FODM3022R3V [ROCHESTER]

1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, MINIFLAT-4;
FODM3022R3V
型号: FODM3022R3V
厂家: Rochester Electronics    Rochester Electronics
描述:

1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, MINIFLAT-4

三端双向交流开关 输出元件 光电
文件: 总11页 (文件大小:1171K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
October 2005  
FODM3010, FODM3011, FODM3012, FODM3021,  
FODM3022, FODM3023  
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac  
Driver Output Optocouplers  
Features  
Description  
The FODM301X and FODM302X series consists of a GaAs  
infrared emitting diode driving a silicon bilateral switch housed  
in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm.  
They are designed for interfacing between electronic controls  
and power triacs to control resistive and inductive loads for  
115V/240V operations.  
Compact 4-pin surface mount package (2.4 mm maximum  
standoff height)  
Peak blocking voltage  
250V (FODM301X)  
400V (FODM302X)  
Available in tape and reel quantities of 500 and 2500.  
Applicable to Infrared Ray reflow (230°C max, 30 seconds.)  
BSI, CSA and VDE certifications pending  
UL (File# E90700) certified  
Applications  
Industrial controls  
Traffic lights  
Vending machines  
Solid state relay  
Lamp ballasts  
Solenoid/valve controls  
Static AC power switch  
Incandescent lamp dimmers  
Motor control  
Package Dimensions  
PIN 1  
0.026 (0.66)  
0.100 (2.54) TYP  
0.020 (0.51)  
0.012 (0.30)  
MAIN  
TERMINAL  
0.287 (7.29)  
0.248 (6.30)  
1
2
4
3
ANODE  
MAIN  
TERMINAL  
CATHODE  
0.173 (4.40)  
0.169 (4.29)  
TYP  
0.154 (3.91)  
0.094 (2.39)  
0.079 (2.01)  
0.008 (0.20)  
0.000 (0.0)  
0.035 (0.89)  
0.012 (0.30)  
0.033 (0.85)  
0.026 (0.65)  
NOTE  
All dimensions are in inches (millimeters)  
©2005 Fairchild Semiconductor Corporation  
1
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
Absolute Maximum Ratings (T = 25°C unless otherwise specified)  
A
Parameter  
Symbol  
Value  
Units  
TOTAL PACKAGE  
Storage Temperature  
T
-40 to +125  
125  
°C  
°C  
°C  
STG  
Junction Temperature  
T
J
Operating Temperature  
T
-40 to +100  
OPR  
EMITTER  
Continuous Forward Current  
Peak Forward Current (1 µs pulse, 300 pps.)  
Reverse Input Voltage  
I
60  
1
mA  
A
F (avg)  
I
F (pk)  
V
P
3
V
R
D
Power Dissipation (No derating required over operating temp. range)  
DETECTOR  
100  
mW  
On-State RMS Current  
I
70  
mA (RMS)  
V
T(RMS)  
Off-State Output Terminal Voltage  
FODM3010/1/2  
FODM3021/2/3  
V
250  
400  
300  
DRM  
Power Dissipation (No derating required over operating temp. range)  
P
mW  
D
Electrical Characteristics (T = 25°C)  
A
Individual Component Characteristics  
Parameter  
Test Conditions  
Symbol Device Min Typ* Max Unit  
EMITTER  
Input Forward Voltage  
I = 10 mA  
V
All  
All  
1.20  
0.01  
1.5  
V
F
F
Reverse Leakage Current  
DETECTOR  
V
= 3 V, T = 25°C  
I
R
100  
µA  
R
A
Peak Blocking Current Either Direction  
Peak On-State Voltage Either Direction  
Critical Rate of Rise of Off-State Voltage  
Rated V  
, I = 0 (note 1)  
I
DRM  
All  
All  
All  
2
100  
3
nA  
V
DRM  
F
I
= 100mA peak  
V
1.7  
10  
TM  
TM  
I
= 0 (Figure 8, note 2)  
dV/dt  
V/µs  
F
Transfer Characteristics (T = 25°C)  
A
DC Characteristics  
Test Conditions Symbol  
Device  
FODM3010  
FODM3021  
FODM3011  
FODM3022  
FODM3012  
FODM3023  
All  
Min  
Typ*  
Max  
Unit  
LED Trigger Current  
Main Terminal  
I
15  
10  
5
mA  
FT  
Voltage = 3V (note 3)  
Holding Current, Either Direction  
I
300  
µA  
H
Isolation Characteristics  
Characteristic  
Test Conditions Symbol  
Device  
Min  
Typ*  
Max  
Unit  
Steady State Isolation Voltage  
(1 Minute)  
V
All  
3750  
VRMS  
ISO  
* All typicals at T = 25°C  
A
Note  
1. Test voltage must be applied within dv/dt rating.  
2. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.  
