BA33D18HFP-TR_技术文档

Datasheet

Dual Output Fixed Output

LDO Regulators

BA3258HFP BA33Dxx series

●General Description

The BA3258HFP, BA33D15HFP, BA33D18HFP are fixed 2-output low-saturation regulators with a voltage accuracy at both

outputs of ±2%. These series incorporate both overcurrent protection and thermal shutdown (TSD) circuits in order to

prevent damage due to output short-circuiting and overloading, respectively.

●Features

Output voltage accuracy: ±2%.

●Package

W (Typ.) x D (Typ.) x H (Max.)

9.395mm x 10.54 mm x 2.005mm

HRP5

A ceramic capacitor can be used to prevent output

oscillation (BA3258HFP).

High Ripple Rejection (BA33Dxx Series)

Built-in thermal shutdown circuit

Built-in overcurrent protection circuit

●Key Specifications

Input Power Supply Voltage:

BA3258HFP

14.0V(Max.)

BA33Dxx Series

Output voltage range:

16.0V(Max.)

Fixed

HRP5

Output current: BA3258HFP

BA33Dxx Series

1A (Max.)

0.5A(Max.)

Operating temperature range:

BA3258HFP

BA33Dxx Series

-30℃ to 85℃

-25℃ to 105℃

●Applications

FPDs, TVs, PCs, DSPs in DVDs and CDs

●Ordering Information

B A

3

x

H

F

P

-

T R

Part

Package

Packaging and forming specification

Number

HFP:HRP5

TR: Embossed tape and reel

(HRP5)

●Lineup

Maximum output current

Output Voltage 1

Output Voltage 2

Package

Orderable Part Number

(Max.)

1A

(Typ.)

3.3V

(Typ.)

1.5V

1.8V

BA3258HFP-TR

BA33D15HFP-TR

BA33D18HFP-TR

HRP5

Reel of 2000

0.5A

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

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Datasheet

BA3258HFP BA33Dxx series

●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions

BA3258HFP

V_O1

5

3.3V

Pin No.

Pin name

V_CC

Function

Current

Limit

C_O1

1

2

Power supply pin

Output voltage monitor pin

GND pin

1μF

V₀₂_S

GND

V_O2

3

V_O2

4

1.5V output pin

3.3V output pin

GND pin

1.5V

5

V_O1

Current

Limit

GND

C_O2

3

FIN

GND

1μF

GND

Thermal

FIN

2

TOP VIEW

Shutdown

V₀₂_S

External capacitor

setting range

V_CC(1 Pin) Approximately 3.3µF

V_O1(5 Pin) 1µF to 1000µF

V_O2(4 Pin) 1µF to 1000µF

V_CC

V_IN

V_REF

1

C_IN

3.3μF

1

2

3

4

5

HRP5

Fig.1 BA3258HFP Block Diagram

BA33DxxSeries

GND(Fin)

V_CC

Pin No.

Pin name

V_CC

Function

Power supply pin

N.C. pin

Reference

Voltage

1

2

3

4

Current

Limit

N.C.

Sat.

Prevention

GND

V_O1

GND pin

3.3V output pin

5

FIN

V_O2

1.5V/1.8V output pin

GND pin

V_CC

GND

*The N.C. pin is not electrically connected internally

Thermal

Shut Down

Current

Limit

Sat.

Prevention

TOP VIEW

External capacitor

setting range

V_CC(1 Pin) Approximately 3.3µF

V_O1(4 Pin) 10µF to 1000µF

V_O2(5 Pin) 10µF to 1000µF

1

2

3

GND

4

5

V_CC

N.C.

V_O1

V_{O 2}

C_O

10μF

C_O

10μF

1μF

1

2

3

4

5

HRP5

Fig.2 BA33Dxx Series Block Diagram

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Datasheet

BA3258HFP BA33Dxx series

●Absolute Maximum Ratings

BA3258HFP

BA33Dxx Series

Parameter

Applied voltage

Power dissipation

Symbol

V_CC

Ratings

15^*1

Unit

V

Symbol

V_CC

Ratings

18^*1

Unit

V

Applied voltage

Pd^*2

2300^*2

mW

Power dissipation

Pd^*2

2300^*2

mW

Operating

Topr

Tstg

−30 to 85

−55 to 150

150

℃

Topr

Tstg

−25 to 105

−55 to 150

150

℃

temperature range

Ambient storage

temperature

Maximum junction

temperature

temperature range

Ambient storage

temperature

Maximum junction

temperature

Tjmax

*1 Must not exceed Pd

*2. Derated at 18.4 mW/℃ at Ta>25℃ when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm)

●Recommended Operating Ratings

BA3258HFP

BA33DxxSeries

Parameter

Ratings

Min. Typ. Max.

