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SN74LS642-1DW [ROCHESTER]

LS SERIES, 8-BIT TRANSCEIVER, INVERTED OUTPUT, PDSO20, SO-20;
SN74LS642-1DW
型号： SN74LS642-1DW
厂家： Rochester Electronics    Rochester Electronics
描述：

LS SERIES, 8-BIT TRANSCEIVER, INVERTED OUTPUT, PDSO20, SO-20

光电二极管 输出元件 逻辑集成电路
文件： 总25页 (文件大小：1719K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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SN54LS640 THRU SN54LS642, SN54LS644, SN54LS645  
SN74LS640 THRU SN74LS642, SN74LS644, SN74LS645  
OCTAL BUS TRANSCEIVRS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
Copyright 1988, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS640 THRU SN54LS642, SN54LS644, SN54LS645  
SN74LS640 THRU SN74LS642, SN74LS644, SN74LS645  
OCTAL BUS TRANSCEIVRS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS640 THRU SN54LS642, SN54LS644, SN54LS645  
SN74LS640 THRU SN74LS642, SN74LS644, SN74LS645  
OCTAL BUS TRANSCEIVRS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS640, SN54LS645  
SN74LS640, SN74LS645  
OCTAL BUS TRANSCEIVRS WITH 3-STATE OUTPUTS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS640, SN54LS645  
SN74LS640, SN74LS645  
OCTAL BUS TRANSCEIVRS WITH 3-STATE OUTPUTS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS640, SN54LS645  
SN74LS640, SN74LS645  
OCTAL BUS TRANSCEIVRS WITH 3-STATE OUTPUTS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS641, SN54LS642, SN54LS644  
SN74LS641, SN74LS642, SN74LS644  
OCTAL BUS TRANSCEIVRS WITH OPEN-COLLECTOR OUTPUTS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
SN54LS641, SN54LS642, SN54LS644  
SN74LS641, SN74LS642, SN74LS644  
OCTAL BUS TRANSCEIVRS WITH OPEN-COLLECTOR OUTPUTS  
SDLS189 – APRIL 1979 – REVISED MARCH 1988  
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
5962-8416101VRA  
ACTIVE  
CDIP  
CFP  
J
20  
20  
20  
20  
25  
1
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
-55 to 125 5962-8416101VR  
A
SNV54LS640J  
5962-8416101VSA  
84161012A  
ACTIVE  
ACTIVE  
W
Call TI  
Call TI  
-55 to 125 5962-8416101VS  
A
SNV54LS640W  
LCCC  
FK  
-55 to 125 84161012A  
SNJ54LS  
640FK  
8416101RA  
8416101SA  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
20  
20  
1
1
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-55 to 125 8416101RA  
SNJ54LS640J  
W
-55 to 125 8416101SA  
SNJ54LS640W  
SN54LS640J  
SN54LS645J  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
20  
20  
20  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
-55 to 125 SN54LS640J  
-55 to 125 SN54LS645J  
SN74LS640-1DW  
DW  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
0 to 70  
0 to 70  
0 to 70  
LS640-1  
LS640-1  
LS640-1  
SN74LS640-1DWE4  
SN74LS640-1DWG4  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
DW  
DW  
20  
20  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
SN74LS640-1DWR  
SN74LS640-1N  
OBSOLETE  
ACTIVE  
SOIC  
PDIP  
DW  
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS640-1N  
SN74LS640-1N  
74LS640-1  
SN74LS640-1NE4  
SN74LS640-1NSR  
SN74LS640-1NSRE4  
SN74LS640-1NSRG4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
20  
20  
20  
20  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
NS  
NS  
NS  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
74LS640-1  
SO  
Green (RoHS  
& no Sb/Br)  
74LS640-1  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
SN74LS640DW  
SN74LS640DWE4  
SN74LS640DWG4  
SN74LS640DWR  
SN74LS640DWRE4  
SN74LS640DWRG4  
SN74LS640N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
DW  
DW  
DW  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
20  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70 LS640  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS640  
25  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS640  
