SN75463PE4 [ROCHESTER]

OR Gate Based Peripheral Driver, 0.5A, BIPolar, PDIP8, 0.300 INCH, PLASTIC, DIP-8;
SN75463PE4
型号: SN75463PE4
厂家: Rochester Electronics    Rochester Electronics
描述:

OR Gate Based Peripheral Driver, 0.5A, BIPolar, PDIP8, 0.300 INCH, PLASTIC, DIP-8

栅 驱动 光电二极管 接口集成电路
文件: 总17页 (文件大小:1107K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
REI Datasheet  
SN55461-2-3, SN75461-2-3  
Dual Peripheral Drivers  
These dual peripheral drivers are functionally interchangeable with SN55451B through SN55453B  
and SN75451B through SN75453B peripheral drivers, but are designed for use in systems that  
require higher breakdown voltages than those devices an provide at the expense of slightly slower  
switching speeds. Typical applications include logic buffers, power drivers, relay drivers, lamp drivers,  
MOS drivers, line drivers, and memory drivers.  
The SN55461/SN75461, SN55462/SN75462, and SN55463/SN75463 are dual peripheral AND,  
NAND, and OR drivers respectively (assuming positive logic), with the output of the gates internally  
connected to the bases of the npn output transistors.  
Quality Overview  
Rochester Electronics  
Manufactured Components  
ISO-9001  
AS9120ꢀcertification  
QualifiedꢀManufacturersꢀListꢀ(QML)ꢀMIL-PRF-38535  
Rochester branded components are  
manufactured using either die/wafers  
purchased from the original suppliers  
or Rochester wafers recreated from the  
originalꢀIP.ꢀAllꢀrecreationsꢀareꢀdoneꢀwithꢀ  
the approval of the OCM.  
Class Q Military  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀClassꢀVꢀSpaceꢀLevel  
QualifiedꢀSuppliersꢀListꢀofꢀDistributorsꢀ(QSLD)  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀRochesterꢀisꢀaꢀcriticalꢀsupplierꢀtoꢀDLAꢀand  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀmeetsꢀallꢀindustryꢀandꢀDLAꢀstandards.  
Partsꢀ areꢀ testedꢀ usingꢀ originalꢀ factoryꢀ  
test programs or Rochester developed  
test solutions to guarantee product  
meets or exceeds the OCM data sheet.  
RochesterElectronics,LLCiscommittedtosupplyingꢀ  
products that satisfy customer expectations for  
quality and are equal to those originally supplied by  
industry manufacturers.  
The original manufacturer’s datasheet accompanying this document reflects the performance  
and specifications of the Rochester manufactured version of this device. Rochester Electronics  
guarantees the performance of its semiconductor products to the original OEM specifications.  
‘Typical’ values are for reference purposes only. Certain minimum or maximum ratings may be  
based on product characterization, design, simulation, or sample testing.  
© 2013 Rochester Electronics, LLC. All Rights Reserved 07112013  
To learn more, please visit www.rocelec.com  
ꢀꢁꢌ ꢂ ꢃ ꢄ ꢅ ꢆ ꢇꢈ ꢉꢊꢆ ꢀ ꢁꢌ ꢂꢃ ꢄ  
ꢏꢆ  
ꢓꢑ  
SLRS022A − DECEMBER 1976 − REVISED OCTOBER 1995  
SN55461, SN55462, SN55463 . . . JG PACKAGE  
SN75461, SN75462, SN75463 . . . D OR P PACKAGE  
(TOP VIEW)  
PERIPHERAL DRIVERS FOR  
HIGH-VOLTAGE, HIGH-CURRENT DRIVER  
APPLICATIONS  
Characterized for Use to 300 mA  
High-Voltage Outputs  
