BAS40-04E6433 [ROCHESTER]

0.12 A, 2 ELEMENT, SILICON, SIGNAL DIODE, SOT-23, 3 PIN;
BAS40-04E6433
型号: BAS40-04E6433
厂家: Rochester Electronics    Rochester Electronics
描述:

0.12 A, 2 ELEMENT, SILICON, SIGNAL DIODE, SOT-23, 3 PIN

文件: 总16页 (文件大小:1056K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAS40.../BAS140W  
Silicon Schottky Diode  
General-purpose diode for high-speed switching  
Circuit protection  
Voltage clamping  
High-level detecting and mixing  
BAS140W  
BAS40  
BAS40-04  
BAS40-05  
BAS40-06  
BAS40-02L  
BAS40-05W  
BAS40-06W  
3
3
3
3
D
2
D
2
1
2
D
1
D
1
D
1
D
2
1
2
1
2
1
2
1
2
BAS40-07  
BAS40-07W  
4
3
D
1
D
2
1
2
ESD: Electrostatic discharge sensitive device, observe handling precaution!  
Type  
Package  
SOD323  
SOT23  
Configuration  
single  
L (nH) Marking  
S
BAS140W  
BAS40  
1.8  
1.8  
0.4  
1.8  
1.8  
1.4  
1.8  
1.4  
2
white 4  
43s  
FF  
single  
BAS40-02L  
BAS40-04  
BAS40-05  
BAS40-05W  
BAS40-06  
BAS40-06W  
BAS40-07  
BAS40-07W  
TSLP-2-1  
SOT23  
single, leadless  
series  
44s  
45s  
45s  
46s  
46s  
47s  
47s  
SOT23  
common cathode  
common cathode  
common anode  
common anode  
parallel pair  
parallel pair  
SOT323  
SOT23  
SOT323  
SOT143  
SOT343  
1.6  
Jan-11-2005  
1
BAS40.../BAS140W  
Maximum Ratings at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Value  
40  
Unit  
V
Diode reverse voltage  
Forward current  
V
R
120  
200  
mA  
I
F
Non-repetitive peak surge forward current  
t 10ms  
I
FSM  
mW  
Total power dissipation  
P
tot  
BAS140W, T 113°C  
250  
250  
250  
250  
250  
250  
250  
250  
S
BAS40, BAS40-07, T 81°C  
S
BAS40-02L, T 127°C  
S
BAS40-04, BAS40-06, T 56°C  
S
BAS40-06W, T 106°C  
S
BAS40-05, T 31°C  
S
BAS40-05W, T 98°C  
S
BAS40-07W, T 118°C  
S
150  
°C  
Junction temperature  
T
j
Operating temperature range  
Storage temperature  
T
-55 ... 125  
-55 ... 150  
op  
T
stg  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
1)  
K/W  
Junction - soldering point  
R
thJS  
BAS140W  
150  
275  
90  
BAS40, BAS40-07  
BAS40-02L  
BAS40-04, BAS40-06  
BAS40-06W  
375  
175  
475  
205  
125  
BAS40-05  
BAS40-05W  
BAS40-07W  
1For calculation of RthJA please refer to Application Note Thermal Resistance  
Jan-11-2005  
2
BAS40.../BAS140W  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
40  
-
typ. max.  
DC Characteristics  
-
-
-
V
Breakdown voltage  
V
(BR)  
I
= 10 µA  
(BR)  
1
Reverse current  
I
µA  
R
V = 30 V  
R
mV  
Forward voltage  
V
F
I = 1 mA  
250  
350  
600  
310  
450  
720  
380  
500  
F
I = 10 mA  
F
I = 40 mA  
1000  
F
1)  
-
-
20  
Forward voltage matching  
V  
F
I = 10 mA  
F
AC Characteristics  
-
3
5
-
pF  
Diode capacitance  
C
R
τ
T
F
rr  
V = 0 , f = 1 MHz  
R
Differential forward resistance  
-
-
10  
-
I = 10 mA, f = 10 kHz  
F
100 ps  
Charge carrier life time  
I = 25 mA  
F
1
VF is the difference between lowest and highestVF in a multiple diode component.  
