MOC3032-M_技术文档

September 2010

MOC3031M, MOC3032M, MOC3033M,

MOC3041M, MOC3042M, MOC3043M

6-Pin DIP Zero-Cross Optoisolators Triac Driver Output

(250/400 Volt Peak)

Features

Description

■ Simplifies logic control of 115 VAC power

■ Zero voltage crossing

The MOC303XM and MOC304XM devices consist of a

GaAs infrared emitting diode optically coupled to a

monolithic silicon detector performing the function of a

zero voltage crossing bilateral triac driver.

■ dv/dt of 2000 V/µs typical, 1000 V/µs guaranteed

■ VDE recognized (File # 94766), ordering option V

They are designed for use with a triac in the interface of

logic systems to equipment powered from 115 VAC

lines, such as teletypewriters, CRTs, solid-state relays,

industrial controls, printers, motors, solenoids and

consumer appliances, etc.

(e.g., MOC3043VM)

Applications

■ Solenoid/valve controls

■ Lighting controls

■ Static power switches

■ AC motor drives

■ Temperature controls

■ E.M. contactors

■ AC motor starters

■ Solid state relays

Schematic

Package Outlines

ANODE 1

6

MAIN TERM.

CATHODE

N/C

NC*

2

3

5

4

ZERO

MAIN TERM.

CROSSING

CIRCUIT

*DO NOT CONNECT

(TRIAC SUBSTRATE)

www.fairchildsemi.com

MOC303XM, MOC304XM Rev. 1.0.7

Absolute Maximum Ratings ^{(T = 25°C unless otherwise noted)}

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameters

Device

Value

Units

TOTAL DEVICE

T

Storage Temperature

All

-40 to +150

-40 to +85

°C

STG

T

Operating Temperature

Lead Solder Temperature

OPR

T

260 for 10

sec

SOL

T

Junction Temperature Range

All

-40 to +100

7500

°C

J

(1)

V

Isolation Surge Voltage

Vac(pk)

ISO

(peak AC voltage, 60Hz, 1 sec. duration, I ≤ 2µA)

I-O

P

Total Device Power Dissipation @ 25°C

Derate above 25°C

All

250

mW

D

2.94

mW/°C

EMITTER

I

Continuous Forward Current

Reverse Voltage

All

60

6

mA

V

F

V

P

R

Total Power Dissipation 25°C Ambient

Derate above 25°C

120

1.41

mW

D

mW/°C

DETECTOR

V

Off-State Output Terminal Voltage

MOC3031M/2M/3M

MOC3041M/2M/3M

All

250

400

1

V

A

DRM

I

Peak Repetitive Surge Current

(PW = 100µs, 120 pps)

TSM

P

Total Power Dissipation @ 25°C Ambient

Derate above 25°C

All

150

mW

D

1.76

mW/°C

Note

1. Isolation surge voltage, V , is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are

ISO

common, and Pins 4, 5 and 6 are common.

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

2

Electrical Characteristics ^{(T = 25°C Unless otherwise speciﬁed)}

A

Individual Component Characteristics

Symbol

EMITTER

Parameters

Test Conditions

Device Min. Typ. Max. Units

V

Input Forward Voltage

I = 30mA

All

1.25

0.01

1.5

V

F

I

Reverse Leakage Current

V = 6V

100

µA

R

DETECTOR

(2)

I

Peak Blocking Current,

Either Direction

Rated V

, I = 0

All

100

3

nA

V

DRM1

DRM

F

V

Peak On-State Voltage,

Either Direction

I

= 100mA peak, I = 0

1.8

TM

F

(4)

dv/dt

Critical Rate of Rise of

Off-State Voltage

I = 0 (Figure 9)

1000

V/µs

F

Transfer Characteristics

Symbol DC Characteristics

Test Conditions

Device

Min. Typ. Max. Units

I

LED Trigger Current

Main Terminal

Voltage = 3V

MOC3031M/

MOC3041M

15

10

5

mA

FT

(3)

