BA06CC0WT-V5 [ROHM]
Fixed Positive LDO Regulator;型号: | BA06CC0WT-V5 |
厂家: | ROHM |
描述: | Fixed Positive LDO Regulator |
文件: | 总9页 (文件大小:1048K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TECHNICAL NOTE
3-terminal Regulator & LDO Regulator Series
Standard Fixed Output
LDO Regulator
BA□□DD0,BA□□DD0W,BA□□CC0 and BA□□CC0W Series
●General Description
BA□□DD0/CC0 are low-saturation regulators, available for output s up to 2A/1A. ROHM has a wide output voltage range
and package lineup with and without shutdown switches. This IC has a built-in over-current protection circuit that prevents
the destruction of the IC due to output short circuits, a thermal shut-down circuit that protects the IC from damage due to
overloading and an over-voltage protection circuit that protects the IC from surges generated in the power supply line of the
IC.
●Features
1) Maximum output current : 2A (BA□□DD0),
1A(BA□□CC0)
5) Built-in thermal shutdown circuit for protecting the
IC from damage due to overloading
2) ±1% highly accurate output voltage (BA□□DD0)
3) Low saturation with PNP output
4) Built-in over-current protection circuit that prevents
the destruction of the IC due to output short circuits
6) Built-in over- voltage protection circuit that prevents
the destruction of the IC due to power supply
surges
7) TO220FP and HRP5 packaging (BA□□DD0)
TO220FP and TO252 packaging(BA□□CC0)
●Applications
Used in DSP power supplies for DVD and CD players, FPDs, televisions, personal computers or any other consumer device
●Line up
■1A BA□□CC0 Series
Part Number
BA□□CC0WT
BA□□CC0WT-V5
BA□□CC0WFP
BA□□CC0T
3.0
3.3
○
○
○
○
○
5.0
○
○
○
○
○
6.0
-
-
○
-
○
7.0
○
-
○
○
○
8.0
○
○
○
○
○
9.0
○
○
○
○
○
10
○
-
-
○
○
12
○
○
○
○
○
15
-
-
-
○
○
Package
TO220FP-5
TO220FP-5(V5)
TO252-5
○
-
-
○
○
TO220FP-3
TO252-3
BA□□CC0FP
■2A BA□□DD0 Series
Part Number
BA□□DD0WT
BA□□DD0WHFP
BA□□DD0T
1.5
1.8
○
○
○
2.5
○
○
○
3.0
○
○
○
3.3
○
○
○
5.0
○
○
○
9.0
○
○
○
12
○
○
○
16
○
○
○
Package
○
○
○
TO220FP-5
HRP5
TO220FP-3
Part Number:BA□□CC0□□
Part Number:BA□□DD0□□
b c
a
b c
a
Symbol
Details
Symbol
Details
Output Voltage Designation
Output Voltage Designation
Output Voltage(V)
Output Voltage(V)
Output Voltage(V)
Output Voltage(V)
□□
03
□□
08
□□
15
□□
50
3.0V(Typ.)
3.3V(Typ.)
5.0V(Typ.)
6.0V(Typ.)
7.0V(Typ.)
8.0V(Typ.)
9.0V(Typ.)
10.0V(Typ.)
12.0V(Typ.)
15.0V(Typ.)
1.5V(Typ.)
1.8V(Typ.)
2.5V(Typ.)
3.0V(Typ.)
3.3V(Typ.)
5.0V(Typ.)
9.0V(Typ.)
12.0V(Typ.)
16.0V(Typ.)
033
05
09
18
90
a
a
J0
25
J2
06
J2
30
J6
07
J5
33
Switch:”With W”:Shutdown switch included
”Without W”:Shutdown switch not included
Switch:”With W”:Shutdown switch included
”Without W”:Shutdown switch not included
b
c
b
c
Package
T:TO220FP-5(V5)、TO220FP-3
FP:TO252-5、TO252-3
Package
T:TO220FP-5、TO220FP-3
HFP:HRP5
Oct.2007
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Vcc
Limits
-0.3~+35
Unit
V
*1
Input Power Supply Voltage
2300(HRP5)
1300(TO252-5)
1200(TO252-3)
2000(TO220FP-3,5)
-40~+125
*2
Power Dissipation
Pd
mW
Operating Temperature Range
Ambient Storage Temperature
Junction Temperature
Topr
Tstg
℃
℃
℃
V
-55~+150
Tjmax
VCTL
+150
*3
*4
Output Control Terminal Voltage
-0.3~+Vcc
Vcc peak
+50
V
Voltage Applied to the Tip
*1 Must not exceed Pd
*2 HRP5 : In cases in which Ta≧25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 18.4 mW/℃.
