud Rate . . . . . . . . . . . . . 58

UART Serial Port Baud Rate Generation . . . . . . . . . . . . . . . . . 58

Timer 1 Generated Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . 59

Timer 2 Generated Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . 59

INTERRUPT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Interrupt Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

ADuC816 HARDWARE DESIGN CONSIDERATIONS . . . . . . 62

Clock Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

External Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Power-On Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Power-Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Grounding and Board Layout Recommendations . . . . . . . . . . . 64

ADuC816 System Self-Identification . . . . . . . . . . . . . . . . . . . . . 65

OTHER HARDWARE CONSIDERATIONS . . . . . . . . . . . . . . . 65

In-Circuit Serial Download Access . . . . . . . . . . . . . . . . . . . . . . 65

Embedded Serial Port Debugger . . . . . . . . . . . . . . . . . . . . . . . . 65

Single-Pin Emulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Enhanced-Hooks Emulation Mode . . . . . . . . . . . . . . . . . . . . . . 66

Typical System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 66

QUICKSTART DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . 67

Download—In-Circuit Serial Downloader . . . . . . . . . . . . . . . . . 67

DeBug—In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . 67

ADSIM—Windows Simulator . . . . . . . . . . . . . . . . . . . . . . . . . . 67

OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

–2–

REV. A

REV. 0

ADuC816

SPECIFICATIONS¹

(AV_DD= 2.7 V to 3.6 V or 4.75 V to 5.25 V, DV_DD= 2.7 V to 3.6 V or 4.75 V to 5.25 V,

REFIN(+) = 2.5 V; REFIN(–) = AGND; AGND = DGND = 0 V; XTAL1/XTAL2 = 32.768 kHz Crystal; all specifications T_MINto T_MAXunless otherwise noted.)

Parameter

ADuC816BS

Unit

Test Conditions/Comments

ADC SPECIFICATIONS

Conversion Rate

5.4

105

Hz min

Hz max

On Both Channels

Programmable in 0.732 ms Increments

Primary ADC

No Missing Codes²

Resolution

16

13

16

Bits min

Bits p-p typ

20 Hz Update Rate

Range = 20 mV, 20 Hz Update Rate

Range = 2.56 V, 20 Hz Update Rate

p-p Resolution at this Range/Update Rate

Setting Is Limited Only by the Number of

Bits Available from ADC

Output Noise

See Table IX and X

in ADC Description

Output Noise Varies with Selected

Update Rate and Gain Range

Integral Nonlinearity

Offset Error

1

3

LSB max

μV typ

Offset Error Drift

10

0.5

95

80

nV/°C typ

μV typ

Full-Scale Error³

Range = 20 mV to 640 mV

Range = 1.28 V to 2.56 V

LSB typ

ppm/°C typ

LSB typ

dBs typ

Gain Error Drift⁴

ADC Range Matching

Power Supply Rejection (PSR)

AIN = 18 mV

AIN = 7.8 mV, Range = 20 mV

AIN = 1 V, Range = 2.56 V

dBs typ

Common-Mode DC Rejection

On AIN

95

90

dBs typ

At DC, AIN = 7.8 mV, Range = 20 mV

At DC, AIN = 1 V, Range = 2.56 V

20 Hz Update Rate

50 Hz/60 Hz 1 Hz, AIN = 7.8 mV,

Range = 20 mV

50 Hz/60 Hz 1 Hz, AIN = 1 V,

Range = 2.56 V

50 Hz/60 Hz 1 Hz, AIN = 1 V,

Range = 2.56 V

On REFIN

Common-Mode 50 Hz/60 Hz Rejection²

On AIN

95

90

dBs typ

On REFIN

Normal Mode 50 Hz/60 Hz Rejection²

On AIN

On REFIN

60

dBs typ

50 Hz/60 Hz 1 Hz, 20 Hz Update Rate

Auxiliary ADC

No Missing Codes²

Resolution

16

Bits min

Bits p-p typ

Range = 2.5 V, 20 Hz Update Rate

Output Noise Varies with Selected

Update Rate

Output Noise

See Table XI

in ADC Description

1

–2

Integral Nonlinearity

Offset Error

LSB max

LSB typ

Offset Error Drift

1

μV/°C typ

Full-Scale Error⁵

–2.5

0.5

80

LSB typ

Gain Error Drift⁴

Power Supply Rejection (PSR)

Normal Mode 50 Hz/60 Hz Rejection²

On AIN

ppm/°C typ

dBs typ

AIN = 1 V, 20 Hz Update Rate

60

dBs typ

50 Hz/60 Hz 1 Hz

50 Hz/60 Hz 1 Hz, 20 Hz Update Rate

On REFIN

DAC PERFORMANCE

DC Specifications⁶

Resolution

12

3

–1

50

1

Bits

Relative Accuracy

Differential Nonlinearity

Offset Error

LSB typ

LSB max

mV max

% max

% typ

Guaranteed 12-Bit Monotonic

Gain Error⁷

AV_DDRange

V_REFRange

1

AC Specifications^{2, 6}

Voltage Output Settling Time

Digital-to-Analog Glitch Energy

15

10

μs typ

nVs typ

Settling Time to 1 LSB of Final Value

1 LSB Change at Major Carry

REV. A

REV. 0

–3–

ADuC816–SPECIFICATIONS¹

Parameter

ADuC816BS

Unit

Test Conditions/Comments

INTERNAL REFERENCE

ADC Reference

Reference Voltage

1.25 1%

45

100

V min/max

dBs typ

ppm/°C typ

Initial Tolerance @ 25°C, V_DD= 5 V

Power Supply Rejection

Reference Tempco

DAC Reference

Reference Voltage

Power Supply Rejection

Reference Tempco

2.5 1%

50

100

V min/max

dBs typ

ppm/°C typ

Initial Tolerance @ 25°C, V_DD= 5 V

ANALOG INPUTS/REFERENCE INPUTS

Primary ADC

Differential Input Voltage Ranges^{8, 9}

External Reference Voltage = 2.5 V

RN2, RN1, RN0 of ADC0CON Set to

0 0 0 (Unipolar Mode 0 mV to 20 mV)

0 0 1 (Unipolar Mode 0 mV to 40 mV)

0 1 0 (Unipolar Mode 0 mV to 80 mV)

0 1 1 (Unipolar Mode 0 mV to 160 mV)

1 0 0 (Unipolar Mode 0 mV to 320 mV)

1 0 1 (Unipolar Mode 0 mV to 640 mV)

1 1 0 (Unipolar Mode 0 V to 1.28 V)

1 1 1 (Unipolar Mode 0 V to 2.56 V)

Bipolar Mode (ADC0CON.3 = 0)

20

40

80

160

320

640

1.28

2.56

mV

V

nA max

pA/°C typ

V min

V max

Analog Input Current²

Analog Input Current Drift

Absolute AIN Voltage Limits

1

5

AGND + 100 mV

AV_DD– 100 mV

Auxiliary ADC

Input Voltage Range^{8, 9}

0 to V_REF

V

Unipolar Mode, for Bipolar Mode

See Note 11

Average Analog Input Current

Average Analog Input Current Drift²

Absolute AIN Voltage Limits¹⁰

125

2

nA/V typ

pA/V/°C typ

V min

Input Current Will Vary with Input

Voltage on the Unbuffered Auxiliary ADC

AGND – 30 mV

AV_DD+ 30 mV

V max

External Reference Inputs

REFIN(+) to REFIN(–) Range²

1

V min

AV_DD

1

0.1

0.3

0.65

V max

Average Reference Input Current

Average Reference Input Current Drift

“NO Ext. REF” Trigger Voltage

μA/V typ

nA/V/°C typ

V min

Both ADCs Enabled

NOXREF Bit Active if V_REF< 0.3 V

NOXREF Bit Inactive if V_REF> 0.65 V

V max

ADC SYSTEM CALIBRATION

Full-Scale Calibration Limit

Zero-Scale Calibration Limit

Input Span

+1.05 × FS

–1.05 × FS

0.8 × FS

V max

V min

V max

2.1 × FS

ANALOG (DAC) OUTPUTS

Voltage Range

0 to V_REF

0 to AV_DD

10

100

0.5

V typ

kΩ typ

pF typ

Ω typ

μA typ

DACRN = 0 in DACCON SFR

DACRN = 1 in DACCON SFR

From DAC Output to AGND

Resistive Load

Capacitive Load

Output Impedance

I_SINK

50

TEMPERATURE SENSOR

Accuracy

Thermal Impedance (θ_JA)

2

90

°C typ

°C/W typ

–4–

REV. 0

REV. A

ADuC816

Test Conditions/Comments

Parameter

ADuC816BS

Unit

TRANSDUCER BURNOUT CURRENT SOURCES

AIN+ Current

AIN– Current

–100

+100

nA typ

AIN+ is the Selected Positive Input to

the Primary ADC

AIN– is the Selected Negative Input

the Auxiliary ADC

Initial Tolerance @ 25°C Drift

Drift

10

0.03

% typ

%/°C typ

EXCITATION CURRENT SOURCES

Output Current

Initial Tolerance @ 25°C

Drift

Initial Current Matching @ 25°C

Drift Matching

–200

10

200

1

20

1

0.1

AV_DD– 0.6

AGND

μA typ

Available from Each Current Source

% typ

ppm/°C typ

% typ

ppm/°C typ

μA/V typ

V max

Matching Between Both Current Sources

AV_DD= 5 V + 5%

Line Regulation (AV_DD

Load Regulation

)

Output Compliance

min

LOGIC INPUTS

All Inputs Except SCLOCK, RESET,

and XTAL1

V_INL, Input Low Voltage

0.8

0.4

2.0

V max

V min

DV_DD= 5 V

DV_DD= 3 V

V_INH, Input High Voltage

SCLOCK and RESET Only

(Schmitt-Triggered Inputs)²

V_T+

1.3/3

V min/V max

DV_DD= 5 V

DV_DD= 3 V

DV_DD= 5 V

DV_DD= 3 V

DV_DD= 5 V

DV_DD= 3 V

0.95/2.5

0.8/1.4

0.4/1.1

0.3/0.85

V_T–

V_T+– V_T–

Input Currents

Port 0, P1.2–P1.7, EA

10

μA max

V_IN= 0 V or V_DD

SCLOCK, SDATA/MOSI, MISO, SS¹¹–10 min, –40 max

μA min/μA max V_IN= 0 V, DV_DD= 5 V, Internal Pull-Up

10

μA max

V_IN= V_DD, DV_DD= 5 V

V_IN= 0 V, DV_DD= 5 V

RESET

μA max

35 min, 105 max

μA min/μA max

V_IN= V_DD, DV_DD= 5 V,

Internal Pull-Down

P1.0, P1.1, Ports 2 and 3

10

–180

–660

–20

–75

5

μA max

μA min

μA max

μA min

μA max

pF typ

V_IN= V_DD, DV_DD= 5 V

V_IN= 2 V, DV_DD= 5 V

V_IN= 450 mV, DV_DD= 5 V

All Digital Inputs

Input Capacitance

CRYSTAL OSCILLATOR (XTAL1 AND XTAL2)

Logic Inputs, XTAL1 Only

V_INL, Input Low Voltage

0.8

0.4

3.5

2.5

18

V max

V min

pF typ

DV_DD= 5 V

DV_DD= 3 V

DV_DD= 5 V

DV_DD= 3 V

V_INH, Input High Voltage

XTAL1 Input Capacitance

XTAL2 Output Capacitance

18

REV. A

REV. 0

–5–

ADuC816–SPECIFICATIONS¹

Parameter

ADuC816BS

Unit

Test Conditions/Comments

LOGIC OUTPUTS (Not Including XTAL2)²

V_OH, Output High Voltage

2.4

0.4

V min

V max

V

V_DD= 5 V, I_SOURCE= 80 μA

V_DD= 3 V, I_SOURCE= 20 μA

V

_OL, Output Low Voltage¹²

I_SINK= 8 mA, SCLOCK, SDATA/MOSI

I_SINK= 10 mA, P1.0 and P1.1

I_SINK= 1.6 mA, All Other Outputs max

Floating State Leakage Current

Floating State Output Capacitance

10

μA max

pF typ

5

POWER SUPPLY MONITOR (PSM)

AV_DDTrip Point Selection Range

2.63

4.63

3.5

2.63

4.63

3.5

V min

V max

% max

V min

V max

% max

Four Trip Points Selectable in This Range

Programmed via TPA1–0 in PSMCON

AV_DDPower Supply Trip Point Accuracy

DV_DDTrip Point Selection Range

Four Trip Points Selectable in This Range

Programmed via TPD1–0 in PSMCON

DV_DDPower Supply Trip Point Accuracy

WATCHDOG TIMER (WDT)

Timeout Period

0

ms min

ms max

Nine Timeout Periods in This Range

Programmed via PRE3–0 in WDCON

2000

MCU CORE CLOCK RATE

MCU Clock Rate²

Clock Rate Generated via On-Chip PLL

Programmable via CD2–0 Bits in

PLLCON SFR

98.3

kHz min

12.58

MHz max

START-UP TIME

At Power-On

From Idle Mode

300

1

ms typ

From Power-Down Mode

Oscillator Running

OSC_PD Bit = 0 in PLLCON SFR

Wake Up with INT0 Interrupt

Wake Up with SPI/I²C Interrupt

Wake Up with TIC Interrupt

Wake Up with External RESET

Oscillator Powered Down

Wake Up with External RESET

After External RESET in Normal Mode

After WDT Reset in Normal Mode

1

3.4

ms typ

OSC_PD Bit = 1 in PLLCON SFR

Controlled via WDCON SFR

0.9

3.3

sec typ

ms typ

FLASH/EE MEMORY RELIABILITY CHARACTERISTICS¹³

Endurance¹⁴

100,000

100

Cycles min

Years min

Data Retention¹⁵

POWER REQUIREMENTS

DV_DDand AV_DDCan Be Set

Independently

Power Supply Voltage

AV_DD, 3 V Nominal Operation

2.7

3.6

4.75

5.25

2.7

3.6

4.75

5.25

V min

V max

V min

V max

V min

V max

V min

V max

AV_DD, 5 V Nominal Operation

DV_DD, 3 V Nominal Operation

DV_DD, 5 V Nominal Operation

–6–

REV. A

REV. 0

ADuC816

Parameter

ADuC816BS

Unit

Test Conditions/Comments

POWER REQUIREMENTS (continued)

Power Supply Currents Normal Mode^{16, 17}

DV_DDCurrent

4

mA max

μA max

mA max

μA max

DV_DD= 4.75 V to 5.25 V, Core CLK = 1.57 MHz

DV_DD= 2.7 V to 3.6 V, Core CLK = 1.57 MHz

AV_DD= 5.25 V, Core CLK = 1.57 MHz

DV_DD= 4.75 V to 5.25 V, Core CLK = 12.58 MHz

DV_DD= 2.7 V to 3.6 V, Core CLK = 12.58 MHz

AV_DD= 5.25 V, Core CLK = 12.58 MHz

2.1

170

15

8

AV_DDCurrent

DV_DDCurrent

AV_DDCurrent

170

Power Supply Currents Idle Mode^{16, 17}

DV_DDCurrent

1.2

750

140

2

1

140

mA max

μA typ

mA typ

μA typ

DV_DD= 4.75 V to 5.25 V, Core CLK = 1.57 MHz

DV_DD= 2.7 V to 3.6 V, Core CLK = 1.57 MHz

Measured @ AV_DD= 5.25 V, Core CLK = 1.57 MHz

DV_DD= 4.75 V to 5.25 V, Core CLK = 12.58 MHz

DV_DD= 2.7 V to 3.6 V, Core CLK = 12.58 MHz

Measured at AV_DD= 5.25 V, Core CLK = 12.58 MHz

Core CLK = 1.57 MHz or 12.58 MHz

DV_DD= 4.75 V to 5.25 V, Osc. On, TIC On

DV_DD= 2.7 V to 3.6 V, Osc. On, TIC On

Measured at AV_DD= 5.25 V, Osc. On or Osc. Off

DV_DD= 4.75 V to 5.25 V, Osc. Off

AV_DDCurrent

DV_DDCurrent

AV_DDCurrent

Power Supply Currents Power-Down Mode^{16, 17}

DV_DDCurrent

50

20

1

20

5

μA max

μA typ

AV_DDCurrent

DV_DDCurrent

DV_DD= 2.7 V to 3.6 V, Osc. Off

Core CLK = 1.57 MHz, AV_DD= DV_DD= 5 V

Typical Additional Power Supply Currents

(AI_DDand DI_DD

PSM Peripheral

Primary ADC

Auxiliary ADC

DAC

)

50

1

500

150

400

μA typ

mA typ

μA typ

Dual Current Sources

NOTES

¹Temperature Range –40°C to +85°C.

²These numbers are not production tested but are guaranteed by Design and/or Characterization data on production release.

³The primary ADC is factory-calibrated at 25°C with AV_DD= DV_DD= 5 V yielding this full-scale error. If user power supply or temperature conditions are signifi-

cantly different from these, an Internal Full-Scale Calibration will restore this error to this level.

⁴Gain Error Drift is a span drift. To calculate Full-Scale Error Drift, add the Offset Error Drift to the Gain Error Drift times the full-scale input.

⁵The auxiliary ADC is factory-calibrated at 25°C with AV_DD= DV_DD= 5 V yielding this full-scale error of –2.5 LSB. A system zero-scale and full-scale calibration

will remove this error altogether.

⁶DAC linearity and AC Specifications are calculated using:

reduced code range of 48 to 4095, 0 to V_REF

reduced code range of 48 to 3995, 0 to V_DD

.

⁷Gain Error is a measure of the span error of the DAC.

⁸In general terms, the bipolar input voltage range to the primary ADC is given by Range_ADC

=

(V_REF2^RN)/125, where:

V_REF= REFIN(+) to REFIN(–) voltage and V_REF= 1.25 V when internal ADC V_REFis selected.

RN = decimal equivalent of RN2, RN1, RN0, e.g., V_REF= 2.5 V and RN2, RN1, RN0 = 1, 1, 0 the Range_ADC

In unipolar mode the effective range is 0 V to 1.28 V in our example.

= 1.28 V.

⁹1.25 V is used as the reference voltage to the ADC when internal V_REFis selected via XREF0 and XREF1 bits in ADC0CON and ADC1CON respectively.

¹⁰In bipolar mode, the Auxiliary ADC can only be driven to a minimum of A_GND– 30 mV as indicated by the Auxiliary ADC absolute AIN voltage limits. The bipolar

range is still –V_REFto +V_REF; however, the negative voltage is limited to –30 mV.

¹¹Pins configured in I²C-compatible mode or SPI mode, pins configured as digital inputs during this test.

¹²Pins configured in I²C-compatible mode only.

¹³Flash/EE Memory Reliability Characteristics apply to both the Flash/EE program memory and Flash/EE data memory.

¹⁴Endurance is qualified to 100 Kcycles as per JEDEC Std. 22 method A117 and measured at –40°C, +25°C and +85°C, typical endurance at 25°C is 700 Kcycles.

¹⁵Retention lifetime equivalent at junction temperature (T_J) = 55°C as per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6eV

will derate with junction temperature as shown in Figure 27 in the Flash/EE Memory description section of this data sheet.

¹⁶Power Supply current consumption is measured in Normal, Idle, and Power-Down Modes under the following conditions:

Normal Mode: Reset = 0.4 V, Digital I/O pins = open circuit, Core Clk changed via CD bits in PLLCON, Core Executing internal software loop.

Idle Mode: Reset = 0.4 V, Digital I/O pins = open circuit, Core Clk changed via CD bits in PLLCON, PCON.0 = 1, Core Execution suspended in idle mode.

Power-Down Mode: Reset = 0.4 V, All P0 pins and P1.2–P1.7 pins = 0.4 V, All other digital I/O pins are open circuit, Core Clk changed via CD bits in PLLCON,

PCON.1 = 1, Core Execution suspended in power-down mode, OSC turned ON or OFF via OSC_PD bit (PLLCON.7) in PLLCON SFR.

¹⁷DV_DDpower supply current will typically increase by 3 mA (3 V operation) and 10 mA (5 V operation) during a Flash/EE memory program or erase cycle.

Specifications subject to change without notice

REV. A

REV. 0

–7–

ADuC816

TIMING SPECIFICATIONS^{1, 2, 3}

(AV_DD= 2.7 V to 3.6 V or 4.75 V to 5.25 V, DV_DD= 2.7 V to 3.6 V or 4.75 V to 5.25 V; all

specifications T_MINto T_MAXunless otherwise noted.)

32.768 kHz External Crystal

Parameter

Min

Typ

Max

Unit

Figure

CLOCK INPUT (External Clock Driven XTAL1)

t_CK

t_CKL

XTAL1 Period

XTAL1 Width Low

XTAL1 Width High

XTAL1 Rise Time

30.52

15.16

20

μs

1

μs

t_CKH

t_CKR

t_CKF

1/t_CORE

t_CORE

t_CYC

μs

ns

MHz

μs

XTAL1 Fall Time

20

ADuC816 Core Clock Frequency⁴

ADuC816 Core Clock Period⁵

ADuC816 Machine Cycle Time⁶

0.098

0.95

12.58

0.636

7.6

122.45

NOTES

¹AC inputs during testing are driven at DV_DD– 0.5 V for a Logic 1, and 0.45 V for a Logic 0. Timing measurements are made at V_IHmin for a Logic 1, and V_ILmax

for a Logic 0 as shown in Figure 2.

²For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to float when a 100 mV change from the

loaded V_OH/V_OLlevel occurs as shown in Figure 2.

³C_LOADfor Port0, ALE, PSEN outputs = 100 pF; C_LOADfor all other outputs = 80 pF unless otherwise noted.

⁴ADuC816 internal PLL locks onto a multiple (384 times) the external crystal frequency of 32.768 kHz to provide a Stable 12.583 MHz internal clock for the system.

The core can operate at this frequency or at a binary submultiple called Core_Clk, selected via the PLLCON SFR.

⁵This number is measured at the default Core_Clk operating frequency of 1.57 MHz.

⁶ADuC816 Machine Cycle Time is nominally defined as 12/Core_CLK.