Ratings

Min. Typ. Max.

Parameter

Symbol

V_CC

Unit

V

Symbol

V_CC

Unit

Input power supply

voltage

Input power supply

voltage

4.75

-

14.0

4.1

-

16.0

V

3.3 V output current

1.5 V output current

I_O1

I_O2

-

1

A

3.3 V output current

1.5V output current

1.8 V output current

I_O1

I_O2

-

0.5

A

●Electrical Characteristics

BA3258HFP (Unless otherwise specified, Ta = 25℃, V_CC= 5 V)

Limits

Parameter

Symbol

I_B

Unit

Conditions

Min.

-

Typ. Max.

Bias current

3

5

mA I_O1=0mA,I_O2=0mA

[3.3 V Output Block]

Output voltage1

V_O1

∆V_D1

3.234 3.300 3.366

V

A

I_O1=50mA

Minimum output voltage difference 1

Output current capacity 1

Ripple rejection 1

-

1.0

46

-

1.1

-

1.3

-

I_O1=1A,V_CC=3.8V

I_O1

R.R.1

Reg.I1

Reg.L1

52

5

-

dB f=120Hz,ein=0.5Vp-p,I_O1=5mA

mV V_CC=4.75→14V,I_O1=5mA

mV I_O1=5mA→1A

Input stability 1

15

20

Load stability 1

-

5

Temperature coefficient of output

voltage 1^*3

T_CVO1

-

%/℃ I_O1=5mA,Tj=0℃ to 85℃

±0.01

[1.5 V Output Block]

Output voltage 2

V_O2

I_O2

1.470 1.500 1.530

V

A

I_O2=50mA

Output current capacity 2

Ripple rejection 2

Input stability 2

1.0

46

-

52

5

-

R.R.2

Reg.I2

Reg.L2

-

dB f=120Hz,ein=0.5Vp-p,I_O2=5mA

mV V_CC=4.1→14V,I_O2=5mA

mV I_O2=5mA→1A

15

20

Load stability 2

-

5

Temperature coefficient of output

T_CVO2

-

%/℃

I

_O2=5mA,Tj=0℃ to 125℃

±0.01

voltage 2^*3

*3: Not 100% tested.

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Datasheet

BA3258HFP BA33Dxx series

●Electrical Characteristics - continued

BA33Dxx Series (Unless otherwise specified, Ta = 25℃, V_CC= 5 V)

Limits

Parameter

Symbol

I_B

Unit

Conditions

Min. Typ. Max.

0.7 1.6

Bias current

-

mA I_O1=0mA,I_O2=0mA

[3.3V Output Block]

Output voltage 1

V_O13.234 3.300 3.366

V

A

I_O1=250mA

I_O1=250mA,V_CC=3.135V

Minimum output voltage difference 1

Output current capacity 1

Ripple rejection 1

∆V_D1

I_O1

－

0.5

50

-

0.25 0.50

-

R.R.1

Reg.I1

Reg.L1

58

5

-

dB f=120Hz,ein=1Vp-p,I_O1=200mA

mV V_CC=4.1V→16V,I_O1=250mA

mV I_O1=0mA→0.5A

Input stability 1

30

75

Load stability 1

-

30

Temperature coefficient of output

T_CVO1

-

±0.01

-

%/℃ I_O1=5mA,Tj=0℃ to 125℃

voltage 1^*3

BA33D15HFP V_O2output

[1.5V Output Block]

Output voltage 2

Output current capacity 2

Ripple rejection 2

Input stability 2

V_O21.470 1.500 1.530

V

A

I_O2=250mA

I_O2

0.5

50

-

R.R.2

Reg.I2

Reg.L2

58

5

-

dB f=120Hz,ein=1Vp-p,I_O2=200mA

mV V_CC=4.1V→16V,I_O2=250mA

mV I_O2=0mA→0.5A

30

75

Load stability 2

-

30

Temperature coefficient of output

voltage 2^*3

-

%/℃ I_O2=5mA,Tj=0℃ to 125℃

±0.01

T_CVO2

BA33D18HFP V_O2output

[1.8V Output Block]

Output voltage 2

Output current capacity 2

Ripple rejection 2

Input stability 2

V_O21.764 1.800 1.836

V

A

I_O2=250mA

I_O2

0.5

50

-

R.R.2

Reg.I2

Reg.L2

58

5

-

dB f=120Hz,ein=1Vp-p,I_O2=200mA

mV V_CC=4.1V→16V,I_O2=250mA

mV I_O2=0mA→0.5A

30

75

Load stability 2

-

30

Temperature coefficient of output

T_CVO2

-

%/℃ I_O2=5mA,Tj=0℃ to 125℃

±0.01

voltage 2^*3

*3: Not 100% tested.