MOC3032M/

MOC3042M

MOC3033M/

MOC3043M

I

Holding Current,

Either Direction

All

400

µA

H

Zero Crossing Characteristics

Symbol

Characteristics

Test Conditions

Device Min. Typ. Max. Units

V

Inhibit Voltage

I = rated I , MT1-MT2

All

20

V

IH

F

FT

voltage above which device

will not trigger

off-state

I

Leakage in Inhibited

State

I = rated I , rated V

off-state

All

2

mA

DRM2

F

FT

DRM

Notes:

2. Test voltage must be applied within dv/dt rating.

3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended

F

FT

operating I lies between max I (15mA for MOC3031M & MOC3041M, 10mA for MOC3032M & MOC3042M,

F

FT

5mA for MOC3033M & MOC3043M) and absolute max I (60mA).

F

4. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

3

Safety and Insulation Ratings

As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.

Compliance with the safety ratings shall be ensured by means of protective circuits.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Installation Classiﬁcations per DIN VDE 0110/1.89

Table 1

For Rated Main Voltage < 150Vrms

For Rated Main voltage < 300Vrms

Climatic Classiﬁcation

I-IV

55/100/21

2

Pollution Degree (DIN VDE 0110/1.89)

Comparative Tracking Index

CTI

175

V

Input to Output Test Voltage, Method b,

1594

V

PR

peak

V

x 1.875 = V , 100% Production Test

IORM

PR

with tm = 1 sec, Partial Discharge < 5pC

Input to Output Test Voltage, Method a,

1275

peak

V

x 1.5 = V , Type and Sample Test

PR

IORM

with tm = 60 sec, Partial Discharge < 5pC

Max. Working Insulation Voltage

Highest Allowable Over Voltage

External Creepage

V

850

6000

7

V

IORM

peak

V

IOTM

peak

mm

Ω

External Clearance

7

Insulation Thickness

0.5

9

RIO

Insulation Resistance at Ts, V = 500V

10

IO

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

4

Typical Performance Curves

Figure 1. LED Forward Voltage vs. Forward Current

Figure 2. On-State Characteristics

= 30mA

800

600

400

200

0

1.6

I

F

T

= 25°C

A

1.5

1.4

1.3

T

= -40°C

= 25°C

= 85°C

A

1.2

1.1

1.0

0.9

0.8

T

A

-200

-400

-600

-800

A

-4

-3

-2

-1

0

1

2

3

4

0.1

1

10

100

I

F

- LED FORWARD CURRENT (mA)

V , ON-STATE VOLTAGE (VOLTS)

TM

Figure 3. Trigger Current vs. Temperature

Figure 4. Leakage Current, I_DRMvs. Temperature

1.3

1.2

1.1

1.0

0.9

0.8

10000

1000

100

10

1

NORMALIZED TO

_A= 25^oC

T

0.1

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

T , AMBIENT TEMPERATURE ( ^oC)

A

T , AMBIENT TEMPERATURE (°C)

A

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

5

Typical Performance Curves ^(Continued)

Figure 6. LED Current Required to Trigger vs. LED Pulse Width

Figure 5. I_DRM2- Leakage in Inhibit State vs. Temperature

1.8

16

NORMALIZED TO

PW >> 100 µs

IN

1.6

1.4

14

12

10

8

I

= RATED I

FT

F

1.2

1.0

0.8

0.6

0.4

6

4

2

-40

-20

0

20

40

60

80

100

0

T , AMBIENT TEMPERATURE (°C)

A

1

10

100

PW , LED TRIGGER PULSE WIDTH (µS)

IN

Figure 7. Holding Current, I_Hvs. Temperature

Figure 8. Inhibit Voltage vs. Temperature

3.2

2.8

2.4

2.0

1.6

1.2

0.8

0.4

0.0

1.3

1.2

1.1

1.0

0.9

0.8

0.7

NORMALIZED TO

T

= 25° C

A

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

T , AMBIENT TEMPERATURE (°C)

A

T , AMBIENT TEMPERATURE (°C)

A

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

6

1. The mercury wetted relay provides a high speed repeated

pulse to the D.U.T.

