MC74ACT244NG [ROCHESTER]
ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDIP20, LEAD FREE, PLASTIC, DIP-20;
| 型号： | MC74ACT244NG |
| 厂家： | 
Rochester Electronics |
| 描述： | ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDIP20, LEAD FREE, PLASTIC, DIP-20 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总10页 (文件大小：800K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC244, MC74ACT244
Octal Buffer/Line Driver
with 3−State Outputs
The MC74AC244/74ACT244 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter/receiver which provides improved PC board
density.
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Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
Registers
PDIP−20
N SUFFIX
CASE 738
• Outputs Source/Sink 24 mA
• ′ACT244 Has TTL Compatible Inputs
• Pb−Free Packages are Available*
1
V
OE
2
CC
SOIC−20W
DW SUFFIX
CASE 751D
20
19
18
17
16
15
14
12
13
11
1
TSSOP−20
DT SUFFIX
CASE 948E
1
2
3
4
5
6
7
8
9
10
OE
1
GND
1
Pinout: 20−Lead Packages Conductors (Top View)
SOEIAJ−20
M SUFFIX
CASE 967
TRUTH TABLE
Inputs
OE
Outputs
1
D
(Pins 12, 14, 16, 18)
1
L
L
H
L
H
X
L
H
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
NOTE: H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
TRUTH TABLE
Inputs
OE
Outputs
D
(Pins 3, 5, 7, 9)
2
L
L
H
L
H
X
L
H
Z
NOTE: H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
September, 2006 − Rev. 7
MC74AC244/D
MC74AC244, MC74ACT244
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
−0.5 to V +0.5
V
IN
CC
V
OUT
−0.5 to V +0.5
V
CC
I
IN
20
50
mA
mA
mA
°C
I
DC Output Sink/Source Current, per Pin
OUT
I
DC V or GND Current per Output Pin
50
CC
CC
T
stg
Storage Temperature
−65 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
V
′AC
V
CC
Supply Voltage
′ACT
5.5
V
IN
, V
OUT
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
V
V
CC
V
CC
V
CC
V
CC
V
CC
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
Input Rise and Fall Time (Note 1)
−
−
−
−
−
ns/V
t , t
r
f
′AC Devices except Schmitt Inputs
−
−
Input Rise and Fall Time (Note 2)
t , t
ns/V
r
f
′ACT Devices except Schmitt Inputs
−
T
J
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
T
A
−40
−
25
−
I
−24
24
mA
mA
OH
I
OL
Output Current − Low
−
−
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
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2
MC74AC244, MC74ACT244
DC CHARACTERISTICS
74AC
74AC
T
=
V
(V)
A
CC
T
= +25°C
Symbol
Parameter
Unit
V
Conditions
A
−40°C to +85°C
Typ
Guaranteed Limits
V
IH
Minimum High Level Input Voltage
Maximum Low Level Input Voltage
Minimum High Level Output Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
OUT
or V − 0.1 V
CC
V
IL
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
V
= 0.1 V
OUT
or V − 0.1 V
CC
V
OH
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
I
= −50 mA
OUT
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
V
*V = V or V
IN
IL
IH
−12 mA
I
−24 mA
−24 mA
OH
V
OL
Maximum Low Level Output Voltage
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
V
V
I
= 50 mA
OUT
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
*V = V or V
IN IL
IH
12 mA
24 mA
24 mA
I
OL
I
Maximum Input Leakage Current
Maximum 3−State Current
5.5
5.5
−
−
0.1
0.5
1.0
5.0
mA
mA
V = V , GND
I CC
IN
I
V (OE) = V , V
I IL IH
OZ
V = V , GND
I
CC
V
V
V
V
= V , GND
O
CC
†Minimum Dynamic Output Current
Maximum Quiescent Supply Current
I
5.5
5.5
5.5
−
−
−
−
−
75
−75
80
mA
mA
mA
= 1.65 V Max
= 3.85 V Min
OLD
OLD
OHD
I
OHD
I
8.0
= V or GND
IN CC
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
IN
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
CC
CC
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74AC
74AC
T
= +25°C
T
A
= −40°C to +85°C
V
(V)
*
Figure
No.