TO252FP-3 : In cases in which Ta≧25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 9.6 mW/℃.
TO252FP-5 : In cases in which Ta≧25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 10.4 mW/℃.
TO220FP-5 : No heat sink. When Ta≧25℃, the power is reduced by 16 mW/℃.
*3 Only for models with shutdown switches.
*4 Applied voltage : 200msec or less (tr≥1msec)
tr≧1msec
50V
35V
MAX200msec
(Voltage Supply more than 35V)
0V
●
Recommended Operating Range (Ta=25℃)
Parameter
Symbol
Min.
4.0
3.0
-
Max.
25.0
25.0
1
Unit
V
Input Power
BA□□CC0
BA□□DD0
BA□□CC0
BA□□DD0
Vcc
Supply Voltage
Output Current
Io
A
V
-
2
Output Control Terminal Voltage
VCTL
0
Vcc
●
Electrical Characteristics(ABRIDGED)
BA□□CC0 Series (unless specified otherwise, Ta=25℃, VCTL=5.0V(only with switch), Io=500mA,and Vcc=VccD*5
)
Parameter
Symbol
Vo
Min.
Typ.
Vo
Max.
Vo×1.02
10
Unit
V
Conditions
Refer to the lineup for Vo
Output Voltage
Vo×0.98
Circuit Current at Shutdown
Minimum I/O Difference
Output Current Capacity
Input Stability
Isd
-
-
1.0
-
-
-
0
μA VCTL=0V
Vd
0.3
-
0.5
V
Vcc= 0.95×Vo
Io
-
A
Reg.I
Reg.L
TCVO
20
100
mV Vcc= (Vo+1)V → 25V
mV Io=5mA→1A
%/℃ Io=5mA ,Tj=0~125℃
Load Stability
50
100
Output Voltage Temperature Coefficient*6
±0.02
-
BA00DD0□□ series (unless specified otherwise, Ta=25℃, VCTL=3V(only with switch), Io=500mA,and Vcc=VccD*7
)
Parameter
Symbol
Vo
Min.
Typ.
Vo
Max.
Vo×1.01
10
Unit
V
Conditions
Io=200mA
Output Voltage
Vo×0.99
Circuit Current at Shutdown
Minimum I/O Difference
Output Current Capacity
Input Stability
Isd
-
-
2.0
-
-
-
0
μA VCTL=0V
Vd
0.45
-
0.7
V
A
Vcc= 0.95×Vo, Io=2A
Io
-
Reg.I
Reg.L
TCVO
15
50
mV Vcc= VccD*7→25 V,Io=200mA
Load Stability
50
200
mV Io=5mA→2A
Output Voltage Temperature Coefficient*6
±0.02
-
%/℃ Io=5mA ,Tj=0~125℃
*5 Vo=3.0V : Vcc= 8.0V , Vo=3.3V : Vcc=8.3V , Vo=5.0V : Vcc=10.0V , Vo=6.0V : Vcc=11.0V , Vo=7.0V : Vcc=12.0V,
Vo=8.0V : Vcc= 13.0V , Vo=9.0V : Vcc=14.0V , Vo=10.0V : Vcc=15.0V , Vo=12.0V : Vcc=17.0V , Vo=15.0V : Vcc=20.0V
*6 Design guarantee(100% shipping inspection not performed)
*7 Vo=1.5V , 1.8V , 2.5V , 3.0V : Vcc=4.0V , Vo=3.3V , 5.0V : Vcc=7.0V , Vo=9.0V : Vcc=12.0V
Vo=12V : Vcc=14V , Vo=16V : Vcc=18V
2/8
●Reference Data
BA□□CC0□□(BA33CC0WT)
(Unless specified otherwise, Vcc=8.3V, Vo=3.3V, VCTL=5.0V, and Io=0mA)
4
3.5
3
4
3.5
3
3
2.5
2
[BA033CC0WFP]
[BA033CC0WT]
[BA033CC0WFP]
2.5
2
2.5
2
1.5
1
1.5
1
1.5
1
0.5
0
0.5
0
0.5
0
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
SUPPLY VOLTAGE Vcc [V]
:
SUPPLY VOLTAGE Vcc [V]
:
SUPPLY VOLTAGE : Vcc [V]
Fig.2 Input Stability
Fig.1 Circuit current
Fig.3 Input Stability
(Io=500mA)
600
500
400
300