Jan-11-2005  
3
BAS40.../BAS140W  
Diode capacitance C = ƒ (V )  
Forward resistance r = ƒ (I )  
f F  
T
R
f = 1MHz  
f = 10 kHz  
BAS 40...  
EHB00040  
BAS 40...  
EHB00041  
10 3  
5
pF  
4
CT  
rf  
10 2  
10 1  
10 3  
3
2
1
0
1
10  
mA 100  
0.1  
0
10  
20  
V
30  
VR  
Ι F  
Reverse current I = ƒ(V )  
Forward current I = ƒ (V )  
R
R
F
F
T = Parameter  
T = Parameter  
A
A
BAS 40...  
EHB00038  
10 2  
BAS 40...  
EHB00039  
103  
ΙF  
Ι R  
µ A  
mA  
TA = 150 C  
102  
101  
100  
10-1  
10 1  
10 0  
10-1  
TA = -40 ˚C  
25 ˚C  
85 C  
85 ˚C  
150 ˚C  
25 C  
10-2  
0
10-2  
0.0  
10  
20  
30  
V
40  
0.5  
1.0  
V
1.5  
VR  
VF  
Jan-11-2005  
4
BAS40.../BAS140W  
Forward current I = ƒ (T )  
Forward current I = ƒ (T )  
F
S
F
S
BAS140W  
BAS40, BAS40-07  
140  
mA  
140  
mA  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Forward current I = ƒ (T )  
Forward current I = ƒ (T )  
F
S
F
S
BAS40-02L  
BAS40-04, BAS40-06  
140  
mA  
140  
mA  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Jan-11-2005  
5
BAS40.../BAS140W  
Forward current I = ƒ (T )  
Forward current I = ƒ (T )  
F S  
F
S
BAS40-06W  
BAS40-05  
140  
mA  
140  
mA  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Forward current I = ƒ (T )  
Forward current I = ƒ (T )  
F S  
F
S
BAS40-05W  
BAS40-07W  
140  
mA  
140  
mA  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Jan-11-2005  
6
BAS40.../BAS140W  
Permissible Puls Load R  
= ƒ (t )  
Permissible Pulse Load  
thJS  
p
BAS140W  
I
/ I  
= ƒ (t )  
Fmax FDC p  
BAS140W  
BAS 140W  
EHD07165  
BAS 140W  
EHD07166  
10 2  
5
5
K/W  
Ι Fmax  
Ι FDC  
t p  
RthJS  
t p  
T
D =  
T
10 2  
5
D =  
0.5  
0.2  
D =  
0
0.1  
10 1  
5
0.005  
0.01  
0.02  
0.05  
0.1  
0.05  
0.02  
0.01  
0.005  
0
10 1  
5
0.2  
0.5  
t p  
t p  
T
D =  
T
10 0  
10 0  
10 -6 10 -5 10 -4 10 -3 10 -2  
s
10 0  
10 -6 10 -5 10 -4 10 -3 10 -2  
s
10 0  
t p  
t p  
Permissible Puls Load R  
= ƒ (t )  
Permissible Pulse Load  
thJS  
p
BAS40-02L  
I
/ I  
= ƒ (t )  
p
Fmax FDC  
BAS40-02L  
10 1  
10 2  
K/W  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.005  
D = 0  
-
10 1  
0.2  
0.5  
10 0  
10 -6 10 -5 10 -4 10 -3 10 -2 10 -1  
10 0  
10 1  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
Jan-11-2005  
7
BAS40.../BAS140W  
Permissible Puls Load R  
= ƒ (t )  
Permissible Pulse Load  
I / I = ƒ (t )  
Fmax FDC  
thJS  
p
BAS40-06W  
p
BAS40-06W  
10 2  
10 3  
K/W  
-
10 2  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 1  
0.5  
0.2  
0.1  
0.2  
0.5  
10 1  
0.05  
0.02  
0.01  
0.005  
D = 0  
10 0  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
Permissible Puls Load R  
= ƒ (t )  
Permissible Pulse Load  
I / I = ƒ (t )  