Specifications subject to change without notice.

t_CKR

t_CHK

t_CKL

t_CKF

t_CK

Figure 1. XTAL1 Input

DV – 0.5V

DD

V

– 0.1V

+ 0.1V

V

– 0.1V

0.2DV + 0.9V

DD

LOAD

TIMING

REFERENCE

POINTS

V

LOAD

TEST POINTS

LOAD

0.2DV – 0.1V

DD

V

+ 0.1V

LOAD

0.45V

Figure 2. Timing Waveform Characteristics

–8–

REV. A

REV. 0

ADuC816

12.58 MHz Core_Clk

Variable Core_Clk

Parameter

Min

Max

Min

Max

Unit

Figure

EXTERNAL PROGRAM MEMORY

t_LHLL

t_AVLL

t_LLAX

t_LLIV

t_LLPL

t_PLPH

t_PLIV

t_PXIX

t_PXIZ

t_AVIV

t_PLAZ

t_PHAX

ALE Pulsewidth

119

39

49

2t_CORE– 40

t_CORE– 40

t_CORE– 30

ns

3

Address Valid to ALE Low

Address Hold after ALE Low

ALE Low to Valid Instruction In

ALE Low to PSEN Low

218

133

4t_CORE– 100

3t_CORE– 105

49

193

t_CORE– 30

3t_CORE– 45

PSEN Pulsewidth

PSEN Low to Valid Instruction In

Input Instruction Hold after PSEN

Input Instruction Float after PSEN

Address to Valid Instruction In

PSEN Low to Address Float

Address Hold after PSEN High

0

54

292

25

t_CORE– 25

5t_CORE– 105

25

0

CORE_CLK

t_LHLL

ALE (O)

t_PLPH

t_AVLL

t_LLPL

t_LLIV

t_PLIV

PSEN (O)

t_PXIZ

t_PLAZ

t_LLAX

t_PXIX

PCL

(OUT)

INSTRUCTION

(IN)

PORT 0 (I/O)

t_AVIV

t_PHAX

PORT 2 (O)

PCH

Figure 3. External Program Memory Read Cycle

REV. A

REV. 0

–9–

ADuC816

12.58 MHz Core_Clk

Variable Core_Clk

Min Max

Parameter

Min

Max

Unit

Figure

EXTERNAL DATA MEMORY READ CYCLE

t_RLRH

t_AVLL

t_LLAX

t_RLDV

t_RHDX

t_RHDZ

t_LLDV

t_AVDV

t_LLWL

t_AVWL

t_RLAZ

t_WHLH

RD Pulsewidth

377

39

44

6t_CORE– 100

t_CORE– 40

t_CORE– 35

ns

4

Address Valid after ALE Low

Address Hold after ALE Low

RD Low to Valid Data In

Data and Address Hold after RD

Data Float after RD

ALE Low to Valid Data In

Address to Valid Data In

ALE Low to RD Low

232

5t_CORE– 165 ns

ns

0

89

2t_CORE– 70

ns

486

550

288

8t_CORE– 150 ns

9t_CORE– 165 ns

188

3t_CORE– 50

4t_CORE– 130

3t_CORE+ 50

ns

Address Valid to RD Low

RD Low to Address Float

RD High to ALE High

0

119

0

39

t_CORE– 40

t_CORE+ 40

CORE_CLK

ALE (O)

t_WHLH

PSEN (O)

t_LLDV

t_LLWL

t_RLRH

RD (O)

t_AVWL

t_LLAX

t_RLDV

t_RHDZ

t_RHDX

t_AVLL

t_RLAZ

A0 – A7

(OUT)

PORT 0 (I/O)

DATA (IN)

t_AVDV

A16 – A23

A8 – A15

PORT 2 (O)

Figure 4. External Data Memory Read Cycle

–10–

REV. A

REV. 0

ADuC816

12.58 MHz Core_Clk

Variable Core_Clk

Parameter

Min

Max

Min

Max

Unit

Figure

EXTERNAL DATA MEMORY WRITE CYCLE

t_WLWH

t_AVLL

t_LLAX

t_LLWL

t_AVWL

t_QVWX

t_QVWH

t_WHQX

t_WHLH

WR Pulsewidth

377

39

44

188

29

406

29

6t_CORE– 100

t_CORE– 40

t_CORE– 35

3t_CORE– 50

4t_CORE– 130

t_CORE– 50

7t_CORE– 150

t_CORE– 50

t_CORE– 40

ns

5

Address Valid after ALE Low

Address Hold after ALE Low

ALE Low to WR Low

Address Valid to WR Low

Data Valid to WR Transition

Data Setup before WR

288

119

3t_CORE+ 50

Data and Address Hold after WR

WR High to ALE High

39

t_CORE+ 40

CORE_CLK

ALE (O)

t_WHLH

PSEN (O)

t_LLWL

t_WLWH

WR (O)

t_AVWL

t_LLAX

t_QVWX

t_WHQX

t_AVLL

t_QVWH

DATA

PORT 0 (O)

PORT 2 (O)

A0 – A7

A8 – A15

A16 – A23

Figure 5. External Data Memory Write Cycle

REV. A

REV. 0

–11–

ADuC816

12.58 MHz Core_Clk

Variable Core_Clk

Typ

Parameter

Min

Typ

Max

Min

Max

Unit Figure

UART TIMING (Shift Register Mode)

t_XLXL

t_QVXH

t_DVXH

t_XHDX

t_XHQX

Serial Port Clock Cycle Time

Output Data Setup to Clock

Input Data Setup to Clock

Input Data Hold after Clock

Output Data Hold after Clock

0.95

2t_CORE

μs

ns

6

662

292

0

10t_CORE– 133

2t_CORE+ 133

0

42

2t_CORE– 117

6

ALE (O)

t_XLXL

TXD

01

67

(OUTPUT CLOCK)

SET RI

t_QVXH

OR

SET TI

t_XHQX

RXD

MSB

BIT 6

BIT 1

(OUTPUT DATA)

t_DVXH

t_XHDX

RXD

(INPUT DATA)

MSB

BIT 6

BIT 1

LSB

Figure 6. UART Timing in Shift Register Mode

–12–

REV. 0

REV. A

ADuC816

Parameter

Min

Max

Unit

Figure

I²C-COMPATIBLE INTERFACE TIMING

t_L

t_H

SCLOCK Low Pulsewidth

4.7

4.0

0.6

100

μs

7

SCLOCK High Pulsewidth

Start Condition Hold Time

Data Setup Time

t_SHD

t_DSU

t_DHD

t_RSU

t_PSU

t_BUF

Data Hold Time

0.9

Setup Time for Repeated Start

Stop Condition Setup Time

Bus Free Time between a STOP

Condition and a START Condition

Rise Time of Both SCLOCK and SDATA

Fall Time of Both SCLOCK and SDATA

Pulsewidth of Spike Suppressed

0.6

1.3

t_R

t_F

t_SUP

300

50

ns

7

*

*Input filtering on both the SCLOCK and SDATA inputs suppresses noise spikes less than 50 ns.

t_BUF

t_SUP

t_R

SDATA (I/O)

LSB

ACK

MSB

t_DSU

t_F

t_DHD

t_RSU

t_R

t_PSU

SCLK (I)

t_SHD

t_H

1

2-7

1

8

9

S(R)

PS

t_F

t_SUP

t_L

REPEATED

START

STOP

START

CONDITION CONDITION

Figure 7. I ²C-Compatible Interface Timing

REV. 0

REV. A

–13–

ADuC816

Parameter

Min

Typ

Max

Unit

Figure

SPI MASTER MODE TIMING (CPHA = 1)

t_SL

t_SH

SCLOCK Low Pulsewidth*

SCLOCK High Pulsewidth*

Data Output Valid after SCLOCK Edge

Data Input Setup Time before SCLOCK Edge

Data Input Hold Time after SCLOCK Edge

Data Output Fall Time

Data Output Rise Time

SCLOCK Rise Time

SCLOCK Fall Time

630

ns

8

t_DAV

t_DSU

t_DHD

t_DF

t_DR

t_SR

50

100

10

25

t_SF

*Characterized under the following conditions:

a. Core clock divider bits CD2, CD1, and CD0 bits in PLLCON SFR set to 0, 1, and 1 respectively, i.e., core clock frequency = 1.57 MHz and

b. SPI bit-rate selection bits SPR1 and SPR0 bits in SPICON SFR set to 0 and 0 respectively.

SCLOCK

(CPOL = 0)

t_SH

t_SL

t_SR

t_SF

SCLOCK

(CPOL = 1)

t_DAV

t_DF

t_DR

MOSI

MISO

MSB

BITS 6 – 1

LSB

MSB IN

LSB IN

t_DSU

t_DHD

Figure 8. SPI Master Mode Timing (CPHA = 1)

–14–

REV. 0

REV. A

ADuC816

Parameter

Min

Typ

Max

Unit

Figure

SPI MASTER MODE TIMING (CPHA = 0)

t_SL

SCLOCK Low Pulsewidth*

630

ns

9

t_SH

SCLOCK High Pulsewidth*

t_DAV

t_DOSU

t_DSU

t_DHD

t_DF

Data Output Valid after SCLOCK Edge

Data Output Setup before SCLOCK Edge

Data Input Setup Time before SCLOCK Edge

Data Input Hold Time after SCLOCK Edge

Data Output Fall Time

50

150

100

10

25

t_DR

Data Output Rise Time

t_SR

t_SF

SCLOCK Rise Time

SCLOCK Fall Time

*Characterized under the following conditions:

a. Core clock divider bits CD2, CD1 and CD0 bits in PLLCON SFR set to 0, 1, and 1 respectively, i.e., core clock frequency = 1.57 MHz and

b. SPI bit-rate selection bits SPR1 and SPR0 bits in SPICON SFR set to 0 and 0 respectively.

SCLOCK

(CPOL = 0)

t_SH

t_SL

t_SR

t_SF

SCLOCK

(CPOL = 1)

t_DAV

t_DOSU

t_DF

t_DR

MOSI

MISO

BITS 6 – 1

LSB

MSB

BITS 6 – 1

MSB IN

LSB IN

t_DSUt_DHD

Figure 9. SPI Master Mode Timing (CPHA = 0)

RREEVV.. A0

–15–

ADuC816

Parameter

Min

Typ

Max

Unit

Figure

SPI SLAVE MODE TIMING (CPHA = 1)

t_SS

t_SL

t_SH

t_DAV

t_DSU

t_DHD

t_DF

t_DR

t_SR

SS to SCLOCK Edge

SCLOCK Low Pulsewidth

SCLOCK High Pulsewidth

Data Output Valid after SCLOCK Edge

Data Input Setup Time before SCLOCK Edge

Data Input Hold Time after SCLOCK Edge

Data Output Fall Time

Data Output Rise Time

SCLOCK Rise Time

SCLOCK Fall Time

SS High after SCLOCK Edge

0

ns

10

330

50

100

10

25

t_SF

t_SFS

0

SS

t_SFS

t_SS

t_DF

SCLOCK

(CPOL = 0)

t_SL

t_SR

t_SH

t_SF

SCLOCK

(CPOL = 1)

t_DAV

t_DF

t_DR

MISO

BITS 6

–

1

MSB

LSB

BITS 6

–

1

LSB IN

MOSI

MSB IN

t_DHD

t_DSU

Figure 10. SPI Slave Mode Timing (CPHA = 1)

REV. A

REV. 0

–16–

ADuC816

Parameter

Min

Typ

Max

Unit

Figure

SPI SLAVE MODE TIMING (CPHA = 0)

t_SS

t_SL

t_SH

t_DAV

t_DSU

t_DHD

t_DF

t_DR

t_SR

SS to SCLOCK Edge

0

ns

11

SCLOCK Low Pulsewidth

SCLOCK High Pulsewidth

Data Output Valid after SCLOCK Edge

Data Input Setup Time before SCLOCK Edge

Data Input Hold Time after SCLOCK Edge

Data Output Fall Time

Data Output Rise Time

SCLOCK Rise Time

SCLOCK Fall Time

SS to SCLOCK Edge

330

50

100

10

25

50

20

t_SF

t_SSR

t_DOSS

t_SFS

Data Output Valid after SS Edge

SS High after SCLOCK Edge

0

SS

t_SFS

t_SS

SCLOCK

(CPOL = 0)

t_SH

t_SL

t_SF

t_SR

SCLOCK

(CPOL = 1)

t_DAV

t_DOSS

t_DF

t_DR

BITS 6 – 1

MSB

LSB

MISO

MOSI

BITS 6 – 1

LSB IN

MSB IN

t_DSU

t_DHD

Figure 11. SPI Slave Mode Timing (CPHA = 0)

REV. A

REV. 0

–17–

ADuC816

ABSOLUTE MAXIMUM RATINGS

(T_A= 25°C unless otherwise noted)

Parameter

AV_DDto AGND

AV_DDto DGND

DV_DDto AGND

DV_DDto DGND

AGND to DGND¹

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Ratings

−0.3 V to +7 V

−0.3 V to +0.3 V

−2 V to +5 V

AV_DDto DV_DD

Analog Input Voltage to AGND²

Reference Input Voltage to AGND

AIN/REFIN Current (Indefinite)

Digital Input Voltage to DGND

Digital Output Voltage to DGND

Operating Temperature Range

Storage Temperature Range

Junction Temperature

ș_JAThermal Impedance (MQFP)

−0.3 V to AV_DD+0.3 V

30 mA

−0.3 V to DV_DD+0.3 V

−40°C to +85°C

−65°C to +150°C

150°C

90°C/W

52°C/W

ș_JAThermal Impedance (LFCSP

Base Floating)

Lead Temperature, Soldering

Vapor Phase (60 sec)

Infrared (15 sec)

215°C

220°C

¹AGND and DGND are shorted internally on the ADuC816.

²Applies to P1.2 to P1.7 pins operating in analog or digital input modes.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

–18–

REV. A

ADuC816

PIN FUNCTION DESCRIPTIONS

52

40

1

39

56

43

PIN 1

1

PIN 1

INDICATOR

42

ADuC816

TOP VIEW

(Not to Scale)

ADuC816

TOP VIEW

(Not to Scale)

14

29

15

NOTES

28

13

27

1. THE EXPOSED PADDLE MUST BE LEFT

UNCONNECTED.

14

26

56-Lead MQFP

56-Lead LFCSP

PIN FUNCTION DESCRIPTIONS

Pin No.

52-Lead

MQFP

Pin No.

56-Lead

CSP

Mnemonic

Type¹Description

1, 2

56, 1

P1.0/P1.1

I/O

P1.0 and P1.1 can function as digital inputs or digital outputs and have a pull-up configuration as

described for Port 3. P1.0 and P1.1 have an increased current drive sink capability of 10 mA.

P1.0/T2

I/O

P1.0 and P1.1 also have various secondary functions as described below. P1.0 can be used to

provide a clock input to Timer 2. When enabled, Counter 2 is incremented in response to a

negative transition on the T2 input pin.

P1.1/T2EX

I/O

P1.1 can also be used to provide a control input to Timer 2.When enabled, a negative transition

on the T2EX input pin will cause a Timer 2 capture or reload event.

3–4,

2–3,

P1.2–P1.7

I

Port 1.2 to Port 1.7 have no digital output driver; they can function as a digital input

9–12

11–14

P1.2/DAC/IEXC1

I/O

for which 0 must be written to the port bit. As a digital input, these pins must be driven high or

low externally. These pins also have the following analog functionality: The voltage output from

the DAC or one or both current sources (200 μA or 2 × 200 μA) can be configured to appear at

this pin.

P1.3/AIN5/IEXC2

I/O

Auxiliary ADC input or one or both current sources can be configured at this pin.

P1.4/AIN1

I

Primary ADC, Positive Analog Input

P1.5/AIN2

I

Primary ADC, Negative Analog Input

P1.6/AIN3

I

Auxiliary ADC Input or Muxed Primary ADC, Positive Analog Input

P1.7/AIN4/DAC

I/O

Auxiliary ADC Input or Muxed Primary ADC, Negative Analog Input. The voltage output from the

DAC can also be configured to appear at this pin.

5

4, 5

6, 7, 8

9

AV_DD

S

Analog Supply Voltage, 3 V or 5 V

6

AGND

REFIN(–)

REFIN(+)

SS

S

Analog Ground. Ground reference pin for the analog circuitry.

Reference Input, Negative Terminal

7

I

8

10

I

Reference Input, Positive Terminal

13

14

15

I

Slave Select Input for the SPI Interface. A weak pull-up is present on this pin.

Master Input/Slave Output for the SPI Interface. A weak pull-up is present on this input pin

16

MISO

I/O

I

17

RESET

Reset Input. A high level on this pin for 16 core clock cycles while the oscillator is running resets

the device. There is an internal weak pull-down and a Schmitt trigger input stage on this pin.

16–19,

22–25

18–21,

24–27

P3.0–P3.7

P3.0/RXD

I/O

P3.0–P3.7 are bidirectional port pins with internal pull-up resistors. Port 3 pins that

have 1s written to them are pulled high by the internal pull-up resistors, and in that state can be

used as inputs. As inputs, Port 3 pins being pulled externally low will source current because of

the internal pull-up resistors.When driving a 0-to-1 output transition, a strong pull-up is active for

two core clock periods of the instruction cycle. Port 3 pins also have various secondary functions

including: Receiver Data for UART Serial Port

P3.1/TXD

I/O

Transmitter Data for UART Serial Port

INT0

INT1

External Interrupt 0.This pin can also be used as a gate control input to Timer 0.

External Interrupt 1.This pin can also be used as a gate control input to Timer 1.

Timer/Counter 0 External Input.

P3.2/

P3.3/

P3.4/T0

P3.5/T1

Timer/Counter 1 External Input

WR

External Data Memory Write Strobe. Latches the data byte from Port 0 into an external data

memory.

P3.6/

RD

I/O

External Data Memory Read Strobe. Enables the data from an external data memory to Port 0.

P3.7/

–19–

REV. A

ADuC816

Pin No.

52-Lead

MQFP

Pin No.

56-Lead

CSP

Mnemonic

Type¹Description

20, 34, 48 22, 36, 51,

DV_DD

S

Digital Supply, 3 V or 5 V

21, 35, 47 23, 37, 38, 50 DGND

S

Digital Ground. Ground reference point for the digital circuitry.

26

SCLOCK

I/O

Serial Interface Clock for either the I2C or SPI Interface. As an input, this pin is a Schmitt-triggered input,

and a weak internal pull-up is present on this pin unless it is outputting logic low. This pin can also be

directly controlled in software as a digital output pin.

27

MOSI/SDATA

I/O

Serial Data I/O for the I²C Interface or Master Output/Slave Input for the SPI Interface. A weak

internal pull-up is present on this pin unless it is outputting logic low. This pin can also be directly

controlled in software as a digital output pin.

28–31

36–39

30–33

39–42

P2.0–P2.7

(A8–A15)

(A16–A23)

Port 2 is a bidirectional port with internal pull-up resistors. Port 2 pins that have 1s written to

them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As

inputs, Port 2 pins being pulled externally low will source current because of the internal pull-up

resistors. Port 2 emits the high order address bytes during fetches from external program

memory and middle and high order address bytes during accesses to the 24-bit external data

memory space.

32

33

34

35

XTAL1

XTAL2

I

Input to the Crystal Oscillator Inverter

O

Output from the Crystal Oscillator Inverter. (See the ADuC816 Hardware Design Considerations

section for description.)

40

43

EA

I/O

External Access Enable, Logic Input. When held high, this input enables the device to fetch code

from internal program memory locations 0000h to F7FFh.When held low, this input enables the

device to fetch all instructions from external program memory. To determine the mode of code

EA

execution, i.e., internal or external, the

pin is sampled at the end of an external RESET assertion

EA

or as part of a device power cycle.

may also be used as an external emulation I/O pin, and

therefore the voltage level at this pin must not be changed during normal mode operation as it

may cause an emulation interrupt that will halt code execution.

41

42

44

45

PSEN

ALE

O

Program Store Enable, Logic Output. This output is a control signal that enables the external

program memory to the bus during external fetch operations. It is active every six oscillator

periods except during external data memory accesses. This pin remains high during internal

PSEN

program execution.

can also be used to enable Serial Download mode when pulled low through

a resistor at the end of an external RESET assertion or as part of a device power cycle.

O

Address Latch Enable, Logic Output. This output is used to latch the low byte (and page byte for

24-bit data address space accesses) of the address to external memory during external code or

data memory access cycles. It is activated every six oscillator periods except during an external

data memory access. It can be disabled by setting the PCON.4 bit in the PCON SFR.

43–46

49–52

46–49

52–55

P0.0–P0.7

(AD0–AD3)

I/O

These pins are part of Port 0, which is an 8-bit, open-drain, bidirectional I/O port. Port 0 pins that

have 1s written to them float and in that state can be used (AD4–AD7)as high impedance inputs.

An external pull-up resistor will be required on P0 outputs to force a valid logic high level

externally. Port 0 is also the multiplexed low order address and data bus during accesses to

external program or data memory. In this application, it uses strong internal pull-ups when

emitting 1s.

¹I = Input, O = Output, S = Supply.

–20–

REV. A

ADuC816

Figure 12. 52-MQFP Block Diagram

REV. A

–21–

ADuC816

MEMORY ORGANIZATION

DATA MEMORY SPACE

READ/WRITE

As with all 8051-compatible devices, the ADuC816 has sepa-

rate address spaces for Program and Data memory as shown in

Figure 13 and Figure 14.

9FH

FFFFFFH

(PAGE 159)

640 BYTES

FLASH/EE DATA

MEMORY

ACCESSED

INDIRECTLY

VIA SFR

If the user applies power or resets the device while the EA pin is

pulled low, the part will execute code from the external pro-

gram space, otherwise the part defaults to code execution

from its internal 8 Kbyte Flash/EE program memory. This

internal code space can be downloaded via the UART serial

port while the device is in-circuit.

CONTROL REGISTERS

00H

(PAGE 0)

EXTERNAL

DATA

MEMORY

SPACE

(24-BIT

ADDRESS

SPACE)

INTERNAL

DATA MEMORY

SPACE

PROGRAM MEMORY SPACE

READ ONLY

FFFFH

FFH

SPECIAL

FUNCTION

REGISTERS

ACCESSIBLE

BY DIRECT

ADDRESSING

ONLY

ACCESSIBLE

BY

UPPER

128

INDIRECT

ADDRESSING

ONLY

EXTERNAL

PROGRAM

MEMORY

SPACE

80H

7FH

80H

ACCESSIBLE

BY

DIRECT

LOWER

128

AND INDIRECT

ADDRESSING

00H

000000H

2000H

Figure 14. Data Memory Map

The lower 128 bytes of internal data memory are mapped as shown

in Figure 15. The lowest 32 bytes are grouped into four banks

of eight registers addressed as R0 through R7. The next 16 bytes

(128 bits), locations 20Hex through 2FHex above the register

banks, form a block of directly addressable bit locations at bit

addresses 00H through 7FH. The stack can be located anywhere

in the internal memory address space, and the stack depth can be

expanded up to 256 bytes.

1FFFH

EA = 1

INTERNAL

8 KBYTE

FLASH/EE

PROGRAM

MEMORY

EA = 0

EXTERNAL

PROGRAM

MEMORY

SPACE

0000H

Figure 13. Program Memory Map

The data memory address space consists of internal and exter-

nal memory space. The internal memory space is divided into

four physically separate and distinct blocks, namely the lower

128 bytes of RAM, the upper 128 bytes of RAM, the 128 bytes

of special function register (SFR) area, and a 640-byte Flash/EE

Data memory. While the upper 128 bytes of RAM, and the

SFR area share the same address locations, they are accessed

through different address modes.

7FH

GENERAL-PURPOSE

AREA

30H

2FH

BANKS

BIT-ADDRESSABLE

SELECTED

VIA

(BIT ADDRESSES)

The lower 128 bytes of data memory can be accessed through

direct or indirect addressing, the upper 128 bytes of RAM can

be accessed through indirect addressing, and the SFR area is

accessed through direct addressing.

20H

18H

10H

BITS IN PSW

1FH

17H

0FH

07H

11

10

01

00

Also, as shown in Figure 13, the additional 640 Bytes of

Flash/EE Data Memory are available to the user and can be

accessed indirectly via a group of control registers mapped into

the Special Function Register (SFR) area. Access to the Flash/

EE Data Memory is discussed in detail later as part of the Flash/

EE Memory section in this data sheet.

FOUR BANKS OF EIGHT

REGISTERS

R0 R7

08H

00H

RESET VALUE OF

STACK POINTER

The external data memory area can be expanded up to 16 MBytes.

This is an enhancement of the 64 KByte external data memory

space available on standard 8051-compatible cores.

Figure 15. Lower 128 Bytes of Internal Data Memory

The external data memory is discussed in more detail in the

ADuC816 Hardware Design Considerations section.

–22–

REV. 0

REV. A

ADuC816

Reset initializes the stack pointer to location 07 hex and increments

it once to start from locations 08 hex which is also the first regis-

ter (R0) of register bank 1. Thus, if one is going to use more

than one register bank, the stack pointer should be initialized to an

area of RAM not used for data storage.

Program Status Word SFR

The PSW register is the Program Status Word which contains

several bits reflecting the current status of the CPU as detailed in

Table I.

SFR Address

Power ON Default Value

Bit Addressable

D0H

00H

Yes

The SFR space is mapped to the upper 128 bytes of internal data

memory space and accessed by direct addressing only. It provides

an interface between the CPU and all on-chip peripherals. A block

diagram showing the programming model of the ADuC816 via

the SFR area is shown in Figure 16. A complete SFR map is shown

in Figure 17.

CY

AC

F0

RS1

RS0

OV

F1

P

Table I. PSW SFR Bit Designations

640-BYTE

ELECTRICALLY

Bit

Name

Description

8 KBYTE

REPROGRAMMABLE

ELECTRICALLY

NONVOLATILE

REPROGRAMMABLE

7

6

5

4

3

CY

AC

F0

Carry Flag

Auxiliary Carry Flag

General-Purpose Flag

Register Bank Select Bits

FLASH/EE DATA

NONVOLATILE

MEMORY

FLASH/EE PROGRAM

MEMORY

RS1

DUAL

SIGMA-DELTA ADCs

RS0

RS1

0

1

RS0

0

1

0

1

Selected Bank

128-BYTE

0

1

2

3

SPECIAL

FUNCTION

REGISTER

AREA

8051-

COMPATIBLE

CORE

OTHER ON-CHIP

PERIPHERALS

TEMPERATURE

SENSOR

CURRENT

SOURCES

12-BIT DAC

SERIAL I/O

WDT

2

1

0

OV

F1

P

Overflow Flag

General-Purpose Flag

Parity Bit

256 BYTES

RAM

PSM

Power Control SFR

TIC

PLL

The Power Control (PCON) register contains bits for power-

saving options and general-purpose status flags as shown in

Table II.

Figure 16. Programming Model

SFR Address

Power ON Default Value

Bit Addressable

87H

00H

No

OVERVIEW OF MCU-RELATED SFRS

Accumulator SFR

ACC is the Accumulator register and is used for math operations

including addition, subtraction, integer multiplication and division,

and Boolean bit manipulations. The mnemonics for accumulator-

specific instructions refer to the Accumulator as A.

SMOD SERIPD INT0PD ALEOFF

GF1

GF0

PD

IDL

B SFR

Table II. PCON SFR Bit Designations

The B register is used with the ACC for multiplication and divi-

sion operations. For other instructions it can be treated as a

general-purpose scratchpad register.

Bit

Name

Description

7

6

SMOD

SERIPD

Double UART Baud Rate

I²C/SPI Power-Down Interrupt

Enable

Stack Pointer SFR

The SP register is the stack pointer and is used to hold an internal

RAM address that is called the “top of the stack.” The SP register

is incremented before data is stored during PUSH and CALL

executions. While the Stack may reside anywhere in on-chip

RAM, the SP register is initialized to 07H after a reset. This causes

the stack to begin at location 08H.

5

INT0PD

INT0 Power-Down Interrupt

Enable

4

3

2

1

0

ALEOFF

GF1

GF0

PD

IDL

Disable ALE Output

General-Purpose Flag Bit

Power-Down Mode Enable

Idle Mode Enable

Data Pointer

The Data Pointer is made up of three 8-bit registers, named

DPP (page byte), DPH (high byte) and DPL (low byte). These

are used to provide memory addresses for internal and external

code access and external data access. It may be manipulated as

a 16-bit register (DPTR = DPH, DPL), although INC DPTR

instructions will automatically carry over to DPP, or as three

independent 8-bit registers (DPP, DPH, DPL).

REV. A

REV. 0

–23–

ADuC816

SPECIAL FUNCTION REGISTERS

Figure 17 shows a full SFR memory map and SFR contents on

RESET; NOT USED indicates unoccupied SFR locations. Unoc-

cupied locations in the SFR address space are not implemented;

i.e., no register exists at this location. If an unoccupied location

is read, an unspecified value is returned. SFR locations reserved

for future use are shaded (RESERVED) and should not be

accessed by user software.

All registers except the program counter and the four general-

purpose register banks, reside in the SFR area. The SFR registers

include control, configuration, and data registers that provide

an interface between the CPU and all on-chip peripherals.