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Datasheet

BA3258HFP BA33Dxx series

●Typical Performance Curves

BA3258HFP (Unless otherwise specified, Ta = 25℃, V_CC= 5V)

Fig.3

Fig.4

Circuit Current

(with no load)

Circuit Current vs. Load Current I_O1

(I_O1= 0 →1 A)

Fig.6

Input Stability

(3.3 V output with no load)

Fig.5

Circuit Current vs. Load Current I_O2

(I_O2= 0 → 1 A)

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BA3258HFP BA33Dxx series

●Typical Performance Curves - continued

Fig.8

Load Stability

(3.3 V output)

Fig.7

Input Stability

(1.5 V output with no load)

Fig.10

Fig.9

Load Stability

I/O Voltage Difference (3.3 V output)

(V_CC= 3.8 V, I_O1= 0 → 1 A)

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BA3258HFP BA33Dxx series

●Typical Performance Curves - continued

R.R.(1.5 V output)

R.R.(3.3 V output)

Fig.11

R.R. Characteristics

(ein = 0.5 V_P-P, I_O= 5 mA)

Fig.12

Output Voltage vs Temperature

(3.3 V output)

Fig.13

Fig.14

Circuit Current vs Temperature

(I_O= 0 mA)

Output Voltage vs Temperature

(1.5 V output)

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BA3258HFP BA33Dxx series

●Typical Performance Curves - continued

BA33D15HFP (Unless otherwise specified, Ta = 25℃, V_CC= 5V)

Fig.15

Circuit Current

(with no load)

Fig.16

Circuit Current vs Load Current I_O1

(I_O1= 0 → 500 mA)

Fig.17

Fig.18

Input Stability

Circuit Current vs Load Current I_O2

(I_O2= 0 → 500 mA)

(3.3 V output, I_O1= 250 mA）

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BA3258HFP BA33Dxx series

●Typical Performance Curves - continued

Fig.19

Input Stability

(1.5 V output, I_O2= 250 mA)

Fig.20

Load Stability

(3.3 V output)

Fig.22

Fig.21

I/O Voltage Difference

(V_CC= 3.135 V, 3.3 V output)

Load Stability

(1.5 V output)

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BA3258HFP BA33Dxx series

●Typical Performance Curves - continued

Vo2(1.5V output)

Vo1(3.3V output)

Fig.23

Fig.24

R.R. Characteristics

(ein = 1 V_P-P, I_O= 100 mA)

Output Voltage vs. Temperature

(3.3 V output)

Fig.26

Circuit Current vs Temperature

(I_O= 0 mA)

Fig.25

Output Voltage vs. Temperature

(1.5 V output)

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Datasheet

BA3258HFP BA33Dxx series

●I/O equivalence circuit

BA3258HFP

BA33DxxSeries

V_CC

V_O1/V_O2

V_O2

V_O1

V₀₂_S

Fig.27 BA3258HFP I/O equivalence circuit

Fig.28 BA33Dxx Series I/O equivalence circuit

●Power Dissipation

If the IC is used under excessive power dissipation conditions, the chip temperature will rise, which will have an adverse

effect on the electrical characteristics of the IC, such as a reduction in current capability. Furthermore, if the temperature

exceeds Tjmax, element deterioration or damage may occur. Implement proper thermal designs to ensure that the power

dissipation is within the permissible range in order to prevent instantaneous IC damage resulting from heat and maintain the

reliability of the IC for long-term operation. Refer to the power derating characteristics curves in Fig.29.

・Power Consumption (Pc) Calculation Method

*V_CC: Applied voltage

V_CC

I

_O1:Load current on V_O1side

V_CC

I^P

3.3 V output

I_O1

V_O1

I_O2:Load current on V_O2side

・Power consumption of 3.3V power transistor:

P_C1= (V_CC− 3.3) × I_O1

・Power consumption of V_O2power transistor:

I_CC:Circuit current

* The I_CC(circuit current) varies with the load.

(See reference data in Fig.4, 5, 16, and 17.)

Controller

V_CC

I_O2

Power Tr

V_O2

P_C2= (V_CC− V_O2) × I_O2

・Power consumption due to circuit current:

P_C3= V_CC× I_CC

I_CC

1.5 V output or

1.8 V output

GND

→P_C= P_C1+ P_C2+ P_C3

Refer to the above and implement proper thermal designs so that the IC will not be used under excessive power dissipation

conditions under the entire operating temperature range.

