BA2902YFV-MGE2 [ROHM]
Operational Amplifier, 4 Func, 10000uV Offset-Max, BIPolar, PDSO14, 5 X 6.40 MM, 1.35 MM HEIGHT, ROHS COMPLIANT, SSOP-14;
| 型号： | BA2902YFV-MGE2 |
| 厂家： | 
ROHM |
| 描述： | Operational Amplifier, 4 Func, 10000uV Offset-Max, BIPolar, PDSO14, 5 X 6.40 MM, 1.35 MM HEIGHT, ROHS COMPLIANT, SSOP-14 光电二极管 |
| 文件： | 总29页 (文件大小：559K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Operational Amplifier Series
AutomotiveGround Sense
Operational Amplifiers
BA2904Yxxx-M, BA2902Yxx-M
●General Description
●Key Specifications
Automotive series BA2904Yxxx-M/BA2902Yxx-M
integrate two or four independent Op-Amps and
ground sense input Amplifier on a single chip and
have some features of high-gain, low power
consumption, and operating voltage range of 3V to
32V (single power supply ). BA2904Yxxx-M,
BA2902Yxx-M are manufactured for automotive
requirements of car navigation system, car audio, and
so on.
Wide operating supply voltage
single supply :
+3.0V to +32V
±1.5V to ±16V
dual supply :
low supply current
BA2904Yxxx-M BA2902Yxx-M
0.7mA(Typ.)
input bias current :
input offset current :
20nA(Typ.)
2nA(Typ.)
Operating temperature range :
-40℃ to +125℃
●Features
Operable with a single power supply
Wide operating supply voltage
Standard Op-Amp Pin-assignments
Input and output are operable GND sense
Low supply current
High open loop voltage gain
Internal ESD protection circuit
Wide temperature range
●Packages
SOP8
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
SOP14
SSOP-B8
SSOP-B14
MSOP8
●Selection Guide
Maximum operating temperature
+125°C
Output current
Source/Sink
supply current
BA2904YF-M
BA2904YFV-M
BA2904YFVM-M
Dual
30mA / 20mA
30mA / 20mA
0.7mA
Automotive(-Ｍ)
BA2902YF-M
BA2902YFV-M
Quad
0.7mA
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Block Diagram
VCC
IN
IN
－
＋
VOUT
VEE
Fig.1 Simplified schematic (one channel only)
●Pin Configuration
OUT1
1
2
3
14 OUT4
OUT1
-IN1
+IN1
VCC
+IN2
-IN2
OUT2
VCC
OUT2
-IN2
+IN2
1
2
3
4
8
7
6
5
13
12
-IN4
+IN4
VEE
CH1
+
CH4
+ -
-
CH1
- +
-IN1
+IN1
VEE
4
5
11
10
+IN3
-IN3
OUT3
CH2
+ -
+ -
CH3
- +
CH2
6
7
9
8
SSOP-B14
SOP14
SOP8
SSOP-B8
MSOP8
Package
MSOP8
SOP8
SSOP-B8
BA2904YFV-M
SOP14
SSOP-B14
BA2902YFV-M
BA2904YF-M
BA2904YFVM-M
BA2902YF-M
●Ordering Information
B A 2 9 0 x Y x x x
-
M x x
Parts Number.
BA2904Yxxx
BA2902Yxx
Package
: SOP8
SOP14
FV : SSOP-B8
SSOP-B14
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP14/SSOP-B8/SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
F
M: Automotive
FVM: MSOP8
●Line-up
2channel
/4channel
Ordarable Parts
Topr
Supply voltage
+3 to +32V
Package
Number
SOP8
Reel of 2500
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 2500
BA2904YF-ME2
BA2904YFV-ME2
BA2904YFVM-MTR
BA2902YF-ME2
BA2902YFV-ME2
Dual
SSOP-B8
MSOP8
-40°C to +125°C
SOP14
Quad
SSOP-B14
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Ratings
Unit
V
Supply Voltage
VCC-VEE
+36
780*1*6
Power Dissipation
SOP8
SSOP-B8
MSOP8
690*2*6
590*3*6
610*4*6
Pd
mW
SOP14
SSOP-B14
870*5*6
Differential Input Voltage *7
Vid
+36
V
V
Input Common-mode Voltage Range
Vicm
Vopr
(VEE-0.3) to (VEE+36)
+3.0 to +32
(±1.5 to ±16)
Operating Supply Voltage
V
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Topr
Tstg
-40 to +125
-55 to +150
+150
℃
℃
℃
Tjmax
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature
environment may cause deterioration of characteristics.