SPICON

F8H

DACL

FBH

DACH

FCH

DACCON

FDH

00H

ISPI

FFH

WCOL

FEH

SPE

FDH

SPIM

FCH

CPOL

FBH

CPHA

FAH

SPR1

F9H

SPR0

RESERVED RESERVED

SPIDAT

BITS

0

1

0

F8H

0

04H

00H

B

RESERVED RESERVED NOT USED RESERVED RESERVED RESERVED

BITS

F7H

F6H

F5H

F4H

F3H

F2H

F1H

F0H

0

F0H

I2CCON

F7H

00H

GN0M* GN0H* GN1L* GN1H*

MDO

EFH

MDE

EEH

MCO

EDH

MDI

ECH

I2CM

EBH

I2CRS

EAH

I2CTX

E9H

I2CI

RESERVED RESERVED

RESERVED

0

E8H

0

E8H

EAH

OF0M*

EBH

OF0H*

ECH

OF1L*

EDH

OF1H*

00H

55H

53H

9AH

59H

ACC

BITS

E7H

E6H

E5H

E4H

E3H

E2H

E1H

D9H

E0H

ADCSTAT

E2H

ADC0M

E3H

ADC0H

E4H

ADC1L

E5H

ADC1H

00H

80H

00H

80H

PSMCON

RDY0

RDY1

DEH

CAL

DDH

NOXREF ERR0

ERR1

DAH

RESERVED

DFH

0

DCH

0

DBH

0

D8H

0

D8H

PSW

D0H

DAH

DBH

DCH

DDH

DFH

00H

DEH

ADCMODE ADC0CON ADC1CON

SF

ICON

PLLCON

CY

D7H

AC

D6H

F0

D5H

RSI

D4H

RS0

D3H

OV

D2H

FI

P

RESERVED

0

D1H

D0H

0

D1H

D2H

D3H

D4H

TL2

D5H

TH2

D7H

00H

07H

00H

16H

00H

45H

00H

03H

T2CON

RCAP2L

RCAP2H

TF2

CFH

EXF2

CEH

RCLK

CDH

TCLK

CCH

EXEN2

CBH

TR2

CAH

CNT2

C9H

CAP2

C8H

RESERVED

RESERVED RESERVED

0

C8H

C0H

B8H

B0H

A8H

A0H

CAH

CBH

CCH

CDH

00H

WDCON

CHIPID

EADRL

PRE3

PRE2

C6H

PRE1

C5H

PRE0

C4H

WDIR

C3H

WDS

C2H

WDE

C1H

WDWR

C0H 0

RESERVED

ECON

RESERVED RESERVED RESERVED

RESERVED

C7H

0

1

0

10H

00H

FFH

00H

FFH

C2H

C6H

00H

IP

P3

IE

EDATA1

BCH

EDATA2

BDH

EDATA3

EDATA4

BFH

00H

PADC

BEH

PT2

BDH

PS

BCH

PT1

BBH

PX1

BAH

PT0

B9H

PX0

B8H

RESERVED RESERVED

BFH

0

1

0

1

0

1

0

1

B9H

BEH

00H

RD

B7H

WR

INT1

B3H

INT0

B2H

TXD

B1H

RXD

B0H

T1

B5H

T0

B4H

RESERVED

NOT USED

NOT USED NOT USED NOT USED NOT USED RESERVED

IEIP2

1

0

1

0

1

0

1

B6H

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

EA

EADC

AEH

ET2

ES

ET1

EX1

AAH

ET0

A9H

EX0

RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED

AFH

A7H

ADH

A5H

ACH

A4H

ABH

A3H

A8H

A0H

A9H

TIMECON

A0H

P2

HTHSEC

SEC

MIN

A4H

HOUR

A5H

INTVAL

A6H

00H

NOT USED

A6H

A2H

A1H

A2H

I2CDAT

A3H

I2CDAT

00H

SCON

98H

SBUF

SM0

SM1

9EH

SM2

REN

TB8

RB8

T1

R1

98H

NOT USED NOT USED NOT USED NOT USED

9FH

9DH

9CH

9BH

9AH

99H

9AH

9BH

00H

P1

T2EX

91H

T2

90H

NOT USED NOT USED NOT USED NOT USED NOT USED NOT USED NOT USED

TMOD TL0 TL1 TH0 TH1

00H 89H 00H 8AH 00H 8BH 8CH 00H 8DH 00H

DPL DPH DPP

82H 83H 84H

97H

96H

95H

94H

93H

92H

90H

TCON

88H

FFH

TF1

8FH

TR1

8EH

TF0

8DH

TR0

8CH

IE1

8BH

IT1

8AH

IE0

89H

IT0

RESERVED RESERVED

PCON

88H

80H

00H

P0

SP

BITS

RESERVED RESERVED

87H

86H

85H

84H

83H

82H

81H

80H

81H

87H

FFH

07H

00H

*CALIBRATION COEFFICIENTS ARE PRECONFIGURED AT POWER-UP TO FACTORY-CALIBRATED VALUES.

SFR MAP KEY:

THESE BITS ARE CONTAINED IN THIS BYTE.

MNEMONIC

TCON

BIT MNEMONIC

IE0

IT0

BIT BIT ADDRESS

89H

0

88H

0

DEFAULT VALUE

88H

00H

DEFAULT BIT VALUE

SFR ADDRESS

SFR NOTE:

SFRs WHOSE ADDRESSES END IN 0H OR 8H ARE BIT-ADDRESSABLE.

Figure 17. Special Function Register Locations and Reset Values

–24–

REV. 0

REV. A

ADuC816

SFR INTERFACE TO THE PRIMARY AND AUXILIARY

ADCS

Both ADCs are controlled and configured via a number of SFRs

that are mentioned here and described in more detail in the

following pages.

ICON:

Current Source Control Register. Allows

user control of the various on-chip current

source options.

ADC0H/M*:

ADC1H/L:

OF0H/M*:

OF1H/L:

Primary ADC 16-bit conversion result held in

these two 8-bit registers.

ADCSTAT:

ADCMODE:

ADC0CON:

ADC1CON:

SF:

ADC Status Register. Holds general status of

the Primary and Auxiliary ADCs.

Auxiliary ADC 16-bit conversion result held

in these two 8-bit registers.

ADC Mode Register. Controls general modes

of operation for Primary and Auxiliary ADCs.

Primary ADC 16-bit Offset Calibration Coeffi-

cient held in these two 8-bit registers.

Primary ADC Control Register. Controls

specific configuration of Primary ADC.

Auxiliary ADC 16-bit Offset Calibration Coeffi-

cient held in these two 8-bit registers.

Auxiliary ADC Control Register. Controls

specific configuration of Auxiliary ADC.

GN0H/M*:

GN1H/L:

Primary ADC 16-bit Gain Calibration Coeffi-

cient held in these two 8-bit registers.

Sinc Filter Register. Configures the decimation

factor for the Sinc3 filter and thus the Primary

and Auxiliary ADC update rates.

Auxiliary ADC 16-bit Gain Calibration Coeffi-

cient held in these two 8-bit registers.

*To maintain code compatibility with the ADuC824, it is the low-byte SFR

associated with these register groups that is omitted on the ADuC816.

ADCSTAT (ADC Status Register)

This SFR reflects the status of both ADCs including data ready, calibration and various (ADC-related) error and warning condi-

tions including reference detect and conversion overflow/underflow flags.

SFR Address

Power-On Default Value

Bit Addressable

D8H

00H

Yes

RDY0

RDY1

CAL

NOXREF

ERR0

ERR1

---

Table III. ADCSTAT SFR Bit Designations

Bit

Name

Description

7

RDY0

Ready Bit for Primary ADC.

Set by hardware on completion of ADC conversion or calibration cycle.

Cleared directly by the user or indirectly by write to the mode bits to start another Primary

ADC conversion or calibration. The Primary ADC is inhibited from writing further results to its

data or calibration registers until the RDY0 bit is cleared.

Ready Bit for Auxiliary ADC.

Same definition as RDY0 referred to the Auxiliary ADC.

6

5

RDY1

CAL

Calibration Status Bit.

Set by hardware on completion of calibration.

Cleared indirectly by a write to the mode bits to start another ADC conversion or calibration.

No External Reference Bit (only active if Primary or Auxiliary ADC is active).

Set to indicate that one or both of the REFIN pins is floating or the applied voltage is below a

specified threshold. When Set conversion results are clamped to all ones,if using ext. reference.

4

3

NOXREF

ERR0

Cleared to indicate valid V_REF

.

Primary ADC Error Bit.

Set by hardware to indicate that the result written to the Primary ADC data registers has

been clamped to all zeros or all ones. After a calibration this bit also flags error conditions that

caused the calibration registers not to be written.

Cleared by a write to the mode bits to initiate a conversion or calibration.

Auxiliary ADC Error Bit.

2

ERR1

Same definition as ERR0 referred to the Auxiliary ADC.

Reserved for Future Use.

1

0

---

REV. A

REV. 0

–25–

ADuC816

ADCMODE (ADC Mode Register)

Used to control the operational mode of both ADCs.

SFR Address

Power-On Default Value

Bit Addressable

D1H

00H

No

---

ADC0EN

ADC1EN

---

MD2

MD1

MD0

Table IV. ADCMODE SFR Bit Designations

Description

Bit

Name

7

6

5

---

Reserved for Future Use.

Primary ADC Enable.

Set by the user to enable the Primary ADC and place it in the mode selected in MD2-MD0 below

Cleared by the user to place the Primary ADC in power-down mode.

Auxiliary ADC Enable.

ADC0EN

4

ADC1EN

Set by the user to enable the Auxiliary ADC and place it in the mode selected in MD2-MD0 below

Cleared by the user to place the Auxiliary ADC in power-down mode.

Reserved for Future Use.

Primary and Auxiliary ADC Mode bits.

These bits select the operational mode of the enabled ADC as follows:

3

2

1

0

---

MD2

MD1

MD0

MD2

MD1

MD0

0

1

Power-Down Mode (Power-On Default)

Idle Mode

In Idle Mode the ADC filter and modulator are held in a reset state

although the modulator clocks are still provided.

Single Conversion Mode

0

1

0

In Single Conversion Mode, a single conversion is performed on the

enabled ADC. On completion of the conversion, the ADC data regis-

ters (ADC0H/M and/or ADC1H/L) are updated, the relevant flags

in the ADCSTAT SFR are written, and power-down is re-entered with

the MD2–MD0 accordingly being written to 000.

Continuous Conversion

0

1

In continuous conversion mode the ADC data registers are regularly

updated at the selected update rate (see SF register)

Internal Zero-Scale Calibration

Internal short automatically connected to the enabled ADC(s)

Internal Full-Scale Calibration

1

0

1

Internal or External V_REF(as determined by XREF0 and XREF1 bits

in ADC0/1CON) is automatically connected to the ADC input for

this calibration.

1

0

1

System Zero-Scale Calibration

User should connect system zero-scale input to the ADC input pins

as selected by CH1/CH0 and ACH1/ACH0 bits in the ADC0/1CON

register.

System Full-Scale Calibration

User should connect system full-scale input to the ADC input pins as

selected by CH1/CH0 and ACH1/ACH0 bits in the ADC0/1CON

register.

NOTES

1. Any change to the MD bits will immediately reset both ADCs. A write to the MD2–0 bits with no change is also treated as a reset. (See exception to this in Note 3 below.)

2. If ADC0CON is written when AD0EN = 1, or if AD0EN is changed from 0 to 1, then both ADCs are also immediately reset. In other words, the Primary ADC is

given priority over the Auxiliary ADC and any change requested on the primary ADC is immediately responded to.

3. On the other hand, if ADC1CON is written or if ADC1EN is changed from 0 to 1, only the Auxiliary ADC is reset. For example, if the Primary ADC is continuously

converting when the Auxiliary ADC change or enable occurs, the primary ADC continues undisturbed. Rather than allow the Auxiliary ADC to operate with a phase

difference from the primary ADC, the Auxiliary ADC will fall into step with the outputs of the primary ADC. The result is that the first conversion time for the

Auxiliary ADC will be delayed up to three outputs while the Auxiliary ADC update rate is synchronized to the Primary ADC.

4. Once ADCMODE has been written with a calibration mode, the RDY0/1 bits (ADCSTAT) are immediately reset and the calibration commences. On completion,

the appropriate calibration registers are written, the relevant bits in ADCSTAT are written, and the MD2–0 bits are reset to 000 to indicate the ADC is back in

power-down mode.

5. Any calibration request of the Auxiliary ADC while the temperature sensor is selected will fail to complete. Although the RDY1 bit will be set at the end of the

calibration cycle, no update of the calibration SFRs will take place and the ERR1 bit will be set.

6. Calibrations are performed at maximum SF (see SF SFR) value guaranteeing optimum calibration operation.

–26–

RREEVV.. 0A

ADuC816

ADC0CON (Primary ADC Control Register)

Used to configure the Primary ADC for range, channel selection, external Ref enable, and unipolar or bipolar coding.

SFR Address

Power-On Default Value

Bit Addressable

D2H

07H

No

---

XREF0

CH1

CH0

UNI0

RN2

RN1

RN0

Table V. ADC0CON SFR Bit Designations

Bit

Name

Description

7

6

---

XREF0

Reserved for Future Use.

Primary ADC External Reference Select Bit.

Set by user to enable the Primary ADC to use the external reference via REFIN(+)/REFIN(–).

Cleared by user to enable the Primary ADC to use the internal bandgap reference (V_REF= 1.25 V).

Primary ADC Channel Selection Bits.

5

4

CH1

CH0

Written by the user to select the differential input pairs used by the Primary ADC as follows:

CH1

CH0

Positive Input Negative Input

0

1

0

1

0

1

AIN1

AIN3

AIN2

AIN3

AIN2

AIN4

AIN2 (Internal Short)

AIN2

3

UNI0

Primary ADC Unipolar Bit.

Set by user to enable unipolar coding, i.e., zero differential input will result in 000000 hex output.

Cleared by user to enable bipolar coding, zero differential input will result in 800000 hex output.

Primary ADC Range Bits.

2

1

0

RN2

RN1

RN0

Written by the user to select the Primary ADC input range as follows:

RN2

RN1

RN0

Selected Primary ADC Input Range (V_REF= 2.5 V)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

20 mV

40 mV

80 mV

160 mV

320 mV

640 mV

1.28 V

2.56 V

REV. A

REV. 0

–27–

ADuC816

ADC1CON (Auxiliary ADC Control Register)

Used to configure the Auxiliary ADC for channel selection, external Ref enable and unipolar or bipolar coding. It should be notedthat the

Auxiliary ADC only operates on a fixed input range of V_REF

.

SFR Address

Power-On Default Value

Bit Addressable

D3H

00H

No

---

XREF1

ACH1

ACH0

UNI1

---

Table VI. ADC1CON SFR Bit Designations

Bit

Name

Description

7

6

---

XREF1

Reserved for Future Use.

Auxiliary ADC External Reference Bit.

Set by user to enable the Auxiliary ADC to use the external reference via REFIN(+)/REFIN(–).

Cleared by user to enable the Auxiliary ADC to use the internal bandgap reference.

Auxiliary ADC Channel Selection Bits.

5

4

ACH1

ACH0

Written by the user to select the single-ended input pins used to drive the Auxiliary ADC as follows:

ACH1

ACH0

Positive Input

AIN3

AIN4

Temp Sensor*

Negative Input

AGND

AGND (Temp. Sensor routed to the ADC input)

AGND

0

1

0

1

0

1

AIN5

3

UNI1

Auxiliary ADC Unipolar Bit.

Set by user to enable unipolar coding, i.e., zero input will result in 0000 hex output.

Cleared by user to enable bipolar coding, zero input will result in 8000 hex output.

Reserved for Future Use.

2

1

0

---

*NOTES

1. When the temperature sensor is selected, user code must select internal reference via XREF1 bit above and clear the UNI1 bit (ADC1CON.3) to select bipolar coding.

2. The temperature sensor is factory calibrated to yield conversion results 8000H at 0°C.

3. A +1°C change in temperature will result in a +1 LSB change in the ADC1H register ADC conversion result.

SF (Sinc Filter Register)

value for the SF register is 45 hex, resulting in a default ADC

update rate of just under 20 Hz. Both ADC inputs are chopped

to minimize offset errors, which means that the settling time for

a single conversion or the time to a first conversion result in

continuous conversion mode is 2 × t_ADC. As mentioned earlier,

all calibration cycles will be carried out automatically with a

maximum, i.e., FFhex, SF value to ensure optimum calibra-

tion performance. Once a calibration cycle has completed, the

value in the SF register will be that programmed by user software.

The number in this register sets the decimation factor and thus

the output update rate for the Primary and Auxiliary ADCs.

This SFR cannot be written by user software while either ADC is

active. The update rate applies to both Primary and Auxiliary

ADCs and is calculated as follows:

1

3

1

8.SF

f_ADC

=

·

·f_MOD

Where:

f_ADC

f_MOD

SF =

=

ADC Output Update Rate

Modulator Clock Frequency = 32.768 kHz

Decimal Value of SF Register

Table VII. SF SFR Bit Designations

SF(dec)

SF(hex)

f_ADC(Hz)

t_ADC(ms)

The allowable range for SF is 0Dhex to FFhex. Examples of SF

values and corresponding conversion update rate (f_ADC) and con-

version time (t_ADC) are shown in Table VII, the power-on default

13

69

255

0D

45

FF

105.3

19.79

5.35

9.52

50.34

186.77

–28–

REV. 0

REV. A

ADuC816

ICON (Current Sources Control Register)

Used to control and configure the various excitation and burnout current source options available on-chip.

SFR Address

Power-On Default Value

Bit Addressable

D5H

00H

No

---

BO

ADC1IC

ADC0IC

I2PIN

I1PIN

I2EN

I1EN

Table VIII. ICON SFR Bit Designations

Description

Bit

Name

7

6

---

BO

Reserved for Future Use.

Burnout Current Enable Bit.

Set by user to enable both transducer burnout current sources in the primary ADC signal paths.

Cleared by user to disable both transducer burnout current sources.

Auxiliary ADC Current Correction Bit.

Set by user to allow scaling of the Auxiliary ADC by an internal current source calibration word.

Primary ADC Current Correction Bit.

5

4

3

ADC1IC

ADC0IC

I2PIN*

Set by user to allow scaling of the Primary ADC by an internal current source calibration word.

Current Source-2 Pin Select Bit.

Set by user to enable current source-2 (200 μA) to external Pin 3 (P1.2/DAC/IEXC1).

Cleared by user to enable current source-2 (200 μA) to external Pin 4 (P1.3/AIN5/IEXC2).

Current Source-1 Pin Select Bit.

Set by user to enable current source-1 (200 μA) to external Pin 4 (P1.3/AIN5/IEXC2).

Cleared by user to enable current source-1 (200 μA) to external Pin 3 (P1.2/DAC/IEXC1).

Current Source-2 Enable Bit.

Set by user to turn on excitation current source-2 (200 μA).

Cleared by user to turn off excitation current source-2 (200 μA).

Current Source-1 Enable Bit.

2

1

0

I1PIN*

I2EN

I1EN

Set by user to turn on excitation current source-1 (200 μA).

Cleared by user to turn off excitation current source-1 (200 μA).

*Both current sources can be enabled to the same external pin, yielding a 400 μA current source.

ADC0H/ADC0M (Primary ADC Conversion Result Registers)

These two 8-bit registers hold the 16-bit conversion result from the Primary ADC.

SFR Address

ADC0H

ADC0M

00H

High Data Byte

Middle Data Byte

Both Registers

DBH

DAH

Power-On Default Value

Bit Addressable

No

ADC1H/ADC1L (Auxiliary ADC Conversion Result Registers)

These two 8-bit registers hold the 16-bit conversion result from the Auxiliary ADC.

SFR Address

ADC1H

ADC1L

00H

High Data Byte

Low Data Byte

Both Registers

DDH

DCH

Power-On Default Value

Bit Addressable

No

REV. A

REV. 0

–29–

ADuC816

OF0H/OF0M (Primary ADC Offset Calibration Registers¹)

These two 8-bit registers hold the 16-bit offset calibration coefficient for the Primary ADC. These registers are configured at power-

on with a factory default value of 8000Hex. However, these bytes will be automatically overwritten if an internal or system zero-scale

calibration is initiated by the user via MD2–0 bits in the ADCMODE register.

SFR Address

OF0H

OF0M

8000H

No

Primary ADC Offset Coefficient High Byte

Primary ADC Offset Coefficient Middle Byte

OF0H and OF0M Respectively

Both Registers

E3H

E2H

Power-On Default Value

Bit Addressable

OF1H/OF1L (Auxiliary ADC Offset Calibration Registers¹)

These two 8-bit registers hold the 16-bit offset calibration coefficient for the Auxiliary ADC. These registers are configured at power-on

with a factory default value of 8000Hex. However, these bytes will be automatically overwritten if an internal or system zero-scale

calibration is initiated by the user via the MD2–0 bits in the ADCMODE register.

SFR Address

OF1H

OF1L

8000H

No

Auxiliary ADC Offset Coefficient High Byte

Auxiliary ADC Offset Coefficient Low Byte

OF1H and OF1L Respectively

Both Registers

E5H

E4H

Power-On Default Value

Bit Addressable

GN0H/GN0M (Primary ADC Gain Calibration Registers¹)

These two 8-bit registers hold the 16-bit gain calibration coefficient for the Primary ADC. These registers are configured at power-on

with a factory-calculated internal full-scale calibration coefficient. Every device will have an individual coefficient. However, these

bytes will be automatically overwritten if an internal or system full-scale calibration is initiated by the user via MD2–0 bits in the

ADCMODE register.

SFR Address

GN0H

GN0M

Primary ADC Gain Coefficient High Byte

Primary ADC Gain Coefficient Middle Byte

Configured at factory final test, see notes above.

Both Registers

EBH

EAH

Power-On Default Value

Bit Addressable

No

GN1H/GN1L (Auxiliary ADC Gain Calibration Registers¹)

These two 8-bit registers hold the 16-bit gain calibration coefficient for the Auxiliary ADC. These registers are configured at power-

on with a factory calculated internal full-scale calibration coefficient. Every device will have an individual coefficient. However, these

bytes will be automatically overwritten if an internal or system full-scale calibration is initiated by the user via MD2–0 bits in the

ADCMODE register.

SFR Address

GN1H

GN1L

Auxiliary ADC Gain Coefficient High Byte

Auxiliary ADC Gain Coefficient Low Byte

Configured at factory final test, see notes above.

Both Registers

EDH

ECH

Power-On Default Value

Bit Addressable

No

NOTE

¹These registers can be overwritten by user software only if Mode bits MD0–2 (ADCMODE SFR) are zero.

–30–

REV. 0

REV. A

ADuC816

PRIMARY AND AUXILIARY ADC CIRCUIT DESCRIPTION

OVERVIEW

the analog inputs if required. On-chip burnout currents can

also be turned on. These currents can be used to check that a

transducer on the selected channel is still operational before

attempting to take measurements.

The ADuC816 incorporates two independent sigma-delta ADCs

(Primary and Auxiliary) with on-chip digital filtering intended

for the measurement of wide dynamic range, low frequency

signals such as those in weigh-scale, strain-gauge, pressure trans-

ducer or temperature measurement applications.

The ADC employs a sigma-delta conversion technique to realize

up to 16 bits of no missing codes performance. The sigma-delta

modulator converts the sampled input signal into a digital pulse

train whose duty cycle contains the digital information. A Sinc3

programmable low-pass filter is then employed to decimate the

modulator output data stream to give a valid data conversion

result at programmable output rates from 5.35 Hz (186.77 ms)

to 105.03 Hz (9.52 ms). A Chopping scheme is also employed

to minimize ADC offset errors. A block diagram of the Primary

ADC is shown in Figure 18.

Primary ADC

This ADC is intended to convert the primary sensor input. The

input is buffered and can be programmed for one of 8 input ranges

from 20 mV to 2.56 V being driven from one of three differ-

ential input channel options AIN1/2, AIN3/4, or AIN3/2. The

input channel is internally buffered allowing the part to handle

significant source impedances on the analog input, allowing R/C

filtering (for noise rejection or RFI reduction) to be placed on

DIFFERENTIAL

REFERENCE

PROGRAMMABLE GAIN

AMPLIFIER

THE EXTERNAL REFERENCE

INPUT TO THE ADuC816 IS

ANALOG INPUT CHOPPING

SIGMA-DELTA ADC

DIFFERENTIAL AND

THE PROGRAMMABLE

OUTPUT AVERAGE

GAIN AMPLIFIER ALLOWS

EIGHT UNIPOLAR AND

EIGHT BIPOLAR INPUT

RANGES FROM 20mV TO

2.56V (EXT VREF = +2.5V)

THE INPUTS ARE

ALTERNATELY REVERSED

THROUGH THE

CONVERSION CYCLE.

CHOPPING YIELDS

EXCELLENT ADC OFFSET

AND OFFSET DRIFT

PERFORMANCE

FACILITATES RATIOMETRIC

THE SIGMA-DELTA

OPERATION. THE EXTERNAL

REFERENCE VOLTAGE IS

SELECTED VIA THE XREF0 BIT

IN ADC0CON.