1A  
1B  
V
CC  
1
2
3
4
8
7
6
5
2B  
2A  
2Y  
1Y  
No Output Latch-Up at 30 V (After  
Conducting 300 mA)  
GND  
Medium-Speed Switching  
SN55461, SN55462, SN55463 . . . FK PACKAGE  
(TOP VIEW)  
Circuit Flexibility for Varied Applications  
and Choice of Logic Function  
TTL-Compatible Diode-Clamped Inputs  
Standard Supply Voltages  
3
2
1
20 19  
18  
Plastic DIP (P) With Copper Lead Frame for  
NC  
2B  
NC  
2A  
NC  
1B  
4
5
6
7
8
Cooler Operation and Improved Reliability  
17  
16  
15  
NC  
1Y  
Package Options Include Plastic Small  
Outline Packages, Ceramic Chip Carriers,  
and Standard Plastic and Ceramic 300-mil  
DIPs  
NC  
14 NC  
9 10 11 12 13  
SUMMARY OF SERIES 55461/75461  
DEVICE  
SN55461  
SN55462  
SN55463  
SN75461  
SN75462  
SN75463  
LOGIC  
AND  
NAND  
OR  
PACKAGES  
FK, JG  
FK, JG  
FK, JG  
D, P  
NC − No internal connection  
AND  
NAND  
OR  
D, P  
D, P  
description  
These dual peripheral drivers are functionally interchangeable with SN55451B through SN55453B and  
SN75451B through SN75453B peripheral drivers, but are designed for use in systems that require higher  
breakdown voltages than those devices can provide at the expense of slightly slower switching speeds. Typical  
applications include logic buffers, power drivers, relay drivers, lamp drivers, MOS drivers, line drivers, and  
memory drivers.  
The SN55461/SN75461, SN55462/SN75462, and SN55463/SN75463 are dual peripheral AND, NAND, and  
OR drivers respectively (assuming positive logic), with the output of the gates internally connected to the bases  
of the npn output transistors.  
Series SN55461 drivers are characterized for operation over the full military temperature range of 55°C  
to 125°C. Series SN75461 drivers are characterized for operation from 0°C to 70°C.  
Copyright 1995, Texas Instruments Incorporated  
ꢐꢛ ꢚ ꢦꢡꢠ ꢞ ꢟ ꢠ ꢚꢘ ꢙꢚ ꢛ ꢜ ꢞ ꢚ ꢟ ꢣꢢ ꢠ ꢗꢙ ꢗꢠꢝ ꢞꢗ ꢚꢘꢟ ꢣꢢ ꢛ ꢞꢨ ꢢ ꢞꢢ ꢛ ꢜꢟ ꢚꢙ ꢇꢢꢩ ꢝꢟ ꢒꢘꢟ ꢞꢛ ꢡꢜ ꢢꢘꢞ ꢟ  
ꢟ ꢞ ꢝ ꢘꢦꢝ ꢛꢦ ꢪ ꢝ ꢛꢛ ꢝ ꢘ ꢞꢫꢧ ꢐꢛ ꢚ ꢦꢡꢠ ꢞ ꢗꢚꢘ ꢣꢛ ꢚꢠ ꢢꢟ ꢟꢗ ꢘꢬ ꢦꢚꢢ ꢟ ꢘꢚꢞ ꢘꢢ ꢠꢢ ꢟꢟ ꢝꢛ ꢗꢥ ꢫ ꢗꢘꢠ ꢥꢡꢦ ꢢ  
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢂꢃ  
ꢆꢇ  
SLRS022A − DECEMBER 1976 − REVISED OCTOBER 1995  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
SN55’  
7
SN75’  
7
UNIT  
V
Supply voltage, V  
CC  
(see Note 1)  
Input voltage, V  
5.5  
5.5  
35  
5.5  
5.5  
35  
V
I
Intermitter voltage (see Note 2)  
Off-state output voltage, V  
V
V
O
Continuous collector or output current (see Note 3)  
400  
500  
400  
500  
mA  
mA  
Peak collector or output current (t 10 ms, duty cycle 50%, see Note 4)  
w
Continuous total power dissipation  
See Dissipation Rating Table  
Operating free-air temperature range, T  
55 to 125  
0 to 70  
°C  
°C  
°C  
°C  
°C  
A
Storage temperature range, T  
stg  
65 to 150  
260  
65 to 150  
Case temperature for 60 seconds, T  
FK package  
JG package  
D or P package  
C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds  
300  
260  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. Voltage values are with respect to network GND unless otherwise specified.  