*1
*2
*3
*4
*5
*6
*7
To use at temperature above Ta＝25℃ reduce 6.2mW/℃.
To use at temperature above Ta＝25℃ reduce 5.5mW/℃.
To use at temperature above Ta＝25℃ reduce 4.8mW/℃.
To use at temperature above Ta＝25℃ reduce 7.0mW/℃.
To use at temperature above Ta＝25℃ reduce 4.9mW/℃.
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Electrical Characteristics
○BA2904Yxxx-M (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Typ.
2
Temperature
Range
Parameter
Symbol
Unit
mV
Conditions
VOUT=1.4V
VCC=5 to 30V, VOUT=1.4V
Min.
-
Max.
7
25℃
Input Offset Voltage*8
Input Offset Voltage drift
Input Offset Current*8
Input Offset Current drift
Input Bias Current*8
Vio
△Vio/△T
Iio
Full range
-
-
-
±7
2
10
-
-
μV/℃ VOUT=1.4V
nA VOUT=1.4V
pA/℃ VOUT=1.4V
nA VOUT=1.4V
25℃
-
50
200
-
Full range
-
-
-
ΔIio/ΔT
Ib
-
-
±10
20
-
25℃
250
250
1.2
2
Full range
25℃
-
-
0.7
-
Supply Current
ICC
mA RL=∞, All Op-Amps
Full range
25℃
-
3.5
27
-
RL=2kΩ
-
-
High Level Output Voltage
VOH
V
Full range
Full range
28
5
VCC=30V, RL=10kΩ
-
Low Level Output Voltage
Large Signal Voltage Gain
VOL
AV
20
mV RL=∞, All Op-Amps
RL≧2kΩ, VCC=15V
VOUT=1.4 to 11.4V
(VCC-VEE)=5V
VOUT=VEE+1.4V
25℃
25℃
25
0
100
-
V/mV
-
Input Common-mode
Voltage range
Vicm
VCC-1.5
V
Common-mode Rejection Ratio CMRR
25℃
25℃
50
65
20
10
10
2
80
100
30
-
dB VOUT=1.4V
-
-
-
-
-
-
Power Supply Rejection Ratio
Output Source Current*9
PSRR
dB VCC=5 to 30V
25℃
VIN+=1V, VIN-=0V
mA
IOH
VOUT=0V, 1CH is short circuit
Full range
25℃
20
-
VIN+=0V,VIN-=1V
VOUT=5V, 1CH is short circuit
IOL
mA
Output Sink Current*9
Full range
VIN+=0V, VIN-=1V
VOUT=200mV
Isink
CS
25℃
25℃
25℃
12
-
40
120
0.2
μA
-
-
-
Channel Separation
Slew Rate
dB f=1kHz, input referred
VCC=15V, AV=0dB
V/μs
SR
-
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
CL=100pF
VCC=15V, VEE=-15V
RS=100Ω, Vi=0V, f=1kHz
Gain bandwidth product
GBW
Vn
0.5
40
MHz
25℃
25℃
-
-
-
-
Input Referred Noise Voltage
nV/ Hz
*8 Absolute value
*9 Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Electrical Characteristics
○BA2902Yxx-M (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Typ.
2
Temperature
Range
25℃
Parameter
Symbol
Unit
mV
Conditions
VOUT=1.4V
VCC=5 to 30V, VOUT=1.4V
Min.
-
Max.