AS PART OF THE CHOPPING

IMPLEMENTATION, EACH

DATA WORD OUTPUT

FROM THE FILTER IS

SUMMED AND AVERAGED

WITH ITS PREDECESSOR

TO NULL ADC CHANNEL

OFFSET ERRORS

ARCHITECTURE ENSURES

16 BITS NO MISSING

CODES. THE ENTIRE

SIGMA-DELTA ADC IS

CHOPPED TO REMOVE

DRIFT ERROR

BURNOUT CURRENTS

TWO 100nA BURNOUT

CURRENTS ALLOW THE

USER TO EASILY DETECT

IF A TRANSDUCER HAS

BURNED OUT OR GONE

OPEN-CIRCUIT

REFERENCE DETECT

CIRCUITRY TESTS FOR OPEN OR

SHORTED REFERENCES INPUTS

SEE PAGE 34

SEE PAGE 35

SEE PAGE 36

SEE PAGE 35

SEE PAGE 36

SEE PAGE 29 AND 34

REFIN(–)

REFIN(+)

AV

DD

DIGTAL OUTPUT

RESULT WRITTEN

TO ADC0H/M

SFRs

SIGMA-DELTA A/D CONVERTER

AIN1

AIN2

SIGMA-

DELTA

PROGRAMMABLE

BUFFER

OUTPUT

AVERAGE

OUTPUT

SCALING

DIGITAL

FILTER

MODULATOR

MUX

PGA

AIN3

AIN4

CHOP

AGND

OUTPUT SCALING

THE OUPUT WORD FROM THE

DIGITAL FILTER IS SCALED BY

THE CALIBRATION

COEFFICIENTS BEFORE

BEING PROVIDED AS

THE CONVERSION RESULT

ANALOG MULTIPLEXER

A DIFFERENTIAL MULTIPLEXER

ALLOWS SELECTION OF THREE

FULLY DIFFERENTIAL PAIR OPTIONS AND

ADDITIONAL INTERNAL SHORT OPTION

(AIN2–AIN2).THE MULTIPLEXER IS

CONTROLLED VIA THE CHANNEL

SELECTION BITS IN ADC0CON

PROGRAMMABLE

DIGITAL FILTER

SIGMA-DELTA

MODULATOR

BUFFER AMPLIFIER

3

THE SINC FILTER REMOVES

THE MODULATOR PROVIDES

A HIGH-FREQUENCY 1-BIT

DATA STREAM (THE OUTPUT

OF WHICH IS ALSO CHOPPED)

TO THE DIGITAL FILTER,

THE DUTY CYCLE OF WHICH

REPRESENTS THE SAMPLED

ANALOG INPUT VOLTAGE

THE BUFFER AMPLIFIER

PRESENTS A HIGH

QUANTIZATION NOISE INTRODUCED

BY THE MODULATOR. THE UPDATE

RATE AND BANDWIDTH OF THIS

FILTER ARE PROGRAMMABLE

VIA THE SF SFR

SEE PAGE 37

IMPEDANCE INPUT STAGE

FOR THE ANALOG INPUTS,

ALLOWING SIGNIFICANT

EXTERNAL SOURCE

SEE PAGES 27 AND 33

IMPEDANCES

SEE PAGE 35

SEE PAGE 33

SEE PAGE 35

Figure 18. Primary ADC Block Diagram

REV. 0

REV. A

–31–

ADuC816

(assuming an external 2.5 V reference). The single-ended inputs

can be driven from AIN3, AIN4 or AIN5 pins or directly from

the on-chip temperature sensor voltage. A block diagram of the

Auxiliary ADC is shown in Figure 19.

Auxiliary ADC

The Auxiliary ADC is intended to convert supplementary inputs

such as those from a cold junction diode or thermistor. This ADC

is not buffered and has a fixed input range of 0 V to 2.5 V

DIFFERENTIAL REFERENCE

THE EXTERNAL REFERENCE INPUT TO

THE ADuC816 IS DIFFERENTIAL AND

FACILITATES RATIOMETRIC

OPERATION. THE EXTERNAL REFER-

ENCE VOLTAGE IS SELECTED VIA THE

XREF1 BIT IN ADC1CON. REFERENCE

DETECT CIRCUITRY TESTS FOR OPEN

OR SHORTED REFERENcES INPUTS

SIGMA-DELTA ADC

OUTPUT AVERAGE

THE SIGMA-DELTA

AS PART OF THE CHOPPING

ARCHITECTURE ENSURES

ANALOG INPUT CHOPPING

IMPLEMENTATION EACH

16 BITS NO MISSING

DATA WORD OUTPUT

CODES. THE ENTIRE

THE INPUTS ARE ALTERNATELY

REVERSED THROUGH THE

CONVERSION CYCLE. CHOPPING

YIELDS EXCELLENT ADC

OFFSET AND OFFSET DRIFT

PERFORMANCE

FROM THE FILTER IS

SIGMA-DELTA ADC IS

SUMMED AND AVERAGED

CHOPPED TO REMOVE DRIFT

WITH ITS PREDECESSOR

SEE PAGE 35

ERRORS

TO NULL ADC CHANNEL

OFFSET ERRORS

SEE PAGE 35

SEE PAGE 36

REFIN(–)

REFIN(+)

DIGTAL OUTPUT

RESULT WRITTEN

TO ADC1H/L SFRs

SIGMA-DELTA A/D CONVERTER

AIN3

AIN4

SIGMA-

DELTA

PROGRAMMABLE

DIGITAL FILTER

OUTPUT

AVERAGE

OUTPUT

SCALING

MU

MODULATOR

MUX

X

AIN5

CHOP

ON-CHIP

TEMPERATURE

SENSOR

CHOP

OUTPUT SCALING

THE OUPUT WORD FROM THE

DIGITAL FILTER IS SCALED BY

THE CALIBRATION

COEFFICIENTS BEFORE

BEING PROVIDED AS

THE CONVERSION RESULT

ANALOG MULTIPLEXER

PROGRAMMABLE DIGITAL

FILTER

A DIFFERENTIAL MULTIPLEXER

ALLOWS SELECTION OF THREE

EXTERNAL SINGLE ENDED INPUTS OR

THE ON-CHIP TEMP. SENSOR.

THE MULTIPLEXER IS CONTROLLED VIA

THE CHANNEL SELECTION

SIGMA-DELTA

MODULATOR

3

THE SINC FILTER REMOVES

THE MODULATOR PROVIDES A

HIGH FREQUENCY 1-BIT DATA

STREAM (THE OUTPUT OF WHICH

IS ALSO CHOPPED) TO THE

DIGITAL FILTER,

THE DUTY CYCLE OF WHICH

REPRESENTS THE SAMPLED

ANALOG INPUT VOLTAGE

QUANTIZATION NOISE INTRODUCED

BY THE MODULATOR. THE UPDATE

RATE AND BANDWIDTH OF THIS

FILTER ARE PROGRAMMABLE

VIA THE SF SFR

SEE PAGE 37

BITS IN ADC1CON

SEE PAGE 28 AND 33

SEE PAGE 35

Figure 19. Auxiliary ADC Block Diagram

–32–

RREEVV.. A0

ADuC816

PRIMARY AND AUXILIARY ADC NOISE

PERFORMANCE

Tables IX, X and XI below show the output rms noise in μV

and output peak-to-peak resolution in bits (rounded to the

nearest 0.5 LSB) for some typical output update rates on both

the Primary and Auxiliary ADCs. The numbers are typical and

are generated at a differential input voltage of 0 V. The output

update rate is selected via the SF7–SF0 bits in the Sinc Filter

(SF) SFR. It is important to note that the peak-to-peak resolu-

tion figures represent the resolution for which there will be no

code flicker within a six-sigma limit.

Table IX. Primary ADC, Typical Output RMS Noise (ꢃV)

Typical Output RMS Noise vs. Input Range and Update Rate; Output RMS Noise in ꢃV

SF

Word

Data Update

Rate (Hz)

Input Range

ꢄ160 mV

ꢄ20 mV

ꢄ40 mV

ꢄ80 mV

ꢄ320 mV

ꢄ640 mV

ꢄ1.28 V ꢄ2.56 V

13

69

255

105.3

19.79

5.35

1.50

0.60

0.35

1.50

0.65

0.35

1.60

0.65

0.37

1.75

0.65

0.37

3.50

0.65

0.37

4.50

0.95

0.51

6.70

1.40

0.82

11.75

2.30

1.25

Table X. Primary ADC, Peak-to-Peak Resolution (Bits)

Peak-to-Peak Resolution vs. Input Range and Update Rate; Peak-to-Peak Resolution in Bits

SF

Word

Data Update

Rate (Hz)

Input Range

ꢄ160 mV

ꢄ20 mV

ꢄ40 mV

ꢄ80 mV

ꢄ320 mV

ꢄ640 mV

ꢄ1.28 V ꢄ2.56 V

13

69

255

105.3

19.79

5.35

12

13

14

13

14

15

14

15

16

15

15.5

16¹

16

16¹

NOTE

¹Peak-to-peak resolution at these range/update rate settings is limited only by the number of bits available from the ADC. Effective resolution at these range/update

rate settings is greater than 16 bits as indicated by the rms noise table shown in Table IX.

Table XI. Auxiliary ADC

Typical Output RMS Noise vs. Update Rate¹

Peak-to-Peak Resolution vs. Update Rate¹

Peak-to-Peak Resolution in Bits

Output RMS Noise in ꢃV

SF

Word

Data Update

Rate (Hz)

Input Range

2.5 V

SF

Word

Data Update

Rate (Hz)

Input Range

2.5 V

13

69

255

105.3

19.79

5.35

10.75

2.00

1.15

13

69

255

105.3

19.79

5.35

16²

16

NOTE

NOTES

¹ADC converting in bipolar mode.

²In unipolar mode peak-to-peak resolution at 105 Hz is 15 bits.

Analog Input Channels

Primary and Auxiliary ADC Inputs

The primary ADC has four associated analog input pins (labelled

AIN1 to AIN4) which can be configured as two fully differential

input channels. Channel selection bits in the ADC0CON SFR

detailed in Table V allow three combinations of differential pair

selection as well as an additional shorted input option (AIN2–AIN2).

The output of the primary ADC multiplexer feeds into a high

impedance input stage of the buffer amplifier. As a result, the

primary ADC inputs can handle significant source impedances and

are tailored for direct connection to external resistive-type sensors

like strain gauges or Resistance Temperature Detectors (RTDs).

The auxiliary ADC has three external input pins (labelled AIN3

to AIN5) as well as an internal connection to the internal on-chip

temperature sensor. All inputs to the auxiliary ADC are single-

ended inputs referenced to the AGND on the part. Channel

selection bits in the ADC1CON SFR detailed previously in

Table VI allow selection of one of four inputs.

The auxiliary ADC, however, is unbuffered resulting in higher

analog input current on the auxiliary ADC. It should be noted that

this unbuffered input path provides a dynamic load to the driving

source. Therefore, resistor/capacitor combinations on the input

pins can cause dc gain errors depending on the output impedance

of the source that is driving the ADC inputs.

Two input multiplexers switch the selected input channel to the

on-chip buffer amplifier in the case of the primary ADC and

directly to the sigma-delta modulator input in the case of the

auxiliary ADC. When the analog input channel is switched, the

settling time of the part must elapse before a new valid word is

available from the ADC.

Analog Input Ranges

The absolute input voltage range on the primary ADC is restricted

to between AGND + 100 mV to AVDD – 100 mV. Care must be

taken in setting up the common-mode voltage and input voltage

range so that these limits are not exceeded, otherwise there will

be a degradation in linearity performance.

REV. A

REV. 0

–33–

ADuC816

The absolute input voltage range on the auxiliary ADC is restricted

to between AGND – 30 mV to AVDD + 30 mV. The slightly

negative absolute input voltage limit does allow the possibility of

monitoring small signal bipolar signals using the single-ended

auxiliary ADC front end.

Burnout Currents

The primary ADC on the ADuC816 contains two 100 nA con-

stant current generators, one sourcing current from AVDD to

AIN(+), and one sinking from AIN(–) to AGND. The currents

are switched to the selected analog input pair. Both currents are

either on or off, depending on the Burnout Current Enable

(BO) bit in the ICON SFR (see Table VIII). These currents can

be used to verify that an external transducer is still operational

before attempting to take measurements on that channel. Once

the burnout currents are turned on, they will flow in the exter-

nal transducer circuit, and a measurement of the input voltage

on the analog input channel can be taken. If the resultant volt-

age measured is full-scale, this indicates that the transducer has

gone open-circuit. If the voltage measured is 0 V, it indicates that

the transducer has short circuited. For normal operation, these

burnout currents are turned off by writing a 0 to the BO bit in

the ICON SFR. The current sources work over the normal abso-

lute input voltage range specifications.

Programmable Gain Amplifier

The output from the buffer on the primary ADC is applied to the

input of the on-chip programmable gain amplifier (PGA). The

PGA can be programmed through eight different unipolar input

ranges and bipolar ranges. The PGA gain range is programmed

via the range bits in the ADC0CON SFR. With the external refer-

ence select bit set in the ADC0CON SFR and an external 2.5 V

reference, the unipolar ranges are 0 mV to +20 mV, 0 mV to

40 mV, 0 mV to 80 mV, 0 mV to 160 mV, 0 mV to 320 mV,

0 mV to 640 mV and 0 V to 1.28 V and 0 to 2.56 V while the

bipolar ranges are 20 mV, 40 mV, 80 mV, 160 mV,

320 mV, 640 mV, 1.28 V and 2.56 V. These are the nominal

ranges that should appear at the input to the on-chip PGA. An

ADC range matching specification of 0.5 LSB (typ) across all

ranges means that calibration need only be carried out at a single

gain range and does not have to be repeated when the PGA

gain range is changed.

Excitation Currents

The ADuC816 also contains two identical, 200 μA constant

current sources. Both source current from AVDD to Pin 3

(IEXC1) or Pin 4 (IEXC2) These current sources are con-

trolled via bits in the ICON SFR shown in Table VIII. They

can be configured to source 200 μA individually to both pins or

a combination of both currents, i.e., 400 μA to either of the

selected pins. These current sources can be used to excite exter-

nal resistive bridge or RTD sensors.

The auxiliary ADC does not incorporate a PGA and is configured

for a fixed single input range of 0 to V_REF

.

Bipolar/Unipolar Inputs

The analog inputs on the ADuC816 can accept either uni-

polar or bipolar input voltage ranges. Bipolar input ranges

do not imply that the part can handle negative voltages with

respect to system AGND.

Reference Input

The ADuC816’s reference inputs, REFIN(+) and REFIN(–),

provide a differential reference input capability. The common-

mode range for these differential inputs is from AGND to AVDD.

The nominal reference voltage, VREF (REFIN(+) – REFIN(–)),

for specified operation is 2.5 V with the primary and auxil-

iary reference enable bits set in the respective ADC0CON

and/or ADC1CON SFRs.

Unipolar and bipolar signals on the AIN(+) input on the primary

ADC are referenced to the voltage on the respective AIN(–) input.

For example, if AIN(–) is 2.5 V and the primary ADC is config-

ured for an analog input range of 0 mV to +20 mV, the input

voltage range on the AIN(+) input is 2.5 V to 2.52 V. If AIN(–)

is 2.5 V and the ADuC816 is configured for an analog input range

of 1.28 V, the analog input range on the AIN(+) input is 1.22 V

to 3.78 V (i.e., 2.5 V 1.28 V).

The part is also functional (although not specified for perfor-

mance) when the XREF0 or XREF1 bits are “0,” which enables

the on-chip internal bandgap reference. In this mode, the ADCs

will see the internal reference of 1.25 V, therefore halving all

input ranges. As a result of using the internal reference volt-

age, a noticeable degradation in peak-to-peak resolution will

result. Therefore, for best performance, operation with an exter-

nal reference is strongly recommended.

As mentioned earlier, the auxiliary ADC input is a single-ended

input with respect to the system AGND. In this context a bipolar

signal on the auxiliary ADC can only span 30 mV negative

with respect to AGND before violating the voltage input limits

for this ADC.

Bipolar or unipolar options are chosen by programming the

Primary and Auxiliary Unipolar enable bits in the ADC0CON

and ADC1CON SFRs respectively. This programs the relevant

ADC for either unipolar or bipolar operation. Programming for

either unipolar or bipolar operation does not change any of the

input signal conditioning; it simply changes the data output coding

and the points on the transfer function where calibrations occur.

When an ADC is configured for unipolar operation, the output

coding is natural (straight) binary with a zero differential input

voltage resulting in a code of 000 . . . 000, a midscale voltage

resulting in a code of 100 . . . 000, and a full-scale input voltage

resulting in a code of 111 . . . 111. When an ADC is configured

for bipolar operation, the coding is offset binary with a negative

full-scale voltage resulting in a code of 000 . . . 000, a zero

differential voltage resulting in a code of 100 . . . 000, and a

positive full-scale voltage resulting in a code of 111 . . . 111.

In applications where the excitation (voltage or current) for the

transducer on the analog input also drives the reference voltage

for the part, the effect of the low-frequency noise in the excita-

tion source will be removed as the application is ratiometric. If the

ADuC816 is not used in a ratiometric application, a low noise

reference should be used. Recommended reference voltage sources

for the ADuC816 include the AD780, REF43, and REF192.

It should also be noted that the reference inputs provide a high

impedance, dynamic load. Because the input impedance of each

reference input is dynamic, resistor/capacitor combinations on

these inputs can cause dc gain errors depending on the output

impedance of the source that is driving the reference inputs.

Reference voltage sources, like those recommended above (e.g.,

AD780) will typically have low output impedances and therefore

decoupling capacitors on the REFIN(+) input would be recom-

–34–

REV. 0

REV. A

ADuC816

mended. Deriving the reference input voltage across an external

resistor, as shown in Figure 52, will mean that the reference

input sees a significant external source impedance. External

decoupling on the REFIN(+) and REFIN(–) pins would not be

recommended in this type of circuit configuration.

frequency. In this manner, the 1-bit output of the comparator

is translated into a band-limited, low noise output from the

ADuC816 ADCs.

The ADuC816 filter is a low-pass, Sinc³or (sinx/x)³filter whose

primary function is to remove the quantization noise introduced

at the modulator. The cutoff frequency and decimated output data

rate of the filter are programmable via the SF (Sinc Filter) SFR

as described in Table VII.

Reference Detect

The ADuC816 includes on-chip circuitry to detect if the part has a

valid reference for conversions or calibrations. If the voltage

between the external REFIN(+) and REFIN(–) pins goes below

0.3 V or either the REFIN(+) or REFIN(–) inputs is open circuit,

the ADuC816 detects that it no longer has a valid reference. In

this case, the NOXREF bit of the ADCSTAT SFR is set to a 1. If

the ADuC816 is performing normal conversions and the NOXREF

bit becomes active, the conversion results revert to all 1s. Therefore,

it is not necessary to continuously monitor the status of the

NOXREF bit when performing conversions. It is only necessary

to verify its status if the conversion result read from the ADC Data

Register is all 1s.

Figure 21 shows the frequency response of the ADC chan-

nel at the default SF word of 69 dec or 45 hex, yielding an

overall output update rate of just under 20 Hz.

It should be noted that this frequency response allows frequency

components higher than the ADC Nyquist frequency to pass

through the ADC, in some cases without significant attenuation.

These components may, therefore, be aliased and appear in-band

after the sampling process.

It should also be noted that rejection of mains-related frequency

components, i.e., 50 Hz and 60 Hz, is seen to be at level of

>65 dB at 50 Hz and >100 dB at 60 Hz. This confirms the

data sheet specifications for 50 Hz/60 Hz Normal Mode Rejec-

tion (NMR) at a 20 Hz update rate.

If the ADuC816 is performing either an offset or gain calibration

and the NOXREF bit becomes active, the updating of the respec-

tive calibration registers is inhibited to avoid loading incorrect

coefficients to these registers, and the appropriate ERR0 or ERR1

bits in the ADCSTAT SFR are set. If the user is concerned

about verifying that a valid reference is in place every time a cali-

bration is performed, the status of the ERR0 or ERR1 bit should

be checked at the end of the calibration cycle.

0

–10

–20

–30

Sigma-Delta Modulator

–40

A sigma-delta ADC generally consists of two main blocks, an

analog modulator and a digital filter. In the case of the ADuC816

ADCs, the analog modulators consist of a difference amplifier,

an integrator block, a comparator, and a feedback DAC as illus-

trated in Figure 20.

–50

–60

–70

–80

–90

DIFFERENCE

AMP

ANALOG

INPUT

COMPARATOR

–100

–110

–120

HIGH-

FREQUENCY

BITSTREAM

TO DIGITAL

FILTER

INTEGRATOR

DAC

0

10

20

30

40

50

60

70

80

90 100 110

FREQUENCY – Hz

Figure 21. Filter Response, SF = 69 dec

The response of the filter, however, will change with SF word as

can be seen in Figure 22, which shows >90 dB NMR at 50 Hz

and >70 dB NMR at 60 Hz when SF = 255 dec.

Figure 20. Sigma-Delta Modulator Simplified Block Diagram

In operation, the analog signal sample is fed to the difference

amplifier along with the output of the feedback DAC. The differ-

ence between these two signals is integrated and fed to the

comparator. The output of the comparator provides the input to

the feedback DAC so the system functions as a negative feedback

loop that tries to minimize the difference signal. The digital data

that represents the analog input voltage is contained in the duty

cycle of the pulse train appearing at the output of the comparator.

This duty cycle data can be recovered as a data word using a

subsequent digital filter stage. The sampling frequency of

the modulator loop is many times higher than the bandwidth of

the input signal. The integrator in the modulator shapes the

quantization noise (which results from the analog-to-digital con-

version) so that the noise is pushed toward one-half of the

modulator frequency.

0

–10

–20

–30

–40

–50

–60

–70

–80

–90

–100

–110

–120

Digital Filter

0

10

20

30

40

50

60

70

80

90

100

The output of the sigma-delta modulator feeds directly into the

digital filter. The digital filter then band-limits the response to a

frequency significantly lower than one-half of the modulator

FREQUENCY – Hz

Figure 22. Filter Response, SF = 255 dec

REV. A

REV. 0

–35–

ADuC816

Figures 23 and 24 show the NMR for 50 Hz and 60 Hz across

the full range of SF word, i.e., SF = 13 dec to SF = 255 dec.

Calibration

The ADuC816 provides four calibration modes that can be pro-

grammed via the mode bits in the ADCMODE SFR detailed in

Table IV. In fact, every ADuC816 has already been factory

calibrated. The resultant Offset and Gain calibration coefficients

for both the primary and auxiliary ADCs are stored on-chip

in manufacturing-specific Flash/EE memory locations. At power-

on, these factory calibration coefficients are automatically

downloaded to the calibration registers in the ADuC816 SFR

space. Each ADC (primary and auxiliary) has dedicated calibration

SFRs, these have been described earlier as part of the general

ADC SFR description. However, the factory calibration values

in the ADC calibration SFRs will be overwritten if any one of

the four calibration options are initiated and that ADC is enabled

via the ADC enable bits in ADCMODE.

0

–10

–20

–30

–40

–50

–60

–70

–80

–90

–100

–110

Even though an internal offset calibration mode is described

below, it should be recognized that both ADCs are chopped. This

chopping scheme inherently minimizes offset and means that an

internal offset calibration should never be required. Also, because

factory 5 V/25°C gain calibration coefficients are automatically

present at power-on, an internal full-scale calibration will only

be required if the part is being operated at 3 V or at temperatures

significantly different from 25°C.

–120

10 30 50 70 90 110 130 150 170 190 210 230 250

SF – Decimal

Figure 23. 50 Hz Normal Mode Rejection vs. SF

0

–10

–20

–30

–40

–50

–60

–70

–80

–90

–100

–110

The ADuC816 offers “internal” or “system” calibration facilities.

For full calibration to occur on the selected ADC, the calibration

logic must record the modulator output for two different input

conditions. These are “zero-scale” and “full-scale” points. These

points are derived by performing a conversion on the different

input voltages provided to the input of the modulator during

calibration. The result of the “zero-scale” calibration conversion

is stored in the Offset Calibration Registers for the appropri-

ate ADC. The result of the “full-scale” calibration conversion

is stored in the Gain Calibration Registers for the appropriate

ADC. With these readings, the calibration logic can calculate

the offset and the gain slope for the input-to-output transfer

function of the converter.

–120

10 30 50 70 90 110 130 150 170 190 210 230 250

SF – Decimal

Figure 24. 60 Hz Normal Mode Rejection vs. SF

During an “internal” zero-scale or full-scale calibration, the

respective “zero” input and “full-scale” input are automatically

connected to the ADC input pins internally to the device. A

“system” calibration, however, expects the system zero-scale and

system full-scale voltages to be applied to the external ADC pins

before the calibration mode is initiated. In this way external ADC

errors are taken into account and minimized as a result of system

calibration. It should also be noted that to optimize calibration

accuracy, all ADuC816 ADC calibrations are carried out auto-

matically at the slowest update rate.

ADC Chopping

Both ADCs on the ADuC816 implement a chopping scheme

whereby the ADC repeatability reverses its inputs. The deci-

mated digital output words from the Sinc³filters therefore have a

positive offset and negative offset term included.

As a result, a final summing stage is included in each ADC so that

each output word from the filter is summed and averaged with the

previous filter output to produce a new valid output result to be

written to the ADC data SFRs. In this way, while the ADC

throughput or update rate is as discussed earlier and illustrated

in Table VII, the full settling time through the ADC (or the time

Internally in the ADuC816, the coefficients are normalized before

being used to scale the words coming out of the digital filter. The

offset calibration coefficient is subtracted from the result prior to

the multiplication by the gain coefficient. All ADuC816 ADC

specifications will only apply after a zero-scale and full-scale

calibration at the operating point (supply voltage/temperature)

of interest.

to a first conversion result), will actually be given by 2 × t_ADC

.

The chopping scheme incorporated in the ADuC816 ADC results

in excellent dc offset and offset drift specifications and is

extremely beneficial in applications where drift, noise rejection,

and optimum EMI rejection are important factors.

From an operational point of view, a calibration should be treated

like another ADC conversion. A zero-scale calibration (if required)

should always be carried out before a full-scale calibration. System

software should monitor the relevant ADC RDY0/1 bit in the

ADCSTAT SFR to determine end of calibration via a polling

sequence or interrupt driven routine.

REV. A

REV. 0

–36–

ADuC816

NONVOLATILE FLASH/EE MEMORY

Flash/EE Memory Overview

The ADuC816 incorporates Flash/EE memory technology on-chip

to provide the user with nonvolatile, in-circuit reprogrammable,

code and data memory space.

ADuC816 Flash/EE Memory Reliability

The Flash/EE Program and Data Memory arrays on the ADuC816

are fully qualified for two key Flash/EE memory characteristics,

namely Flash/EE Memory Cycling Endurance and Flash/EE

Memory Data Retention.

Flash/EE memory is a relatively recent type of nonvolatile memory

technology and is based on a single transistor cell architecture.