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating I lies  
F
FT  
F
between max I (15 mA for FODM3010 and FODM3021, 10 mA for FODM3011 and FODM3022, 5 mA for FODM3012 and  
FT  
FODM3023) and absolute max I (60 mA).  
F
2
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
Typical Performance Curves  
Fig. 1 LED Forward Voltage vs. Forward Current  
Fig. 2 Leakage Current vs. Ambient Temperature  
1000  
100  
10  
1.8  
VDRM = 600V  
1.7  
1.6  
1.5  
1.4  
T
= -40°C  
A
1.3  
1.2  
1.1  
1.0  
0.9  
T
= 25°C  
A
1
T
= 100°C  
A
0.1  
-40  
-20  
0
20  
40  
60  
80  
100  
1
10  
- FORWARD CURRENT (mA)  
100  
T
- AMBIENT TEMPERATURE (°C)  
I
A
F
Fig. 3 Holding Current vs. Ambient Temperature  
Fig. 4 Trigger Current vs. Ambient Temperature  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.8  
10  
1.0  
0.1  
V
= 3V  
TM  
NORMALIZED TO T = 25°C  
NORMALIZED TO T = 25°C  
A
A
-40  
-20  
0
20  
40  
60  
80  
100  
100  
-40  
-20  
0
20  
40  
60  
80  
T
- AMBIENT TEMPERATURE (°C)  
A
T
- AMBIENT TEMPERATURE (°C)  
A
3
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
Typical Performance Curves  
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width  
Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature  
12  
1.4  
T
=T25°C  
A
NORMALIZED TO T = 25°C  
A
NORMALIZED TO PW >> 100µs  
IN  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
10  
8
6
4
2
0
20  
40  
60  
80  
100  
-40  
-20  
0
1
10  
100  
T
- AMBIENT TEMPERATURE (°C)  
A
PW - LED TRIGGER PULSE WIDTH (°C)  
IN  
Fig. 7 On-State Characteristics  
800  
600  
400  
200  
0
T
A
= 25°C  
-200  
-400  
-600  
-800  
-4  
-3  
-2  
-1  
0
1
2
3
4
V
- ON-STATE VOLTAGE (V)  
TM  
4
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
Typical Performance Curves  
400V (FODM302X)  
250V (FODM301X)  
1. The mercury wetted relay provides a high speed  
repeated pulse to the D.U.T.  
2. 100x scope probes are used, to allow high speeds and  
voltages.  
RTEST  
Vdc  
R = 10 kΩ  
3. The worst-case condition for static dv/dt is established by  
triggering the D.U.T. with a normal LED input current,  
CTEST  
PULSE  
INPUT  
then removing the current. The variable R  
allows the  
MERCURY  
WETTED  
RELAY  
TEST  
X100  
SCOPE  
PROBE  
dv/dt to be gradually increased until the D.U.T. continues  
to trigger in response to the applied voltage pulse, even  
after the LED current has been removed. The dv/dt is  
D.U.T.  
then decreased until the D.U.T. stops triggering. τ is  
RC  
measured at this point and recorded.  
V
= 400 V (FODM302X)  
= 250 V (FODM301X)  
max  
APPLIED VOLTAGE  
WAVEFORM  
252 V (FODM302X)  
158 V (FODM301X)  
0.63 V  
252  
max  
dv/dt =  
=
=
(FODM302X)  
(FODM301X)  
τ
τ
0 VOLTS  
RC  
RC  
τ
RC  
158  
τ
RC  
Figure 8. Static dv/dt Test Circuit  
NOTE: This optoisolator should not be used to drive a load directly. It is  
intended to be a trigger device only.  