2. This is the voltage between two emitters A and B.  
3. This value applies when the base-emitter resistance (R ) is equal to or less than 500 .  
BE  
4. Both halves of these dual circuits may conduct rated current simultaneously; however, power dissipation averaged over a short time  
interval must fall within the continuous dissipation rating.  
DISSIPATION RATING TABLE  
T
25°C  
DERATING FACTOR  
T
= 70°C  
T = 125°C  
A
A
A
PACKAGE  
POWER RATING  
ABOVE T = 25°C  
POWER RATING POWER RATING  
A
D
FK  
JG  
P
725 mW  
5.8 mW/°C  
11.0 mW/°C  
8.4 mW/°C  
8.0 mW/°C  
464 mW  
880 mW  
672 mW  
640 mW  
1375 mW  
275 mW  
210 mW  
1050 mW  
1000 mW  
recommended operating conditions  
SN55’  
SN75’  
MIN NOM  
UNIT  
MIN NOM  
MAX  
MAX  
Supply voltage, V  
CC  
4.5  
2
5
5.5  
4.75  
2
5
5.25  
V
V
High-level input voltage, V  
IH  
Low-level input voltage, V  
IL  
0.8  
0.8  
70  
V
Operating free-air temperature, T  
55  
125  
0
°C  
A
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀꢁꢌ ꢂ ꢃ ꢄ ꢅ ꢆ ꢇꢈ ꢉꢊꢆ ꢀ ꢁ ꢌꢂꢃ ꢄ  
ꢏꢆ  
ꢏꢆ  
SLRS022A − DECEMBER 1976 − REVISED OCTOBER 1995  
logic symbol  
logic diagram (positive logic)  
1
3
1A  
2
&
3
5
1
2
1Y  
2Y  
1Y  
2Y  
1A  
1B  
1B  
6
2A  
7
5
6
7
2A  
2B  
2B  
This symbol is in accordance with ANSI/IEEE Std 91-1984  
and IEC Publication 617-12.  
4
GND  
Pin numbers shown are for D, JG, and P packages.  
schematic (each driver)  
FUNCTION TABLE  
(each driver)  
V
Y
CC  
A
L
B
L
Y
4 kΩ  
1.6 kΩ  
130 Ω  
L (on state)  
L (on state)  
L (on state)  
H (off state)  
L
H
L
H
H
H
A
B
positive logic:  
Y = AB or A + B  
500 Ω  
1 kΩ  
GND  
Resistor values shown are nominal.  
electrical characteristics over recommended operating free-air temperature range  
SN55461  
SN75461  
PARAMETER  
Input clamp voltage  
TEST CONDITIONS  
UNIT  
V
MIN TYP  
MAX  
MIN TYP  
MAX  
V
IK  
V
= MIN,  
I = 12 mA  
1.2  
1.5  
1.2  
1.5  
CC  
I
V
V
= MIN,  
= 35 V  
V
= MIN,  
CC  
OH  
IH  
I
High-level output current  
300  
0.5  
0.8  
100  
µA  
OH  
V
= MIN,  
= 100 mA  
V
= 0.8 V,  
= 0.8 V,  
CC  
IL  
0.25  
0.5  
0.25  
0.5  
0.4  
0.7  
I
OL  
V
Low-level output voltage  
V
OL  
V
= MIN,  
V
IL  
CC  
= 300 mA  
I
OL  
I
I
I
I
I
Input current at maximum input voltage  
High-level input current  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= MAX, V = 5.5 V  
1
40  
1
40  
mA  
µA  
I
I
= MAX, V = 2.4 V  
IH  
I
Low-level input current  
= MAX, V = 0.4 V  
−1  
8
1.6  
11  
−1  
8
1.6  
11  
mA  
mA  
mA  
IL  
I
Supply current, outputs high  
Supply current, outputs low  
= MAX, V = 5 V  
I
CCH  
CCL  
= MAX, V = 0  
56  
76  
56  
76  
I
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.  
All typical values are at V  
CC  
= 5 V, T = 25°C.  