Endurance quantifies the ability of the Flash/EE memory to be

cycled through many Program, Read, and Erase cycles. In real

terms, a single endurance cycle is composed of four independent,

sequential events. These events are defined as:

This technology is basically an outgrowth of EPROM technology

and was developed through the late 1980s. Flash/EE memory takes

the flexible in-circuit reprogrammable features of EEPROM and

combines them with the space efficient/density features of EPROM

(see Figure 25).

a. initial page erase sequence

b. read/verify sequence

c. byte program sequence

d. second read/verify sequence

A single Flash/EE

Memory

Endurance Cycle

Because Flash/EE technology is based on a single transistor cell

architecture, a Flash memory array, like EPROM, can be imple-

mented to achieve the space efficiencies or memory densities

required by a given design.

In reliability qualification, every byte in both the program and

data Flash/EE memory is cycled from 00 hex to FFhex until a

first fail is recorded signifying the endurance limit of the on-chip

Flash/EE memory.

Like EEPROM, Flash memory can be programmed in-system at

a byte level, although it must first be erased; the erase being per-

formed in page blocks. Thus, Flash memory is often and more

correctly referred to as Flash/EE memory.

As indicated in the specification pages of this data sheet, the

ADuC816 Flash/EE Memory Endurance qualification has been

carried out in accordance with JEDEC Specification A117 over

the industrial temperature range of –40°C, +25°C, and +85°C.

The results allow the specification of a minimum endurance figure

over supply and temperature of 100,000 cycles, with an endurance

figure of 700,000 cycles being typical of operation at 25°C.

EPROM

TECHNOLOGY

EEPROM

TECHNOLOGY

SPACE EFFICIENT/

DENSITY

IN-CIRCUIT

REPROGRAMMABLE

Retention quantifies the ability of the Flash/EE memory to retain

its programmed data over time. Again, the ADuC816 has been

qualified in accordance with the formal JEDEC Retention Life-

time Specification (A117) at a specific junction temperature

(T_J= 55°C). As part of this qualification procedure, the Flash/EE

memory is cycled to its specified endurance limit described above,

before data retention is characterized. This means that the Flash/

EE memory is guaranteed to retain its data for its full specified

retention lifetime every time the Flash/EE memory is repro-

grammed. It should also be noted that retention lifetime, based

on an activation energy of 0.6 eV, will derate with T_Jas shown

in Figure 26.

FLASH/EE MEMORY

TECHNOLOGY

Figure 25. Flash/EE Memory Development

Overall, Flash/EE memory represents a step closer to the ideal

memory device that includes nonvolatility, in-circuit program-

mability, high density and low cost. Incorporated in the ADuC816,

Flash/EE memory technology allows the user to update program

code space in-circuit, without the need to replace one-time

programmable (OTP) devices at remote operating nodes.

Flash/EE Memory and the ADuC816

300

The ADuC816 provides two arrays of Flash/EE memory for user

applications. 8K bytes of Flash/EE Program space are provided

on-chip to facilitate code execution without any external discrete

ROM device requirements. The program memory can be pro-

grammed using conventional third party memory programmers.

This array can also be programmed in-circuit, using the serial

download mode provided.

250

200

ADI SPECIFICATION

100 YEARS MIN.

AT T_J= 55ꢅC

150

100

50

A 640-Byte Flash/EE Data Memory space is also provided on-chip.

This may be used as a general-purpose nonvolatile scratchpad

area. User access to this area is via a group of six SFRs. This space

can be programmed at a byte level, although it must first be erased

in 4-byte pages.

0

40

50

60

70

80

90

100

110

T

JUNCTION TEMPERATURE – ꢅC

J

Figure 26. Flash/EE Memory Data Retention

RREEVV.. A0

–37–

ADuC816

Using the Flash/EE Program Memory

5V

The 8 Kbyte Flash/EE Program Memory array is mapped

into the lower 8 Kbytes of the 64 Kbytes program space

addressable by the ADuC816, and is used to hold user code

in typical applications.

PROGRAM

DATA

V

DD

P0

P1

GND

(D0–D7)

ADuC816

PROGRAM MODE

(SEE TABLE XII)

PROGRAM

ADDRESS

(A0–A13)

(P2.0 = A0)

(P1.7 = A13)

P3

COMMAND

ENABLE

The program memory Flash/EE memory arrays can be pro-

grammed in one of two modes, namely:

P3.0

P2

NEGATIVE

EDGE

P3.6

Serial Downloading (In-Circuit Programming)

WRITE ENABLE

STROBE

ALE

ENTRY

SEQUENCE

As part of its factory boot code, the ADuC816 facilitates

serial code download via the standard UART serial port.

Serial download mode is automatically entered on power-up if

the external pin, PSEN, is pulled low through an external

resistor as shown in Figure 27. Once in this mode, the user can

download code to the program memory array while the device is

sited in its target application hardware. A PC serial download

executable is provided as part of the ADuC816 QuickStart devel-

opment system. The Serial Download protocol is detailed in a

MicroConverter Applications Note uC004 available from the ADI

MicroConverter Website at www.analog.com/microconverter.

PSEN

GND

RESET

V

DD

Figure 28. Flash/EE Memory Parallel Programming

Table XII. Flash/EE Memory Parallel Programming Modes

Port 3 Pins

Programming

0.7 0.6 0.5 0.4 0.3 0.2 0.1 Mode

X

0

1

Erase Flash/EE

Program, Data, and

Security Modes

Read Device

Signature/ID

X

1

0

1

0

X

0

1

0

1

0

Program Code Byte

Program Data Byte

Read Code Byte

Read Data Byte

Program Security

Modes

X

1

0

1

Read/Verify Security

Modes

All Other Codes

Flash/EE Program Memory Security

Redundant

The ADuC816 facilitates three modes of Flash/EE program

memory security. These modes can be independently activated,

restricting access to the internal code space. These security

modes can be enabled as part of the user interface available on all

ADuC816 serial or parallel programming tools referenced on the

MicroConverter web page at www.analog.com/microconverter.

The security modes available on the ADuC816 are described

as follows:

PULL PSEN LOW DURING RESET

TO CONFIGURE THE ADuC816

FOR SERIAL DOWNLOAD MODE

ADuC816

PSEN

1kꢆ

Lock Mode

Figure 27. Flash/EE Memory Serial Download Mode

Programming

This mode locks code in memory, disabling parallel program-

ming of the program memory although reading the memory in

parallel mode is still allowed. This mode is deactivated by initi-

ating a “code-erase” command in serial download or parallel

programming modes.

Parallel Programming

The parallel programming mode is fully compatible with conven-

tional third party Flash or EEPROM device programmers. A

block diagram of the external pin configuration required to support

parallel programming is shown in Figure 28. In this mode, Ports 0,

1, and 2 operate as the external data and address bus interface,

ALE operates as the Write Enable strobe, and Port 3 is used as a

general configuration port that configures the device for various

program and erase operations during parallel programming.

Secure Mode

This mode locks code in memory, disabling parallel programming

(program and verify/read commands) as well as disabling the

execution of a “MOVC” instruction from external memory,

which is attempting to read the op codes from internal memory.

This mode is deactivated by initiating a “code-erase” command

in serial download or parallel programming modes.

The high voltage (12 V) supply required for Flash/EE program-

ming is generated using on-chip charge pumps to supply the high

voltage program lines.

REV. A

REV. 0

–38–

ADuC816

Serial Safe Mode

FUNCTION:

This mode disables serial download capability on the device. If

Serial Safe mode is activated and an attempt is made to reset

the part into serial download mode, i.e., RESET asserted and

deasserted with PSEN low, the part will interpret the serial

download reset as a normal reset only. It will, therefore, not

enter serial download mode but only execute a normal reset

sequence. Serial Safe mode can only be disabled by initiating a

code-erase command in parallel programming mode.

HOLDS THE 8-BIT PAGE

ADDRESS POINTER

HOLDS THE 4-BYTE

PAGE DATA

9FH

BYTE 1 BYTE 2 BYTE 3 BYTE 4

EADRL

EDATA1 (BYTE 1)

EDATA2 (BYTE 2)

EDATA3 (BYTE 3)

EDATA4 (BYTE 4)

Using the Flash/EE Data Memory

The user Flash/EE data memory array consists of 640 bytes that

are configured into 160 (00H to 9FH) 4-byte pages as shown in

Figure 29.

00H

BYTE 1 BYTE 2 BYTE 3 BYTE 4

ECON COMMAND

INTERPRETER LOGIC

9FH BYTE 1

BYTE 2

BYTE 3

BYTE 4

FUNCTION:

INTERPRETS THE FLASH

COMMAND WORD

FUNCTION:

RECEIVES COMMAND DATA

ECON

Figure 30. Flash/EE Data Memory Control and Configuration

ECON—Flash/EE Memory Control SFR

This SFR acts as a command interpreter and may be written with

one of five command modes to enable various read, program and

erase cycles as detailed in Table XIII:

00H BYTE 1

BYTE 2

BYTE 3

BYTE 4

Figure 29. Flash/EE Data Memory Configuration

Table XIII. ECON–Flash/EE Memory Control Register

Command Modes

As with other ADuC816 user-peripheral circuits, the interface to

this memory space is via a group of registers mapped in the SFR

space. A group of four data registers (EDATA1–4) are used to

hold 4-byte page data just accessed. EADRL is used to hold the

8-bit address of the page to be accessed. Finally, ECON is an 8-

bit control register that may be written with one of five Flash/EE

memory access commands to trigger various read, write, erase, and

verify functions. These registers can be summarized as follows:

Command

Byte

Command Mode

01H

READ COMMAND.

Results in four bytes being read into EDATA1–4

from memory page address contained in EADRL.

PROGRAM COMMAND.

02H

ECON:

SFR Address: B9H

Results in four bytes (EDATA1–4) being written

to memory page address in EADRL. This write

command assumes the designated “write” page has

been pre-erased.

RESERVED FOR INTERNAL USE.

03H should not be written to the ECON SFR.

VERIFY COMMAND.

Function:

Controls access to 640 Bytes

Flash/EE Data Space.

00H

Default:

EADRL:

SFR Address: C6H

03H

04H

Function:

Holds the Flash/EE Data Page

Address. (640 Bytes => 160 Page

Addresses.)

00H

Allows the user to verify if data in EDATA1–4 is

contained in page address designated by EADRL.

A subsequent read of the ECON SFR will result

in a “zero” being read if the verification is valid,

a nonzero value will be read to indicate an invalid

verification.

ERASE COMMAND.

Results in an erase of the 4-byte page designated

in EADRL.

Default:

EDATA 1–4:

SFR Address: BCH to BFH respectively

Function:

Holds Flash/EE Data memory

page write or page read data bytes.

EDATA1–2 –> 00H

05H

06H

Default :

EDATA3–4 –> 00H

A block diagram of the SFR interface to the Flash/EE Data

Memory array is shown in Figure 30.

ERASE-ALL COMMAND.

Results in erase of the full Flash/EE Data memory

160-page (640 bytes) array.

07H to FFH RESERVED COMMANDS.

Commands reserved for future use.

REV. A

REV. 0

–39–

ADuC816

Flash/EE Memory Timing

Erase-All

The typical program/erase times for the Flash/EE Data

Memory are:

Although the 640-byte User Flash/EE array is shipped from the

factory pre-erased, i.e., Byte locations set to FFH, it is nonethe-

less good programming practice to include an erase-all routine as

part of any configuration/setup code running on the ADuC816.

An “ERASE-ALL” command consists of writing “06H” to the

ECON SFR, which initiates an erase of all 640 byte locations in

the Flash/EE array. This command coded in 8051 assembly would

appear as:

Erase Full Array (640 Bytes) – 2 ms

Erase Single Page (4 Bytes) – 2 ms

Program Page (4 Bytes) – 250 μs

Read Page (4 Bytes) – Within Single Instruction Cycle

Using the Flash/EE Memory Interface

As with all Flash/EE memory architectures, the array can be pro-

grammed in-system at a byte level, although it must be erased

first; the erasure being performed in page blocks (4-byte pages

in this case).

MOV ECON, #06H

; Erase all Command

; 2ms Duration

Program a Byte

In general terms, a byte in the Flash/EE array can only be pro-

grammed if it has previously been erased. To be more specific, a

byte can only be programmed if it already holds the value FFH.

Because of the Flash/EE architecture, this erasure must happen

at a page level; therefore, a minimum of four bytes (1 page) will

be erased when an erase command is initiated.

A typical access to the Flash/EE Data array will involve setting

up the page address to be accessed in the EADRL SFR, config-

uring the EDATA1–4 with data to be programmed to the array

(the EDATA SFRs will not be written for read accesses) and

finally, writing the ECON command word which initiates one

of the six modes shown in Table XIII.

A more specific example of the Program-Byte process is shown

below. In this example the user writes F3H into the second

byte on Page 03H of the Flash/EE Data Memory space while

preserving the other three bytes already in this page. As the user

is only required to modify one of the page bytes, the full page must

be first read so that this page can then be erased without the exist-

ing data being lost.

It should be noted that a given mode of operation is initiated as

soon as the command word is written to the ECON SFR. The

core microcontroller operation on the ADuC816 is idled until the

requested Program/Read or Erase mode is completed.

In practice, this means that even though the Flash/EE memory

mode of operation is typically initiated with a two-machine cycle

MOV instruction (to write to the ECON SFR), the next instruc-

tion will not be executed until the Flash/EE operation is complete

(250 μs or 2 ms later). This means that the core will not respond

to Interrupt requests until the Flash/EE operation is complete,

although the core peripheral functions like Counter/Timers will

continue to count and time as configured throughout this period.

This example, coded in 8051 assembly, would appear as:

MOV EADRL,#03H

MOV ECON,#01H

; Set Page Address Pointer

; Read Page

MOV EDATA2,#0F3H ; Write New Byte

MOV ECON,#05H

MOV ECON,#02H

; Erase Page

; Write Page (Program Flash/EE)

–40–

REV. A

REV. 0

ADuC816

USER INTERFACE TO OTHER ON-CHIP ADuC816

PERIPHERALS

The following section gives a brief overview of the various

peripherals also available on-chip. A summary of the SFRs used

to control and configure these peripherals is also given.

driving 10 kΩ/100 pF. It has two selectable ranges, 0 V to V_REF

(the internal bandgap 2.5 V reference) and 0 V to AV_DD. It can

operate in 12-bit or 8-bit mode. The DAC has a control regis-

ter, DACCON, and two data registers, DACH/L. The DAC

output can be programmed to appear at Pin 3 or Pin 12. It

should be noted that in 12-bit mode, the DAC voltage output

will be updated as soon as the DACL data SFR has been writ-

ten; therefore, the DAC data registers should be updated as

DACH first followed by DACL.5

DAC

The ADuC816 incorporates a 12-bit, voltage output DAC

on-chip. It has a rail-to-rail voltage output buffer capable of

DACCON

DAC Control Register

SFR Address

Power-On Default Value

Bit Addressable

FDH

00H

No

---

DACPIN

DAC8

DACRN

DACEN

DACCLR

Table XIV. DACCON SFR Bit Designations

Bit

Name

Description

7

6

5

4

---

DACPIN

Reserved for Future Use.

DAC Output Pin Select.

Set by the user to direct the DAC output to Pin 12 (P1.7/AIN4/DAC).

Cleared by user to direct the DAC output to Pin 3 (P1.2/DAC/IEXC1).

DAC 8-bit Mode Bit.

3

DAC8

Set by user to enable 8-bit DAC operation. In this mode the 8-bits in DACL SFR are routed to

the 8 MSBs of the DAC and the 4 LSBs of the DAC are set to zero.

Cleared by user to operate the DAC in its normal 12-bit mode of operation.

DAC Output Range Bit.

2

1

0

DACRN

DACCLR

DACEN

Set by user to configure DAC range of 0 – AV_DD

.

Cleared by user to configure DAC range of 0 – 2.5 V.

DAC Clear Bit.

Set to “1” by user to enable normal DAC operation.

Cleared to “0” by user to reset DAC data registers DACl/H to zero.

DAC Enable Bit.

Set to “1” by user to enable normal DAC operation.

Cleared to “0” by user to power-down the DAC.

DACH/L

DAC Data Registers

Function

SFR Address

DAC Data Registers, written by user to update the DAC output.

DACL (DAC Data Low Byte) –>FBH

DACH (DAC Data High Byte) –>FCH

Power-On Default Value

Bit Addressable

00H

No

–>Both Registers

The 12-bit DAC data should be written into DACH/L right-justified such that DACL contains the lower eight bits, and the lower

nibble of DACH contains the upper four bits.

REV. A

REV. 0

–41–

ADuC816

On-Chip PLL

required. The default core clock is the PLL clock divided by

8 or 1.572864 MHz. The ADC clocks are also derived from the

PLL clock, with the modulator rate being the same as the crystal

oscillator frequency. The above choice of frequencies ensures

that the modulators and the core will be synchronous, regardless

of the core clock rate. The PLL control register is PLLCON.

The ADuC816 is intended for use with a 32.768 kHz watch crys-

tal. A PLL locks onto a multiple (384) of this to provide a stable

12.582912 MHz clock for the system. The core can operate at

this frequency or at binary submultiples of it to allow power

saving in cases where maximum core performance is not

PLLCON

PLL Control Register

SFR Address

Power-On Default Value

Bit Addressable

D7H

03H

No

OSC_PD

LOCK

---

FINT

CD2

CD1

CD0

LTEA

Table XV. PLLCON SFR Bit Designations

Bit

Name

Description

7

OSC_PD

Oscillator Power-Down Bit.

Set by user to halt the 32 kHz oscillator in power-down mode.

Cleared by user to enable the 32 kHz oscillator in power-down mode.

This feature allows the TIC to continue counting even in power-down mode.

PLL Lock Bit.

6

LOCK

This is a read only bit.

Set automatically at power-on to indicate the PLL loop is correctly tracking the crystal clock. If the

external crystal becomes subsequently disconnected the PLL will rail and the core will halt.

Cleared automatically at power-on to indicate the PLL is not correctly tracking the crystal clock.

This may be due to the absence of a crystal clock or an external crystal at power-on. In this mode,

the PLL output can be 12.58 MHz 20%.

5

4

3

---

LTEA

FINT

Reserved for future use; should be written with “0.”

Reading this bit returns the state of the external EA pin latched at reset or power-on.

Fast Interrupt Response Bit.

Set by user enabling the response to any interrupt to be executed at the fastest core clock frequency,

regardless of the configuration of the CD2–0 bits (see below). Once user code has returned from an

interrupt, the core resumes code execution at the core clock selected by the CD2–0 bits.

Cleared by user to disable the fast interrupt response feature.

CPU (Core Clock) Divider Bits.

This number determines the frequency at which the microcontroller core will operate.

2

1

0

CD2

CD1

CD0

CD2

CD1

CD0

Core Clock Frequency (MHz)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

12.582912

6.291456

3.145728

1.572864 (Default Core Clock Frequency)

0.786432

0.393216

0.196608

0.098304

–42–

REV. 0

REV. A

ADuC816

Time Interval Counter (TIC)

overflow will clock the interval counter. When this counter is equal

to the time interval value loaded in the INTVAL SFR, the TII

bit (TIMECON.2) is set and generates an interrupt if enabled

(See IEIP2 SFR description under Interrupt System later in this

data sheet.) If the ADuC816 is in power-down mode, again

with TIC interrupt enabled, the TII bit will wake up the device

and resume code execution by vectoring directly to the TIC

interrupt service vector address at 0053 hex. The TIC-related

SFRs are described in Table XVI. Note also that the timebase

SFRs can be written initially with the current time, the TIC can

then be controlled and accessed by user software. In effect, this

facilitates the implementation of a real-time clock. A block

diagram of the TIC is shown in Figure 31.

A time interval counter is provided on-chip for counting longer

intervals than the standard 8051-compatible timers are capable

of. The TIC is capable of timeout intervals ranging from 1/128th

second to 255 hours. Furthermore, this counter is clocked by

the crystal oscillator rather than the PLL and thus has the

ability to remain active in power-down mode and time long

power-down intervals. This has obvious applications for remote

battery-powered sensors where regular widely spaced readings

are required.

Six SFRs are associated with the time interval counter, TIMECON

being its control register. Depending on the configuration of the

IT0 and IT1 bits in TIMECON, the selected time counter register

TCEN

32.768kHz EXTERNAL CRYSTAL

ITS0, 1

8-BIT

PRESCALER

HUNDREDTHS COUNTER

HTHSEC

INTERVAL

TIEN

TIMEBASE

SELECTION

MUX

SECOND COUNTER

SEC

MINUTE COUNTER

MIN

HOUR COUNTER

HOUR

8-BIT

INTERVAL COUNTER

INTERVAL TIMEOUT

TIME INTERVAL COUNTER

INTERRUPT

COMPARE

COUNT = INTVAL?

TIME INTERVAL

INTVAL

Figure 31. TIC, Simplified Block Diagram

RREEVV.. A0

–43–

ADuC816

TIMECON

TIC CONTROL REGISTER

SFR Address

Power-On Default Value

Bit Addressable

A1H

00H

No

---

ITS1

ITS0

STI

TII

TIEN

TCEN

Table XVI. TIMECON SFR Bit Designations

Description

Reserved for Future Use.

Reserved for Future Use. For future product code compatibility this bit should be written as a ‘1.’

Interval Timebase Selection Bits.

Bit

Name

7

6

5

4

---

ITS1

ITS0

Written by user to determine the interval counter update rate.

ITS1

ITS0

Interval Timebase

1/128 Second

Seconds

Minutes

Hours

0

1

0

1

0

1

3

STI

Single Time Interval Bit.

Set by user to generate a single interval timeout. If set, a timeout will clear the TIEN bit.

Cleared by user to allow the interval counter to be automatically reloaded and start counting again at

each interval timeout.

2

1

0

TII

TIC Interrupt Bit.

Set when the 8-bit Interval Counter matches the value in the INTVAL SFR.

Cleared by user software.

Time Interval Enable Bit.

Set by user to enable the 8-bit time interval counter.

Cleared by user to disable and clear the contents of the interval counter.

TIEN

TCEN

Time Clock Enable Bit.

Set by user to enable the time clock to the time interval counters.

Cleared by user to disable the clock to the time interval counters and clear the time interval SFRs.

The time registers (HTHSEC, SEC, MIN and HOUR) can be written while TCEN is low.

REV. A

REV. 0

–44–

ADuC816

INTVAL

User Time Interval Select Register

Function

User code writes the required time interval to this register. When the 8-bit interval counter is equal

to the time interval value loaded in the INTVAL SFR, the TII bit (TIMECON.2) bit is set and

generates an interrupt if enabled. (See IEIP2 SFR description under Interrupt System later in this

data sheet.)

A6H

00H

SFR Address

Power-On Default Value

Bit Addressable

Valid Value

No

0 to 255 decimal

HTHSEC

Hundredths Seconds Time Register

Function

This register is incremented in (1/128) second intervals once TCEN in TIMECON is active. The

HTHSEC SFR counts from 0 to 127 before rolling over to increment the SEC time register.

A2H

SFR Address

Power-On Default Value

Bit Addressable

Valid Value

00H

No

0 to 127 decimal

SEC

Seconds Time Register

Function

This register is incremented in 1-second intervals once TCEN in TIMECON is active. The SEC

SFR counts from 0 to 59 before rolling over to increment the MIN time register.

SFR Address

A3H

Power-On Default Value

Bit Addressable

Valid Value

00H

No

0 to 59 decimal

MIN

Minutes Time Register

Function

This register is incremented in 1-minute intervals once TCEN in TIMECON is active. The MIN

counts from 0 to 59 before rolling over to increment the HOUR time register.

SFR Address

A4H

00H

No

Power-On Default Value

Bit Addressable

Valid Value

0 to 59 decimal

HOUR

Hours Time Register

Function

This register is incremented in 1-hour intervals once TCEN in TIMECON is active. The HOUR

SFR counts from 0 to 23 before rolling over to 0.

A5H

SFR Address

Power-On Default Value

Bit Addressable

Valid Value

00H

No

0 to 23 decimal

REV. 0

REV. A

–45–

ADuC816

(see PRE3–0 bits in WDCON). The watchdog timer itself is a

16-bit counter that is clocked at 32.768 kHz. The watchdog

time-out interval can be adjusted via the PRE3–0 bits in WDCON.

Full Control and Status of the watchdog timer function can be

controlled via the watchdog timer control SFR (WDCON). The

WDCON SFR can only be written by user software if the double

write sequence described in WDWR below is initiated on every

write access to the WDCON SFR.

Watchdog Timer

The purpose of the watchdog timer is to generate a device reset or

interrupt within a reasonable amount of time if the ADuC816

enters an erroneous state, possibly due to a programming error,

electrical noise, or RFI. The Watchdog function can be disabled by

clearing the WDE (Watchdog Enable) bit in the Watchdog Control

(WDCON) SFR. When enabled; the watchdog circuit will generate

a system reset or interrupt (WDS) if the user program fails to set

the watchdog (WDE) bit within a predetermined amount of time

WDCON

Watchdog Timer Control Register

SFR Address

Power-On Default Value

Bit Addressable

C0H

10H

Yes

PRE3

PRE2

PRE1

PRE0

WDIR

WDS

WDE

WDWR

Table XVII. WDCON SFR Bit Designations

Bit

Name

Description

7

6

5

4

PRE3

PRE2

PRE1

PRE0

Watchdog Timer Prescale Bits.

The Watchdog timeout period is given by the equation: t_WD= (2^PRE× (2⁹/f_PLL))

(0 ≤ PRE ≤ 7; f_PLL= 32.768 kHz)

PRE3

PRE2

PRE1

PRE0Timout Period (ms) Action

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

15.6

31.2

62.5

125

250

500

1000

2000

0.0

Reset or Interrupt

Immediate Reset

Reserved

PRE3–0 > 1001

3

WDIR

Watchdog Interrupt Response Enable Bit.