2000  
2000  
2000  
20  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS640  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS640  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS640  
Pb-Free  
(RoHS)  
0 to 70  
SN74LS640N  
SN74LS640N3  
SN74LS640NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
2000  
2000  
2000  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS640N  
74LS640  
74LS640  
74LS640  
LS641-1  
LS641-1  
LS641-1  
LS641-1  
LS641-1  
LS641-1  
SN74LS640NSR  
SN74LS640NSRE4  
SN74LS640NSRG4  
SN74LS641-1DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
NS  
20  
20  
20  
20  
20  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
NS  
Green (RoHS  
& no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
DW  
DW  
DW  
Green (RoHS  
& no Sb/Br)  
SN74LS641-1DWE4  
SN74LS641-1DWG4  
SN74LS641-1DWR  
SN74LS641-1DWRE4  
SN74LS641-1DWRG4  
25  
Green (RoHS  
& no Sb/Br)  
25  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
SN74LS641-1N  
ACTIVE  
PDIP  
N
20  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
0 to 70  
SN74LS641-1N  
SN74LS641-1N3  
SN74LS641-1NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
25  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS641-1N  
LS641  
SN74LS641DW  
SN74LS641DWE4  
SN74LS641DWG4  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
0 to 70  
Green (RoHS  
& no Sb/Br)  
LS641  
Green (RoHS  
& no Sb/Br)  
LS641  
SN74LS641DWR  
SN74LS641DWRE4  
SN74LS641DWRG4  
SN74LS641N  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
SOIC  
SOIC  
SOIC  
PDIP  
DW  
DW  
DW  
N
20  
20  
20  
20  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
LS641  
Call TI  
Call TI  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS641N  
SN74LS641N3  
SN74LS641NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
2000  
2000  
2000  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS641N  
74LS641  
SN74LS641NSR  
SN74LS641NSRE4  
SN74LS641NSRG4  
SN74LS642-1DW  
SN74LS642-1DWE4  
SN74LS642-1DWG4  
SN74LS642-1N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
NS  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
Green (RoHS  
& no Sb/Br)  
74LS641  
SO  
Green (RoHS  
& no Sb/Br)  
74LS641  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
Green (RoHS  
& no Sb/Br)  
LS642-1  
25  
Green (RoHS  
& no Sb/Br)  
LS642-1  
25  
Green (RoHS  
& no Sb/Br)  
LS642-1  
20  
Pb-Free  
(RoHS)  
SN74LS642-1N  
SN74LS642-1N  
SN74LS642-1NE4  
N
20  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
SN74LS642DW  
SN74LS642DWE4  
SN74LS642DWG4  
SN74LS642N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SO  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
20  
20  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70 LS642  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS642  
25  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS642  
20  
Pb-Free  
(RoHS)  
0 to 70  
SN74LS642N  
SN74LS642N  
74LS642  
74LS642  
74LS642  
SN74LS642NE4  
SN74LS642NSR  
SN74LS642NSRE4  
SN74LS642NSRG4  
N
20  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
0 to 70  
NS  
NS  
NS  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
SO  
Green (RoHS  
& no Sb/Br)  
0 to 70  
SO  
Green (RoHS  
& no Sb/Br)  
0 to 70  
SN74LS644-1N  
SN74LS644N  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
SOIC  
N
N
20  
20  
20  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
SN74LS645-1DW  
DW  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
LS645-1  
SN74LS645-1DWE4  
SN74LS645-1DWG4  
SN74LS645-1DWR  
SN74LS645-1DWRE4  
SN74LS645-1DWRG4  
SN74LS645-1N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
DW  
DW  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
LS645-1  
25  
Green (RoHS  
& no Sb/Br)  