A
switching characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
30  
25  
8
MAX  
55  
UNIT  
t
t
t
t
Propagation delay time, low-to-high-level output  
Propagation delay time, high-to-low-level output  
Transition time, low-to-high-level output  
PLH  
PHL  
TLH  
THL  
40  
I
R
200 mA,  
= 50 ,  
C = 15 pF,  
L
See Figure 1  
O
L
ns  
20  
Transition time, high-to-low-level output  
10  
20  
SN55461  
SN75461  
V
S
10  
V
= 30 V,  
I
O
300 mA,  
S
V
OH  
High-level output voltage after switching  
mV  
See Figure 2  
V
S
10  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢂꢃ  
ꢆꢇ  
ꢂꢃ  
SLRS022A − DECEMBER 1976 − REVISED OCTOBER 1995  
logic symbol  
logic diagram (positive logic)  
1
3
5
1A  
1B  
2A  
2B  
&
3
5
1Y  
2Y  
1
1A  
2
6
7
1Y  
2Y  
2
1B  
6
2A  
7
2B  
4
This symbol is in accordance with ANSI/IEEE Std 91-1984  
and IEC Publication 617-12.  
GND  
Pin numbers shown are for D, JG, and P packages.  
schematic (each driver)  
FUNCTION TABLE  
(each driver)  
V
CC  
1.6 kΩ  
4 kΩ  
A
L
B
L
Y
130 Ω  
1.6 kΩ  
H (off state)  
H (off state)  
H (off state)  
L (on state)  
L
H
L
H
H
Y
A
B
H
positive logic:  
Y = AB or A + B  
500 Ω  
1 kΩ  
1 kΩ  
GND  
Resistor values shown are nominal.  
electrical characteristics over recommended operating free-air temperature range  
SN55462  
SN75462  
PARAMETER  
Input clamp voltage  
TEST CONDITIONS  
UNIT  
V
TYP  
TYP  
MIN  
MAX MIN  
MAX  
V
IK  
V
= MIN,  
I = 12 mA  
1.2  
1.5  
1.2  
1.5  
CC  
I
V
V
= MIN,  
= 35 V  
V
= 0.8 V,  
= MIN,  
= MIN,  
CC  
OH  
IL  
I
High-level output current  
300  
0.5  
0.8  
100  
µA  
OH  
V
= MIN,  
= 100 mA  
V
V
CC  
IH  
0.25  
0.5  
0.25  
0.5  
0.4  
0.7  
I
OL  
V
Low-level output voltage  
V
OL  
V
= MIN,  
CC  
= 300 mA  
IH  
I
OL  
I
I
I
I
I
Input current at maximum input voltage  
High-level input current  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= MAX, V = 5.5 V  
1
40  
1
40  
mA  
µA  
I
I
= MAX, V = 2.4 V  
IH  
I
Low-level input current  
= MAX, V = 0.4 V  
1.1  
13  
1.6  
17  
1.1  
13  
1.6  
17  
mA  
mA  
mA  
IL  
I
Supply current, outputs high  
Supply current, outputs low  
= MAX, V = 0  
I
CCH  
CCL  
= MAX, V = 5 V  
61  
76  
61  
76  
I
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.  
All typical values are at V  
CC  
= 5 V, T = 25°C.  
A
switching characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
45  
MAX  
65  
UNIT  
t
t
t
t
Propagation delay time, low-to-high-level output  
Propagation delay time, high-to-low-level output  
Transition time, low-to-high-level output  
PLH  
PHL  
TLH  
THL  
30  
50  
I
R
200 mA,  
= 50 ,  
C = 15 pF,  
L
See Figure 1  
O
L
ns  
13  
25  
Transition time, high-to-low-level output  
10  
20  
SN55462  
SN75462  
V
S
10  
V
= 30 V,  
I
O
300 mA,  
S
V
OH  
High-level output voltage after switching  
mV  
See Figure 2  
V
S
10  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀꢁꢌ ꢂ ꢃ ꢄ ꢅ ꢆ ꢇꢈ ꢉꢊꢆ ꢀ ꢁ ꢌꢂꢃ ꢄ  
ꢏꢆ  
ꢏꢆ  
SLRS022A − DECEMBER 1976 − REVISED OCTOBER 1995  
logic symbol  
logic diagram (positive logic)  
1
3
1  
1A  
2
3
5
1
2
1Y  
2Y  
1Y  
2Y  
1A  
1B  
1B  
6
2A  
7
5
6
7
2A  
2B  
2B  
4
This symbol is in accordance with ANSI/IEEE Std 91-1984  
and IEC Publication 617-12.  
