SN7408N3 [ROCHESTER]
AND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, PDIP14, PLASTIC, MS-001AA, DIP-14;型号: | SN7408N3 |
厂家: | Rochester Electronics |
描述: | AND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, PDIP14, PLASTIC, MS-001AA, DIP-14 栅 光电二极管 逻辑集成电路 |
文件: | 总22页 (文件大小:1175K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2015
PACKAGING INFORMATION
Orderable Device
JM38510/08003BCA
JM38510/08003BDA
JM38510/08003BDA
JM38510/31004B2A
JM38510/31004B2A
JM38510/31004BCA
JM38510/31004BCA
JM38510/31004BDA
JM38510/31004BDA
JM38510/31004SCA
JM38510/31004SCA
JM38510/31004SDA
JM38510/31004SDA
M38510/08003BCA
M38510/08003BCA
M38510/08003BDA
M38510/08003BDA
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
CDIP
CFP
J
14
14
14
20
20
14
14
14
14
14
14
14
14
14
14
14
14
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JM38510/
08003BCA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
W
W
FK
FK
J
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A42
JM38510/
08003BDA
CFP
A42
JM38510/
08003BDA
LCCC
LCCC
CDIP
CDIP
CFP
POST-PLATE
POST-PLATE
A42
JM38510/
31004B2A
JM38510/
31004B2A
JM38510/
31004BCA
J
A42
JM38510/
31004BCA
W
W
J
A42
JM38510/
31004BDA
CFP
A42
JM38510/
31004BDA
CDIP
CDIP
CFP
A42
JM38510/
31004SCA
J
A42
JM38510/
31004SCA
W
W
J
A42
JM38510/
31004SDA
CFP
A42
JM38510/
31004SDA
CDIP
CDIP
CFP
A42
JM38510/
08003BCA
J
A42
JM38510/
08003BCA
W
W
A42
JM38510/
08003BDA
CFP
A42
JM38510/
08003BDA
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
M38510/31004B2A
M38510/31004B2A
M38510/31004BCA
M38510/31004BCA
M38510/31004BDA
M38510/31004BDA
M38510/31004SCA
M38510/31004SCA
M38510/31004SDA
M38510/31004SDA
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
FK
20
20
14
14
14
14
14
14
14
14
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JM38510/
31004B2A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
1
1
1
1
1
1
1
1
1
POST-PLATE
A42
JM38510/
31004B2A
JM38510/
31004BCA
J
A42
JM38510/
31004BCA
W
W
J
A42
JM38510/
31004BDA
CFP
A42
JM38510/
31004BDA
CDIP
CDIP
CFP
A42
JM38510/
31004SCA
J
A42
JM38510/
31004SCA
W
W
A42
JM38510/
31004SDA
CFP
A42
JM38510/
31004SDA
SN54LS08J
SN54LS08J
SN54S08J
SN54S08J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
CDIP
J
J
J
J
14
14
14
14
1
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
SN54LS08J
SN54LS08J
SN54S08J
SN54S08J
SN7408N
SN7408N
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
PDIP
SOIC
N
N
N
N
D
14
14
14
14
14
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
SN7408N3
SN7408N3
SN74LS08D
Call TI
Call TI
Call TI
Call TI
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LS08
LS08
SN74LS08D
ACTIVE
SOIC
D
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
SN74LS08DBR
SN74LS08DBR
SN74LS08DE4
SN74LS08DE4
SN74LS08DG4
SN74LS08DG4
SN74LS08DR
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DB
14
14
14
14
14
14
14
14
14
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LS08
LS08
LS08
LS08
LS08
LS08
LS08
LS08
LS08
LS08
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DB
D
2000
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
SN74LS08DR
D
Green (RoHS
& no Sb/Br)
SN74LS08DRE4
SN74LS08DRE4
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
SN74LS08J
SN74LS08J
SN74LS08N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
N
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS08N
SN74LS08N
SN74LS08N
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS08N3
SN74LS08N3
SN74LS08NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS08N
SN74LS08N
74LS08
SN74LS08NE4
SN74LS08NSR
SN74LS08NSR
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
N
14
14
14
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
NS
NS
2000
2000
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
74LS08
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
SN74S08D
SN74S08D
ACTIVE
SOIC
SOIC
D
14
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
S08
S08
ACTIVE
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
SN74S08J
SN74S08J
SN74S08N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
N
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74S08N
SN74S08N
SN74S08N
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S08N3
SN74S08N3
SNJ54LS08FK
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
LCCC
N
N
14
14
20
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
FK
1
1
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
08FK
SNJ54LS08FK
ACTIVE
LCCC
FK
20
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
08FK
SNJ54LS08J
SNJ54LS08J
SNJ54LS08W
SNJ54LS08W
SNJ54S08FK
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CFP
J
J
14
14
14
14
20
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
SNJ54LS08J
SNJ54LS08J
SNJ54LS08W
SNJ54LS08W
W
W
FK
A42
CFP
A42
LCCC
POST-PLATE
SNJ54S
08FK
SNJ54S08FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
08FK
SNJ54S08J
SNJ54S08J
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
SNJ54S08J
SNJ54S08J
SNJ54S08W
SNJ54S08W
LIFEBUY
LIFEBUY
CFP
CFP
W
W
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
SNJ54S08W
SNJ54S08W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2015
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS08, SN54LS08-SP, SN54S08, SN74LS08, SN74S08 :
Catalog: SN74LS08, SN54LS08, SN74S08
•
Military: SN54LS08, SN54S08
•
Space: SN54LS08-SP
•
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2015
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
•
•
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LS08DBR
SN74LS08DR
SSOP
SOIC
DB
D
14
14
2000
2500
330.0
330.0
16.4
16.4
8.2
6.5
6.6
9.0
2.5
2.1
12.0
8.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LS08DBR
SN74LS08DR
SSOP
SOIC
DB
D
14
14
2000
2500
367.0
367.0
367.0
367.0
38.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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