SN74HC126DTG4 [ROCHESTER]
Bus Driver, HC/UH Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, GREEN, PLASTIC, SOIC-14;![SN74HC126DTG4](http://pdffile.icpdf.com/pdf2/p00256/img/icpdf/SN74HC126PWR_1548310_icpdf.jpg)
型号: | SN74HC126DTG4 |
厂家: | ![]() |
描述: | Bus Driver, HC/UH Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, GREEN, PLASTIC, SOIC-14 驱动 光电二极管 逻辑集成电路 |
文件: | 总20页 (文件大小:880K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SCLS103E − MARCH 1984 − REVISED JULY 2003
D
D
Wide Operating Voltage Range of 2 V to 6 V
D
D
D
Typical t = 11 ns
pd
6-mA Output Drive at 5 V
High-Current 3-State Outputs Interface
Directly With System Bus or Can Drive Up
To 15 LSTTL Loads
Low Input Current of 1 µA Max
D
Low Power Consumption, 80-µA Max I
CC
SN54HC126 . . . FK PACKAGE
(TOP VIEW)
SN54HC126 . . . J OR W PACKAGE
SN74HC126 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
1OE
1A
V
CC
13 4OE
1
2
3
4
5
6
7
14
3
2
1
20 19
18
4A
NC
4Y
1Y
NC
4
5
6
7
8
12
11
10
9
1Y
4A
17
16
2OE
2A
4Y
2OE
NC
3OE
3A
15 NC
14
9 10 11 12 13
2Y
3OE
2A
8
GND
3Y
NC − No internal connection
description/ordering information
These quadruple bus buffer gates feature independent line drivers with 3-state outputs. Each output is disabled
when the associated output-enable (OE) input is low.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pullup
resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube of 25
Tube of 50
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HC126N
SN74HC126N
SN74HC126D
SN74HC126DR
SN74HC126DT
SN74HC126NSR
SN74HC126DBR
SN74HC126PW
SN74HC126PWR
SN74HC126PWT
SNJ54HC126J
SNJ54HC126W
SNJ54HC126FK
HC126
SOP − NS
HC126
HC126
−40°C to 85°C
SSOP − DB
TSSOP − PW
HC126
CDIP − J
CFP − W
LCCC − FK
SNJ54HC126J
SNJ54HC126W
SNJ54HC126FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢛ ꢝ ꢨ ꢠ ꢟꢫ ꢦꢥ ꢣꢤ ꢥꢟ ꢡꢨ ꢪꢜ ꢢꢝ ꢣ ꢣꢟ ꢲꢘ ꢑꢚ ꢐꢏ ꢔ ꢚꢙꢳꢂ ꢙꢂꢉ ꢢꢪꢪ ꢨꢢ ꢠ ꢢ ꢡꢧ ꢣꢧꢠ ꢤ ꢢ ꢠ ꢧ ꢣꢧ ꢤꢣꢧ ꢫ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢋꢌ ꢍ ꢎꢏ ꢌ ꢐꢑ ꢒ ꢓꢌ ꢀ ꢓꢌ ꢔꢔ ꢒꢏ ꢕ ꢍꢖꢒ ꢀ
ꢗꢘ ꢖ ꢄ ꢙ ꢚꢀꢖꢍꢖ ꢒ ꢛꢌꢖ ꢐꢌ ꢖꢀ
SCLS103E − MARCH 1984 − REVISED JULY 2003
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
H
L
H
H
L
H
L
X
Z
logic diagram (positive logic)
1
10
1OE
3OE
3A
2
3
6
9
8
1A
1Y
2Y
3Y
4Y
4
13
12
2OE
4OE
4A
5
11
2A
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS103E − MARCH 1984 − REVISED JULY 2003
recommended operating conditions (see Note 3)
SN54HC126
MIN NOM
SN74HC126
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC126
SN74HC126
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V = V or V
IH
V
OH
OL
I
IL
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V
V = V or V
V
I
IH
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
5
OL
= 7.8 mA
0.4
OL
I
I
I
V = V
I
or 0
6 V
1000
10
nA
µA
µA
pF
I
CC
V
O
= V
or 0
6 V
0.01
OZ
CC
CC
V = V
I
or 0,
I
O
= 0
6 V
160
10
80
CC
C
2 V to 6 V
3
10
10
i
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢋꢌ ꢍ ꢎꢏ ꢌ ꢐꢑ ꢒ ꢓꢌ ꢀ ꢓꢌ ꢔꢔ ꢒꢏ ꢕ ꢍꢖꢒ ꢀ
ꢗꢘ ꢖ ꢄ ꢙ ꢚꢀꢖꢍꢖ ꢒ ꢛꢌꢖ ꢐꢌ ꢖꢀ
SCLS103E − MARCH 1984 − REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
47
SN54HC126
SN74HC126
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
120
24
MIN
MAX
180
36
MIN
MAX
150
30
2 V
4.5 V
6 V
14
t
t
t
t
A
Y
Y
ns
pd
en
dis
t
11
20
31
26
2 V
57
120
24
180
36
150
30
4.5 V
6 V
16
OE
OE
ns
ns
ns
12
20
31
26
2 V
35
120
24
180
36
150
30
4.5 V
6 V
17
Y
15
20
31
26
2 V
28
60
90
75
Any
4.5 V
6 V
8
12
18
15
6
10
15
13
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
67
SN54HC126
SN74HC126
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
150
30
MIN
MAX
225
45
MIN
MAX
188
38
2 V
4.5 V
6 V
19
t
t
t
A
Y
Y
ns
pd
en
t
15
25
39
33
2 V
100
20
135
27
202
40
169
