BA1117FP_技术文档

Low drop adjustable

positive voltage regulator

BA1117FP

●Features

Low dropout voltage:

-

1.2 V typ. (at IO = 1 A, 25℃)

Output current up to 1 A

Adjustable version availability (VREF = 1.25 V)

Internal current and thermal limit

Available in ±1% (at 25℃) and 2% in full

temperature range

TO220-3

TO252-3

High supply voltage rejection:

-

75 dB typ. (at 25℃)

Temperature range: -20℃ to 105℃

Designed to use by ceramic capacitors

●Typical Application

IN

OUT

V

●Description

V_REF

R1

R2

10uF

22uF

ADJ

The BA1117FP is a low drop voltage regulator

able to provide up to 1 A of output current,

available in adjustable versions (VREF =1.25V).

The device is supplied in: TO252-3 and TO220-3.

Surface mounted packages optimize the

thermal characteristics while offering a relevant

space saving advantage. High efficiency is

assured by NPN pass transistor. Only a very

common 22uF minimum capacitor is needed for

stability. Chip trimming allows the regulator to

reach a very tight reference voltage tolerance, within

±1% at 25℃.

I_ADJ

VREF = 1.25 V (Typ.)

IADJ = 60 uA (Typ.)

VO = VREF × (1 + R2 / R1 ) + IADJ × R2

Table1. Device summary

Order codes

Output voltage

Adjustable from 1.25 V

TO252-3

TO220-3

BA1117FP-E2

Under development

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

1/12

TSZ22111･14･001

Datasheet

BA1117FP

●Diagram

Figure 1. Block diagram

www.rohm.com

TSZ22111･15･001

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

2/12

Datasheet

BA1117FP

●Pin configuration

Figure 2. Pin connections (top view)

VIN

3

2

1

VOUT

ADJ

1

2

3

VOUT

ADJ

VIN

TO220-3

TO252-3

Note1:

The TAB is connected to the VOUT.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

3/12

Datasheet

BA1117FP

●Maximum ratings

Table 2. Absolute maximum ratings

Symbol

Parameter

Value

15

1.2^(Note3)

-55 to +150

-20 to +105

Unit

V

VIN

PD

DC input voltage

Power dissipation

W

TSTG

TOP

Storage temperature range

℃

Operating junction temperature range

℃

Note2: Absolute maximum ratings are those values beyond which damage to the device may occur.

Functional operation under these condition is not implied. Beyond the above suggested

max. power dissipation, a short-circuit may permanently damage the device.

Note3:

In case Ta≧25℃(70mm×70mm×1.6mm when mounted on a glass epoxy board) is reduced by 9.6mW/℃.

Table 3. Thermal data

Symbol

Parameter

Thermal resistance junction-ambient

TO252-3

TO220-3

Unit

RthJA

104.2

67.5

℃/W

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

4/12

TSZ22111･15･001

Datasheet

BA1117FP

●Electrical characteristics

Refer to the test circuits, TJ = -20 to 105℃, CO = 22 uF, CI = 10 uF, unless otherwise specified.

Table 4. Electrical characteristics of BA1117 (Adjustable)

Symbol

Parameter

Reference Voltage

Test conditions

VI = 5.3 V, IO = 10 mA, TJ = 25℃

IO = 10 mA to 1 A, VI = 2.75 to 10 V

Min.

1.238

1.225

Typ.

Max.

1.262

1.27

Unit

V

VO

1.250

VO

V

⊿VO

VI

Line regulation

VI = 2.75 V to 8 V, IO = 0 mA

VI = 2.75 V, IO = 0 to 1A

1

6

mV

%

Load regulation

10

Temperature stability

Long term stability

Operating input voltage

Adjustment Pin Current

0.5

0.3

1000hrs, TJ = 105℃

IO = 100mA

%

10

V

IADJ

VI ≦ 10 V

60

120

uA

Adjustment Pin Current

Change

⊿IADJ

VI - VO =1.4 to 10 V, IO = 10 mA to 1 A

0.2

5

uA

IO(min)

IO

Minimum Load Current

Output current

VI = 10 V

1.7

1700

100

mA

uV

VI - VO = 5 V, TJ = 25℃

B = 10 Hz to 10 kHz, TJ = 25℃

1000

60

eN

Output noise voltage

IO = 40mA, f = 120 Hz

SVR

Supply voltage rejection

75

dB

VI – VO = 3 V, Vripple = 1 VPP,

IO = 100 mA

1

1.10

1.15

1.40

0.2

V

IO = 500 mA

1.05

1.20

0.08

VD

Dropout voltage

IO = 1 A

V

⊿VO(pwr)