200
100
0
80
70
60
50
40
30
20
10
0
3.5
3
[BA033CC0WT]
[BA033CC0WT]
[BA033CC0WT]
2.5
2
1.5
1
0.5
0
0
100 200 300 400 500 600 700 800 900 1000
OUTPUT CURRENT : IO [mA]
0
200 400
600 800 1000 1200 1400 1600 1800 2000
10
100
1000
10000
100000
1000000
OUTPUT CURRENT: IO[mA]
FREQUENCY : f [Hz]
Fig.5 Input/Output Voltage Difference
Fig.6 Ripple Rejection Characteristics
Fig.4 Load Stability
IOUT(0V=1A)
(Io=100mA)
1000
200
4.5
4
900
800
700
600
500
400
300
200
100
0
[BA033CC0WT]
[BA033CC0WT]
[BA033CC0WT]
150
100
50
3.5
3
2.5
2
0
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90 100
0
100 200 300 400 500 600 700 800 900 1000
OUTPUT CURRENT:Io(mA)
0
2
4
6
8
10
12
14 16
18
20
CONTROL VOLTAGE:Vctl(V)
AMBIENT TEMPERATURE : Ta [℃]
Fig.7 Output Voltage
Fig.8 Circuit Current by load Level
Fig.9 CTL Voltage vs. CTL Current
Temperature Characteristics
(IOUT=0mA→1A)
4
4
8
7
6
5
4
3
2
1
0
[BA033CC0WFP]
[BA033CC0WFP]
3.5
3
3.5
[BA033CC0WFP]
3
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
130
140
150
160
170
180
190
0
5
10 15
20 25 30 35 40
0
2
4
6
8
10 12 14 16 18 20 22 24
AMBIENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE : Vcc [V]
CONTROL VOLTAGE : Vctl [V]
Fig.10 CTL Voltage vs. Output Voltage
Fig.12 Thermal Shutdown
Circuit Characteristics
Fig.11 Overvoltage Operating
Characteristics(Io=200mA)
3/8
●Reference Data
BA□□DD0□□(BA50DD0WT)
(Unless specified otherwise, Vcc=7.0V, Vo=5.0V, VCTL=3.0V, and Io=0mA)
8
7.5
7
6.5
6
6
5
4
3
2
1
0
8
7.5
7
6.5
6
[BA50DD0WT]
[BA50DD0WT]
[BA50DD0WT]
5.5
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
2
4
6
8
10 12 14 16 18 20 22 24
0
2
4
6
8
10 12 14 16 18 20 22 24
0
2
4
6
8
10 12 14 16 18 20 22 24
SUPPLY VOLTAGE Vcc [V]
:
SUPPLY VOLTAGE : Vcc [V]
SUPPLY VOLTAGE Vcc [V]
:
Fig.15 Input Stability
Fig.13 Circuit Current
Fig.14 Input Stability
800
700
600
500
400
300
200
100
0
8
60
50
40
30
20
10
0
[BA50DD0WT]
7.5
7
[BA50DD0WT]
[BA50DD0WT]
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9
2
10
100
1000
10000
100000
1000000
0
0.4 0.8 1.2 1.6
2
2.4 2.8 3.2 3.6
4
4.4 4.8
OUTPUT CURRENT : IOUT [A]
FREQUENCY : f [Hz]
OUTPUT CURRENT : IOUT [A]
Fig.16 Load Stability
Fig.18 Ripple Rejection Characteristics
Fig.17 Input/Output Voltage Difference
(Vcc=4.75V)
(Iout=100mA)
5.2
5.1
5
200
800
[BA50DD0WT]
[BA50DD0WT]
[BA50DD0WT]
180
700
600
500
400
300
200
100
0
160
140
120
100
80
60
4.9
4.8
40
20
0
-4 -3 -2 -1
0
10 20 30 40 50 60 70 80 90 10 11
0
0.5
1
1.5
2
0
2
4
6
8
10 12 14 16 18 20 22 24
0
0
0
0
0
0
OUTPUT CURRENT : IOUT [A]
AMBIENT TEMPERATURE : Ta [℃]
CONTROL VOLYAGE:Vctl(V)
Fig.21 CTL Voltage vs. CTL Current
Fig.19 Output Voltage
