SMS15T1 [ROCHESTER]

350 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, CASE 318F-05, SC-74, SC-59ML, 6 PIN;


型号：	SMS15T1
厂家：	Rochester Electronics
描述：	350 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, CASE 318F-05, SC-74, SC-59ML, 6 PIN 电视
文件：	总5页 (文件大小：735K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMS05T1 Series

SC−74 Quad Transient

Voltage Suppressor

for ESD Protection

This quad monolithic silicon voltage suppressor is designed for

applications requiring transient overvoltage protection capability. It is

intended for use in voltage and ESD sensitive equipment such as

computers, printers, business machines, communication systems and

other applications. This quad device provides superior surge

protection over current quad Zener MMQA series by providing up to

350 watts peak power.

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SC−74 QUAD TRANSIENT

VOLTAGE SUPPRESSOR

350 WATTS PEAK POWER

5 VOLTS

Features

• SC-74 Package Allows Four Separate Unidirectional Configurations

• Peak Power − 350 W, 8 x 20 mS

• ESD Rating of Class N (Exceeding 25 kV) per

the Human Body Model

SC−74

CASE 318F

STYLE 1

• ESD Rating:

IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact)

IEC 61000−4−4 (EFT) 40 A (5/50 ns)

IEC 61000−4−5 (lightning) 23 A (8/20 ms)

• UL Flammability Rating of 94 V−0

MARKING DIAGRAM

• Pb−Free Packages are Available

xxx M G

Typical Applications

• Hand Held Portable Applications such as Cell Phones, Pagers,

Notebooks and Notebook Computers

xxx = Specific Device Code

= Date Code*

= Pb−Free Package

MAXIMUM RATINGS

(Note: Microdot may be in either location)

*Date Code orientation and/or position may

vary depending upon manufacturing location.

Rating

Symbol

Value

Unit

Peak Power Dissipation

350

8 x 20 mS @ T = 25°C (Note 1)

PIN ASSIGNMENT

Total Power Dissipation on FR−5 Board

225

@ T = 25°C (Note 2)

Derate Above 25°C

1.8

mW/°C

°C/W

PIN 1. CATHODE

2. ANODE

Thermal Resistance,

Junction−to−Ambient

556

3. CATHODE

4. CATHODE

5. ANODE

Junction and Storage

Temperature Range

T , T

−55 to +150

260

°C

stg

6. CATHODE

Lead Solder Temperature

Maximum 10 Seconds Duration

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform

2. FR−5 = 1.0 x 0.75 x 0.62 in.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

November, 2006 − Rev. 7

SMS05T1/D

SMS05T1 Series

ELECTRICAL CHARACTERISTICS

(T = 25°C unless otherwise noted)

Symbol

Parameter

Maximum Reverse Peak Pulse Current

Clamping Voltage @ I

Working Peak Reverse Voltage

RWM

Maximum Reverse Leakage Current @ V

RWM

Breakdown Voltage @ I

Test Current

BR RWM

Maximum Temperature Coefficient of V

Forward Current

Forward Voltage @ I

Maximum Zener Impedance @ I

Reverse Current

Uni−Directional

Maximum Zener Impedance @ I

ELECTRICAL CHARACTERISTICS − UNIDIRECTIONAL

Max

Reverse

Breakdown

Leakage

Voltage

Current

Max Reverse Voltage Max Reverse Voltage

(Clamping Voltage) (Clamping Voltage)

At Specified Reverse At Specified Reverse

Surge Current (I Surge Current (I

Capacitance

@ 0 Volt Bias,

1 MHz

)

RSM

(8x20 ms) (8x20 ms) (8x20 ms) (8x20 ms)

(V)

(pF)

Device

Marking

Min Nom Max (mA) (mA) (V)

(A)

5.0

(V)

9.8

(A)

(V)

Min

250

Max

400

150

125

Device

SMS05T1

SMS12T1

SMS15T1

SMS24T1

5V0

12V

15V

24V

6.0

−

7.2

1.0

5.0

15.5

23.0

29.0

44.0

13.3

16.7

26.7

19.0

24.0

40.0

18.5

ORDERING INFORMATION

Device

†

Package

Shipping

SMS05T1

SC−74

3000 / Tape & Reel

SMS05T1G

SC−74

(Pb−Free)

SMS12T1

SC−74

SMS12T1G

SC−74

(Pb−Free)

SMS15T1

SC−74

SMS15T1G

SC−74

(Pb−Free)

SMS24T1

SC−74

SMS24T1G

SC−74

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

http://onsemi.com

SMS05T1 Series

110

100

0.1

0.01

0.1

100

1000

100

125

150

t , PULSE DURATION (ms)

T , AMBIENT TEMPERATURE (°C)

Figure 1. Non−Repetitive Peak Pulse Power

versus Pulse Time

Figure 2. Power Derating Curve

110

100

WAVEFORM

PARAMETERS

t = 8 ms

PARAMETERS

t = 8 ms

SMS24

t = 20 ms

c−t

SMS15

t = I /2

SMS12

SMS05

t, TIME (ms)

, PEAK PULSE CURRENT (A)

Figure 3. Pulse Waveform

Figure 4. Clamping Voltage versus

Peak Pulse Current

300

250

200

150

100

PULSE

WAVEFORM

t = 8 ms

T = 25°C

t = 20 ms

8 X 20 ms SURGE

SMS05

SMS12

SMS15

SMS24

I , FORWARD CURRENT (A)

V , REVERSE VOLTAGE (V)

Figure 5. 8 x 20 ms V_F

Figure 6. Typical Capacitance (SMS05 Series)

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SMS05T1 Series

PACKAGE DIMENSIONS

SC−74 (SC−59ML)

CASE 318F−05

ISSUE M

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. 318F−01, −02, −03, −04 OBSOLETE. NEW

STANDARD 318F−05.

MILLIMETERS

INCHES

NOM

0.039

0.002

0.015

0.007

0.118

0.059

0.037

0.016

0.108

−

DIM

MIN

0.90

0.01

0.25

0.10

2.90

1.30

0.85

0.20

2.50

0°

NOM

1.00

0.06

0.37

0.18

3.00

1.50

0.95

0.40

2.75

−

MAX

1.10

0.10

0.50

0.26

3.10

1.70

1.05

0.60

3.00

10°

MIN

0.035

0.001

0.010

0.004

0.114

0.051

0.034

0.008

0.099

0°

MAX

0.043

0.004

0.020

0.010

0.122

0.067

0.041

0.024

0.118

10°

0.05 (0.002)

STYLE 1:

PIN 1. CATHODE

2. ANODE

3. CATHODE

4. CATHODE

5. ANODE

6. CATHODE

SOLDERING FOOTPRINT*

2.4

0.094

0.95

0.037

1.9

0.074

0.95

0.037

0.7

0.028

1.0

0.039

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

For additional information, please contact your local

Sales Representative

SMS05T1/D

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SMS15T1 [ROCHESTER]

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