GND  
Pin numbers shown are for D, JG, and P packages.  
schematic (each driver)  
FUNCTION TABLE  
(each driver)  
V
CC  
A
L
B
L
4 kΩ  
1.6 kΩ  
4 kΩ  
130 Ω  
Y
L (on state)  
H (off state)  
H (off state)  
H (off state)  
L
H
L
Y
H
H
A
B
H
positive logic:  
Y = A + B or A B  
500 Ω  
1 kΩ  
Resistor values shown are nominal.  
GND  
electrical characteristics over recommended operating free-air temperature range  
SN55463  
SN75463  
PARAMETER  
Input clamp voltage  
TEST CONDITIONS  
UNIT  
TYP  
TYP  
MIN  
MAX MIN  
MAX  
V
IK  
V
= MIN, I = 12 mA  
1.2  
1.5  
1.2  
1.5  
V
CC  
I
V
V
= MIN,  
= 35 V  
V
IH  
V
IL  
V
IL  
= MIN,  
= 0.8 V,  
= 0.8 V,  
CC  
OH  
I
High-level output current  
300  
0.5  
0.8  
100  
µA  
OH  
V
= MIN,  
= 100 mA  
CC  
0.25  
0.5  
0.25  
0.5  
0.4  
0.7  
I
OL  
V
Low-level output voltage  
V
OL  
V
= MIN,  
CC  
= 300 mA  
I
OL  
I
I
I
I
I
Input current at maximum input voltage  
High-level input current  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= MAX, V = 5.5 V  
1
40  
1
40  
mA  
µA  
I
I
= MAX, V = 2.4 V  
IH  
I
Low-level input current  
= MAX, V = 0.4 V  
−1  
8
1.6  
11  
−1  
8
1.6  
11  
mA  
mA  
mA  
IL  
I
Supply current, outputs high  
Supply current, outputs low  
= MAX, V = 5 V  
I
CCH  
CCL  
= MAX, V = 0  
58  
76  
58  
76  
I
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.  
All typical values are at V  
CC  
= 5 V, T = 25°C.  
A
switching characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
30  
25  
8
MAX  
55  
UNIT  
t
t
t
t
Propagation delay time, low-to-high-level output  
Propagation delay time, high-to-low-level output  
Transition time, low-to-high-level output  
PLH  
PHL  
TLH  
THL  
40  
I
R
200 mA,  
= 50 ,  
C = 15 pF,  
L
See Figure 1  
O
L
ns  
25  
Transition time, high-to-low-level output  
10  
25  
SN55463  
SN75463  
V
S
10  
V
= 30 V,  
I
300 mA,  
S
O
V
OH  
High-level output voltage after switching  
mV  
See Figure 2  
V
S
10  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢂꢃ  
ꢆꢇ  
ꢂꢃ  
SLRS022A − DECEMBER 1976 − REVISED OCTOBER 1995  
PARAMETER MEASUREMENT INFORMATION  
5 ns  
90%  
1.5 V  
10 ns  
90%  
1.5 V  
3 V  
Input  
2.4 V  
10 V  
= 50 Ω  
Input  
’461  
’463  
10%  
10%  
0.5 µs  
R
L
’461  
’462  
0 V  
3 V  
Output  
5 ns  
10 ns  
Pulse  
Generator  
(see Note A)  
Input  
’462  
Circuit  
Under  
90%  
90%  
C
= 15 pF  
1.5 V  
1.5 V  
L
Test  
(see Note B)  
10%  
10%  
(see Note B)  
0 V  
t
t
PHL  
90%  
PLH  
90%  
V
OH  
GND SUB  
’463  
50%  
10%  
50%  
10%  
Output  
V
OL  
0.4 V  
t
t
TLH  
THL  
VOLTAGE WAVEFORMS  
TEST CIRCUIT  
NOTES: A. The pulse generator has the following characteristics: PRR 1 MHz, Z 50 .  