If this bit is set by the user, the watchdog will generate an interrupt response instead of a system

reset when the watchdog timeout period has expired. This interrupt is not disabled by the CLR

EA instruction and it is also a fixed, high-priority interrupt. If the watchdog is not being used to

monitor the system, it can alternatively be used as a timer. The prescaler is used to set the timeout

period in which an interrupt will be generated. (See also Note 1, Table XXXIV in the Interrupt

System section.)

2

1

WDS

WDE

Watchdog Status Bit.

Set by the Watchdog Controller to indicate that a watchdog timeout has occurred.

Cleared by writing a “0” or by an external hardware reset. It is not cleared by a watchdog reset.

Watchdog Enable Bit.

Set by user to enable the watchdog and clear its counters. If this bit is not set by the user within

the watchdog timeout period, the watchdog will generate a reset or interrupt, depending on WDIR.

Cleared under the following conditions, User writes “0,” Watchdog Reset (WDIR = “0”);

Hardware Reset; PSM Interrupt.

0

WDWR

Watchdog Write Enable Bit.

To write data into the WDCON SFR involves a double instruction sequence. The WDWR bit must

be set and the very next instruction must be a write instruction to the WDCON SFR.

e.g.,

CLR

EA

;

disable interrupts while writing

to WDT

SETB

MOV

SET B

WDWR

WDCON, #72h

EA

;

allow write to WDCON

enable WDT for 2.0s timeout

enable interrupts again (if rqd)

–46–

REV. 0

REV. A

ADuC816

PSMCON SFR. This bit will not be cleared until the failing

power supply has returned above the trip point for at least

250 ms. This monitor function allows the user to save working

registers to avoid possible data loss due to the low supply condi-

tion, and also ensures that normal code execution will not

resume until a safe supply level has been well established. The

supply monitor is also protected against spurious glitches trig-

gering the interrupt circuit.

Power Supply Monitor

As its name suggests, the Power Supply Monitor, once enabled,

monitors both supplies (AVDD or DVDD) on the ADuC816. It

will indicate when any of the supply pins drop below one of

four user-selectable voltage trip points from 2.63 V to 4.63 V.

For correct operation of the Power Supply Monitor function,

AV_DDmust be equal to or greater than 2.7 V. Monitor function

is controlled via the PSMCON SFR. If enabled via the IEIP2

SFR, the monitor will interrupt the core using the PSMI bit in the

PSMCON

Power Supply Monitor Control Register

SFR Address

Power-On Default Value

Bit Addressable

DFH

DEH

No

CMPD

CMPA

PSMI

TPD1

TPD0

TPA1

TPA0

PSMEN

Table XVIII. PSMCON SFR Bit Designations

Bit

Name

Description

7

CMPD

DVDD Comparator Bit.

This is a read-only bit and directly reflects the state of the DVDD comparator.

Read “1” indicates the DVDD supply is above its selected trip point.

Read “0” indicates the DVDD supply is below its selected trip point.

AVDD Comparator Bit.

This is a read-only bit and directly reflects the state of the AVDD comparator.

Read “1” indicates the AVDD supply is above its selected trip point.

Read “0” indicates the AVDD supply is below its selected trip point.

Power Supply Monitor Interrupt Bit.

6

5

CMPA

PSMI

This bit will be set high by the MicroConverter if either CMPA or CMPD are low, indicating

low analog or digital supply. The PSMI bit can be used to interrupt the processor. Once CMPD

and/or CMPA return (and remain) high, a 250 ms counter is started. When this counter times

out, the PSMI interrupt is cleared. PSMI can also be written by the user. However, if either com-

parator output is low, it is not possible for the user to clear PSMI.

4

3

TPD1

TPD0

DVDD Trip Point Selection Bits.

These bits select the DVDD trip-point voltage as follows:

TPD1

TPD0

Selected DVDD Trip Point (V)

0

1

0

1

0

1

4.63

3.08

2.93

2.63

2

1

TPA1

TPA0

AVDD Trip Point Selection Bits.

These bits select the AVDD trip-point voltage as follows:

TPA1

TPA0

Selected AVDD Trip Point (V)

0

1

0

1

0

1

4.63

3.08

2.93

2.63

0

PSMEN

Power Supply Monitor Enable Bit.

Set to “1” by the user to enable the Power Supply Monitor Circuit.

Cleared to “0” by the user to disable the Power Supply Monitor Circuit.

REV. A

REV. 0

–47–

ADuC816

SERIAL PERIPHERAL INTERFACE

each SCLOCK period. Therefore, a byte is transmitted/received

after eight SCLOCK periods. The SCLOCK pin is configured

as an output in master mode and as an input in slave mode. In

master mode the bit-rate, polarity and phase of the clock are

controlled by the CPOL, CPHA, SPR0 and SPR1 bits in the

SPICON SFR (see Table XIX below). In slave mode the

SPICON register will have to be configured with the phase and

polarity (CPHA and CPOL) of the expected input clock. In

both master and slave mode the data is transmitted on one edge

of the SCLOCK signal and sampled on the other. It is important

therefore that the CPHA and CPOL are configured the same for the

master and slave devices.

The ADuC816 integrates a complete hardware Serial Peripheral

Interface (SPI) interface on-chip. SPI is an industry standard syn-

chronous serial interface that allows eight bits of data to be

synchronously transmitted and received simultaneously, i.e., full

duplex. It should be noted that the SPI physical interface is shared

with the I²C interface and therefore the user can only enable one

or the other interface at any given time (see SPE in SPICON

below). The system can be configured for Master or Slave opera-

tion and typically consists of four pins, namely:

MISO (Master In, Slave Out Data I/O Pin), Pin 14

The MISO (master in slave out) pin is configured as an input line

in master mode and an output line in slave mode. The MISO

line on the master (data in) should be connected to the MISO

line in the slave device (data out). The data is transferred as

byte wide (8-bit) serial data, MSB first.

SS (Slave Select Input Pin), Pin 13

The Slave Select (SS) input pin is only used when the ADuC816

is configured in slave mode to enable the SPI peripheral. This line

is active low. Data is only received or transmitted in slave mode

when the SS pin is low, allowing the ADuC816 to be used in single

master, multislave SPI configurations. If CPHA = 1 then the SS

input may be permanently pulled low. With CPHA = 0 then the

SS input must be driven low before the first bit in a byte wide

transmission or reception and return high again after the last bit

in that byte wide transmission or reception. In SPI Slave Mode,

the logic level on the external SS pin (Pin 13), can be read via

the SPR0 bit in the SPICON SFR.

MOSI (Master Out, Slave In Pin), Pin 27

The MOSI (master out slave in) pin is configured as an output line

in master mode and an input line in slave mode. The MOSI

line on the master (data out) should be connected to the MOSI

line in the slave device (data in). The data is transferred as byte

wide (8-bit) serial data, MSB first.

SCLOCK (Serial Clock I/O Pin), Pin 26

The master clock (SCLOCK) is used to synchronize the data

being transmitted and received through the MOSI and MISO

data lines. A single data bit is transmitted and received in

The following SFR registers are used to control the SPI interface.

SPICON:

SPI Control Register

SFR Address

Power-On Default Value

Bit Addressable

F8H

04H

Yes

ISPI

WCOL

SPE

SPIM

CPOL

CPHA

SPR1

SPR0

Table XIX. SPICON SFR Bit Designations

Bit

Name

Description

7

ISPI

SPI Interrupt Bit.

Set by MicroConverter at the end of each SPI transfer.

Cleared directly by user code or indirectly by reading the SPIDAT SFR

Write Collision Error Bit.

Set by MicroConverter if SPIDAT is written to while an SPI transfer is in progress.

Cleared by user code.

SPI Interface Enable Bit.

6

5

4

3

2

WCOL

SPE

Set by user to enable the SPI interface.

Cleared by user to enable the I²C interface.

SPI Master/Slave Mode Select Bit.

SPIM

CPOL

CPHA

Set by user to enable Master Mode operation (SCLOCK is an output).

Cleared by user to enable Slave Mode operation (SCLOCK is an input).

Clock Polarity Select Bit.

Set by user if SCLOCK idles high.

Cleared by user if SCLOCK idles low.

Clock Phase Select Bit.

Set by user if leading SCLOCK edge is to transmit data.

Cleared by user if trailing SCLOCK edge is to transmit data.

–48–

REV. 0

REV. A

ADuC816

Table XIX. SPICON SFR Bit Designations (continued)

Bit

Name

Description

1

0

SPR1

SPR0

SPI Bit-Rate Select Bits.

These bits select the SCLOCK rate (bit-rate) in Master Mode as follows:

SPR1

SPR0

Selected Bit Rate

0

1

0

1

0

1

f

_CORE/2

_CORE/4

_CORE/8

_CORE/16

In SPI Slave Mode, i.e., SPIM = 0, the logic level on the external SS pin (Pin 13), can be read

via the SPR0 bit.

NOTE

The CPOL and CPHA bits should both contain the same values for master and slave devices.

SPIDAT

SPI Data Register

Function

The SPIDAT SFR is written by the user to transmit data over the SPI interface or read by user

code to read data just received by the SPI interface.

SFR Address

Power-On Default Value

Bit Addressable

F7H

00H

No

Using the SPI Interface

SPI Interface—Master Mode

Depending on the configuration of the bits in the SPICON SFR

shown in Table XIX, the ADuC816 SPI interface will transmit

or receive data in a number of possible modes. Figure 32 shows

all possible ADuC816 SPI configurations and the timing rela-

tionships and synchronization between the signals involved.

Also shown in this figure is the SPI interrupt bit (ISPI) and how

it is triggered at the end of each byte-wide communication.

In master mode, the SCLOCK pin is always an output and gener-

ates a burst of eight clocks whenever user code writes to the

SPIDAT register. The SCLOCK bit rate is determined by

SPR0 and SPR1 in SPICON. It should also be noted that the

SS pin is not used in master mode. If the ADuC816 needs to

assert the SS pin on an external slave device, a Port digital output

pin should be used.

In master mode a byte transmission or reception is initiated

by a write to SPIDAT. Eight clock periods are generated via the

SCLOCK pin and the SPIDAT byte being transmitted via MOSI.

With each SCLOCK period a data bit is also sampled via MISO.

After eight clocks, the transmitted byte will have been completely

transmitted and the input byte will be waiting in the input shift

register. The ISPI flag will be set automatically and an interrupt

will occur if enabled. The value in the shift register will be latched

into SPIDAT.

SCLOCK

(CPOL = 1)

SCLOCK

(CPOL = 0)

SS

SAMPLE INPUT

?

MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB

DATA OUTPUT

(CPHA = 1)

SPI Interface—Slave Mode

In slave mode the SCLOCK is an input. The SS pin must

also be driven low externally during the byte communication.

ISPI FLAG

SAMPLE INPUT

DATA OUTPUT

Transmission is also initiated by a write to SPIDAT. In slave

mode, a data bit is transmitted via MISO and a data bit is received

via MOSI through each input SCLOCK period. After eight clocks,

the transmitted byte will have been completely transmitted and the

input byte will be waiting in the input shift register. The ISPI flag

will be set automatically and an interrupt will occur if enabled.

The value in the shift register will be latched into SPIDAT only

when the transmission/reception of a byte has been completed.

The end of transmission occurs after the eighth clock has been

received, if CPHA = 1 or when SS returns high if CPHA = 0.

MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB

?

(CPHA = 0)

ISPI FLAG

Figure 32. SPI Timing, All Modes

REV. A

REV. 0

–49–

ADuC816

I²C-COMPATIBLE INTERFACE

SPICON previously). An Application Note describing the

operation of this interface as implemented is available from

the MicroConverter Website at www.analog.com/microconverter.

This interface can be configured as a Software Master or Hard-

ware Slave, and uses two pins in the interface.

The ADuC816 supports a 2-wire serial interface mode which is

I²C compatible. The I²C-compatible interface shares its pins

with the on-chip SPI interface and therefore the user can only

enable one or the other interface at any given time (see SPE in

SDATA (Pin 27)

SCLOCK (Pin 26)

Serial Data I/O Pin

Serial Clock

Three SFRs are used to control the I²C-compatible interface. These are described below:

I2CCON:

SFR Address

Power-On Default Value

Bit Addressable

I²C Control Register

E8H

00H

Yes

MDO

MDE

MCO

MDI

I2CM

I2CRS

I2CTX

I2CI

Table XX. I2CCON SFR Bit Designations

Bit

Name

Description

7

MDO

I²C Software Master Data Output Bit (MASTER MODE ONLY).

This data bit is used to implement a master I²C transmitter interface in software. Data written to this

bit will be output on the SDATA pin if the data output enable (MDE) bit is set.

I²C Software Master Data Output Enable Bit (MASTER MODE ONLY).

Set by user to enable the SDATA pin as an output (Tx).

6

5

4

3

2

1

0

MDE

MCO

MDI

Cleared by the user to enable SDATA pin as an input (Rx).

I²C Software Master Clock Output Bit (MASTER MODE ONLY).

This data bit is used to implement a master I²C transmitter interface in software. Data written to

this bit will be outputted on the SCLOCK pin.

I²C Software Master Data Input Bit (MASTER MODE ONLY).

This data bit is used to implement a master I²C receiver interface in software. Data on the SDATA

pin is latched into this bit on SCLOCK if the Data Output Enable (MDE) bit is ‘0.’

I²C Master/Slave Mode Bit.

I2CM

I2CRS

I2CTX

I2CI

Set by user to enable I²C software master mode.

Cleared by user to enable I²C hardware slave mode.

I²C Reset Bit (SLAVE MODE ONLY).

Set by user to reset the I²C interface.

Cleared by user code for normal I²C operation.

I²C Direction Transfer Bit (SLAVE MODE ONLY).

Set by the MicroConverter if the interface is transmitting.

Cleared by the MicroConverter if the interface is receiving.

I²C Interrupt Bit (SLAVE MODE ONLY).

Set by the MicroConverter after a byte has been transmitted or received.

Cleared automatically when user code reads the I2CDAT SFR (see I2CDAT below).

I2CADD

Function

I²C Address Register

Holds the I²C peripheral address for

the part. It may be overwritten by

user code. Technical Note uC001 at

www.analog.com/microconverter

describes the format of the I²C stan-

dard 7-bit address in detail.

9BH

I2CDAT

Function

I²C Data Register

The I2CDAT SFR is written by the

user to transmit data over the I²C

interface or read by user code to read

data just received by the I²C interface

Accessing I2CDAT automatically

clears any pending I²C interrupt and

the I2CI bit in the I2CCON SFR.

User software should only access

I2CDAT once per interrupt cycle.

9AH

SFR Address

Power-On Default Value

Bit Addressable

55H

No

SFR Address

Power-On Default Value

Bit Addressable

00H

No

–50–

REV. 0

REV. A

ADuC816

8051-COMPATIBLE ON-CHIP PERIPHERALS

This section gives a brief overview of the various secondary periph-

eral circuits are also available to the user on-chip. These remaining

functions are fully 8051-compatible and are controlled via standard

8051 SFR bit definitions.

address bytes during fetches from external program memory

and middle and high order address bytes during accesses to the

16-bit external data memory space.

Port 3 is a bidirectional port with internal pull-ups directly

controlled via the P2 SFR (SFR address = B0 hex). Port 3 pins

that have 1s written to them are pulled high by the internal pull-

ups and in that state they can be used as inputs. As inputs, Port

3 pins being pulled externally low will source current because of

the internal pull-ups. Port 3 pins also have various secondary

functions described in Table XXII.

Parallel I/O Ports 0–3

The ADuC816 uses four input/output ports to exchange data with

external devices. In addition to performing general-purpose I/O,

some ports are capable of external memory operations; others are

multiplexed with an alternate function for the peripheral features

on the device. In general, when a peripheral is enabled, that pin

may not be used as a general purpose I/O pin.

Table XXII. Port 3, Alternate Pin Functions

Port 0 is an 8-bit open drain bidirectional I/O port that is directly

controlled via the Port 0 SFR (SFR address = 80 hex). Port 0

pins that have 1s written to them via the Port 0 SFR will be

configured as open drain and will therefore float. In that state,

Port 0 pins can be used as high impedance inputs. An external

pull-up resistor will be required on Port 0 outputs to force a

valid logic high level externally. Port 0 is also the multiplexed

low-order address and data bus during accesses to external pro-

gram or data memory. In this application it uses strong internal

pull-ups when emitting 1s.

Alternate Function

P3.0

RXD (UART Input Pin)

(or Serial Data I/O in Mode 0)

TXD (UART Output Pin)

(or Serial Clock Output in Mode 0)

INT0 (External Interrupt 0)

P3.1

P3.2

P3.3

P3.4

P3.5

P3.6

P3.7

INT1 (External Interrupt 1)

T0 (Timer/Counter 0 External Input)

T1 (Timer/Counter 1 External Input)

WR (External Data Memory Write Strobe)

RD (External Data Memory Read Strobe)

Port 1 is also an 8-bit port directly controlled via the P1 SFR

(SFR address = 90 hex). The Port 1 pins are divided into two

distinct pin groupings.

The alternate functions of P1.0, P1.1, and Port 3 pins can only be

activated if the corresponding bit latch in the P1 and P3 SFRs

contains a 1. Otherwise, the port pin is stuck at 0.

P1.0 and P1.1 pins on Port 1 are bidirectional digital I/O pins with

internal pull-ups. If P1.0 and P1.1 have 1s written to them via the

P1 SFR, these pins are pulled high by the internal pull-up resis-

tors. In this state they can also be used as inputs; as input pins

being externally pulled low, they will source current because of

the internal pull-ups. With 0s written to them, both these pins

will drive a logic low output voltage (VOL) and will be capable of

sinking 10 mA compared to the standard 1.6 mA sink capa-

bility on the other port pins. These pins also have various

secondary functions described in Table XXI.

Timers/Counters

The ADuC816 has three 16-bit Timer/Counters: Timer 0,

Timer 1, and Timer 2. The Timer/Counter hardware has been

included on-chip to relieve the processor core of the overhead

inherent in implementing timer/counter functionality in soft-

ware. Each Timer/Counter consists of two 8-bit registers THx and

TLx (x = 0, 1 and 2). All three can be configured to operate

either as timers or event counters.

In “Timer” function, the TLx register is incremented every

machine cycle. Thus one can think of it as counting machine

cycles. Since a machine cycle consists of 12 core clock periods,

the maximum count rate is 1/12 of the core clock frequency.

Table XXI. Port 1, Alternate Pin Functions

Alternate Function

P1.0

P1.1

T2 (Timer/Counter 2 External Input)

T2EX (Timer/Counter 2 Capture/Reload Trigger)

In “Counter” function, the TLx register is incremented by a

1-to-0 transition at its corresponding external input pin, T0, T1,

or T2. In this function, the external input is sampled during

S5P2 of every machine cycle. When the samples show a high in

one cycle and a low in the next cycle, the count is incremented.

The new count value appears in the register during S3P1 of the

cycle following the one in which the transition was detected. Since

it takes two machine cycles (16 core clock periods) to recognize a

1-to-0 transition, the maximum count rate is 1/16 of the core

clock frequency. There are no restrictions on the duty cycle of

the external input signal, but to ensure that a given level is

sampled at least once before it changes, it must be held for a mini-

mum of one full machine cycle. Remember that the core clock

frequency is programmed via the CD0–2 selection bits in the

PLLCON SFR.

The remaining Port 1 pins (P1.2–P1.7) can only be configured

as Analog Input (ADC), Analog Output (DAC) or Digital Input

pins. By (power-on) default these pins are configured as Analog

Inputs, i.e., “1” written in the corresponding Port 1 register bit.

To configure any of these pins as digital inputs, the user should

write a “0” to these port bits to configure the corresponding pin

as a high impedance digital input.

Port 2 is a bidirectional port with internal pull-up resistors directly

controlled via the P2 SFR (SFR address = A0 hex). Port 2 pins

that have 1s written to them are pulled high by the internal pull-up

resistors and, in that state, they can be used as inputs. As inputs,

Port 2 pins being pulled externally low will source current because

of the internal pull-up resistors. Port 2 emits the high order

REV. A

REV. 0

–51–

ADuC816

User configuration and control of all Timer operating modes is achieved via three SFRs namely:

TMOD, TCON:

T2CON:

Control and configuration for Timers 0 and 1.

Control and configuration for Timer 2.

TMOD

Timer/Counter 0 and 1 Mode Register

SFR Address

Power-On Default Value

Bit Addressable

89H

00H

No

Gate

C/T

M1

M0

Gate

C/T

M1

M0

Table XXIII. TMOD SFR Bit Designations

Bit

Name

Description

7

Gate

Timer 1 Gating Control.

Set by software to enable timer/counter 1 only while INT1 pin is high and TR1 control bit is set.

Cleared by software to enable timer 1 whenever TR1 control bit is set.

Timer 1 Timer or Counter Select Bit.

6

C/T

Set by software to select counter operation (input from T1 pin).

Cleared by software to select timer operation (input from internal system clock).

Timer 1 Mode Select Bit 1 (Used with M0 Bit).

5

4

M1

M0

Timer 1 Mode Select Bit 0.

M1

0

1

M0

0

1

0

TH1 operates as an 8-bit timer/counter. TL1 serves as 5-bit prescaler.

16-Bit Timer/Counter. TH1 and TL1 are cascaded; there is no prescaler.

8-Bit Auto-Reload Timer/Counter. TH1 holds a value which is to be

reloaded into TL1 each time it overflows.

1

Timer/Counter 1 Stopped.

3

2

Gate

Timer 0 Gating Control.

Set by software to enable timer/counter 0 only while INT0 pin is high and TR0 control bit is set.

Cleared by software to enable Timer 0 whenever TR0 control bit is set.

Timer 0 Timer or Counter Select Bit.

Set by software to select counter operation (input from T0 pin).

Cleared by software to select timer operation (input from internal system clock).

Timer 0 Mode Select Bit 1.

C/T

1

0

M1

M0

Timer 0 Mode Select Bit 0.

M1

0

M0

0

1

TH0 operates as an 8-bit timer/counter. TL0 serves as 5-bit prescaler.

16-Bit Timer/Counter. TH0 and TL0 are cascaded; there is no prescaler

8-Bit Auto-Reload Timer/Counter. TH0 holds a value which is to be

reloaded into TL0 each time it overflows.

1

0

1

TL0 is an 8-bit timer/counter controlled by the standard timer 0 control

bits. TH0 is an 8-bit timer only, controlled by Timer 1 control bits.

–52–

REV. 0

REV. A

ADuC816

TCON: Timer/Counter 0 and 1 Control Register

SFR Address

Power-On Default Value

Bit Addressable

88H

00H

Yes

TF1

TR1

TF0

TR0

IE1¹

IT1¹

IE0¹

IT0¹

NOTE

¹These bits are not used in the control of timer/counter 0 and 1, but are used instead in the control and monitoring of the external INT0 and INT1 interrupt pins.

Table XXIV. TCON SFR Bit Designations

Bit

Name

Description

7

TF1

Timer 1 Overflow Flag.

Set by hardware on a timer/counter 1 overflow.

Cleared by hardware when the Program Counter (PC) vectors to the interrupt service routine.

Timer 1 Run Control Bit.

Set by user to turn on timer/counter 1.

Cleared by user to turn off timer/counter 1.

Timer 0 Overflow Flag.

Set by hardware on a timer/counter 0 overflow.

Cleared by hardware when the PC vectors to the interrupt service routine.

Timer 0 Run Control Bit.

6

5

4

3

TR1

TF0

TR0

IE1

Set by user to turn on timer/counter 0.

Cleared by user to turn off timer/counter 0.

External Interrupt 1 (INT1) Flag.

Set by hardware by a falling edge or zero level being applied to external interrupt pin INT1, depend-

ing on bit IT1 state.

Cleared by hardware when the when the PC vectors to the interrupt service routine only if the inter-

rupt was transition-activated. If level-activated, the external requesting source controls the

request flag, rather than the on-chip hardware.

2

1

IT1

IE0

External Interrupt 1 (IE1) Trigger Type.

Set by software to specify edge-sensitive detection (i.e., 1-to-0 transition).

Cleared by software to specify level-sensitive detection (i.e., zero level).

External Interrupt 0 (INT0) Flag.

Set by hardware by a falling edge or zero level being applied to external interrupt pin INT0, depend-

ing on bit IT0 state.

Cleared by hardware when the PC vectors to the interrupt service routine only if the interrupt was

transition-activated. If level-activated, the external requesting source controls the request flag,

rather than the on-chip hardware.

0

IT0

External Interrupt 0 (IE0) Trigger Type.

Set by software to specify edge-sensitive detection (i.e., 1-to-0 transition).

Cleared by software to specify level-sensitive detection (i.e., zero level).

Timer/Counter 0 and 1 Data Registers

Each timer consists of two 8-bit registers. These can be used as independent registers or combined to be a single 16-bit register

depending on the timer mode configuration.

TH0 and TL0

Timer 0 high byte and low byte.

SFR Address = 8Chex, 8Ahex respectively.

TH1 and TL1

Timer 1 high byte and low byte.

SFR Address = 8Dhex, 8Bhex respectively.

REV. 0

REV. A

–53–

ADuC816

TIMER/COUNTER 0 AND 1 OPERATING MODES

Mode 2 (8-Bit Timer/Counter with Autoreload)

The following paragraphs describe the operating modes for timer/

counters 0 and 1. Unless otherwise noted, it should be assumed

that these modes of operation are the same for timer 0 as for timer 1.

Mode 2 configures the timer register as an 8-bit counter (TL0)

with automatic reload, as shown in Figure 35. Overflow from TL0

not only sets TF0, but also reloads TL0 with the contents of TH0,

which is preset by software. The reload leaves TH0 unchanged.

Mode 0 (13-Bit Timer/Counter)

Mode 0 configures an 8-bit timer/counter with a divide-by-32

prescaler. Figure 33 shows mode 0 operation.

