W132-10BX [ROCHESTER]

132 SERIES, PLL BASED CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24, MO-153AE, TSSOP-24;
W132-10BX
型号: W132-10BX
厂家: Rochester Electronics    Rochester Electronics
描述:

132 SERIES, PLL BASED CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24, MO-153AE, TSSOP-24

驱动 光电二极管 输出元件 逻辑集成电路
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THIS SPEC IS OBSOLETE  
Spec No: 38-07216  
Spec Title: W132 Spread Aware(TM), Ten/Eleven Output Zero  
Delay Buffer  
Sunset Owner: RGL  
Replaced by: N/A  
1W132  
W132  
Spread Awareª, Ten/Eleven Output Zero Delay Buffer  
Features  
Key Specifications  
• Spread Aware™—designed to work with SSFTG refer-  
Operating Voltage: ................................................ 3.3V±10%  
Operating Range: ........................25 MHz < fOUT < 140 MHz  
Cycle-to-Cycle Jitter: ................................................<150 ps  
Output to Output Skew: ............................................<100 ps  
Phase Error Jitter: .....................................................<125 ps  
ence signals  
• Well suited to both 100- and 133-MHz designs  
• Ten (-09B) or Eleven (-10B) LVCMOS/LVTTL outputs  
• Single output enable pin for -10 version, dual pins on  
-09 devices allow shutting down a portion of the out-  
puts.  
• 3.3V power supply  
• On board 25W damping resistors  
• Available in 24-pin TSSOP package  
Block Diagram  
Pin Configurations  
FBIN  
FBOUT  
Q0  
PLL  
AGND  
VDD  
Q0  
Q1  
Q2  
GND  
GND  
Q3  
1
2
3
4
5
6
7
8
9
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
CLK  
AVDD  
VDD  
Q9  
CLK  
Q1  
Q2  
Q8  
OE0:4  
GND  
GND  
Q7  
Q6  
Q5  
Q3  
Q4  
OE  
Q5  
Q6  
Q7  
Q4  
VDD  
OE  
10  
11  
12  
OE5:8  
VDD  
FBIN  
FBOUT  
Q8  
Q9  
AGND  
VDD  
Q0  
Q1  
Q2  
GND  
GND  
Q3  
1
2
3
4
5
6
7
8
9
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
CLK  
AVDD  
VDD  
Q8  
configuration of these blocks dependent upon specific option being used  
Q7  
GND  
GND  
Q6  
Q4  
Q5  
VDD  
OE0:4  
FBOUT  
10  
11  
12  
VDD  
OE5:8  
FBIN  
Spread Aware is a trademark of Cypress Semiconductor Corporation.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-07216 Rev. OBS  
Revised December 02, 2004  
W132  
Pin Definitions  
Pin  
Pin No.  
Pin No.  
(-10B)  
Pin  
Name  
CLK  
(-09B)  
24  
Type  
Pin Description  
24  
13  
I
I
Reference Input: Output signals Q0:9 will be synchronized to this signal.  
FBIN  
13  
Feedback Input: This input must be fed by one of the outputs (typically FBOUT)  
to ensure proper functionality. If the trace between FBIN and FBOUT is equal in  
length to the traces between the outputs and the signal destinations, then the  
signals received at the destinations will be synchronized to the CLK signal input.  
Q0:8  
Q9  
3, 4, 5, 8,  
9, 16, 17,  
20, 21  
3, 4, 5, 8,  
9, 15, 16,  
17, 20  
O
O
O
Integrated Series Resistor Outputs: The frequency and phase of the signals  
provided by these pins will be equal to the reference signal if properly laid out.  
Each output has a 25series damping resistor integrated.  
Integrated Series Resistor Output: The frequency and phase of the signal  
provided by this pin will be equal to the reference signal if properly laid out. This  
output has a 25series damping resistor integrated.  
Feedback Output: This output has a 25series resistor integrated on chip.  
Typically it is connected directly to the FBIN input with a trace equal in length to  
the traces between outputs Q0:9 and the destination points of these output  
signals.  
n/a  
21  
FBOUT  
12  
12  
AVDD  
23  
1
2, 10, 15,  
22  
23  
1
2, 10, 14,  
22  
P
Analog Power Connection: Connect to 3.3V. Use ferrite beads to help reduce  
noise for optimal jitter performance.  
AGND  
VDD  
G
P
Analog Ground Connection: Connect to common system ground plane.  
Power Connections: Connect to 3.3V. Use ferrite beads to help reduce noise  
for optimal jitter performance.  