Fig.20 Circuit Current by Load Level
Temperature Characteristics
(IOUT=0mA→2A)
8
7
6
5
4
3
2
1
8
8
[BA50DD0WT]
[BA50DD0WT]
[BA50DD0WT]
7
6
5
4
3
2
1
0
6
4
2
0
0
0
2
4
6
8
10 12 14 16 18 20 22 24
0
5
10
15
20 25
30
SUPPLY VOLTAGE : Vcc [V]
35
40
130
140
150
160
170
AMBIENT TEMPERATURE : Ta [℃]
180
190
CONTROL VOLTAGE : VCTL [V]
Fig.22 CTL Voltage vs. Output Voltage
Fig.23 Overvoltage Operating
Fig.24 Thermal Shutdown
(Io=200mA)
4/8
●Block Diagrams
BA□□CC0WFP/ BA□□DD0WHFP/ BA□□CC0WT(V5)/ BA□□DD0WT
GND
(TO252-5・HRP5)
TOP VIEW
Fin
Vcc
FIN
PIN No.
Pin Name
CTL
Function
Output voltage ON/OFF control
Power supply voltage input
Unconnected terminal/GND
Voltage output
Driver
Vref
1
2
R2
R1
Vcc
1
2
3 4 5
1 2 3 4 5
HRP5
1
3
N.C/GND
OUT
*
TO252-5
TOP VIEW
TOP VIEW
4
OVP
2
TSD
OCP
5
N.C
Unconnected terminal
GND
2
Fin
GND
*
3
4
1
5
*1 TO252-5 is N.C.,and TO220FP-5,-5(V5),and HRP5 are GND
*2 Only for TO252-5 and HRP5
CTL
Vcc
N.C.
OUT
N.C.
(TO252-5)
GND
(TO220FP-5,-5(V5),HRP5)
1 2 345
1 2 345
TO220FP-5
TO220FP-5(V5)
Fig.25
BA□□CC0T/ BA□□CC0FP/ BA□□DD0T
GND
(TO252-3)
Fin
Vcc
TOP VIEW
FIN
TOP VIEW
Driver
Vref
PIN No.
Pin Name
Vcc
Function
R2
R1
1
2
Power supply voltage input
N.C/GND
OUT
Unconnected terminal/GND*1
3
Voltage output
OVP
TSD
OCP
1
2
3
2
Fin
GND
GND
*
1
2 3
TO252-3
TO220FP-3
*1 TO252-3 is N.C.,and TO-220FP-3,is GND
*2 Only for TO252-3 and HRP5
1
3
2
Vcc
N.C.
(TO252-3)
GND
(TO220FP-3)
OUT
Fig.26
●Input / Output Equivalent Circuit Diagrams
<
BA□□DD0 Series
>
<
BA□□CC0 Series
>
Vcc
Vcc
Vcc
25kΩ
10kΩ
CTL
OUT
39kΩ 2kΩ
31kΩ
CTL
OUT
25kΩ
R2
R1
R2
R1
Fig.27
Fig.28
●Thermal Design
HRP-5
TO220FP-5
TO252-5
2.0
10
25
20
15
10
5
Board size : 70×70×1.6 ㎜3 (board contains a thermal via)
Board front copper foil area : 10.5×10.5 ㎜2
(1) When using a maximum heat sick : θj-c=6.25(℃/W)
(2) When using an IC alone : θj-6=62.5(℃/W)
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
9
8
7
6
5
4
3
2
1
0
①2-layer board (back surface copper foil area :15×15 ㎜2
②2-layer board (back surface copper foil area :70×70 ㎜2
③4-layer board (back surface copper foil area :70×70 ㎜2
)
)
)
TO252-5θja=96.2(℃/W)
1.6
1.2
0.8
0.4
0.0
(1)20.0
③7.3W
1.30
②5.5W
①2.3W
(2)2.0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
Ambient temperature:Ta(℃)
Ambient temperature:Ta(℃)
Fig.29
Fig.30
Fig.31
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The IC
characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature TjMAX., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction and
long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures lower than the maximum junction temperature TjMAX of the IC.