36
4.5 V
6 V
OE
ns
ns
17
23
36
30
2 V
45
210
42
315
63
265
53
Any
4.5 V
6 V
17
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per gate
No load
45
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢗ ꢘꢖ ꢄ ꢙ ꢚꢀꢖꢍꢖ ꢒ ꢛ ꢌꢖ ꢐ ꢌꢖ
SCLS103E − MARCH 1984 − REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
L
S1
S2
L
50 pF
or
150 pF
S1
S2
t
t
Open
Closed
Closed
Open
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
L
From Output
Under Test
PZL
t
t
Open
Closed
Open
PHZ
PLZ
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
V
CC
Input
50%
50%
0 V
t
t
PLH
PHL
90%
V
V
OH
In-Phase
Output
90%
50%
10%
50%
10%
OL
t
t
r
f
f
V
CC
t
t
PLH
PHL
90%
Output
Control
50%
50%
V
V
OH
90%
t
0 V
Out-of-Phase
Output
50%
10%
50%
10%
t
t
PLZ
PZL
OL
t
≈V
CC
r
Output
Waveform 1
(See Note B)
50%
50%
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
10%
V
OL
OH
t
t
PZH
PHZ
V
CC
V
Output
Waveform 2
(See Note B)
90%
t
90%
90%
Input
50%
10%
50%
10%
0 V
≈0 V
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-86848012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
86848012A
SNJ54HC
126FK
5962-8684801CA
ACTIVE
CDIP
J
14
1
TBD
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8684801CA
SNJ54HC126J
SN54HC126J
SN74HC126D
ACTIVE
ACTIVE
CDIP
SOIC
J
14
14
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HC126J
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC126
SN74HC126DBLE
SN74HC126DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
SN74HC126N
SN74HC126DBRE4
SN74HC126DBRG4
SN74HC126DE4
SN74HC126DG4
SN74HC126DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
D
14
14
14
14
14
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
250
250
250
25
Green (RoHS
& no Sb/Br)
SN74HC126DRE4
SN74HC126DRG4
SN74HC126DT
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
SN74HC126DTE4
SN74HC126DTG4
SN74HC126N
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
N
Pb-Free
(RoHS)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC126N3
SN74HC126NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
25
2000
2000
2000
90
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC126N
SN74HC126NSR
SN74HC126NSRE4
SN74HC126NSRG4
SN74HC126PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
14
14
14
14
14
14
14
14
14
14
14
14
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
HC126
SO
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
PW
PW
PW
PW
PW
PW
PW
PW
FK
Green (RoHS
& no Sb/Br)
SN74HC126PWE4
SN74HC126PWG4
SN74HC126PWR
SN74HC126PWRE4
SN74HC126PWRG4
SN74HC126PWT
SN74HC126PWTE4
SN74HC126PWTG4
SNJ54HC126FK
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
5962-
86848012A
SNJ54HC
126FK
SNJ54HC126J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8684801CA
SNJ54HC126J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC126, SN74HC126 :
Catalog: SN74HC126
•
Military: SN54HC126
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC126DBR
SN74HC126DR
SN74HC126DT
SN74HC126NSR
SN74HC126PWR
SN74HC126PWT
SSOP
SOIC
DB
D
14
14
14
14
14
14
2000
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
12.4
12.4
8.2
6.5
6.5
8.2
6.9
6.9
6.6
9.0
9.0
10.5
5.6
5.6
2.5
2.1
2.1
2.5
1.6
1.6
12.0
8.0
16.0
16.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
D
8.0
SO
NS
PW
PW
2000
2000
250
12.0
8.0
TSSOP
TSSOP
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC126DBR
SN74HC126DR
SN74HC126DT
SN74HC126NSR
SN74HC126PWR
SN74HC126PWT
SSOP
SOIC
DB
D
14
14
14
14
14
14
2000
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
38.0
35.0
35.0
SOIC
D
SO
NS
PW
PW
2000
2000
250
TSSOP
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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