7
Input Offset Voltage*10
Input Offset Voltage drift
Input Offset Current*10
Input Offset Current drift
Input Bias Current*10
Vio
△Vio/△T
Iio
Full range
-
-
-
±7
2
10
-
-
μV/℃ VOUT=1.4V
nA VOUT=1.4V
pA/℃ VOUT=1.4V
nA VOUT=1.4V
25℃
-
50
200
-
Full range
-
-
-
ΔIio/ΔT
Ib
-
-
±10
20
-
25℃
250
250
2
Full range
25℃
-
-
0.7
-
Supply Current
ICC
mA RL=∞, All Op-Amps
Full range
25℃
-
3
3.5
27
-
RL=2kΩ
-
-
High Level Output Voltage
VOH
V
Full range
Full range
28
5
VCC=30V, RL=10kΩ
-
Low Level Output Voltage
Large Signal Voltage Gain
VOL
AV
20
mV RL=∞, All Op-Amps
RL≧2kΩ, VCC=15V
VOUT=1.4 to 11.4V
(VCC-VEE)=5V
VOUT=VEE+1.4V
25℃
25℃
25
0
100
-
V/mV
-
Input Common-mode
Voltage range
Vicm
VCC-1.5
V
Common-mode Rejection Ratio CMRR
25℃
25℃
50
65
20
10
10
2
80
100
30
-
dB VOUT=1.4V
-
-
-
-
-
-
Power Supply Rejection Ratio
Output Source Current*11
PSRR
dB VCC=5 to 30V
25℃
VIN+=1V, VIN-=0V
mA
IOH
VOUT=0V, 1CH is short circuit
Full range
25℃
20
-
VIN+=0V,VIN-=1V
VOUT=5V, 1CH is short circuit
IOL
mA
Output Sink Current*11
Full range
VIN+=0V, VIN-=1V
VOUT=200mV
Isink
CS
25℃
25℃
25℃
12
-
40
120
0.2
μA
-
-
-
Channel Separation
Slew Rate
dB f=1kHz, input referred
VCC=15V, AV=0dB
V/μs
SR
-
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
CL=100pF
VCC=15V, VEE=-15V
RS=100Ω, Vi=0V, f=1kHz
Gain bandwidth product
GBW
Vn
0.5
40
MHz
25℃
25℃
-
-
-
-
Input Referred Noise Voltage
nV/ Hz
*10 Absolute value
*11 Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms
Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents.
1. Absolute maximum ratings
The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of
electrical characteristics or damage to the part itself as well as peripheral components.
1.1 Power supply voltage (VCC-VEE)
Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without
causing deterioration of the electrical characteristics or destruction of the internal circuitry.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without
damaging the IC.
1.3 Input common-mode voltage range (Vicm)
Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing
deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the
common-mode voltage range of the maximum ratings - use within the input common-mode voltage range of the
electric characteristics instead.
1.4 Operating and storage temperature ranges (Topr,Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
1.5 Power dissipation (Pd)
Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For
packaged products, Pd is determined by the maximum junction temperature and the thermal resistance.
2. Electrical characteristics
2.1 Input offset voltage (Vio)
Indicates the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input
voltage difference required for setting the output voltage to 0 V.
2.2 Input offset voltage drift (△Vio/△T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
2.3 Input offset current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.4 Input offset current drift (△Iio/△T)
Signifies the ratio of the input offset current fluctuation to the ambient temperature fluctuation.
2.5 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal, it is defined by the average of the input bias current
at the non-inverting terminal and the input bias current at the inverting terminal.
2.6 Circuit current (ICC)
Indicates the current of the IC itself that flows under specified conditions and during no-load steady state.
2.7 High level output voltage/low level output voltage (VOH/VOL)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
high-level output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output
voltage. Low-level output voltage indicates the lower limit.
2.8 Large signal voltage gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.9 Input common-mode voltage range (Vicm)
Indicates the input voltage range under which the IC operates normally.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
2.10 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.11 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.12 Output source current/ output sink current (IOH/IOL)
The maximum current that can be output under specific output conditions, it is divided into output source current and
output sink current. The output source current indicates the current flowing out of the IC, and the output sink current
the current flowing into the IC.
2.13 Channel separation (CS)
Indicates the fluctuation of output voltage with reference to the change of output voltage of driven channel.
2.14 Slew rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage
as unit time.