5/8
Fig.30 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a normal
temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures less than the
acceptable loss Pd.
Vcc:
Vo:
Io:
Input voltage
Output voltage
Load current
Circuit current
The method of calculating the power consumption Pc(W) is as follows.
Pc = (Vcc-Vo) × Io + Vcc × Icca
Acceptable loss Pd≦Pc
Icca:
Solving this for load current IO in order to operate within the acceptable loss:
Pd – Vcc×Icca
Io≦
Vcc-Vo
(Please refer to Figs.8 and 20 for Icca.)
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.
・Calculation Example
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
1.04-8.3×Icca
Io≦
With the IC alone : θja=62.5℃/W → -16mW/℃
25℃=2000mW → 85℃=1040mW
5
Io≦200mA (Icca : 2mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Icca+Ishort)
*Ishort : Short circuit current
●Peripheral Circuit Considerations
・Vcc Terminal
Please attach a capacitor (greater than 0.33μF) between the Vcc and GND.
The capacitance values will differ depending on the application, so please take this into account when configuring the
terminal.
・GND Terminal
Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not arise
between them.
If a potential difference arises between the set ground and the IC ground, the preset voltage will not be outputted, causing
the system to become unstable. Therefore, please reduce the impedance by making the ground patterns as wide as
possible and by reducing the distance between the set ground and the IC ground as much as possible.
・CTL Terminal
The CTL terminal is turned ON at 2.0V and higher and OFF at 0.8V and lower within the operating power supply voltage
range.
The power supply and the CTL terminal may be started up and shut down in any order without problems.
●Vo Terminal
100
100
Unstable operating region
Unstable operating region
10
1
10
Stable operating region
OUT
Stable operating region
IC
22μF
1
Unstable operating region
Unstable operating region
0.1
1
0.1
200
600
800
1000
400
100
0
10
1000
OUTPUT CURRENT:lo(mA)
OUTPUT CURRENT:lo(mA)
Fig.32 Output Equivalent Circuit
Fig.33 ESR-Io Characteristics
Fig.34 ESR vs Io Characteristics
(BA□□CC0,22μF)
(BA□□DD0,22μF)
Please attach an anti-oscillation capacitor between Vcc and GND. The capacitance of the capacitor may significantly change
due to factors such as temperature changes, making it impossible to completely stop oscillations. Please use a tantalum
capacitor or aluminum electrolysis capacitor with favorable characteristics and small internal series resistance (ESR) even at
low temperatures. The output fluctuates regardless of whether the ESR is large or small. Please use the IC within the stable
operating region while referring to the ESR characteristics reference data shown in Figs.32 through 34. In applications where
there are sudden load fluctuations, the use of a capacitor with large capacitance is recommended.
Below figure , it is ESR-to-Io stability Area characteristics ,measured by 22μF-ceramic-capacitor and resistor connected in
series.
This characteristics is not equal value perfectly to 22μF-aluminum electrolytic capacitor in order to measurement
method.
Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can vary
with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final status
of these items for actual use.
Keep capacitor capacitance within a range of 22μF~1000μF. It is also recommended that a 0.33μF bypass capacitor be
connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input
voltage or the load, please check the operation in real application to determine proper capacitance.
6/8
●
Other Points of Caution
1)Protection Circuits
Over-current Protection Circuit
A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when there
are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is restricted
and does not latch even when a large current momentarily flows through the system with a high-capacitance capacitor.