O
B.  
C includes probe and jig capacitance.  
L
Figure 1. Test Circuit and Voltage Waveforms for Switching Times  
V
S
= 30 V  
5 ns  
90%  
10 ns  
3 V  
90%  
1.5 V  
Input  
2 mH  
1.5 V  
Input  
2.4 V  
5 V  
’461  
’463  
10%  
90%  
10%  
40 µs  
0 V  
3 V  
65 Ω  
1N3064  
’461  
’462  
5 ns  
10 ns  
Output  
Pulse  
Generator  
(see Note A)  
90%  
1.5 V  
Circuit  
Under  
Input  
’462  
1.5 V  
Test  
(see Note B)  
10%  
10%  
C
= 15 pF  
0 V  
L
(see Note B)  
V
OH  
GND SUB  
’463  
Output  
0.4 V  
V
OL  
VOLTAGE WAVEFORMS  
NOTES: A. The pulse generator has the following characteristics: PRR 12.5 kHz, Z = 50 .  
TEST CIRCUIT  
O
B.  
C includes probe and jig capacitance.  
L
Figure 2. Test Circuit and Voltage Waveforms for Latch-Up Test  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
SOIC  
PDIP  
SOIC  
Drawing  
JM38510/12908BPA  
JM38510/12909BPA  
SN55461JG  
ACTIVE  
JG  
JG  
JG  
JG  
JG  
D
8
8
8
8
8
8
8
8
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
Call TI  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
SN55462JG  
Call TI  
SN55463JG  
Call TI  
SN75461D  
Call TI  
SN75461P  
P
Call TI  
SN75462D  
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN75462DE4  
SN75462DG4  
SN75462DR  
SN75462DRE4  
SN75462DRG4  
SN75462P  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
D
D
D
D
D
P
P
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN75462PE4  
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN75463D  
SN75463DR  
SN75463P  
OBSOLETE  
OBSOLETE  
ACTIVE  
SOIC  
SOIC  
PDIP  
D
D
P
8
8
8
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
50  
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN75463PE4  
ACTIVE  
PDIP  
P
8
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SNJ55461FK  
SNJ55461JG  
SNJ55462FK  
SNJ55462JG  
SNJ55463JG  
OBSOLETE  
OBSOLETE  
ACTIVE  
LCCC  
CDIP  
LCCC  
CDIP  
CDIP  
FK  
JG  
FK  
JG  
JG  
20  
8
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
20  
8
1
1
POST-PLATE N / A for Pkg Type  
ACTIVE  
A42  
N / A for Pkg Type  
Call TI  
OBSOLETE  
8
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
SN75462DR  
SOIC  
D
8
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
340.5 338.1 20.6  
SN75462DR  
D
8
2500  
Pack Materials-Page 2  
MECHANICAL DATA  
MCER001A – JANUARY 1995 – REVISED JANUARY 1997  
JG (R-GDIP-T8)  
CERAMIC DUAL-IN-LINE  
0.400 (10,16)  
0.355 (9,00)  
8
5
0.280 (7,11)  
0.245 (6,22)  
1
4
0.065 (1,65)  
0.045 (1,14)  
0.310 (7,87)  
0.290 (7,37)  
0.063 (1,60)  
0.015 (0,38)  
0.020 (0,51) MIN  
0.200 (5,08) MAX  
0.130 (3,30) MIN  
Seating Plane  
0.023 (0,58)  
0.015 (0,38)  
0°–15°  
0.100 (2,54)  
0.014 (0,36)  
0.008 (0,20)  
4040107/C 08/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification.  
E. Falls within MIL STD 1835 GDIP1-T8  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
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specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
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products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Medical  
Security  
Logic  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
Power Mgmt  
power.ti.com  
Transportation and  
Automotive  
www.ti.com/automotive  
Microcontrollers  
RFID  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2011, Texas Instruments Incorporated  

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