2.15 Gain Band Width (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
2.16 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Typical Performance Curves
○BA2904Yxxx-M
1. 0
0. 8
0. 6
0. 4
0. 2
0. 0
1000
800
BA2904YF-M
BA2904YFV-M
600
25℃
BA2904YFVM-M
－40℃
400
200
0
125℃
0
10
20
30
40
0
25
50
75
100
125
150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.2
Fig.3
Derating Curve
Supply Current – Supply Voltage
40
30
20
10
0
1.0
0.8
0.6
0.4
0.2
0.0
32V
-40℃
125℃
25℃
5V
3V
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Fig.4
Fig.5
Supply Current – Ambient Temperature
Maximum Output Voltage – Supply Voltage
(RL=10kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
5
4
3
2
1
0
50
40
30
20
10
0
-40℃
25℃
125℃
-50 -25
0
25 50 75 100 125 150
0
1
2
3
4
5
AMBIENT TEMPERATURE [℃]
OUTPUT VOLTAGE [V]
Fig.6
Fig.7
Maximum Output Voltage – Ambient Temperature
(VCC=5V, RL=2kΩ)
Output Source Current – Output Voltage
(VCC=5V)
50
40
30
20
10
0
100
10
3V
125℃
5V
1
-40℃
25℃
15V
0.1
0.01
0. 001
0
0.4
0.8
1.2
1.6
2
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
OUTPUT VOLTAGE [V]
Fig.9
Output Sink Current – Output Voltage
(VCC=5V)
Fig.8
Output Source Current – Ambient Temperature
(VOUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
80
70
60
50
40
30
20
10
0
30
15V
-40℃
25℃
20
5V
3V
125℃
10
0
-50 -25
0
25 50 75 100 125 150
0
5
10
15
20
25
30
35
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Fig.11
Fig.10
Low Level Sink Current – Supply Voltage
(VOUT=0.2V)
Output Sink Current – Ambient Temperature
(VOUT=VCC)
8
6
80
70
60
50
40
30
20
10
0
32V
4
-40℃
25℃
5V
2
0
3V
125℃
-2
-4
-6
-8
0
5
10
15
20
25
30
35
-50 -25
0
25 50 75 100 125 150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.12
Low Level Sink Current – Ambient Temperature
(VOUT=0.2V)
Fig.13
Input Offset Voltage – Supply Voltage
(Vicm=0V, VOUT=1.4V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
8
6
4
50
40
30
20
10
0
2
3V
25℃
-40℃
0
5V
32V
-2
-4
-6
-8
125℃
0
5
10
15
20
25
30
35
-50 -25
0
25 50 75 100 125 150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.15
Fig.14
Input Bias Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Input Offset Voltage – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
50
40
30
20
10
0
50
40
30
20
10
0
32V
3V
5V
-10
-50 -25
0
25 50 75 100 125 150
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
Fig.17
Fig.16
Input Bias Current – Ambient Temperature
(VCC=30V, Vicm=28V, VOUT=1.4V)
Input Bias Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
10
5
8
6
-40℃
4
125℃
25℃
-40℃
25℃
2
0
0
125℃
-2
-4
-6
-8
-5
-10
-1
0
1
2
3
4
5
0
5
10
15
20
25
30
35
INPUT VOLTAGE [V]
SUPPLY VOLTAGE [V]
Fig.19
Fig.18
Input Offset Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Input Offset Voltage – Input Voltage
(VCC=5V)
10
5
140
130
120
110
100
90
3V
0
5V
32V
80
-5
-10
70
60
4
6
8
10
12
14
16
-50 -25
0
25 50 75 100 125 150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.21
Fig.20
Large Signal Voltage Gain – Supply Voltage
Input Offset Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
(RL=2kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
12/26
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
140
120
100
80
140
130
120
-40℃
25℃
110
100
125℃
90
80
70
60
60
40
-50 -25
0
25 50 75 100 125 150
0
10
20
30
40
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Fig.22
Large Signal Voltage Gain – Ambient Temperature
(RL=2kΩ)
Fig.23
Common Mode Rejection Ratio
– Supply Voltage
140
120
100
80
140
130
120
110
100
90
32V
5V
3V
80
60
70
40
60
-50 -25
0
25 50 75 100 125 150
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
Fig.24
Fig.25
Common Mode Rejection Ratio
– Ambient Temperature
Power Supply Rejection Ratio
– Ambient Temperature
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
1000
2. 0
1. 6
1. 2
0. 8
0. 4
0. 0
800
BA2902YF-M
BA2902YFV-M
600
400
200
0
25℃
－40℃
125℃
0