CORE

ꢇ 12

CLK*

C/T = 0

CORE

ꢇ 12

TL0

TF0

CLK*

(8 BITS)

C/T = 0

C/T = 1

TL0

TH0

P3.4/T0

(5 BITS) (8 BITS)

CONTROL

INTERRUPT

C/T = 1

TR0

P3.4/T0

INTERRUPT

CONTROL

RELOAD

TF0

GATE

P3.2/INT0

TR0

TH0

(8 BITS)

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

GATE

P3.2/INT0

Figure 35. Timer/Counter 0, Mode 2

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

Mode 3 (Two 8-Bit Timer/Counters)

Mode 3 has different effects on timer 0 and timer 1. Timer 1 in

Mode 3 simply holds its count. The effect is the same as setting

TR1 = 0. Timer 0 in Mode 3 establishes TL0 and TH0 as two

separate counters. This configuration is shown in Figure 36. TL0

uses the timer 0 control bits: C/T, Gate, TR0, INT0, and TF0.

TH0 is locked into a timer function (counting machine cycles)

and takes over the use of TR1 and TF1 from timer 1. Thus, TH0

now controls the “timer 1” interrupt. Mode 3 is provided for

applications requiring an extra 8-bit timer or counter.

Figure 33. Timer/Counter 0, Mode 0

In this mode, the timer register is configured as a 13-bit register.

As the count rolls over from all 1s to all 0s, it sets the timer overflow

flag TF0. The overflow flag, TF0, can then be used to request an

interrupt. The counted input is enabled to the timer when TR0 = 1

and either Gate = 0 or INT0 = 1. Setting Gate = 1 allows the timer

to be controlled by external input INT0, to facilitate pulsewidth

measurements. TR0 is a control bit in the special function regis-

ter TCON; Gate is in TMOD. The 13-bit register consists of all

eight bits of TH0 and the lower five bits of TL0. The upper three

bits of TL0 are indeterminate and should be ignored. Setting the

run flag (TR0) does not clear the registers.

When timer 0 is in Mode 3, timer 1 can be turned on and off by

switching it out of, and into, its own Mode 3, or can still be used by

the serial interface as a Baud Rate Generator. In fact, it can be used,

in any application not requiring an interrupt from timer 1 itself.

Mode 1 (16-Bit Timer/Counter)

Mode 1 is the same as Mode 0, except that the timer register is

running with all 16 bits. Mode 1 is shown in Figure 34.

CORE

CLK*

CORE

CLK/12

ꢇ 12

C/T = 0

TL0

(8 BITS)

CORE

ꢇ 12

CLK*

C/T = 0

C/T = 1

TL0

TH0

P3.4/T0

INTERRUPT

(8 BITS) (8 BITS)

CONTROL

TF0

TF1

TR0

C/T = 1

P3.4/T0

INTERRUPT

CONTROL

GATE

TF0

TR0

P3.2/INT0

TH0

(8 BITS)

CORE

CLK/12

GATE

P3.2/INT0

CONTROL

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

TR1

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

Figure 34. Timer/Counter 0, Mode 1

Figure 36. Timer/Counter 0, Mode 3

–54–

RREEVV.. A0

ADuC816

T2CON

Timer/Counter 2 Control Register

SFR Address

Power-On Default Value

Bit Addressable

C8H

00H

Yes

TF2

EXF2

RCLK

TCLK

EXEN2

TR2

CNT2

CAP2

Table XXV. T2CON SFR Bit Designations

Description

Timer 2 Overflow Flag.

Bit

Name

7

TF2

Set by hardware on a timer 2 overflow. TF2 will not be set when either RCLK or TCLK = 1.

Cleared by user software.

Timer 2 External Flag.

Set by hardware when either a capture or reload is caused by a negative transition on T2EX and

EXEN2 = 1.

Cleared by user user software.

Receive Clock Enable Bit.

Set by user to enable the serial port to use timer 2 overflow pulses for its receive clock in serial port

Modes 1 and 3.

Cleared by user to enable timer 1 overflow to be used for the receive clock.

Transmit Clock Enable Bit.

Set by user to enable the serial port to use timer 2 overflow pulses for its transmit clock in serial

port Modes 1 and 3.

Cleared by user to enable timer 1 overflow to be used for the transmit clock.

Timer 2 External Enable Flag.

6

5

4

3

EXF2

RCLK

TCLK

EXEN2

Set by user to enable a capture or reload to occur as a result of a negative transition on T2EX if

Timer 2 is not being used to clock the serial port.

Cleared by user for Timer 2 to ignore events at T2EX.

Timer 2 Start/Stop Control Bit.

Set by user to start timer 2.

Cleared by user to stop timer 2.

2

1

0

TR2

CNT2

CAP2

Timer 2 Timer or Counter Function Select Bit.

Set by user to select counter function (input from external T2 pin).

Cleared by user to select timer function (input from on-chip core clock).

Timer 2 Capture/Reload Select Bit.

Set by user to enable captures on negative transitions at T2EX if EXEN2 = 1.

Cleared by user to enable auto-reloads with Timer 2 overflows or negative transitions at T2EX

when EXEN2 = 1. When either RCLK = 1 or TCLK = 1, this bit is ignored and the timer is

forced to autoreload on Timer 2 overflow.

Timer/Counter 2 Data Registers

Timer/Counter 2 also has two pairs of 8-bit data registers associated with it. These are used as both timer data registers and timer

capture/reload registers.

TH2 and TL2

Timer 2, data high byte and low byte.

SFR Address = CDhex, CChex respectively.

RCAP2H and RCAP2L

Timer 2, Capture/Reload byte and low byte.

SFR Address = CBhex, CAhex respectively.

REV. 0

REV. A

–55–

ADuC816

Timer/Counter 2 Operating Modes

16-Bit Capture Mode

The following paragraphs describe the operating modes for timer/

counter 2. The operating modes are selected by bits in the T2CON

SFR as shown in Table XXVI.

In the “Capture” mode, there are again two options, which are

selected by bit EXEN2 in T2CON. If EXEN2 = 0, then Timer 2

is a 16-bit timer or counter which, upon overflowing, sets bit TF2,

the Timer 2 overflow bit, which can be used to generate an inter-

rupt. If EXEN2 = 1, then Timer 2 still performs the above, but

a l-to-0 transition on external input T2EX causes the current value

in the Timer 2 registers, TL2 and TH2, to be captured into regis-

ters RCAP2L and RCAP2H, respectively. In addition, the

transition at T2EX causes bit EXF2 in T2CON to be set, and

EXF2, like TF2, can generate an interrupt. The Capture Mode

is illustrated in Figure 38.

Table XXVI. TIMECON SFR Bit Designations

RCLK (or) TCLK

CAP2

TR2

MODE

0

1

X

0

1

X

1

0

16-Bit Autoreload

16-Bit Capture

Baud Rate

OFF

The baud rate generator mode is selected by RCLK = 1 and/or

TCLK = 1.

16-Bit Autoreload Mode

In “Autoreload” mode, there are two options, which are selected

by bit EXEN2 in T2CON. If EXEN2 = 0, then when Timer 2

rolls over it not only sets TF2 but also causes the Timer 2 registers

to be reloaded with the 16-bit value in registers RCAP2L and

RCAP2H, which are preset by software. If EXEN2 = 1, then

Timer 2 still performs the above, but with the added feature that

a 1-to-0 transition at external input T2EX will also trigger the

16-bit reload and set EXF2. The autoreload mode is illustrated

in Figure 37 below.

In either case if Timer 2 is being used to generate the baud rate,

the TF2 interrupt flag will not occur. Hence Timer 2 interrupts

will not occur so they do not have to be disabled. In this mode

the EXF2 flag, however, can still cause interrupts and this can

be used as a third external interrupt.

Baud rate generation will be described as part of the UART

serial port operation in the following pages.

CORE

12

CLK*

C/T2 = 0

C/T2 = 1

TL2

(8 BITS)

TH2

(8 BITS)

T2

CONTROL

TR2

RELOAD

TRANSITION

DETECTOR

RCAP2L

RCAP2H

TF2

TIMER

INTERRUPT

T2EX

EXF2

CONTROL

EXEN2

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

Figure 37. Timer/Counter 2, 16-Bit Autoreload Mode

CORE

CLK*

12

C/T2 = 0

TL2

(8 BITS)

TH2

(8 BITS)

TF2

C/T2 = 1

T2

CONTROL

TR2

TIMER

INTERRUPT

CAPTURE

TRANSITION

DETECTOR

RCAP2L

RCAP2H

T2EX

EXF2

CONTROL

EXEN2

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

Figure 38. Timer/Counter 2, 16-Bit Capture Mode

–56–

REV. 0

REV. A

ADuC816

UART SERIAL INTERFACE

while the SFR interface to the UART is comprised of the fol-

lowing registers.

The serial port is full duplex, meaning it can transmit and receive

simultaneously. It is also receive-buffered, meaning it can

commence reception of a second byte before a previously received

byte has been read from the receive register. However, if the first

byte still has not been read by the time reception of the second

byte is complete, the first byte will be lost. The physical interface

to the serial data network is via Pins RXD(P3.0) and TXD(P3.1)

SBUF

The serial port receive and transmit registers are both accessed

through the SBUF SFR (SFR address = 99 hex). Writing to

SBUF loads the transmit register and reading SBUF accesses a

physically separate receive register.

SCON

UART Serial Port Control Register

SFR Address

Power-On Default Value

Bit Addressable

98H

00H

Yes

SM0

SM1

SM2

REN

TB8

RB8

TI

RI

Table XXVII. SCON SFR Bit Designations

Bit

Name

Description

7

6

SM0

SM1

UART Serial Mode Select Bits.

These bits select the Serial Port operating mode as follows:

SM0

SM1

Selected Operating Mode

0

1

0

1

0

1

Mode 0: Shift Register, fixed baud rate (Core_Clk/2)

Mode 1: 8-bit UART, variable baud rate

Mode 2: 9-bit UART, fixed baud rate (Core_Clk/64) or (Core_Clk/32)

Mode 3: 9-bit UART, variable baud rate

5

SM2

Multiprocessor Communication Enable Bit.

Enables multiprocessor communication in Modes 2 and 3. In Mode 0, SM2 should be cleared.

In Mode 1, if SM2 is set, RI will not be activated if a valid stop bit was not received. If SM2 is

cleared, RI will be set as soon as the byte of data has been received. In Modes 2 or 3, if SM2 is

set, RI will not be activated if the received ninth data bit in RB8 is 0. If SM2 is cleared, RI will

be set as soon as the byte of data has been received.

Serial Port Receive Enable Bit.

4

REN

Set by user software to enable serial port reception.

Cleared by user software to disable serial port reception.

Serial Port Transmit (Bit 9).

The data loaded into TB8 will be the ninth data bit that will be transmitted in Modes 2 and 3.

Serial port Receiver Bit 9.

3

2

TB8

RB8

The ninth data bit received in Modes 2 and 3 is latched into RB8. For Mode 1 the stop bit is

latched into RB8.

1

0

TI

RI

Serial Port Transmit Interrupt Flag.

Set by hardware at the end of the eighth bit in Mode 0, or at the beginning of the stop bit in

Modes 1, 2, and 3.

TI must be cleared by user software.

Serial Port Receive Interrupt Flag.

Set by hardware at the end of the eighth bit in mode 0, or halfway through the stop bit in

Modes 1, 2, and 3.

RI must be cleared by software.

REV. A

REV. 0

–57–

ADuC816

Mode 0: 8-Bit Shift Register Mode

Mode 2: 9-Bit UART with Fixed Baud Rate

Mode 0 is selected by clearing both the SM0 and SM1 bits in

the SFR SCON. Serial data enters and exits through RXD. TXD

outputs the shift clock. Eight data bits are transmitted or received.

Transmission is initiated by any instruction that writes to SBUF.

The data is shifted out of the RXD line. The eight bits are trans-

mitted with the least-significant bit (LSB) first, as shown in

Figure 39.

Mode 2 is selected by setting SM0 and clearing SM1. In this

mode the UART operates in 9-bit mode with a fixed baud rate.

The baud rate is fixed at Core_Clk/64 by default, although by

setting the SMOD bit in PCON, the frequency can be doubled to

Core_Clk/32. Eleven bits are transmitted or received, a start bit(0),

eight data bits, a programmable ninth bit and a stop bit(1). The

ninth bit is most often used as a parity bit, although it can be used

for anything, including a ninth data bit if required.

MACHINE

CYCLE 1

MACHINE

CYCLE 2

MACHINE

CYCLE 7

MACHINE

CYCLE 8

To transmit, the eight data bits must be written into SBUF. The

ninth bit must be written to TB8 in SCON. When transmission is

initiated the eight data bits (from SBUF) are loaded onto the

transmit shift register (LSB first). The contents of TB8 are loaded

into the ninth bit position of the transmit shift register. The trans-

mission will start at the next valid baud rate clock. The TI flag

is set as soon as the stop bit appears on TXD.

S1 S2 S3 S4 S5 S6 S1 S2 S3 S4

S4 S5 S6 S1 S2 S3 S4 S5 S6

CORE

CLK

ALE

RXD

(DATA OUT)

DATA BIT 0

DATA BIT 1

DATA BIT 6

DATA BIT 7

TXD

(SHIFT CLOCK)

Reception for Mode 2 is similar to that of Mode 1. The eight

data bytes are input at RXD (LSB first) and loaded onto the

receive shift register. When all eight bits have been clocked in,

the following events occur:

Figure 39. UART Serial Port Transmission, Mode 0

Reception is initiated when the receive enable bit (REN) is 1 and

the receive interrupt bit (RI) is 0. When RI is cleared the data is

clocked into the RXD line and the clock pulses are output from

the TXD line.

The eight bits in the receive shift register are latched into SBUF

The ninth data bit is latched into RB8 in SCON

The Receiver interrupt flag (RI) is set

Mode 1: 8-Bit UART, Variable Baud Rate

Mode 1 is selected by clearing SM0 and setting SM1. Each data

byte (LSB first) is preceded by a start bit(0) and followed by a stop

bit(1). Therefore 10 bits are transmitted on TXD or received on

RXD. The baud rate is set by the Timer 1 or Timer 2 overflow

rate, or a combination of the two (one for transmission and the

other for reception).

if, and only if, the following conditions are met at the time the

final shift pulse is generated:

RI = 0, and

Either SM2 = 0, or SM2 = 1 and the received stop bit = 1.

If either of these conditions is not met, the received frame is

irretrievably lost, and RI is not set.

Transmission is initiated by writing to SBUF. The “write to

SBUF” signal also loads a 1 (stop bit) into the ninth bit position

of the transmit shift register. The data is output bit by bit until

the stop bit appears on TXD and the transmit interrupt flag (TI)

is automatically set as shown in Figure 40.

Mode 3: 9-Bit UART with Variable Baud Rate

Mode 3 is selected by setting both SM0 and SM1. In this mode

the 8051 UART serial port operates in 9-bit mode with a variable

baud rate determined by either Timer 1 or Timer 2. The opera-

tion of the 9-bit UART is the same as for Mode 2 but the baud

rate can be varied as for Mode 1.

STOP BIT

START

BIT

D0

D1

D2

D3

D4

D5

D6

D7

TXD

In all four modes, transmission is initiated by any instruction that

uses SBUF as a destination register. Reception is initiated in Mode 0

by the condition RI = 0 and REN = 1. Reception is initiated in

the other modes by the incoming start bit if REN = 1.

TI

(SCON.1)

SET INTERRUPT

i.e., READY FOR MORE DATA

Figure 40. UART Serial Port Transmission, Mode 0

UART Serial Port Baud Rate Generation

Mode 0 Baud Rate Generation

The baud rate in Mode 0 is fixed:

Mode 0 Baud Rate = (Core Clock Frequency¹/12)

Reception is initiated when a 1-to-0 transition is detected on

RXD. Assuming a valid start bit was detected, character reception

continues. The start bit is skipped and the eight data bits are

clocked into the serial port shift register. When all eight bits have

been clocked in, the following events occur:

NOTE

¹In these descriptions Core Clock Frequency refers to the core clock frequency

selected via the CD0–2 bits in the PLLCON SFR.

The eight bits in the receive shift register are latched into SBUF

The ninth bit (Stop bit) is clocked into RB8 in SCON

The Receiver interrupt flag (RI) is set

Mode 2 Baud Rate Generation

The baud rate in Mode 2 depends on the value of the SMOD bit

in the PCON SFR. If SMOD = 0, the baud rate is 1/64 of the core

clock. If SMOD = 1, the baud rate is 1/32 of the core clock:

Mode 2 Baud Rate = (2^SMOD/64) × (Core Clock Frequency)

if, and only if, the following conditions are met at the time the

final shift pulse is generated:

RI = 0, and

Modes 1 and 3 Baud Rate Generation

Either SM2 = 0, or SM2 = 1 and the received stop bit = 1.

The baud rates in Modes 1 and 3 are determined by the overflow

rate in Timer 1 or Timer 2, or both (one for transmit and the

other for receive).

If either of these conditions is not met, the received frame is

irretrievably lost, and RI is not set.

–58–

REV. 0

REV. A

ADuC816

Timer 1 Generated Baud Rates

Modes 1 and 3 Baud Rate = (1/16) × (Timer 2 Overflow Rate)

When Timer 1 is used as the baud rate generator, the baud rates

in Modes 1 and 3 are determined by the Timer 1 overflow rate and

the value of SMOD as follows:

Modes 1 and 3 Baud Rate = (2^SMOD/32) × (Timer 1 Overflow Rate)

Therefore, when Timer 2 is used to generate baud rates, the timer

increments every two clock cycles and not every core machine

cycle as before. Hence, it increments six times faster than Timer

1, and therefore baud rates six times faster are possible. Because

Timer 2 has 16-bit autoreload capability, very low baud rates

are still possible.

The Timer 1 interrupt should be disabled in this application. The

Timer itself can be configured for either timer or counter opera-

tion, and in any of its three running modes. In the most typical

application, it is configured for timer operation, in the autoreload

mode (high nibble of TMOD = 0100Binary). In that case, the baud

rate is given by the formula:

Timer 2 is selected as the baud rate generator by setting the TCLK

and/or RCLK in T2CON. The baud rates for transmit and receive

can be simultaneously different. Setting RCLK and/or TCLK puts

Timer 2 into its baud rate generator mode as shown in Figure 41.

Modes 1 and 3 Baud Rate =

In this case, the baud rate is given by the formula:

(2^SMOD/32) × (Core Clock/(12 × [256-TH1]))

Modes 1 and 3 Baud Rate

A very low baud rate can also be achieved with Timer 1 by leaving

the Timer 1 interrupt enabled, and configuring the timer to run

as a 16-bit timer (high nibble of TMOD = 0100Binary), and using

the Timer 1 interrupt to do a 16-bit software reload. Table XXVIII

below, shows some commonly-used baud rates and how they

might be calculated from a core clock frequency of 1.5728 MHz

and 12.58 MHz. Generally speaking, a 5% error is tolerable

using asynchronous (start/stop) communications.

= (Core Clk)/(32 × [65536 – (RCAP2H, RCAP2L)])

Table XXIX shows some commonly used baud rates and how they

might be calculated from a core clock frequency of 1.5728 MHz

and 12.5829 MHz.

Table XXIX. Commonly Used Baud Rates, Timer 2

Ideal

Baud

Core

CLK

RCAP2H RCAP2L

Actual

Baud

%

Error

Value

Table XXVIII. Commonly-Used Baud Rates, Timer 1

19200

9600

2400

1200

9600

2400

1200

12.58

1.57

–1 (FFh)

–2 (FEh)

–1 (FFh)

–20 (ECh) 19661

–41 (D7h) 9591

–164 (5Ch) 2398

2.4

0.1

2.4

0.1

Ideal

Baud

Core SMOD TH1-Reload

Actual

Baud

%

Error

CLK

Value

–72 (B8h)

–5 (FBh)

1199

9830

9600

2400

1200

12.58

1.57

1

–7 (F9h)

–27 (E5h)

–55 (C9h)

–7 (F9h)

9362

2427

1192

1170

2.5

1.1

0.7

2.5

1.57

–20 (ECh) 2457

–41 (D7h)

1199

Timer 2 Generated Baud Rates

Baud rates can also be generated using Timer 2. Using Timer 2

is similar to using Timer 1 in that the timer must overflow 16 times

before a bit is transmitted/received. Because Timer 2 has a 16-bit

autoreload mode a wider range of baud rates is possible using

Timer 2.

TIMER 1

OVERFLOW

2

NOTE: OSC. FREQ. IS DIVIDED BY 2, NOT 12.

0

1

SMOD

RCLK

CONTROL

CORE

2

CLK*

TIMER 2

C/T2 = 0

C/T2 = 1

OVERFLOW

1

0

TL2

TH2

(8 BITS)

T2

RX

16

CLOCK

TR2

TCLK

16

RELOAD

TX

CLOCK

RCAP2L

RCAP2H

NOTE AVAILABILITY OF ADDITIONAL

EXTERNAL INTERRUPT

EXF

2

TIMER 2

INTERRUPT

T2EX

CONTROL

TRANSITION

DETECTOR

EXEN2

*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.

Figure 41. Timer 2, UART Baud Rates

–59–

REV. A

REV. 0

ADuC816

INTERRUPT SYSTEM

The ADuC816 provides a total of twelve interrupt sources with two priority levels. The control and configuration of the interrupt

system is carried out through three Interrupt-related SFRs.

IE:

Interrupt Enable Register.

IP:

IEIP2:

Interrupt Priority Register.

Secondary Interrupt Priority-Interrupt Register.

IE:

Interrupt Enable Register

SFR Address

A8H

Power-On Default Value

Bit Addressable

00H

Yes

EA

EADC

ET2

ES

ET1

EX1

ET0

EX0

Table XXX. IE SFR Bit Designations

Description

Bit

Name

7

6

5

4

3

2

1

0

EA

Written by User to Enable “1” or Disable “0” All Interrupt Sources

Written by User to Enable “1” or Disable “0” ADC Interrupt

Written by User to Enable “1” or Disable “0” Timer 2 Interrupt

Written by User to Enable “1” or Disable “0” UART Serial Port Interrupt

Written by User to Enable “1” or Disable “0” Timer 1 Interrupt

Written by User to Enable “1” or Disable “0” External Interrupt 1

Written by User to Enable “1” or Disable “0” Timer 0 Interrupt

Written by User to Enable “1” or Disable “0” External Interrupt 0

EADC

ET2

ES

ET1

EX1

ET0

EX0

IP:

Interrupt Priority Register

SFR Address

Power-On Default Value

Bit Addressable

B8H

00H

Yes

---

PADC

PT2

PS

PT1

PX1

PT0

PX0

Table XXXI. IP SFR Bit Designations

Bit

Name

Description

7

6

5

4

3

2

1

0

---

Reserved for Future Use.

Written by User to Select ADC Interrupt Priority (“1” = High; “0” = Low)

Written by User to Select Timer 2 Interrupt Priority (“1” = High; “0” = Low)

Written by User to Select UART Serial Port Interrupt Priority (“1” = High; “0” = Low)

Written by User to Select Timer 1 Interrupt Priority (“1” = High; “0” = Low)

Written by User to Select External Interrupt 1 Priority (“1” = High; “0” = Low)

Written by User to Select Timer 0 Interrupt Priority (“1” = High; “0” = Low)

Written by User to Select External Interrupt 0 Priority (“1” = High; “0” = Low)

PADC

PT2

PS

PT1

PX1

PT0

PX0

REV. A

REV. 0

–60–

ADuC816

IEIP2:

Secondary Interrupt Enable and Priority Register

SFR Address

Power-On Default Value

Bit Addressable

A9H

A0H

No

---

PTI

PPSM

PSI

---

ETI

EPSM

ESI

Table XXXII. IEIP2 SFR Bit Designations

Description

Reserved for Future Use.

Bit

Name

7

6

5

4

3

2

1

0

---

PTI

PPSM

PSI

Written by User to Select TIC Interrupt Priority (“1” = High; “0” = Low).

Written by User to Select Power Supply Monitor Interrupt Priority (“1” = High; “0” = Low).

Written by User to Select SPI/I²C Serial Port Interrupt Priority (“1” = High; “0” = Low).

Reserved, This Bit Must Be “0.”

---

ETI

EPSM

ESI

Written by User to Enable “1” or Disable “0” TIC Interrupt.

Written by User to Enable “1” or Disable “0” Power Supply Monitor Interrupt.

Written by User to Enable “1” or Disable “0” SPI/I²C Serial Port Interrupt.

Table XXXIV. Interrupt Vector Addresses

Interrupt Priority

The Interrupt Enable registers are written by the user to enable

individual interrupt sources, while the Interrupt Priority registers

allow the user to select one of two priority levels for each interrupt.

An interrupt of a high priority may interrupt the service routine

of a low priority interrupt, and if two interrupts of different priority

occur at the same time, the higher level interrupt will be serviced

first. An interrupt cannot be interrupted by another interrupt of

the same priority level. If two interrupts of the same priority level

occur simultaneously, a polling sequence is observed as shown

in Table XXXIII.

Source

Vector Address

IE0

TF0

IE1

TF1

0003 Hex

000B Hex

0013 Hex

001B Hex

0023 Hex

002B Hex

0033 Hex

003B Hex

0043 Hex

0053 Hex

005B Hex

RI + TI

TF2 + EXF2

RDY0/RDY1 (ADC)

II²C + ISPI

PSMI

Table XXXIII. Priority within an Interrupt Level

TII

WDS (WDIR = 1)^*

Source

Priority

Description

*The watchdog can be configured to generate an interrupt instead of a reset when it

times out. This is used for logging errors or to examine the internal status of the

microcontroller core to understand, from a software debug point of view, why a

watchdog timeout occurred. The watchdog interrupt is slightly different from the

normal interrupts in that its priority level is always set to 1 and it is not possible

to disable the interrupt via the global disable bit (EA) in the IE SFR. This is

done to ensure that the interrupt will always be responded to if a watchdog

timeout occurs. The watchdog will only produce an interrupt if the watch-

dog timeout is greater than zero.

