MOC3043-M [ROCHESTER]
1 CHANNEL TRIAC OUTPUT WITH ZERO CRSVR OPTOCOUPLER, DIP-6;型号: | MOC3043-M |
厂家: | Rochester Electronics |
描述: | 1 CHANNEL TRIAC OUTPUT WITH ZERO CRSVR OPTOCOUPLER, DIP-6 三端双向交流开关 输出元件 光电 |
文件: | 总12页 (文件大小:275K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
September 2010
MOC3031M, MOC3032M, MOC3033M,
MOC3041M, MOC3042M, MOC3043M
6-Pin DIP Zero-Cross Optoisolators Triac Driver Output
(250/400 Volt Peak)
Features
Description
■ Simplifies logic control of 115 VAC power
■ Zero voltage crossing
The MOC303XM and MOC304XM devices consist of a
GaAs infrared emitting diode optically coupled to a
monolithic silicon detector performing the function of a
zero voltage crossing bilateral triac driver.
■ dv/dt of 2000 V/µs typical, 1000 V/µs guaranteed
■ VDE recognized (File # 94766), ordering option V
They are designed for use with a triac in the interface of
logic systems to equipment powered from 115 VAC
lines, such as teletypewriters, CRTs, solid-state relays,
industrial controls, printers, motors, solenoids and
consumer appliances, etc.
(e.g., MOC3043VM)
Applications
■ Solenoid/valve controls
■ Lighting controls
■ Static power switches
■ AC motor drives
■ Temperature controls
■ E.M. contactors
■ AC motor starters
■ Solid state relays
Schematic
Package Outlines
ANODE 1
6
MAIN TERM.
CATHODE
N/C
NC*
2
3
5
4
ZERO
MAIN TERM.
CROSSING
CIRCUIT
*DO NOT CONNECT
(TRIAC SUBSTRATE)
©2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.7
Absolute Maximum Ratings (T = 25°C unless otherwise noted)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameters
Device
Value
Units
TOTAL DEVICE
T
Storage Temperature
All
All
All
-40 to +150
-40 to +85
°C
°C
°C
STG
T
Operating Temperature
Lead Solder Temperature
OPR
T
260 for 10
sec
SOL
T
Junction Temperature Range
All
All
-40 to +100
7500
°C
J
(1)
V
Isolation Surge Voltage
Vac(pk)
ISO
(peak AC voltage, 60Hz, 1 sec. duration, I ≤ 2µA)
I-O
P
Total Device Power Dissipation @ 25°C
Derate above 25°C
All
250
mW
D
2.94
mW/°C
EMITTER
I
Continuous Forward Current
Reverse Voltage
All
All
All
60
6
mA
V
F
V
P
R
Total Power Dissipation 25°C Ambient
Derate above 25°C
120
1.41
mW
D
mW/°C
DETECTOR
V
Off-State Output Terminal Voltage
MOC3031M/2M/3M
MOC3041M/2M/3M
All
250
400
1
V
A
DRM
I
Peak Repetitive Surge Current
(PW = 100µs, 120 pps)
TSM
P
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
All
All
150
mW
D
1.76
mW/°C
Note
1. Isolation surge voltage, V , is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are
ISO
common, and Pins 4, 5 and 6 are common.
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
2
Electrical Characteristics (T = 25°C Unless otherwise specified)
A
Individual Component Characteristics
Symbol
EMITTER
Parameters
Test Conditions
Device Min. Typ. Max. Units
V
Input Forward Voltage
I = 30mA
All
All
1.25
0.01
1.5
V
F
F
I
Reverse Leakage Current
V = 6V
100
µA
R
R
DETECTOR
(2)
I
Peak Blocking Current,
Either Direction
Rated V
, I = 0
All
All
All
100
3
nA
V
DRM1
DRM
F
V
Peak On-State Voltage,
Either Direction
I
= 100mA peak, I = 0
1.8
TM
TM
F
(4)
dv/dt
Critical Rate of Rise of
Off-State Voltage
I = 0 (Figure 9)
1000
V/µs
F
Transfer Characteristics
Symbol DC Characteristics
Test Conditions
Device
Min. Typ. Max. Units
I
LED Trigger Current
Main Terminal
Voltage = 3V
MOC3031M/
MOC3041M
15
10
5
mA
FT
(3)
MOC3032M/
MOC3042M
MOC3033M/
MOC3043M
I
Holding Current,
Either Direction
All
400
µA
H
Zero Crossing Characteristics
Symbol
Characteristics
Test Conditions
Device Min. Typ. Max. Units
V
Inhibit Voltage
I = rated I , MT1-MT2
All
20
V
IH
F
FT
voltage above which device
will not trigger
off-state
I
Leakage in Inhibited
State
I = rated I , rated V
off-state
All
2
mA
DRM2
F
FT
DRM
Notes:
2. Test voltage must be applied within dv/dt rating.
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended
F
FT
operating I lies between max I (15mA for MOC3031M & MOC3041M, 10mA for MOC3032M & MOC3042M,
F
FT
5mA for MOC3033M & MOC3043M) and absolute max I (60mA).