25
50
75
100
125
150
0
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.26
Fig.27
Derating Curve
Supply Current – Supply Voltage
40
2.0
1.6
1.2
0.8
0.4
0.0
30
20
10
0
-40℃
32V
125℃
25℃
5V
3V
0
10
20
30
40
-50
0
50
100
150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.28
Fig.29
Supply Current – Ambient Temperature
Maximum Output Voltage – Supply Voltage
(RL=10kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
14/26
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
5
4
3
2
1
0
50
40
30
20
10
0
-40℃
25℃
125℃
-50 -25
0
25 50 75 100 125 150
0
1
2
3
4
5
AMBIENT TEMPERATURE [℃]
OUTPUT VOLTAGE [V]
Fig.30
Fig.31
Maximum Output Voltage – Ambient Temperature
(VCC=5V, RL=2kΩ)
Output Source Current – Output Voltage
(VCC=5V)
50
40
30
20
10
0
100
10
3V
125℃
5V
1
-40℃
25℃
15V
0.1
0.01
0. 001
0
0.4
0.8
1.2
1.6
2
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
OUTPUT VOLTAGE [V]
Fig.33
Output Sink Current – Output Voltage
(VCC=5V)
Fig.32
Output Source Current – Ambient Temperature
(VOUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
80
70
60
50
40
30
20
10
0
30
15V
-40℃
25℃
20
5V
3V
125℃
10
0
-50 -25
0
25 50 75 100 125 150
0
5
10
15
20
25
30
35
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Fig.35
Fig.34
Low Level Sink Current – Supply Voltage
(VOUT=0.2V)
Output Sink Current – Ambient Temperature
(VOUT=VCC)
8
6
80
70
60
50
40
30
20
10
0
32V
4
-40℃
25℃
5V
2
0
3V
125℃
-2
-4
-6
-8
0
5
10
15
20
25
30
35
-50 -25
0
25 50 75 100 125 150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.36
Low Level Sink Current – Ambient Temperature
(VOUT=0.2V)
Fig.37
Input Offset Voltage – Supply Voltage
(Vicm=0V, VOUT=1.4V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
8
6
4
50
40
30
20
10
0
2
3V
25℃
-40℃
0
5V
32V
-2
-4
-6
-8
125℃
0
5
10
15
20
25
30
35
-50 -25
0
25 50 75 100 125 150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.39
Fig.38
Input Bias Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Input Offset Voltage – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
50
40
30
20
10
0
50
40
30
20
10
0
32V
3V
5V
-10
-50 -25
0
25 50 75 100 125 150
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
Fig.41
Fig.40
Input Bias Current – Ambient Temperature
(VCC=30V, Vicm=28V, VOUT=1.4V)
Input Bias Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
10
5
8
6
-40℃
4
125℃
25℃
-40℃
25℃
2
0
0
125℃
-2
-4
-6
-8
-5
-10
-1
0
1
2
3
4
5
0
5
10
15
20
25
30
35
INPUT VOLTAGE [V]
SUPPLY VOLTAGE [V]
Fig.43
Fig.42
Input Offset Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Input Offset Voltage – Input Voltage
(VCC=5V)
10
5
140
130
120
110
100
90
3V
0
5V
32V
80
-5
-10
70
60
4
6
8
10
12
14
16
-50 -25
0
25 50 75 100 125 150
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.45
Fig.44
Large Signal Voltage Gain – Supply Voltage
Input Offset Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
(RL=2kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
18/26
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
140
120
100
80
140
130
120
-40℃
25℃
110
100
125℃
90
80
70
60
60
40
-50 -25
0
25 50 75 100 125 150
0
10
20
30
40
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Fig.46
Large Signal Voltage Gain – Ambient Temperature
(RL=2kΩ)
Fig.47
Common Mode Rejection Ratio
– Supply Voltage
140
120
100
80
140
130
120
110
100
90
32V
5V
3V
80
60
70
40
60
-50 -25
0
25 50 75 100 125 150
-50 -25
0
25 50 75 100 125 150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
Fig.48
Fig.49
Common Mode Rejection Ratio
– Ambient Temperature
Power Supply Rejection Ratio
– Ambient Temperature
(*)The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.50(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax -Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Fig.50(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package
condition, wind velocity, etc even when the same of package is used.