2. 100x scope probes are used, to allow high speeds and

voltages.

+250 for MOC303XM

+400 for MOC304XM

Vdc

R_TEST

3. The worst-case condition for static dv/dt is established by

triggering the D.U.T. with a normal LED input current, then

R = 10 kΩ

C_TEST

PULSE

INPUT

removing the current. The variable R

allows the dv/dt

TEST

MERCURY

WETTED

RELAY

X100

SCOPE

PROBE

to be gradually increased until the D.U.T. continues to

trigger in response to the applied voltage pulse, even after

the LED current has been removed. The dv/dt is then

decreased until the D.U.T. stops triggering. τ_RCis

measured at this point and recorded.

D.U.T.

Figure 9. Static dv/dt Test Circuit

V

= 400 V

max

V

= 250 V

max

APPLIED VOLTAGE

WAVEFORM

APPLIED VOLTAGE

WAVEFORM

252 V

158 V

0.63 V

τ_RC

252

τ_RC

max

0.63 V

τ_RC

158

RC

max

dv/dt =

=

dv/dt =

=

0 VOLTS

τ_RC

Figure 11. Static dv/dt Test Waveform

(MOC3041M, MOC3042M, MOC3043M)

Figure 10. Static dv/dt Test Waveform

(MOC3031M, MOC3032M, MOC3033M)

Typical circuit (Fig 12, 13) for use when hot line switching is required. In this circuit the “hot” side of the line is switched

and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line.

R

is calculated so that I is equal to the rated I of the part, 5mA for the MOC3033M and MOC3043M, 10mA for

F FT

in

the MOC3032M and MOC3042M, or 15mA for the MOC3031M and MOC3041M. The 39 ohm resistor and 0.01µF

capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and

load used.

R_in

360Ω

180Ω

1

2

6

5

1

2

6

5

HOT

V_CC

HOT

V_CC

MOC3041M

MOC3042M

MOC3043M

MOC3031M

MOC3032M

MOC3033M

39Ω

*

3

4

3

4

240 VAC

115 VAC

0.01

330

1 k

LOAD

NEUTRAL

LOAD

NEUTRAL

For highly inductive loads (power factor < 0.5), change this value to 360 ohms.

*

Figure 13. Hot-Line Switching Application Circuit

(MOC3041M, MOC3042M, MOC3043M)

Figure 12. Hot-Line Switching Application Circuit

(MOC3031M, MOC3032M, MOC3033M)

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

7

115 VAC

R1

D1

1

2

6

5

V_CC

R_in

MOC3031M

MOC3032M

MOC3033M

SCR

180

3

4

R2

D2

LOAD

Figure 14. Inverse-Parallel SCR Driver Circuit

(MOC3031M, MOC3032M, MOC3033M)

Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1

and R2, are optional 1kΩ.

240 VAC

R1

D1

1

2

6

5

V_CC

R_in

MOC3041M

MOC3042M

MOC3043M

SCR

360

3

4

R2

D2

LOAD

Figure 15. Inverse-Parallel SCR Driver Circuit

(MOC3041M, MOC3042M, MOC3043M)

Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors,

R1 and R2, are optional 330Ω.

Note:

This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

8

Package Dimensions

Through Hole

0.4" Lead Spacing

8.13–8.89

6

4

8.13–8.89

6

4

6.10–6.60

Pin 1

1

3

Pin 1

1

3

5.08 (Max.)

3.28–3.53

0.25–0.36

7.62 (Typ.)

5.08 (Max.)

3.28–3.53

0.25–0.36

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.20–0.30

(0.86)

15° (Typ.)

(0.86)

0.41–0.51

0.76–1.14

0.20–0.30

10.16–10.80

1.02–1.78

0.41–0.51

0.76–1.14

1.02–1.78

Surface Mount

(1.78)

8.13–8.89

6

4

(1.52)

(2.54)

(7.49)

6.10–6.60

8.43–9.90

(10.54)

1

3

(0.76)

Pin 1

Rcommended Pad Layout

0.25–0.36

3.28–3.53

5.08

(Max.)