A
CC
Symbol
Parameter
Unit
C = 50 pF
C = 50 pF
L
L
Min
Typ
Max
Min
Max
t
t
Propagation Delay
Data to Output
3.3
5.0
2.0
1.5
6.5
5.0
9.0
7.0
1.5
1.0
10.0
7.5
ns
ns
ns
ns
ns
ns
3−5
3−5
3−7
3−8
3−7
3−8
PLH
PHL
PZH
Propagation Delay
Data to Output
3.3
5.0
2.0
1.5
6.5
5.0
9.0
7.0
2.0
1.0
10.0
7.5
t
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
3.3
5.0
2.0
1.5
6.0
5.0
10.5
7.0
1.5
1.5
11.0
8.0
t
3.3
5.0
2.5
1.5
7.5
5.5
10.0
8.0
2.0
1.5
11.0
8.5
PZL
t
3.3
5.0
3.0
2.5
7.0
6.5
10.0
9.0
1.5
1.0
10.5
9.5
PHZ
t
3.3
5.0
2.5
2.0
7.5
6.5
10.5
9.0
2.5
2.0
11.5
9.5
PLZ
*Voltage Range 3.3 V is 3.3 V 0.3 V.
*Voltage Range 5.0 V is 5.0 V 0.5 V.
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3
MC74AC244, MC74ACT244
DC CHARACTERISTICS
74ACT
74ACT
T
=
V
(V)
A
CC
T
A
= +25°C
Symbol
Parameter
Unit
Conditions
−40°C to +85°C
Typ
Guaranteed Limits
V
Minimum High Level Input Voltage
Maximum Low Level Input Voltage
Minimum High Level Output Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
V
V
V
V
= 0.1 V
CC
IH
OUT
or V − 0.1 V
V
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
OUT
= 0.1 V
CC
IL
or V − 0.1 V
V
OH
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 mA
OUT
*V = V or V
IN
IL
IH
4.5
5.5
−
−
3.86
4.86
3.76
4.76
−24 mA
−24 mA
I
I
OH
V
OL
Maximum Low Level Output Voltage
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
V
V
= 50 mA
OUT
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
24 mA
24 mA
I
OL
I
Maximum Input Leakage Current
5.5
5.5
5.5
−
0.6
−
0.1
−
1.0
1.5
5.0
mA
mA
mA
V = V , GND
I CC
IN
DI
Additional Max. I /Input
V = V − 2.1 V
I CC
CCT
OZ
CC
I
Maximum 3−State Current
0.5
V (OE) = V , V
I IL IH
V = V , GND
I
CC
V
V
V
V
= V , GND
O
CC
†Minimum Dynamic Output Current
Maximum Quiescent Supply Current
I
5.5
5.5
5.5
−
−
−
−
−
75
−75
80
mA
mA
mA
= 1.65 V Max
= 3.85 V Min
OLD
OLD
OHD
I
OHD
I
8.0
= V or GND
IN CC
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74ACT
74ACT
T
= +25°C
T
A
= −40°C to +85°C
V
(V)
*
Figure
No.
A
CC
Symbol
Parameter
Unit
C = 50 pF
C = 50 pF
L
L
Min
Typ
Max
Min
Max
t
t
Propagation Delay
Data to Output
5.0
5.0
2.0
6.5
9.0
1.5
10.0
ns
ns
3−5
3−5
PLH
PHL
PZH
Propagation Delay
Data to Output
2.0
7.0
9.0
1.5
10.0
t
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
5.0
5.0
5.0
5.0
1.5
2.0
2.0
2.5
6.0
7.0
7.0
7.5
8.5
9.5
1.0
1.5
1.5
2.0
9.5
ns
ns
ns
ns
3−7
3−8
3−7
3−8
t
10.5
10.5
10.5
PZL
PHZ
t
9.5
t
10.0
PLZ
*Voltage Range 5.0 V is 5.0 V 0.5 V.