F
4. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
3
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89
Table 1
For Rated Main Voltage < 150Vrms
For Rated Main voltage < 300Vrms
Climatic Classification
I-IV
I-IV
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
CTI
175
V
Input to Output Test Voltage, Method b,
1594
V
V
PR
peak
V
x 1.875 = V , 100% Production Test
IORM
PR
with tm = 1 sec, Partial Discharge < 5pC
Input to Output Test Voltage, Method a,
1275
peak
V
x 1.5 = V , Type and Sample Test
PR
IORM
with tm = 60 sec, Partial Discharge < 5pC
Max. Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
V
850
6000
7
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
Ω
External Clearance
7
Insulation Thickness
0.5
9
RIO
Insulation Resistance at Ts, V = 500V
10
IO
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
4
Typical Performance Curves
Figure 1. LED Forward Voltage vs. Forward Current
Figure 2. On-State Characteristics
= 30mA
800
600
400
200
0
1.6
I
F
T
= 25°C
A
1.5
1.4
1.3
T
= -40°C
= 25°C
= 85°C
A
1.2
1.1
1.0
0.9
0.8
T
T
A
-200
-400
-600
-800
A
-4
-3
-2
-1
0
1
2
3
4
0.1
1
10
100
I
F
- LED FORWARD CURRENT (mA)
V , ON-STATE VOLTAGE (VOLTS)
TM
Figure 3. Trigger Current vs. Temperature
Figure 4. Leakage Current, IDRM vs. Temperature
1.3
1.2
1.1
1.0
0.9
0.8
10000
1000
100
10
1
NORMALIZED TO
A = 25oC
T
0.1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE ( oC)
A
T , AMBIENT TEMPERATURE (°C)
A
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
5
Typical Performance Curves (Continued)
Figure 6. LED Current Required to Trigger vs. LED Pulse Width
Figure 5. IDRM2 - Leakage in Inhibit State vs. Temperature
1.8
16
NORMALIZED TO
PW >> 100 µs
IN
1.6
1.4
14
12
10
8
I
= RATED I
FT
F
1.2
1.0
0.8
0.6
0.4
6
4
2
-40
-20
0
20
40
60
80
100
0
T , AMBIENT TEMPERATURE (°C)
A
1
10
100
PW , LED TRIGGER PULSE WIDTH (µS)
IN
Figure 7. Holding Current, IH vs. Temperature
Figure 8. Inhibit Voltage vs. Temperature
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
1.3
1.2
1.1
1.0
0.9
0.8
0.7
NORMALIZED TO
T
= 25° C
A
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
T , AMBIENT TEMPERATURE (°C)
A
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
6
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
+250 for MOC303XM
+400 for MOC304XM
Vdc
RTEST
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
R = 10 kΩ
CTEST
PULSE
INPUT
removing the current. The variable R
allows the dv/dt
TEST
MERCURY
WETTED
RELAY
X100
SCOPE
PROBE
to be gradually increased until the D.U.T. continues to
trigger in response to the applied voltage pulse, even after
the LED current has been removed. The dv/dt is then
decreased until the D.U.T. stops triggering. τRC is
measured at this point and recorded.
D.U.T.
Figure 9. Static dv/dt Test Circuit
V
= 400 V
max
V
= 250 V
max
APPLIED VOLTAGE
WAVEFORM
APPLIED VOLTAGE
WAVEFORM
252 V
158 V
0.63 V
τRC
252
τRC
max
0.63 V
τRC
158
RC
max
dv/dt =
=
dv/dt =
=
0 VOLTS
0 VOLTS
τRC
τRC
Figure 11. Static dv/dt Test Waveform
(MOC3041M, MOC3042M, MOC3043M)
Figure 10. Static dv/dt Test Waveform
(MOC3031M, MOC3032M, MOC3033M)
Typical circuit (Fig 12, 13) for use when hot line switching is required. In this circuit the “hot” side of the line is switched
and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line.
R
is calculated so that I is equal to the rated I of the part, 5mA for the MOC3033M and MOC3043M, 10mA for
F FT
in
the MOC3032M and MOC3042M, or 15mA for the MOC3031M and MOC3041M. The 39 ohm resistor and 0.01µF
capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and
load used.