Thermal reduction curve indicates a reference value measured at a specified condition. Fig.50(c) show a derating curve for
an example of BA2904Yxxx-M and BA2902xxY-M.
[W]
n of LSI
Power dissipa
tio
Pd (max)
Ta) / Pd
[
/W]
℃
P2
θja = ( Tjmax
θja2 < θja1
θ' ja2
-
Ta [
]
℃
Ambient temperature
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
θ ja1
Tj [
Chip surface temperature
℃
]
0
25
50
75
ture
100
Ta [
125
150
]
℃
Ambient tempe
ra
Power dissipation Pd[W]
(b) Derating curve
(a) Thermal resistance
Fig. 50 Thermal resistance and derating
1000
1000
BA2902YFV-M(15)
BA2904YF-M(12)
800
600
400
200
0
800
600
400
200
0
BA2904YFV-M(13)
BA2904YFVM-M(14)
BA2902YF-M(16)
0
25
50
75
100
125
150
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [
]
℃
AMBIENT TEMPERATURE [
]
℃
(d) BA2902Yxx-M
(c) BA2904Yxxx-M
(12)
6.2
(13)
5.5
(14)
4.8
(15)
7.0
(16)
4.9
単位
mW/℃
When using the unit above Ta=25℃, subtract the value above per Celsius degree .
Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%) is mounted.
Fig. 51 Derating curve
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TSZ22111･15･001
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Application Information
Test Circuit1 NULL method
VCC, VEE, EK, Vicm Unit V
Parameter
VF
S1
S2
S3
Vcc
VEE
EK
Vicm calculation
Input Offset Voltage
Input Offset Current
Input Bias Current
VF1
VF2
ON
ON
OFF 5 to 30
0
0
0
-1.4
-1.4
-1.4
0
0
0
1
2
3
4
5
6
OFF OFF
OFF
OFF
ON
5
5
VF3
VF4
VF5
VF6
VF7
VF8
VF9
VF10
OFF
ON
ON
OFF
15
15
5
0
0
0
0
0
0
-1.4
-11.4
-1.4
-1.4
-1.4
-1.4
0
0
Large Signal Voltage Gain
ON
ON
ON
ON
ON
ON
0
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
OFF
OFF
5
3.5
0
5
Power Supply Rejection Ratio
30
0
- Calculation -
1. Input Offset Voltage (Vio)
| VF1 |
[V]
Vio =
1 + Rf / Rs
0.1μF
2. Input Offset Current (Iio)
| VF2 VF1 |
－
Rf=50kΩ
[A]
Iio =
Ri ×(1 + Rf / Rs)
0.1μF
500kΩ
3. Input Bias Current (Ib)
VCC
EK
SW1
| VF4 VF3 |
－
+15V
[A]
Ib =
Rs=50Ω
Rs=50Ω
2×Ri× (1 + Rf / Rs)
500kΩ
1000pF
Ri=10kΩ
Ri=10kΩ
4. Large Signal Voltage Gain (Av)
DUT
VEE
NULL
EK×(1+Rf /Rs)
Δ
SW3
Av = 20×Log
[dB]
V
VF
Vicm
|VF5-VF6|
RL
SW2
50kΩ
5. Common-mode Rejection Ration (CMRR)
-15V
Vicm×(1+Rf/Rs)
|VF8-VF7|
Δ
CMRR = 20×Log
[dB]
6. Power supply rejection ratio (PSRR)
Fig. 52 Test circuit1 (one channel only)
Vcc×(1+Rf /Rs)
|VF10-VF9|
Δ
PSRR = 20×Log
[dB]
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
Test Circuit 2 Switch Condition
SW SW SW SW SW SW SW SW SW SW SW SW SW SW
10 11 12 13 14
SW No.