GND  
OE  
6, 7, 18,  
19  
n/a  
6, 7, 18,  
19  
G
I
Ground Connections: Connect to common system ground plane.  
11  
n/a  
n/a  
Output Enable Input: Tie to VDD (HIGH, 1) for normal operation. when brought  
to GND (LOW, 0) all outputs are disabled to a LOW state.  
OE0:4  
OE5:8  
11  
I
Output Enable Input: Tie to VDD (HIGH, 1) for normal operation. when brought  
to GND (LOW, 0) outputs Q0:4 are disabled to a LOW state.  
14  
I
Output Enable Input: Tie to VDD (HIGH, 1) for normal operation. when brought  
to GND (LOW, 0) outputs Q5:8 are disabled to a LOW state.  
on the DIMM. The W132 takes in the signal from the mother-  
board and buffers out clock signals with enough drive to sup-  
Overview  
The W132 is a PLL-based clock driver designed for use in dual  
inline memory modules. The clock driver has output frequen-  
cies of up to 133 MHz and output to output skews of less than  
250 ps. The W132 provides minimum cycle-to-cycle and long  
term jitter, which is of significant importance to meet the tight  
input-to-input skew budget in DIMM applications.  
The current generation of 256 and 512 megabyte memory  
modules needs to support 100-MHz clocking speeds. Espe-  
cially for cards configured in 16x4 or 8x8 format, the clock  
signal provided from the motherboard is generally not strong  
enough to meet all the requirements of the memory and logic  
port all the DIMM board clocking needs. The W132 is also  
designed to meet the needs of new PC133 SDRAM designs,  
operating to 133 MHz.  
The W132 was specifically designed to accept SSFTG signals  
currently being used in motherboard designs to reduce EMI.  
Zero delay buffers which are not designed to pass this feature  
through may cause skewing failures.  
Output enable pins allow for shutdown of output when they are  
not being used. This reduces EMI and power consumption.  
Document #: 38-07216 Rev. OBS  
Page 2 of 6  
W132  
1
2
24  
23  
22  
AGND  
VDD  
Q0  
GND  
AVDD  
VDD  
Q9  
FB  
VDD  
3.3V  
0.1µ  
F
0.1µ  
F
3
10µF  
0.1µ  
F
4
21  
20  
19  
18  
17  
16  
15  
14  
13  
Q1  
10µ  
F
FB  
5
Q2  
Q8  
VDD  
6
GND  
GND  
Q3  
GND  
GND  
Q7  
7
8
9
Q4  
Q6  
10  
11  
12  
VDD  
OE  
Q5  
VDD  
0.1µF  
VDD  
FBIN  
VDD  
0.1µ  
F
FBOUT  
Figure 1. Schematic  
If it is desirable to either add a little delay, or slightly precede  
the input signal, this may also be affected by either making the  
trace to the FBIN pin a little shorter or a little longer than the  
traces to the devices being clocked.  
Spread Aware  
Many systems being designed now utilize a technology called  
Spread Spectrum Frequency Timing Generation. Cypress has  
been one of the pioneers of SSFTG development, and we de-  
signed this product so as not to filter off the Spread Spectrum  
feature of the Reference input, assuming it exists. When a zero  
delay buffer is not designed to pass the SS feature through,  
the result is a significant amount of tracking skew which may  
cause problems in systems requiring synchronization.  
For more details on Spread Spectrum timing technology,  
please see the Cypress application note titled, ÒEMI Suppres-  
sion Techniques with Spread Spectrum Frequency Timing  
Generator (SSFTG) ICs.Ó  
Inserting Other Devices in Feedback Path  
Another nice feature available due to the external feedback is  
the ability to synchronize signals up to the signal coming from  
some other device. This implementation can be applied to any  
device (ASIC, multiple output clock buffer/driver, etc.) which is  
put into the feedback path.  
Referring to Figure 2, if the traces between the ASIC/buffer  
and the destination of the clock signal(s) (A) are equal in length  
to the trace between the buffer and the FBIN pin, the signals  
at the destination(s) device will be driven high at the same time  
the Reference clock provided to the ZDB goes high. Synchro-  
nizing the other outputs of the ZDB to the outputs form the  
ASIC/Buffer is more complex however, as any propagation de-  
lay in the ASIC/Buffer must be accounted for.  