Thermal regulation

Ta = 25℃, 30 ms pulse

%/W

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

5/12

TSZ22111･15･001

Datasheet

BA1117FP

●Electrical characteristics (reference data)

2

1.5

1

1.4

TJ = 25℃

1.2

1

TJ = 105℃

0.5

0

0.8

0.6

0.4

0.2

0

-0.5

-1

-1.5

-2

0

200

400

600

[mA]

Figure 3. Dropout voltage

800

1000

-25

0

25

Temperature [℃]

Figure 4. Temperature Stability

50

75

100

125

O

I

90

80

70

60

50

40

30

20

10

0

90

80

70

60

50

40

30

20

10

0

Vripple = 1 Vpp

IO = 0.5 A

0

200

400

600

[mA]

Figure 6. Supply voltage rejection vs IO

800

1000

10

100

1000

10000

100000

O

I

Frequency [Hz]

Figure 5. Supply voltage rejection

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

6/12

TSZ22111･15･001

Datasheet

BA1117FP

●Electrical characteristics (reference data)

0

100

90

80

70

60

50

40

30

20

10

0

IO = 1 A

-0.05

-0.1

-0.15

-0.2

-0.25

-0.3

-0.35

-25

0

25

50

75

100

125

-25

0

25

50

75

100

125

Temperature [℃]

Figure 7. Load regulation

Figure 8. Adjustment pin current

2

1.8

1.6

1.4

1.2

1

V^o:DC : 1.5 V

AC : 50 mV/DIV

0.8

0.6

0.4

0.2

0

IO : 500 mA/DIV

t : 4 us/DIV

0

0.2 0.4 0.6 0.8

1

1.2 1.4 1.6 1.8

2

O

I

[A]

Figure 10. Load Transient Response

Figure 9. Load regulation vs VO

(0→0.5A)

Co=22µF

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

7/12

TSZ22111･15･001

Datasheet

BA1117FP

●BA1117 adjustable: application note

The BA1117 adjustable has a thermal stabilized 1.25 ± 0.012V reference voltage between

the V^OUTand ADJ pins. IADJ is 60uA typ. (120uA max.) and ⊿IADJ is 0.2uA typ(5uA max.).

R¹is normally fixed to 120 Ω.

VO = VREF + R2 (IADJ + IR1) = VREF + R2 (IADJ + VREF / R1) = VREF (1 + R2 / R1) + R2 × IADJ.

In normal applications the R2 value is in the range of a few kΩ, so the R2 × IADJ product can

not be considered in the V^Ocalculation; the above expression then becomes:

VO = VREF (1 + R2 / R1).

In order to have a better load regulation it is important to realize a good Kelvin connection of

R¹and R2 resistors. In particular, the R1 connection must be realized very close to the VOUT

and ADJ pins, while the R²ground connection must be placed as near as possible to the

negative load pin. Ripple rejection can be improved by introducing a 10uF electrolytic

capacitor placed in parallel to the R²resistor (see Figure 11, 12).

The output capacitor is critical in maintaining regulator stability, and must meet the required

conditions for both minimum amount of capacitance and ESR( Equivalent Series Resistance).

The minimum output capacitance required by the BA1117FP is 22uF, if a ceramic/tantalum

capacitor is used. Any increase of the output capacitance will merely improve the loop

stability and transient response. The ESR of the output tantalum capacitor should range

between 0.3Ω- 5Ω.

Figure. 11 Adjustable output voltage application

IN

OUT

V

V_REF

R1

120

22uF

10uF

ADJ

Ω

R2

Figure. 12 Adjustable output voltage application with improved ripple rejection

IN

OUT

V

V_REF

R1

22uF

10uF

ADJ

120

Ω

10 uF

R2

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

8/12

TSZ22111･15･001

Datasheet

BA1117FP

●Input- to-Output Capacitor

It is recommended that a capacitor is placed very close between Input pin and GND, output pin and GND.