However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents, it is not
suitable for continuous operation or transient use. Please be aware when creating thermal designs that the overcurrent
protection circuit has negative current capacity characteristics with regard to temperature (Refer to Figs.4 and 16).
Thermal Shutdown Circuit (Thermal Protection)
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As shown
above, this must be used within the range of acceptable loss, but if the acceptable loss happens to be continuously exceeded,
the chip temperature Tj increases, causing the temperature protection circuit to operate.
When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation
immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12
and 24 for the temperatures at which the temperature protection circuit operates).
There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to avoid
leaving the IC in the overloaded state.
Reverse Current
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode
be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.35).
2) This IC is bipolar IC that has a P-board (substrate) and P+ isolation layer
between each devise, as shown in Fig.36. A P-N junction is formed between
Reverse current
this P-layer and the N-layer of each device, and the P-N junction operates as a
parasitic diode when the electric potential relationship is GND> Terminal A,
OUT
Vcc
GND> Terminal B, while it operates as a parasitic transistor when the electric
potential relationship is Terminal B GND> Terminal A. Parasitic devices are
structurally inevitable in the IC. The operation of parasitic devices induces
mutual interference between circuits, causing malfunctions and eventually the
destruction of the IC. It is necessary to be careful not to use the IC in ways that
would cause parasitic elements to operate. For example, applying a voltage
that is lower than the GND (P-board) to the input terminal.
CTL
GND
Fig. 36:Bypass diode
Transistor (NPN)
B
Resistor
(Pin A)
(Pin B)
O
(Pin B)
E
C
B
GND
E
N
P+
P+
P
N
GND
P
P+
Parasitic element
or transistor
N
P
N
P+
N
N
N
Parasitic element
GND
P
(Pin A)
Parasitic element
GND
Parasitic element
or transistor
GND
Fig. 37: Example of the basic structure of a bipolar IC
●Part Number Selection
H P
0
F
B A
D D
W
2
33
E
Output
voltage
Current capacity
CC0 : 1A
DD0 : 2A
ROHM
model name
Shutdown switch Package
Package specification
W : With switch
None : Without
switch
T : TO220-3,5
F P : TO252-3,5
HFP : HRP5
TR : Embossed taping(HRP5)
E2 : Embossed taping(TO252-3,5)
None : Tube container
V5 :Foaming(V5 only)
(Unit:mm)
(Unit:mm)
(Unit:mm)
TO252-3
TO252-5
7/8
HRP5
<Package Specification>HRP5
< Package Specification > TO252-3,5
Embossed taping
Package Form
Package Quantity
Embossed taping
2000pcs
Package Form
Package Quantity
2000pcs
Package
Orientation
Package
Orientation
TR
E2
(
When the reek is held with the left hand and the tape is drawn out with the
right hand, the No.1 pin of the product faces the upper right direction.
(
When the reek is held with the left hand and the tape is drawn out with the
)
right hand, the No.1 pin of the product faces the lower left direction.
)
Pulling side
Pulling side
Reel
No.1 pin
Reel
No.1 pin
(Unit:mm)
(Unit:mm)
(Unit:mm)
TO220FP-5(V5)
TO220FP-5
TO220FP-3
<Package Specification>TO220FP-5(V5)
<Package Specification>TO220FP-5
<Package Specification>TO220FP-3
Package
Package
Package
Container tube
Form
Container tube
Form
Container tube
Form
Package
Package
Package
500pcs
Quantity
500pcs
Quantity
500pcs
Quantity
The product orientation in each
container tube is constant.
The product orientation in each
container tube is constant.
The product orientation in each
container tube is constant.
Package
Orientation
Package
Orientation
Package
Orientation
*Please make orders in multiples of
the package quantity.
*Please make orders in multiples of
the package quantity.
*Please make orders in multiples of
the package quantity.
8/8
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
THE AMERICAS / EUPOPE / ASIA / JAPAN
ROHM Customer Support System
Contact us : webmaster@ rohm.co.jp
www.rohm.com
TEL : +81-75-311-2121
FAX : +81-75-315-0172
Copyright © 2007 ROHM CO.,LTD.
21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
Appendix1-Rev2.0
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