Fmax FDC  
thJS  
p
BAS40-05W  
p
BAS40-05W  
10 2  
10 3  
K/W  
-
10 2  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 1  
0.5  
0.2  
0.5  
0.2  
0.1  
10 1  
0.05  
0.02  
0.01  
0.005  
D = 0  
10 0  
10 -6  
10 0  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
Jan-11-2005  
8
Package SOD323  
Package Outline  
+0.2  
-0.1  
0.9  
+0.2  
-0.1  
1.25  
±0.05  
0
A
2
+0.15  
acc. to  
DIN 6784  
Cathode  
marking  
1
+0.1  
+0.05  
0.3  
-0.2  
0.3  
-0.05  
+0.1  
0.15  
-0.06  
M
0.25  
A
Foot Print  
0.6  
Marking Layout  
Type code  
BAR63-03W  
Laser marking  
Cathode marking  
Example  
Packing  
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel  
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
0.65  
1.35  
Cathode  
marking  
1
Package SOT143  
Package Outline  
±0.1  
±0.1  
1
2.9  
B
1.9  
0.1 MAX.  
4
3
1
2
A
0.2  
0.08...0.15  
+0.1  
-0.05  
0.8  
0...8˚  
+0.1  
-0.05  
0.4  
M
M
A
0.2  
0.25  
B
(1.7)  
Foot Print  
0.8  
1.2  
0.8  
1.2  
0.8 0.8  
Marking Layout  
Manufacturer  
Date code (Year/Month)  
Type code  
2003, July  
BFP181  
Pin 1  
Example  
Packing  
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel  
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
3.15  
Pin 1  
1.15  
Package SOT23  
Package Outline  
1.1 MAX.  
0.1 MAX.  
±0.1  
2.9  
1
B
A
3
+0.2  
acc. to  
DIN 6784  
2
+0.1  
-0.05  
0.4  
C
0.95  
1.9  
M
M
A
0.25  
B
C
0.20  
Foot Print  
0.8  
1.2  
0.8  
Marking Layout  
Manufacturer  
Date code (Year/Month)  
Type code  
2003, July  
BCW66  
Pin 1  
Example  
Packing  
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel  
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
3.15  
1.15  
Pin 1  
Package SOT323  
Package Outline  
±0.2  
+0.1  
2
±0.1  
0.9  
3x  
0.3  
0.1 MAX.  
0.1  
-0.05  
M
0.1  
A
3
+0.2  
acc. to  
DIN 6784  
1
2
+0.1  
0.15  
-0.05  
0.65 0.65  
M
0.2  
A
Foot Print  
0.6  
0.65  
0.65  
Marking Layout  
Manufacturer  
Pin 1  
Type code  
BCR108W  
Example  
Packing  
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel  
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
Pin 1  
2.15  
1.1  
Package SOT343  
Package Outline  
±0.1  
0.9  
±0.2  
2
1.3  
0.1 MAX.  
0.1  
A
+0.2  
acc. to  
DIN 6784  
4
1
3
2
0.15  
+0.1  
+0.1  
-0.05  
0.3  
0.15  
-0.05  
+0.1  
0.6  
4x  
-0.05  
M
0.2  
A
M
0.1  
Foot Print  
0.6  
1.15  
0.9  
Marking Layout  
Manufacturer  
Pin 1  
Type code  
BGA420  
Example  
Packing  
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel  
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
2.15  
Pin 1  
1.1  
Package TSLP-2-1  
Package Outline  
Top view  
Bottom view  
0.4+0.05  
0.6  
A
1)  
±0.035  
S
0.5  
2x  
0.05 MAX.  
0.03 S  
M
0.1 A B  
0.05  
0.05 2x  
2
1
2
1
M
0.1 A B  
B
Cathode  
marking  
1)  
±0.035  
0.5  
M
0.1 A B  
M
0.1 A B  
1) Dimension applies to plated terminals  
Foot Print  
0.6  
0.45  
Copper  
Solder mask  
Stencil apertures  
Marking Layout  
Type code  
BAS16-02L  
Laser marking  
Cathode marking  
Example  
Packing  
Code E6327: Reel ø180 mm = 15.000 Pieces/Reel  
0.5  
4
Cathode  
marking  
0.76  
Impressum  
Published by Infineon Technologies AG,  
St.-Martin-Strasse 53,  
81669 München  
© Infineon Technologies AG 2005.  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be  
considered as a guarantee of characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of  
non-infringement, regarding circuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.Infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon  
Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that life-support  
device or system, or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body, or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  

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