LS645-1  
2000  
2000  
2000  
20  
Green (RoHS  
& no Sb/Br)  
LS645-1  
Green (RoHS  
& no Sb/Br)  
LS645-1  
Green (RoHS  
& no Sb/Br)  
LS645-1  
Pb-Free  
(RoHS)  
SN74LS645-1N  
SN74LS645-1N3  
SN74LS645-1NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS645-1N  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
SN74LS645-1NSR  
SN74LS645-1NSRE4  
SN74LS645-1NSRG4  
SN74LS645DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
20  
20  
20  
20  
20  
20  
2000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
74LS645-1  
74LS645-1  
74LS645-1  
LS645  
NS  
Green (RoHS  
& no Sb/Br)  
0 to 70  
SO  
NS  
Green (RoHS  
& no Sb/Br)  
0 to 70  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
Green (RoHS  
& no Sb/Br)  
0 to 70  
SN74LS645DWE4  
SN74LS645DWG4  
25  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS645  
25  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LS645  
SN74LS645DWR  
SN74LS645N  
OBSOLETE  
ACTIVE  
SOIC  
PDIP  
DW  
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS645N  
SN74LS645N3  
SN74LS645NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
20  
20  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
20  
2000  
2000  
2000  
1
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74LS645N  
74LS645  
SN74LS645NSR  
SN74LS645NSRE4  
SN74LS645NSRG4  
SNJ54LS640FK  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
NS  
FK  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70  
0 to 70  
0 to 70  
Green (RoHS  
& no Sb/Br)  
74LS645  
SO  
Green (RoHS  
& no Sb/Br)  
74LS645  
LCCC  
TBD  
-55 to 125 84161012A  
SNJ54LS  
640FK  
SNJ54LS640J  
SNJ54LS640W  
SNJ54LS645FK  
ACTIVE  
ACTIVE  
NRND  
CDIP  
CFP  
J
20  
20  
20  
1
1
1
1
TBD  
TBD  
TBD  
A42  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125 8416101RA  
SNJ54LS640J  
W
FK  
-55 to 125 8416101SA  
SNJ54LS640W  
LCCC  
POST-PLATE  
-55 to 125 SNJ54LS  
645FK  
SNJ54LS645J  
SNJ54LS645W  
ACTIVE  
CDIP  
CFP  
J
20  
20  
TBD  
TBD  
A42  
N / A for Pkg Type  
Call TI  
-55 to 125 SNJ54LS645J  
OBSOLETE  
W
Call TI  
-55 to 125  
Addendum-Page 5  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54LS640, SN54LS640-SP, SN54LS645, SN74LS640, SN74LS645 :  
Catalog: SN74LS640, SN54LS640, SN74LS645  
•
Military: SN54LS640, SN54LS645  
•
Space: SN54LS640-SP  
•
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
•
Addendum-Page 6  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Military - QML certified for Military and Defense Applications  
•
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application  
Addendum-Page 7  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LS640-1NSR  
SN74LS640DWR  
SN74LS640NSR  
SN74LS641-1DWR  
SN74LS641NSR  
SN74LS642NSR  
SN74LS645-1DWR  
SN74LS645-1NSR  
SN74LS645NSR  
SO  
SOIC  
SO  
NS  
DW  
NS  
DW  
NS  
NS  
DW  
NS  
NS  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
24.4  
24.4  
24.4  
24.4  
24.4  
24.4  
24.4  
24.4  
24.4  
8.2  
10.8  
8.2  
13.0  
13.0  
13.0  
13.0  
13.0  
13.0  
13.0  
13.0  
13.0  
2.5  
2.7  
2.5  
2.7  
2.5  
2.5  
2.7  
2.5  
2.5  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
24.0  
24.0  
24.0  
24.0  
24.0  
24.0  
24.0  
24.0  
24.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
SOIC  
SO  
10.8  
8.2  
SO  
8.2  
SOIC  
SO  
10.8  
8.2  
SO  
8.2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LS640-1NSR  
SN74LS640DWR  
SN74LS640NSR  
SN74LS641-1DWR  
SN74LS641NSR  
SN74LS642NSR  
SN74LS645-1DWR  
SN74LS645-1NSR  
SN74LS645NSR  
SO  
SOIC  
SO  
NS  
DW  
NS  
DW  
NS  
NS  
DW  
NS  
NS  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
SOIC  
SO  
SO  
SOIC  
SO  
SO  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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