PSMI

WDS

IE0

RDY0/RDY1

TF0

IE1

TF1

I2CI + ISPI

RI + TI

TF2 + EXF2

TII

1 (Highest) Power Supply Monitor Interrupt

2

3

4

Watchdog Interrupt

External Interrupt 0

ADC Interrupt

5

6

7

8

Timer/Counter 0 Interrupt

External Interrupt 1

Timer/Counter 1 Interrupt

I²C/SPI Interrupt

9

Serial Interrupt

10

Timer/Counter 2 Interrupt

11 (Lowest) Time Interval Counter Interrupt

Interrupt Vectors

When an interrupt occurs the program counter is pushed onto the

stack and the corresponding interrupt vector address is loaded into

the program counter. The interrupt vector addresses are shown

in Table XXXIV.

REV. A

REV. 0

–61–

ADuC816

ADuC816 HARDWARE DESIGN CONSIDERATIONS

This section outlines some of the key hardware design consider-

ations that must be addressed when integrating the ADuC816

into any hardware system.

time that the low byte of the program counter is valid on P0, the

signal ALE (Address Latch Enable) clocks this byte into an

address latch. Meanwhile, Port 2 (P2) emits the high byte of the

program counter (PCH), then PSEN strobes the EPROM and

the code byte is read into the ADuC816.

Clock Oscillator

As described earlier, the core clock frequency for the ADuC816

is generated from an on-chip PLL that locks onto a multiple

(384 times) of 32.768 kHz. The latter is generated from an inter-

nal clock oscillator. To use the internal clock oscillator, connect

a 32.768 kHz parallel resonant crystal between XTAL1 and

XTAL2 pins (32 and 33) as shown in Figure 42.

ADuC816

EPROM

D0–D7

P0

(INSTRUCTION)

LATCH

A0–A7

ALE

As shown in the typical external crystal connection diagram in

Figure 42, two internal 12 pF capacitors are provided on-chip.

These are connected internally, directly to the XTAL1 and

XTAL2 pins and the total input capacitances at both pins is

detailed in the specification section of this data sheet. The value

of the total load capacitance required for the external crystal should

be the value recommended by the crystal manufacturer for use

with that specific crystal. In many cases, because of the on-chip

capacitors, additional external load capacitors will not be required.

A8–A15

P2

OE

PSEN

Figure 43. External Program Memory Interface

Note that program memory addresses are always 16 bits wide, even

in cases where the actual amount of program memory used is less

than 64 Kbytes. External program execution sacrifices two of the

8-bit ports (P0 and P2) to the function of addressing the program

memory. While executing from external program memory, Ports

0 and 2 can be used simultaneously for read/write access to exter-

nal data memory, but not for general-purpose I/O.

ADuC816

XTAL1

12pF

32.768kHz

TO INTERNAL

Though both external program memory and external data memory

are accessed by some of the same pins, the two are completely

independent of each other from a software point of view. For

example, the chip can read/write external data memory while

executing from external program memory.

PLL

12pF

XTAL2

Figure 42. External Parallel Resonant Crystal Connections

External Memory Interface

Figure 44 shows a hardware configuration for accessing up to

64 Kbytes of external RAM. This interface is standard to any 8051

compatible MCU.

In addition to its internal program and data memories, the

ADuC816 can access up to 64 Kbytes of external program memory

(ROM/PROM/etc.) and up to 16 Mbytes of external data

memory (SRAM).

ADuC816

SRAM

D0–D7

To select from which code space (internal or external program

memory) to begin executing instructions, tie the EA (external

access) pin high or low, respectively. When EA is high (pulled up

to V_DD), user program execution will start at address 0 of the

internal 8 Kbytes Flash/EE code space. When EA is low (tied to

ground) user program execution will start at address 0 of the

external code space. In either case, addresses above 1FFF hex

(8K) are mapped to the external space.

P0

(DATA)

LATCH

A0–A7

ALE

P2

A8–A15

OE

RD

Note that a second very important function of the EA pin is

described in the Single Pin Emulation Mode section of this

data sheet.

WE

WR

External program memory (if used) must be connected to the

ADuC816 as illustrated in Figure 43. Note that 16 I/O lines

(Ports 0 and 2) are dedicated to bus functions during external

program memory fetches. Port 0 (P0) serves as a multiplexed

address/data bus. It emits the low byte of the program counter

(PCL) as an address, and then goes into a float state awaiting

the arrival of the code byte from the program memory. During the

Figure 44. External Data Memory Interface (64 K Address

Space)

If access to more than 64 Kbytes of RAM is desired, a feature

unique to the ADuC816 allows addressing up to 16 Mbytes

of external RAM simply by adding an additional latch as illustrated

in Figure 45.

–62–

REV. 0

REV. A

ADuC816

SRAM

D0–D7

POWER SUPPLY

20

34

48

P0

DV

(DATA)

DD

LATCH

A0–A7

ALE

P2

POR

(ACTIVE HIGH)

15

RESET

A8–A15

A16–A23

Figure 47. External Active High POR Circuit

Some active-low POR chips, such as the ADM809 can be used with

a manual push-button as an additional reset source as illustrated

by the dashed line connection in Figure 48.

OE

RD

WE

WR

ADuC816

Figure 45. External Data Memory Interface (16 M Bytes

Address Space)

POWER SUPPLY

20

34 DV

48

1kꢆ

DD

In either implementation, Port 0 (P0) serves as a multiplexed

address/data bus. It emits the low byte of the data pointer (DPL) as

an address, which is latched by a pulse of ALE prior to data being

placed on the bus by the ADuC816 (write operation) or the

SRAM (read operation). Port 2 (P2) provides the data pointer

page byte (DPP) to be latched by ALE, followed by the data

pointer high byte (DPH). If no latch is connected to P2, DPP is

ignored by the SRAM, and the 8051 standard of 64 Kbyte external

data memory access is maintained.

POR

(ACTIVE LOW)

15

RESET

OPTIONAL

MANUAL RESET

PUSH-BUTTON

Figure 48. External Active Low POR Circuit

Power Supplies

The ADuC816’s operational power supply voltage range is 2.7 V

to 5.25 V. Although the guaranteed data sheet specifications are

given only for power supplies within 2.7 V to 3.6 V or +5% of

the nominal 5 V level, the chip will function equally well at any

power supply level between 2.7 V and 5.25 V.

Detailed timing diagrams of external program and data memory

read and write access can be found in the timing specification

sections of this data sheet.

Power-On Reset Operation

External POR (power-on reset) circuitry must be implemented to

drive the RESET pin of the ADuC816. The circuit must hold

the RESET pin asserted (high) whenever the power supply

(DV_DD) is below 2.5 V. Furthermore, V_DDmust remain above

2.5 V for at least 10 ms before the RESET signal is deasserted

(low) by which time the power supply must have reached at

least a 2.7 V level. The external POR circuit must be opera-

tional down to 1.2 V or less. The timing diagram of Figure 46

illustrates this functionality under three separate events: power-

up, brownout, and power-down. Notice that when RESET is

Separate analog and digital power supply pins (AV_DDand DV_DD

respectively) allow AV_DDto be kept relatively free of noisy digital

signals often present on the system DVDD line. In this mode the

part can also operate with split supplies; that is, using different

voltage supply levels for each supply. For example, this means that

the system can be designed to operate with a DV_DDvoltage level

of 3 V while the AV_DDlevel can be at 5 V or vice-versa if required.

A typical split supply configuration is shown in Figure 49.

asserted (high) it tracks the voltage on DV_DD

.

ANALOG SUPPLY

DIGITAL SUPPLY

10ꢃF

+

–

+

–

2.5V MIN

DV

DD

ADuC816

10ms

MIN

10ms

MIN

1.2V MAX

20

AV

5

6

DD

34 DV

48

DD

0.1ꢃF

RESET

21

35

AGND

DGND

47

Figure 46. External POR Timing

The best way to implement an external POR function to meet the

above requirements involves the use of a dedicated POR chip, such

as the ADM809/ADM810 SOT-23 packaged PORs from Analog

Devices. Recommended connection diagrams for both active-high

ADM810 and active-low ADM809 PORs are shown in Figure

47 and Figure 48, respectively.

Figure 49. External Dual Supply Connections

RREEVV.. A0

–63–

ADuC816

As an alternative to providing two separate power supplies, AV_DD

quiet by placing a small series resistor and/or ferrite bead between

it and DV_DD, and then decoupling AV_DDseparately to ground. An

example of this configuration is shown in Figure 50. With this

configuration other analog circuitry (such as op amps, voltage

reference, etc.) can be powered from the AV_DDsupply line as well.

In power-down mode, both the PLL and the clock to the core

are stopped. The on-chip oscillator can be halted or can continue

to oscillate depending on the state of the oscillator power-down

bit (OSC_PD) in the PLLCON SFR. The TIC, being driven

directly from the oscillator, can also be enabled during power-

down. All other on-chip peripherals however, are shut down.

Port pins retain their logic levels in this mode, but the DAC output

goes to a high-impedance state (three-state) while ALE and

PSEN outputs are held low. During full power-down mode,

the ADuC816 consumes a total of 5 μA typically. There are five

ways of terminating power-down mode:

DIGITAL SUPPLY

10ꢃF

1.6ꢆ

ADuC816

10ꢃF

BEAD

+

–

20

AV

DD

5

34 DV

48

DD

Asserting the RESET Pin (15)

0.1ꢃF

Returns to normal mode all registers are set to their default state

and program execution starts at the reset vector once the Reset

pin is deasserted.

0.1ꢃF

21

35

DGND

6

AGND

47

Cycling Power

All registers are set to their default state and program execution

starts at the reset vector.

Figure 50. External Single Supply Connections

Time Interval Counter (TIC) Interrupt

Notice that in both Figure 49 and Figure 50, a large value (10 μF)

reservoir capacitor sits on DV_DDand a separate 10 μF capacitor

sits on AV_DD. Also, local small-value (0.1 μF) capacitors are

located at each VDD pin of the chip. As per standard design prac-

tice, be sure to include all of these capacitors, and ensure the

smaller capacitors are closest to each AV_DDpin with trace lengths

as short as possible. Connect the ground terminal of each of these

capacitors directly to the underlying ground plane. Finally, it

should also be noticed that, at all times, the analog and digital

ground pins on the ADuC816 should be referenced to the same

system ground reference point.

Power-down mode is terminated and the CPU services the TIC

interrupt, the RETI at the end of the TIC Interrupt Service

Routine will return the core to the instruction after that which

enabled power down.

I²C or SPI Interrupt

Power-down mode is terminated and the CPU services the I²C/

SPI interrupt. The RETI at the end of the ISR will return the

core to the instruction after that which enabled power down. It

should be noted that the I²C/SPI power down interrupt enable

bit (SERIPD) in the PCON SFR must first be set to allow this

mode of operation.

Power Consumption

INT0 Interrupt

The “CORE” values given represent the current drawn by DV_DD

while the rest (“ADC” and “DAC”) are pulled by the AV_DDpin

and can be disabled in software when not in use. The other

,

Power-down mode is terminated and the CPU services the INT0

interrupt. The RETI at the end of the ISR will return the core

to the instruction after that which enabled power-down. It

should be noted that the INT0 power-down interrupt enable bit

(INT0PD) in the PCON SFR must first be set to allow this

mode of operation.

on-chip peripherals (watchdog timer, power supply monitor, etc.)

consume negligible current and are therefore lumped in with the

“CORE” operating current here. Of course, the user must add

any currents sourced by the parallel and serial I/O pins, and that

sourced by the DAC, in order to determine the total current

needed at the ADuC816’s supply pins. Also, current draw from

the DVDD supply will increase by approximately 5 mA during

Flash/EE erase and program cycles

Grounding and Board Layout Recommendations

As with all high resolution data converters, special attention must

be paid to grounding and PC board layout of ADuC816-based

designs in order to achieve optimum performance from the ADCs

and DAC.

Power-Saving Modes

Setting the Idle and Power-Down Mode bits, PCON.0 and

PCON.1 respectively, in the PCON SFR described in Table II,

allows the chip to be switched from normal mode into idle mode,

and also into full power-down mode.

Although the ADuC816 has separate pins for analog and digital

ground (AGND and DGND), the user must not tie these to two

separate ground planes unless the two ground planes are con-

nected together very close to the ADuC816, as illustrated in the

simplified example of Figure 51a. In systems where digital and

analog ground planes are connected together somewhere else

(at the system’s power supply for example), they cannot be con-

nected again near the ADuC816 since a ground loop would result.

In these cases, tie the ADuC816’s AGND and DGND pins all

to the analog ground plane, as illustrated in Figure 51b. In systems

with only one ground plane, ensure that the digital and analog

components are physically separated onto separate halves of the

board such that digital return currents do not flow near analog

circuitry and vice versa. The ADuC816 can then be placed between

the digital and analog sections, as illustrated in Figure 51c.

In idle mode, the oscillator continues to run, but the core clock

generated from the PLL is halted. The on-chip peripherals con-

tinue to receive the clock, and remain functional. The CPU status

is preserved with the stack pointer, program counter, and all other

internal registers maintain their data during idle mode. Port

pins and DAC output pins also retain their states, and ALE

and PSEN outputs go high in this mode. The chip will recover

from idle mode upon receiving any enabled interrupt, or on

receiving a hardware reset.

–64–

REV. A

REV. 0

ADuC816

OTHER HARDWARE CONSIDERATIONS

To facilitate in-circuit programming, plus in-circuit debug and

emulation options, users will want to implement some simple

connection points in their hardware that will allow easy access

to download, debug, and emulation modes.

PLACE ANALOG

PLACE DIGITAL

A

B

C

COMPONENTS HERE

In-Circuit Serial Download Access

AGND

DGND

Nearly all ADuC816 designs will want to take advantage of the

in-circuit reprogrammability of the chip. This is accomplished by a

connection to the ADuC816’s UART, which requires an external

RS-232 chip for level translation if downloading code from a PC.

Basic configuration of an RS-232 connection is illustrated in

Figure 52 with a simple ADM202-based circuit. If users would

rather not design an RS-232 chip onto a board, refer to the appli-

cation note “uC006–A 4-Wire UART-to-PC Interface”¹for a

simple (and zero-cost-per-board) method of gaining in-circuit

serial download access to the ADuC816.

PLACE ANALOG

COMPONENTS

HERE

PLACE DIGITAL

COMPONENTS

HERE

AGND

DGND

NOTE

¹Application note uC006 is available at www.analog.com/microconverter

In addition to the basic UART connections, users will also need

a way to trigger the chip into download mode. This is accom-

plished via a 1 kΩ pull-down resistor that can be jumpered

onto the PSEN pin, as shown in Figure 52. To get the ADuC816

into download mode, simply connect this jumper and power-

cycle the device (or manually reset the device, if a manual reset

button is available) and it will be ready to receive a new program

serially. With the jumper removed, the device will come up in

normal mode (and run the program) whenever power is cycled or

RESET is toggled.

PLACE ANALOG

COMPONENTS

HERE

PLACE DIGITAL

COMPONENTS

HERE

GND

Figure 51. System Grounding Schemes

In all of these scenarios, and in more complicated real-life appli-

cations, keep in mind the flow of current from the supplies and

back to ground. Make sure the return paths for all currents are

as close as possible to the paths the currents took to reach their

destinations. For example, do not power components on the

analog side of Figure 51b with DV_DDsince that would force

return currents from DV_DDto flow through AGND. Also, try to

avoid digital currents flowing under analog circuitry, which could

happen if the user placed a noisy digital chip on the left half

of the board in Figure 51c. Whenever possible, avoid large

discontinuities in the ground plane(s) (such as are formed by a

long trace on the same layer), since they force return signals to

travel a longer path. And of course, make all connections to the

ground plane directly, with little or no trace separating the pin

from its via to ground.

Note that PSEN is normally an output (as described in the Exter-

nal Memory Interface section) and it is sampled as an input only

on the falling edge of RESET (i.e., at power-up or upon an

external manual reset). Note also that if any external circuitry

unintentionally pulls PSEN low during power-up or reset events, it

could cause the chip to enter download mode and therefore fail to

begin user code execution as it should. To prevent this, ensure

that no external signals are capable of pulling the PSEN pin low,

except for the external PSEN jumper itself.

Embedded Serial Port Debugger

From a hardware perspective, entry to serial port debug mode is

identical to the serial download entry sequence described above.

In fact, both serial download and serial port debug modes can be

thought of as essentially one mode of operation used in two

different ways.

If the user plans to connect fast logic signals (rise/fall time < 5 ns)

to any of the ADuC816’s digital inputs, add a series resistor to

each relevant line to keep rise and fall times longer than 5 ns at

the ADuC816 input pins. A value of 100 Ω or 200 Ω is usually

sufficient to prevent high-speed signals from coupling capacitively

into the ADuC816 and affecting the accuracy of ADC conversions.

Note that the serial port debugger is fully contained on the

ADuC816 device, (unlike “ROM monitor” type debuggers) and

therefore no external memory is needed to enable in-system

debug sessions.

ADuC816 System Self-Identification

Single-Pin Emulation Mode

In some hardware designs it may be an advantage for the soft-

ware running on the ADuC816 target to identify the host Micro-

Converter. For example, code running on the ADuC816 may be

used at future date to run on an ADuC816 MicroConverter host

and the code may be required to operate differently.

Also built into the ADuC816 is a dedicated controller for

single-pin in-circuit emulation (ICE) using standard production

ADuC816 devices. In this mode, emulation access is gained by

connection to a single pin, the EA pin. Normally, this pin is hard-

wired either high or low to select execution from internal or

external program memory space, as described earlier. To enable

single-pin emulation mode, however, users will need to pull the

EA pin high through a 1 kΩ resistor as shown in Figure 52. The

emulator will then connect to the 2-pin header also shown in

Figure 52. To be compatible with the standard connector that

The CHIPID SFR is a read-only register located at SFR address

C2 hex. The top nibble of this byte is set to “1” to designate

an ADuC824 host. For an ADuC824 host, the CHIPID SFR

will contain the value “0” in the upper nibble.

RREEVV.. A0

–65–

ADuC816

DOWNLOAD/DEBUG

ENABLE JUMPER

(NORMALLY OPEN)

DV

1kꢆ

DD

DV

DD

1kꢆ

2-PIN HEADER FOR

EMULATION ACCESS

(NORMALLY OPEN)

51 50 49 48

47 46

45 44 43 42 41 40

52

39

38

37

36

35

34

33

32

31

30

29

28

27

P1.2IEXC1/DAC

AV

DV

DD

AV

DD

DGND

200ꢃA/400ꢃA

EXCITATION

CURRENT

DV

DD

AGND

ADuC816

REFIN–

XTAL2

XTAL1

V

+

–

REF

REFIN+

R1

V

32.766kHz

5.6kꢆ

REF

P1.4/AIN1

P1.5/AIN2

A

+

IN

RTD

A

–

R2

510ꢆ

DVDD

ADM810

GND

NOT CONNECTED IN THIS EXAMPLE

V

RST

DV

DD

CC

ADM202

DV

DD

9-PIN D-SUB

FEMALE

C1+

V+

V

CC

GND

1

2

3

4

5

6

7

8

9

C1–

T1OUT

C2+

C2–

V–

R1IN

R1OUT

T1IN

T2OUT

R2IN

T2IN

R2OUT

Figure 52. Typical System Configuration

comes with the single-pin emulator available from Accutron Limited

(www.accutron.com), use a 2-pin 0.1-inch pitch “Friction Lock”

header from Molex (www.molex.com) such as their part number

22-27-2021. Be sure to observe the polarity of this header. As

represented in Figure 52, when the Friction Lock tab is at the

right, the ground pin should be the lower of the two pins (when

viewed from the top).

Typical System Configuration

A typical ADuC816 configuration is shown in Figure 52. It sum-

marizes some of the hardware considerations discussed in the

previous paragraphs.

Figure 52 also includes connections for a typical analog measure-

ment application of the ADuC816, namely an interface to an

RTD (Resistive Temperature Device). The arrangement shown

is commonly referred to as a 4-wire RTD configuration.

Enhanced-Hooks Emulation Mode

ADuC816 also supports enhanced-hooks emulation mode. An

enhanced-hooks-based emulator is available from Metalink Corpo-

ration (www.metaice.com). No special hardware support for these

emulators needs to be designed onto the board since these are

“pod-style” emulators where users must replace the chip on

their board with a header device that the emulator pod plugs

into. The only hardware concern is then one of determining if

adequate space is available for the emulator pod to fit into the

system enclosure.

Here, the on-chip excitation current sources are enabled to excite

the sensor. An external differential reference voltage is generated

by the current sourced through resistor R1. This current also flows

directly through the RTD, which generates a differential voltage

directly proportional to temperature. This differential voltage is

routed directly to the positive and negative inputs of the primary

ADC (AIN1, AIN2 respectively). A second external resistor, R2, is

used to ensure that absolute analog input voltage on the negative

input to the primary ADC stays within that specified for the

ADuC816, i.e., AGND + 100 mV.

–66–

REV. 0

REV. A

ADuC816

It should also be noted that variations in the excitation current do

not affect the measurement system, as the input voltage from

the RTD and reference voltage across R1 vary ratiometrically with

the excitation current. Resistor R1 must, however, have a low

temperature coefficient to avoid errors in the reference volt-

age over temperature.

Download—In-Circuit Serial Downloader

The Serial Downloader is a software program that allows the user

to serially download an assembled program (Intel Hex format file)

to the on-chip program FLASH memory via the serial COM1

port on a standard PC. An Application Note (uC004) detailing

this serial download protocol is available from www.analog.com/

microconverter.

QUICKSTART DEVELOPMENT SYSTEM

DeBug—In-Circuit Debugger

The QuickStart Development System is a full featured, low cost

development tool suite supporting the ADuC816. The system

consists of the following PC-based (Windows-compatible) hard-

ware and software development tools.

The Debugger is a Windows application that allows the user to

debug code execution on silicon using the MicroConverter UART

serial port. The debugger provides access to all on-chip periph-

erals during a typical debug session as well as single-step and

break-point code execution control.

Hardware:

ADuC816 Evaluation Board, Plug-In

Power Supply and Serial Port Cable

ADSIM—Windows Simulator

Code Development:

Code Functionality:

8051 Assembler C Compiler

(2 Kcode Limited)

The Simulator is a Windows application that fully simulates all

the MicroConverter functionality including ADC and DAC

peripherals. The simulator provides an easy-to-use, intuitive, inter-

face to the MicroConverter functionality and integrates many

standard debug features; including multiple breakpoints, single

stepping; and code execution trace capability. This tool can be

used both as a tutorial guide to the part as well as an efficient way

to prove code functionality before moving to a hardware platform.

ADSIM, Windows MicroConverter

Code Simulator

In-Circuit Code Download: Serial Downloader

In-Circuit Debugger:

Misc. Other:

Serial Port Debugger

CD-ROM Documentation and Two

Additional Prototype Devices

The QuickStart development tool-suite software is freely

available at the Analog Devices MicroConverter Website

www.analog.com/microconverter.

Figures 53 shows the typical components of a QuickStart Devel-

opment System while Figure 54 shows a typical debug session.

A brief description of some of the software tools’ components in

the QuickStart Development System is given below.

Figure 54. Typical Debug Session

Figure 53. Components of the QuickStart Development

System

REV. 0

REV. A

–67–

ADuC816

OUTLINE DIMENSIONS

14.15

13.90 SQ

13.65

2.45

MAX

1.03

0.88

0.73

39

27

40

26

SEATING

PLANE

7.80

REF

TOP VIEW

(PINS DOWN)

10.20

10°

6°

2°

10.00 SQ

9.80

2.10

2.00

1.95

0.23

0.11

VIEW A

PIN 1

52

14

7°

0°

1

13

0.25

MIN

0.10

COPLANARITY

0.38

0.22

0.65 BSC

LEAD PITCH

VIEW A

ROTATED 90° CCW

LEAD WIDTH

COMPLIANT TO JEDEC STANDARDS MO-112-AC-1

Figure 55. 52-Lead Metric Quad Flat Package [MQFP]

(S-52-2)

Dimensions shown in millimeters

0.30

0.23

0.18

8.00

BSC SQ

0.60 MAX

PIN 1

INDICATOR

43

42

56

1

PIN 1

INDICATOR

6.25

6.10 SQ

5.95

TOP

VIEW

EXPOSED

PAD

(BOTTOM VIEW)

7.75

BSC SQ

0.50

0.40

0.30

29

28

14

15

0.25 MIN

6.50

REF

0.80 MAX

0.65 TYP

1.00

0.85

0.80

12° MAX

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.05 MAX

0.02 NOM

COPLANARITY

0.08

SEATING

PLANE

0.50 BSC

0.20 REF

COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2

Figure 56. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

8 mm × 8 mm Body, Very Thin Quad

(CP-56-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model¹

Temperature Range Package Description

Package Option Ordering Quantity

ADuC816BSZ

ADuC816BSZ-REEL

ADuC816BCPZ

–40°C to +85°C

52-Lead Metric Quad Flat Package [MQFP]

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-1

S-52-2

1,000

ADuC816BCPZ-REEL –40°C to +85°C

¹Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D00436-0-1/10(A)

–68–

REV. A


型号：	ADUC816BCPZ
厂家：	Rochester Electronics
描述：	8-BIT, FLASH, 12.58 MHz, MICROCONTROLLER, PQCC56, 8 X 8 MM, ROHS COMPLIANT, MO-220VLLD-2, LFCSP_VQ-56 时钟外围集成电路
文件：	总69页 (文件大小：1395K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ADUC816BCPZ [ROCHESTER]

相关型号：

ADUC816BCPZ-REEL

ADUC816BS

ADUC816BSZ

ADUC816BSZ

ADUC816BSZ-REEL

ADUC824

ADUC824B2BS

ADUC824BS

ADUC824BS

ADUC824BS-REEL

ADUC824BS-REEL

ADUC824BSZ