1
2
3
4
5
6
7
8
9
Supply Current
OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
OFF OFF OFF ON OFF OFF OFF ON ON ON ON OFF OFF OFF
OFF ON OFF OFF ON ON OFF OFF ON ON ON OFF OFF OFF
ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF
High Level Output Voltage
Low Level Output Voltage
Output Source Current
Output Sink Current
Slew Rate
Gain Bandwidth Product
Equivalent Input Noise Voltage
Input voltage
VH
VL
t
Input wave
Output voltage
SR＝ΔV/Δt
90%
VH
ΔV
C
10%
VL
t
Δ
t
Output wave
Fig. 54 Slew Rate Input Waveform
Fig. 53 Test Circuit 2 (each Op-Amp)
Measurement Circuit 3 Amplifier To Amplifier Coupling
VCC
VCC
OTHER
CH
R1//R2
R1//R2
VEE
VEE
R1
VIN
R2
R1
R2
VOUT1
=0.5[Vrms]
V
V
VOUT2
40dB amplifier
40dB amplifier
100 VOUT1
×
CS 20 log
＝
×
VOUT2
(R1=1kΩ, R=100kΩ)
Fig. 55 Test Circuit 3
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
VCC
●Operational Notes
1) Unused circuits
When there are unused circuits, it is recommended that they are
connected as in Fig.56, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (Vicm).
+
-
Connect
to Vicm
Vicm
2) Input voltage
VEE
Applying VEE+36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage
is within the common mode input voltage range of the electric
characteristics.
Fig. 56 The example of
application circuit for unused op-amp
3) Power supply (single / dual)
The op-amp operates when the voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be
used as a dual supply op-amp as well.
4) Power dissipation (Pd)
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise
in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output
and the power supply, or the output and GND may result in IC destruction.
6) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
7) Radiation
This IC is not designed to withstand radiation.
8) IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical
characteristics due to piezo resistance effects.
9) IC operation
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected
to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and
charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias
current for Class A operation will suppress crossover distortion.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
11) Output capacitor
Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,
causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation
due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance
less than 0.1μF.
12) Oscillation by output capacitor
Please pay attention to oscillation by output capacitor, designing application of negative feed back loop circuit with these
ICs.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
5.0 0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
2500pcs
+
−
6
°
4°
4
°
Quantity
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.595
+0.1
0.17
-
0.05
S
0.1
S
1.27
Direction of feed
1pin
0.42 0.1
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
SOP14
<Tape and Reel information>
8.7 0.2
(MAX 9.05 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
14
8
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
7
0.15 0.1
1.27
0.4 0.1
0.1
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
SSOP-B8
<Tape and Reel information>
3.0 0.2
(MAX 3.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
8
7 6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2 3
4
0.15 0.1
S
0.1
0.22 0.10
M
0.08
Direction of feed
1pin
(0.52)
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
SSOP-B14
<Tape and Reel information>
5.0 0.2
Tape
Embossed carrier tape
2500pcs
14
8
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
7
0.15 0.1
0.1
0.65
Direction of feed
1pin
0.22 0.1
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
MSOP8
<Tape and Reel information>
2.9 0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
+
6°
4°
Quantity
3000pcs
−4°
8
7
6
5
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
+0.05
1pin
+0.05
−0.03
0.145
0.475
S
0.22
−0.04
0.08
S
Direction of feed
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved.
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
TSZ22111･15･001
25/26
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Marking Diagram
SOP8(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
Product Name
F-M
Package Type
Marking
Part Number Marking
SOP8
04YM
04YM
LOT Number
BA2904Y
FV-M
SSOP-B8
FVM-M MSOP8
04YM
F-M
SOP14
BA2902YFM
02YM
BA2902Y
FV-M
SSOP-B14
1PIN MARK
www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved.
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
TSZ22111･15･001
26/26
Daattaasshheeeett
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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