CAPACITANCE
Symbol
Parameter
Value Typ
Unit
pF
Test Conditions
C
Input Capacitance
Power Dissipation Capacitance
4.5
45
V
= 5.0 V
= 5.0 V
IN
CC
CC
C
pF
V
PD
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4
MC74AC244, MC74ACT244
ORDERING INFORMATION
Device
†
Package
Shipping
MC74AC244N
PDIP−20
MC74AC244NG
PDIP−20
(Pb−Free)
18 Units / Rail
MC74ACT244N
PDIP−20
MC74ACT244NG
PDIP−20
(Pb−Free)
MC74AC244DW
SOIC−20
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
MC74AC244DWG
SOIC−20
(Pb−Free)
MC74AC244DWR2
MC74AC244DWR2G
SOIC−20
SOIC−20
(Pb−Free)
MC74ACT244DW
MC74ACT244DWG
SOIC−20
SOIC−20
(Pb−Free)
MC74ACT244DWR2
MC74ACT244DWR2G
SOIC−20
1000 / Tape & Reel
SOIC−20
(Pb−Free)
MC74AC244DTR2
MC74AC244DTR2G
MC74ACT244DTR2
MC74ACT244DTR2G
MC74AC244MEL
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
SOEIAJ−20
2500 / Tape & Reel
2000 / Tape & Reel
40 Units / Rail
MC74AC244MELG
SOEIAJ−20
(Pb−Free)
MC74ACT244M
SOEIAJ−20
MC74ACT244MG
SOEIAJ−20
(Pb−Free)
MC74ACT244MEL
MC74ACT244MELG
SOEIAJ−20
2000 / Tape & Reel
SOEIAJ−20
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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5
MC74AC244, MC74ACT244
MARKING DIAGRAMS
PDIP−20
SOIC−20W
TSSOP−20
SOEIAJ−20
20
20
20
1
20
1
AC
244
AC244
AWLYYWWG
MC74AC244N
AWLYYWWG
74AC244
AWLYWWG
ALYWG
G
1
1
20
20
20
1
20
1
ACT
244
ACT244
AWLYYWWG
74ACT244
AWLYWWG
MC74ACT244N
AWLYYWWG
ALYWG
G
1
1
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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6
MC74AC244, MC74ACT244
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
10
B
INCHES
DIM MIN MAX
1.070 25.66
MILLIMETERS
L
C
MIN
MAX
27.17
6.60
4.57
0.55
A
B
C
D
E
1.010
0.240
0.150
0.015
0.260
0.180
0.022
6.10
3.81
0.39
0.050 BSC
1.27 BSC
−T−
SEATING
PLANE
K
0.050
0.100 BSC
0.070
1.27
2.54 BSC
1.77
F
G
J
M
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
N
E
K
L
0.300 BSC
7.62 BSC
G
F
M
N
0
0.020
15
_
0.040
0
_
0.51
15
_
1.01
J 20 PL
_
D 20 PL
M
M
B
0.25 (0.010)
T
M
M
A
0.25 (0.010)
T
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
D
A
q
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
E
B
MILLIMETERS
1
10
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
12.65
7.40
20X B
M
S
S
B
T
0.25
A
e
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
A
L
q
_
_
SEATING
PLANE
18X e
A1
C
T
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7
MC74AC244, MC74ACT244
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING
20X K REF
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
M
S
S
V
0.10 (0.004)
T
U
S
T U
0.15 (0.006)
K
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
K1
20
11
2X L/2
J J1
B
L
−U−
PIN 1
IDENT
SECTION N−N
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
10
0.25 (0.010)
N
S
0.15 (0.006)
T U
6. TERMINAL NUMBERS ARE SHOWN
FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
A
−V−
N
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
F
A
B
6.40
4.30
−−−
6.60 0.252
4.50 0.169
DETAIL E
C
1.20
−−−
D
0.05
0.50
0.15 0.002
0.75 0.020
−W−
F
C
G
H
0.65 BSC
0.026 BSC
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
J
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
G
D
J1
K
H
DETAIL E
0.100 (0.004)
−T− SEATING
K1
L
6.40 BSC
0.252 BSC
0
M
0
8
8
_
_
_
_
PLANE
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8
MC74AC244, MC74ACT244
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
NOTES:
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
L
E
20
11
Q
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.
ꢀꢁ3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
1
H
E
_
E
M
ꢀꢁ4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
L
1
10
ꢀꢁ5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DETAIL P
Z
D
VIEW P
e
A
c
MILLIMETERS
INCHES
MIN
−−−
DIM MIN
MAX
MAX
0.081
0.008
0.020
0.010
0.504
0.215
A
−−−
0.05
0.35
0.15
12.35
5.10
2.05
A
A
b
1
1
0.20 0.002
0.50 0.014
0.25 0.006
b
c
M
0.10 (0.004)
0.13 (0.005)
D
E
12.80 0.486
5.45 0.201
e
1.27 BSC
0.050 BSC
H
7.40
0.50
1.10
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
E
L
L
E
M
Q
0
10
0.90 0.028
0
10
_
0.035
0.032
_
_
_
0.70
−−−
1
Z
0.81
−−−
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