CD4044BPWE4 [ROCHESTER]
R-S Latch, 4000/14000/40000 Series, 1-Func, Low Level Triggered, 4-Bit, True Output, CMOS, PDSO16, GREEN, PLASTIC, TSSOP-16;
| 型号： | CD4044BPWE4 |
| 厂家： | 
Rochester Electronics |
| 描述： | R-S Latch, 4000/14000/40000 Series, 1-Func, Low Level Triggered, 4-Bit, True Output, CMOS, PDSO16, GREEN, PLASTIC, TSSOP-16 光电二极管 |
| 文件： | 总17页 (文件大小：882K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4043B and CD4044B types are supplied
in 16-lead hermetic dual-in-line ceramic
packages (F3A suffix), 16-lead dual-in-line
plastic
packages
(E
suffix),
16-lead
small-outline packages (D, DR, DT, DW, DWR,
and NSR suffixes), and 16-lead thin shrink
small-outline packages (PW and PWR
suffixes).
Copyright 2003, Texas Instruments Incorporated
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2008
PACKAGING INFORMATION
Orderable Device
CD4043BD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4043BDE4
CD4043BDG4
CD4043BDR
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4043BDRE4
CD4043BDRG4
CD4043BDT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4043BDTE4
CD4043BDTG4
CD4043BDW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4043BDWE4
CD4043BDWG4
CD4043BDWR
CD4043BDWRE4
CD4043BDWRG4
CD4043BE
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
25
1
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4043BEE4
N
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4043BF3A
CD4043BF3AS2534
CD4043BM
ACTIVE
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
SOIC
SO
J
J
16
16
16
16
TBD
TBD
TBD
A42 SNPB
Call TI
N / A for Pkg Type
Call TI
D
Call TI
Call TI
CD4043BNSR
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4043BNSRE4
CD4043BNSRG4
CD4043BPW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4043BPWE4
CD4043BPWG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2008
Orderable Device
CD4043BPWR
CD4043BPWRE4
CD4043BPWRG4
CD4044BD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PW
PW
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDE4
CD4044BDG4
CD4044BDR
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDRE4
CD4044BDRG4
CD4044BDT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDTE4
CD4044BDTG4
CD4044BDW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDWE4
CD4044BDWG4
CD4044BDWR
CD4044BDWRE4
CD4044BDWRG4
CD4044BE
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4044BEE4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4044BF
CD4044BF3A
CD4044BF3AS2534
CD4044BM
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
SOIC
SO
J
J
16
16
16
16
16
1
1
TBD
TBD
TBD
TBD
A42 SNPB
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
Call TI
OBSOLETE
OBSOLETE
ACTIVE
J
D
Call TI
Call TI
CD4044BNSR
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BNSRE4
CD4044BNSRG4
CD4044BPW
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
PW
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2008
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
CD4044BPWE4
CD4044BPWG4
CD4044BPWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
16
16
16
16
16
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BPWRE4
CD4044BPWRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CD4043BDR
CD4043BDWR
CD4043BNSR
CD4043BPWR
CD4044BDR
SOIC
SOIC
SO
D
16
16
16
16
16
16
16
16
2500
2000
2000
2000
2500
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
6.5
10.75
8.2
10.3
10.7
10.5
5.6
2.1
2.7
2.5
1.6
2.1
2.7
2.5
1.6
8.0
12.0
12.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
DW
NS
PW
D
TSSOP
SOIC
SOIC
SO
7.0
6.5
10.3
10.7
10.5
5.6
8.0
CD4044BDWR
CD4044BNSR
CD4044BPWR
DW
NS
PW
10.75
8.2
12.0
12.0
8.0
TSSOP
7.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4043BDR
CD4043BDWR
CD4043BNSR
CD4043BPWR
CD4044BDR
SOIC
SOIC
SO
D
16
16
16
16
16
16
16
16
2500
2000
2000
2000
2500
2000
2000
2000
333.2
346.0
346.0
346.0
333.2
346.0
346.0
346.0
345.9
346.0
346.0
346.0
345.9
346.0
346.0
346.0
28.6
33.0
33.0
29.0
28.6
33.0
33.0
29.0
DW
NS
PW
D
TSSOP
SOIC
SOIC
SO
CD4044BDWR
CD4044BNSR
CD4044BPWR
DW
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
相关型号：
CD4044BPWG4
4000/14000/40000 SERIES, LOW LEVEL TRIGGERED R-S LATCH, TRUE OUTPUT, PDSO16, GREEN, PLASTIC, TSSOP-16
TI
CD4044BPWRE4
R-S Latch, 4000/14000/40000 Series, 1-Func, Low Level Triggered, 4-Bit, True Output, CMOS, PDSO16, GREEN, PLASTIC, TSSOP-16
ROCHESTER
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