How to Implement Zero Delay  
Typically, zero delay buffers (ZDBs) are used because a de-  
signer wants to provide multiple copies of a clock signal in  
phase with each other. The whole concept behind ZDBs is that  
the signals at the destination chips are all going HIGH at the  
same time as the input to the ZDB. In order to achieve this,  
layout must compensate for trace length between the ZDB and  
the target devices. The method of compensation is described  
below.  
External feedback is the trait that allows for this compensation.  
The PLL on the ZDB will cause the feedback signal to be in  
phase with the reference signal. When laying out the board,  
match the trace lengths between the output being used for  
feed back and the FBIN input to the PLL.  
Reference  
Zero  
Signal  
Delay  
Buffer  
ASIC/  
Buffer  
Feedback  
Input  
A
Figure 2. 6 Output Buffer in the Feedback Path  
Document #: 38-07216 Rev. OBS  
Page 3 of 6  
W132  
Absolute Maximum Ratings[1]  
Stresses greater than those listed in this table may cause per-  
above those specified in the operating sections of this specifi-  
cation is not implied. Maximum conditions for extended peri-  
ods may affect reliability.  
manent damage to the device. These represent a stress rating  
only. Operation of the device at these or any other conditions  
.
Parameter  
VDD, VIN  
TSTG  
TA  
TB  
PD  
Description  
Voltage on any pin with respect to GND  
Storage Temperature  
Operating Temperature  
Ambient Temperature under Bias  
Power Dissipation  
Rating  
Ð0.5 to +7.0  
Ð65 to +150  
0 to +70  
Ð55 to +125  
0.5  
Unit  
V
ûC  
ûC  
ûC  
W
DC Electrical Characteristics: TA =0ûC to 70ûC, VDD = 3.3V ±10%  
Parameter  
Description  
Supply Current  
Test Condition  
Unloaded, 100 MHz  
Min  
Typ  
Max  
200  
0.8  
Unit  
mA  
V
V
V
V
µA  
µA  
IDD  
VIL  
VIH  
VOL  
VOH  
IIL  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
Input Low Current  
Input High Current  
2.0  
2.1  
IOL = 12 mA  
IOH = Ð12 mA  
VIN = 0V  
0.8  
50  
50  
IIH  
VIN = VDD  
AC Electrical Characteristics: TA = 0ûC to +70ûC, VDD = 3.3V ±10%  
Parameter  
fOUT  
tR  
Description  
Test Condition  
Min  
Typ  
Max  
140  
2.1  
2.5  
4.5  
4.5  
350  
100  
58  
Unit  
MHz  
ns  
Output Frequency  
30-pF load[5]  
25  
Output Rise Time  
0.8V to 2.0V, 30-pF load  
2.0V to 0.8V, 30-pF load  
tF  
Output Fall Time  
ns  
tICLKR  
tICLKF  
tPEJ  
Input Clock Rise Time[2]  
Input Clock Fall Time[2]  
CLK to FBIN Skew Variation[3, 4]  
Output to Output Skew  
Duty Cycle  
ns  
ns  
Measured at VDD/2  
All outputs loaded equally  
30-pF load  
Ð350  
Ð100  
43  
0
0
ps  
tSK  
ps  
tD  
50  
%
tLOCK  
PLL Lock Time  
Power supply stable  
1.0  
150  
ms  
ps  
tJC  
Jitter, Cycle-to-Cycle  
Notes:  
1. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.  
2. Longer input rise and fall time will degrade skew and jitter performance.  
3. Skew is measured at V /2 on rising edges.  
DD  
4. Duty cycle is measured at V /2.  
DD  
5. Production tests are run at 133 MHz.  
Ordering Information  
Ordering Code  
W132  
Option  
Package Type  
-09B, -10B X = 24-pin TSSOP  
Document #: 38-07216 Rev. OBS  
Page 4 of 6  
W132  
Package Diagram  
24-Pin Thin Shrink Small Outline Package (TSSOP)  
Document #: 38-07216 Rev. OBS  
Page 5 of 6  
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  
W132  
Document Title: W132 Spread Awareª, Ten/Eleven Output Zero Delay Buffer  
Document Number: 38-07216  
Issue  
Orig. of  
REV.  
**  
*A  
ECN NO.  
110481  
122835  
294835  
Date  
Change  
Description of Change  
Change from Spec number: 38-00792 to 38-07216  
Add Power up Requirements to Maximum Ratings Information  
To Obsolete the DS  
12/15/01  
12/22/02  
See ECN  
SZV  
RBI  
RGL  
OBS  
Document #: 38-07216 Rev. OBS  
Page 6 of 6  

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