A capacitor, between input pin and GND, is valid when the power supply impedance is high or the trace is long. Also as for a

capacitor, between output pin and GND, the greater the capacity, more sustainable the line regulation and it makes

improvement of the characteristics depending on the load. However, please check the actual functionality of this part by

mounting on a board for the actual application. Ceramic capacitor usually have different, thermal and equivalent series

characteristics, and moreover capacitance decreases gradually in use.

For additional detail, please check the manufacturer, and select the best ceramic capacitor for your application.

10

0

Rated Voltage：10V

B1 characteristics

Rated Voltage：10V

B characteristics

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

Rated Voltage：6.3V

B characteristics

Rated Voltage:10V

F characteristics

Rated Voltage：4V

X6S characteristics

0

1

2

3

4

DC Bias Voltage [V]

Ceramic capacitor capacity – DC bias characteristics

(Characteristics example)

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

9/12

TSZ22111･15･001

Datasheet

BA1117FP

●Operatinal Notes

(1). Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,

can break down the devices, thus making impossible to identify damage mode, such as a short circuit or an open

circuit. If there is any possibility of exposure over the rated values, please consider adding circuit protection devices,

such as fuses.

(2). Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power

supply lines. An external direction diode can be added.

(3). Power supply lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply

line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply

terminals to ICs, connect a capacitor between the power supply and the GND terminal. When using electrolytic

capacitors in the circuit, note that capacitance values are reduced at low temperaturesand over time.

(4). GND voltage

The potential of GND pin must be minimum potential under all operating conditions.

(5). Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

(6). Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

(7). Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as this may cause the IC to

malfunction.

(8). ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(9). Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is

designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its

operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the

operation of this circuit is assumed.

(10). Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to

stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply before connecting

it or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an

antistatic measure. Use similar precaution when transporting or storing the IC.

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

10/12

TSZ22111･15･001

Datasheet

BA1117FP

(11). Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated.P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example, the relation between each potential is as follows:

When VO > Pin A and VO > Pin B, the P-N junction operates as a parasitic diode.

When VO > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC.

The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical

damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the

VO (P substrate) voltage to an input pin, should not be used.

Resistor

Transistor (NPN)

B

Pin A

Pin B

C

E

Pin A

B

C

E

P⁺

N

P⁺

N

P

N

Parasitic

element

P substrate

Parasitic

element

GND

VO

GND

VO

GND

VO

GND

Parasitic element

Other adjacent elements

(12). Ground Wiring Pattern.

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to

change the GND wiring pattern of any external components, either.

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

11/12

TSZ22111･15･001

Datasheet

BA1117FP

●Physical Dimension/Tape and Reel Information

TO252-3

Tape

Embossed carrier tape

2000pcs

6.5 0.2

C0.5

Quantity

+0.2

5.1

-0.1

2.3 0.2

E2

0.5 0.1

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

FIN

(

)

1

2

3

0.65

0.75

0.65

0.5 0.1

1.0 0.2

2.3 0.2

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

1pin

Reel

(Unit : mm)

∗

TO220FP-3

+0.3

−0.1

10.0

4.5

−0.1

Container

Quantity

Tube

+0.3

−0.1

+0.2

7.0

2.8

φ

3.2 0.1

−0.1

500pcs

Direction of feed Direction of products is fixed in a container tube

1.3

0.8

+0.1

0.55

−0.05

2.6 0.5

2.54 0.5

1

2 3

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

●Marking Diagram

TO220FP-3 (TOP VIEW)

TO252-3

(TOP VIEW)

Part Number Marking

LOT Number

B A 1 1 1 7

LOT Number

www.rohm.com

TSZ02201-0RGR0A600450-1-2

18.Nov.2013 Rev.003

12/12

TSZ22111･15･001

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BA1117FP
厂家：	ROHM
描述：	BA1117FP是1A输出的可变型LDO稳压器。(基准电压: VREF= 1.25V) 封装是TO252-3。有助于省空间、适合热特性的封装。为了IC的稳定，输出需要普通22uF的陶瓷电容器、或钽电容器。通过芯片微调，可实现25℃、±1%的高精度基准电压。电容器陶瓷电容器钽电容器稳压器
文件：	总15页 (文件大小：378K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BA1117FP [ROHM]

相关型号：

BA114ES6R

BA114EUS6R

BA114TS6R

BA114TUS6R

BA114YS6R

BA114YUS6R

BA116

BA1160

BA1160100RKE

BA116010K0KE

BA116010R0KE

BA1160120RKE