RL  
Rin  
180  
1
2
4
3
VCC  
120 V  
60 Hz  
FODM3010  
FODM3011  
FODM3012  
Figure 9. Resistive Load  
ZL  
Rin  
180  
2.4k  
1
2
4
3
VCC  
120 V  
60 Hz  
MOC3010  
MOC3011  
MOC3012  
C1  
0.1 µF  
Figure 10. Inductive Load with Sensitive Gate Triac (IGT 15 mA)  
5
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
ZL  
Rin  
180  
1.2 k  
1
2
4
3
VCC  
120 V  
60 Hz  
FODM3010  
FODM3011  
FODM3012  
C1  
0.2 µF  
Figure 11. Inductive Load with Sensitive Gate Triac (IGT 15 mA)  
Rin  
360  
470  
1
2
4
3
HOT  
VCC  
FODM3021  
FODM3022  
FODM3023  
39  
0.05 µF  
240  
VAC  
0.01 µF  
LOAD  
GROUND  
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.  
The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 mF capacitor  
are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load  
used.  
Figure 12.Typical Application Circuit  
6
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
Ordering Information  
Option  
V
Description  
VDE Approved  
R1  
Tape and Reel (500 units)  
R2  
Tape and Reel (2500 units)  
R3  
Tape and Reel (500 units; unit 180° rotated)  
Tape and Reel (2500 units; unit 180° rotated)  
Tape and Reel (500 units) and VDE Approved  
Tape and Reel (2500 units) and VDE Approved  
Tape and Reel (500 units; unit 180° rotated) and VDE Approved  
Tape and Reel (2500 units; unit 180° rotated) and VDE Approved  
R4  
R1V  
R2V  
R3V  
R4V  
Marking Information  
1
2
3011  
6
V X YY M  
3
4
5
Definitions  
1
2
3
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE option –  
See order entry table)  
4
5
6
One digit year code  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
7
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
P
2
D0  
P
0
t
K0  
E
A0  
W
W
1
B0  
F
d
D1  
P
2.54 Pitch  
Description  
Symbol  
Dimensions (mm)  
12.00 0.4  
0.30 0.20  
4.00 0.20  
1.55 0.20  
1.75 0.20  
5.50 0.20  
2.00 0.20  
8.00 0.20  
4.40 0.20  
7.30 0.20  
2.30 0.20  
1.55 0.20  
9.20  
Tape Width  
W
t
Tape Thickness  
Sprocket Hole Pitch  
Sprocket Hole Dia.  
P
0
D
0
Sprocket Hole Location  
Pocket Location  
E
F
P
2
Pocket Pitch  
P
Pocket Dimension  
A0  
B0  
K0  
D1  
Pocket Hole Dia.  
Cover Tape Width  
Cover Tape Thickness  
W
1
d
0.065 0.02  
Max. Component Rotation or Tilt  
20˚ max  
R1  
R2  
R1  
R2  
Devices Per Reel  
500  
2500  
Reel Diameter  
178 mm (7")  
330 mm (13")  
8
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
Footprint Drawing for PCB Layout  
0.024 (0.61)  
0.060 (1.52)  
0.190 (4.83)  
0.310 (7.87)  
0.100 (2.54)  
Recommended Infrared Reflow Soldering Profile  
(heating)  
to 30 s  
230°C (peak temperature)  
210°C  
180°C  
to 60 s  
150 s  
90 s  
60 s  
Time (s)  
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds  
• Time of temperature higher than 210°C: 60 seconds or less  
• One time soldering reflow is recommended  
9
www.fairchildsemi.com  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
ACEx™  
PowerSaver™  
SuperSOT™-8  
SyncFET™  
TinyLogic  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
FAST  
ActiveArray™  
Bottomless™  
Build it Now™  
CoolFET™  
CROSSVOLT™  
DOME™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
PowerTrench  
FASTr™  
FPS™  
FRFET™  
GlobalOptoisolator™  
GTO™  
QFET  
QS™  
TINYOPTO™  
TruTranslation™  
UHC™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
SILENT SWITCHER  
SMART START™  
SPM™  
UltraFET  
HiSeC™  
I2C™  
UniFET™  
VCX™  
Wire™  
MSXPro™  
OCX™  
i-Lo™  
ImpliedDisconnect™  
IntelliMAX™  
OCXPro™  
OPTOLOGIC  
OPTOPLANAR™  
PACMAN™  
POP™  
Power247™  
PowerEdge™  
FACT Quiet Series™  
Stealth™  
Across the board. Around the world.™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
The Power Franchise  
Programmable Active Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY  
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY  
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT  
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. I16  
10  
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0  
www.fairchildsemi.com  

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