0.20–0.30

0.38 (Min.)

0.16–0.88

(8.13)

2.54 (Bsc)

(0.86)

0.41–0.51

0.76–1.14

1.02–1.78

Note:

All dimensions in mm.

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

9

Ordering Information

Order Entry Identiﬁer

(Example)

Option

Description

No option

MOC3031M

MOC3031SM

Standard Through Hole Device

Surface Mount Lead Bend

Surface Mount; Tape and Reel

0.4" Lead Spacing

S

SR2

T

MOC3031SR2M

MOC3031TM

V

MOC3031VM

VDE 0884

TV

MOC3031TVM

MOC3031SVM

MOC3031SR2VM

VDE 0884, 0.4" Lead Spacing

VDE 0884, Surface Mount

VDE 0884, Surface Mount, Tape and Reel

SV

SR2V

Marking Information

1

2

MOC3031V

X YY Q

6

5

3

4

Deﬁnitions

1

2

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

3

4

5

6

One digit year code, e.g., ‘3’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are

marked with date code ‘325’ or earlier are marked in portrait format.

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

10

Carrier Tape Specification

12.0 ± 0.1

2.0 ± 0.05

4.5 ± 0.20

Ø1.5 MIN

1.75 ± 0.10

4.0 ± 0.1

0.30 ± 0.05

11.5 ± 1.0

24.0 ± 0.3

9.1 ± 0.20

21.0 ± 0.1

Ø1.5 ± 0.1/-0

10.1 ± 0.20

0.1 MAX

User Direction of Feed

Reflow Profile

300

280

260

240

220

200

180

160

140

120

100

80

260°C

>245°C = 42 Sec

Time above

183°C = 90 Sec

°C

1.822°C/Sec Ramp up rate

60

40

33 Sec

20

0

60

120

180

270

360

Time (s)

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

11

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

®

*

AccuPower™

Auto-SPM™

F-PFS™

Power-SPM™

PowerTrench^®

PowerXS™

FRFET^®

The Power Franchise^®

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Global Power Resource^SM

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Programmable Active Droop™

QFET^®

QS™

TinyBoost™

TinyBuck™

Quiet Series™

RapidConfigure™

™

TinyCalc™

Current Transfer Logic™

DEUXPEED^®

Dual Cool™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

TriFault Detect™

TRUECURRENT™*

" SerDes™

Saving our world, 1mW/W/kW at a time™

SignalWise™

SmartMax™

EcoSPARK^®

n

EfficientMax™

ESBC™

MicroPak™

SMART START™

®

SPM^®

MicroPak2™

MillerDrive™

MotionMax™

Motion-SPM™

OptoHiT™

Fairchild^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

OPTOLOGIC^®

UHC^®

FAST^®

OPTOPLANAR^®

Ultra FRFET™

UniFET™

VCX™

FastvCore™

®

SyncFET™

Sync-Lock™

FETBench™

FlashWriter^®

*

PDP SPM™

VisualMax™

XS™

FPS™

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a)

are intended for surgical implant into the body or (b) support or

sustain life, and (c) whose failure to perform when properly used in

accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their

parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed

applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the

proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild

Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors

are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical

and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.

Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global

problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet

Product Status

Definition

Identification

Datasheet contains the design specifications for product development. Specifications may change

in any manner without notice.

Advance Information

Preliminary

Formative / In Design

First Production

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make

changes at any time without notice to improve the design.

No Identification Needed Full Production

Obsolete Not In Production

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I49

MOC303XM, MOC304XM Rev. 1.0.7

www.fairchildsemi.com

11


型号：	MOC3032-M
厂家：	Rochester Electronics
描述：	1 CHANNEL TRIAC OUTPUT WITH ZERO CRSVR OPTOCOUPLER, DIP-6 三端双向交流开关输出元件光电
文件：	总12页 (文件大小：275K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MOC3032-M [ROCHESTER]

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