Rin
Rin
360Ω
180Ω
1
2
6
5
1
2
6
5
HOT
VCC
HOT
VCC
MOC3041M
MOC3042M
MOC3043M
MOC3031M
MOC3032M
MOC3033M
39Ω
39Ω
*
*
3
4
3
4
240 VAC
115 VAC
0.01
0.01
330
1 k
LOAD
NEUTRAL
LOAD
NEUTRAL
For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
*
*
Figure 13. Hot-Line Switching Application Circuit
(MOC3041M, MOC3042M, MOC3043M)
Figure 12. Hot-Line Switching Application Circuit
(MOC3031M, MOC3032M, MOC3033M)
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
7
115 VAC
R1
D1
1
2
6
5
VCC
Rin
MOC3031M
MOC3032M
MOC3033M
SCR
SCR
180
3
4
R2
D2
LOAD
Figure 14. Inverse-Parallel SCR Driver Circuit
(MOC3031M, MOC3032M, MOC3033M)
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1
and R2, are optional 1kΩ.
240 VAC
R1
D1
1
2
6
5
VCC
Rin
MOC3041M
MOC3042M
MOC3043M
SCR
SCR
360
3
4
R2
D2
LOAD
Figure 15. Inverse-Parallel SCR Driver Circuit
(MOC3041M, MOC3042M, MOC3043M)
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors,
R1 and R2, are optional 330Ω.
Note:
This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
8
Package Dimensions
Through Hole
0.4" Lead Spacing
8.13–8.89
6
4
8.13–8.89
6
4
6.10–6.60
6.10–6.60
Pin 1
1
3
Pin 1
1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
7.62 (Typ.)
5.08 (Max.)
3.28–3.53
0.25–0.36
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.20–0.30
(0.86)
15° (Typ.)
(0.86)
0.41–0.51
0.76–1.14
0.20–0.30
10.16–10.80
1.02–1.78
0.41–0.51
0.76–1.14
1.02–1.78
Surface Mount
(1.78)
8.13–8.89
6
4
(1.52)
(2.54)
(7.49)
6.10–6.60
8.43–9.90
(10.54)
1
3
(0.76)
Pin 1
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.20–0.30
0.38 (Min.)
0.16–0.88
(8.13)
2.54 (Bsc)
(0.86)
0.41–0.51
0.76–1.14
1.02–1.78
Note:
All dimensions in mm.
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
9
Ordering Information
Order Entry Identifier
(Example)
Option
Description
No option
MOC3031M
MOC3031SM
Standard Through Hole Device
Surface Mount Lead Bend
Surface Mount; Tape and Reel
0.4" Lead Spacing
S
SR2
T
MOC3031SR2M
MOC3031TM
V
MOC3031VM
VDE 0884
TV
MOC3031TVM
MOC3031SVM
MOC3031SR2VM
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape and Reel
SV
SR2V
Marking Information
1
2
MOC3031V
X YY Q
6
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are
marked with date code ‘325’ or earlier are marked in portrait format.
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
10
Carrier Tape Specification
12.0 ± 0.1
2.0 ± 0.05
4.5 ± 0.20
Ø1.5 MIN
1.75 ± 0.10
4.0 ± 0.1
0.30 ± 0.05
11.5 ± 1.0
24.0 ± 0.3
9.1 ± 0.20
21.0 ± 0.1
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
User Direction of Feed
Reflow Profile
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
11
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
®
*
AccuPower™
Auto-SPM™
F-PFS™
Power-SPM™
PowerTrench®
PowerXS™
FRFET®
The Power Franchise®
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
Programmable Active Droop™
QFET®
QS™
TinyBoost™
TinyBuck™
Quiet Series™
RapidConfigure™
™
TinyCalc™
Current Transfer Logic™
DEUXPEED®
Dual Cool™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
" SerDes™
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
EcoSPARK®
n
EfficientMax™
ESBC™
MicroPak™
SMART START™
®
SPM®
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptoHiT™
Fairchild®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
OPTOLOGIC®
UHC®
FAST®
OPTOPLANAR®
Ultra FRFET™
UniFET™
VCX™
FastvCore™
®
SyncFET™
Sync-Lock™
FETBench™
FlashWriter®
*
PDP SPM™
VisualMax™
XS™
FPS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a)
are intended for surgical implant into the body or (b) support or
sustain life, and (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet
Product Status
Definition
Identification
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Advance Information
Preliminary
Formative / In Design
First Production
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I49
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
www.fairchildsemi.com
11
相关型号:
MOC3043-SMT&R
Optocoupler - Trigger Device Output, 1 CHANNEL TRIAC OUTPUT WITH ZERO CRSVR OPTOCOUPLER, ROHS COMPLIANT, SURFACE MOUNT, DIP-6
ISOCOM
MOC3043F-M
Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6
FAIRCHILD
MOC3043FR2-M
Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6
FAIRCHILD
MOC3043FR2V-M
Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6
FAIRCHILD
MOC3043FV-M
Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6
FAIRCHILD
©2020 ICPDF网 联系我们和版权申明