・Calculation example (BA33D15HFP)

Example: V_CC= 5V, I_O1= 200mA, and I_O2= 100mA

・Power consumption of 3.3V power transistor:

・Power consumption of 1.5V power transistor:

・Power consumption due to circuit current:

P_C1= (V_CC− 3.3) × I_O1= (5 − 3.3) × 0.2 = 0.34W

P_C2= (V_CC− 1.5) × I_O2= (5 − 1.5) × 0.2 = 0.35W

P_C3= V_CC× I_CC= 5 × 0.0085 = 0.0425 (W) (See Fig.16 and 17)

Implement proper thermal designs taking into consideration the dissipation at full power consumption

(i.e., P_C1+ P_C2+ P_C3= 0.34 + 0.35 + 0.0425 = 0.7325W).

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Datasheet

BA3258HFP BA33Dxx series

●Explanation of External Components

○BA3258HFP

1) Pin 1 (V_CCpin)

Connecting a ceramic capacitor with a capacitance of approximately 3.3μF between V_CCand GND as close to the pins

as possible is recommended.

2) Pins 4 and 5 (V_Opins)

Insert a capacitor between the Vo and GND pins in order to prevent output oscillation. The capacitor may oscillate if

the capacitance changes as a result of temperature fluctuations. Therefore, it is recommended that a ceramic

capacitor with a temperature coefficient of X5R or above and a maximum capacitance change (resulting from

temperature fluctuations) of ±10% be used. The capacitance should be between 1μF and 1,000µF. (Refer to Fig.30)

○BA33DxxSeries

1) Pin 1 (V_CCpin)

Insert a 1μF capacitor between V_CCand GND. The capacitance will vary depending on the application. Check the

capacitance with the application set and implement designing with a sufficient margin.

2) Pins 4 and 5 (V_Opins)

Insert a capacitor between the V_Oand GND pins in order to prevent oscillation. The capacitance may vary greatly with

temperature changes, thus making it impossible to completely prevent oscillation. Therefore, use a tantalum aluminum

electrolytic capacitor with a low ESR (Equivalent Serial Resistance). The output will oscillate if the ESR is too high or

too low, so refer to the ESR characteristics in Fig.31 and operate the IC within the stable operating region. If there is a

sudden load change, use a capacitor with higher capacitance. A capacitance between 10μF and 1,000μF is

recommended.

Board size: 70 mm × 70 × 1.6 mm (with a thermal via incorporated by the board)

10

10.0

5.0

10.0

5.0

4.0

2.0

Board surface area: 10.5 mm × 10.5 mm

9

8

Unstable region

不安定領域

(1) 2-layer board (Backside copper foil area: 15 mm × 15mm)

(2) 2-layer board (Backside copper foil area: 70 mm × 70 mm)

(3) 4-layer board (Backside copper foil area: 70 mm × 70mm)

(3) 7.3 W

(2) 5.5 W

不安定領域

Unstable region

2.0

1.0

7

6

5

1.0

Stable region

安定領域

0.5

0.2

0.5

0.2

0.15

0.1

4

3

2

1

0

Stable region

安定領域

(1) 2.3 W

0.1

0.05

Unstable region

不安定領域

0.02

0.01

0.02

0.01

0

25

50

75

100 125 150

0

200

400 600

Io [mA]

800 1000

0

200

400 600

Io [mA]

800 1000

AMBIENT TEMPERATURE：Ta［℃］

Fig.29 Thermal Derating Curves

Fig.30 BA3258HFP ESR characteristics

Fig.31 BA33Dxx Series

ESR characteristics

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Datasheet

BA3258HFP BA33Dxx series

●Operational Notes

1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break

down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated

values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.

2) GND voltage

The potential of GND pin must be minimum potential in all operating conditions.

3) Thermal Design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

4) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

5) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

6) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.

Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or

removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic

measure. Use similar precaution when transporting or storing the IC.

7) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic

diode or transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

8) Ground Wiring Pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external components, either.

9) Thermal Shutdown Circuit (TSD)

This IC incorporates a built-in thermal shutdown circuit for protection against thermal destruction. Should the junction

temperature (Tj) reach the thermal shutdown ON temperature threshold, the TSD will be activated, turning off all output

power elements. The circuit will automatically reset once the chip's temperature Tj drops below the threshold temperature.

Operation of the thermal shutdown circuit presumes that the IC's absolute maximum ratings have been exceeded.

Application designs should never make use of the thermal shutdown circuit.

10) Overcurrent protection circuit

An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents.

Continued use of the protection circuits should be avoided. Please note that the current increases negatively impact the

temperature.

11) Damage to the internal circuit or element may occur when the polarity of the V_CCpin is opposite to that of the other pins in

applications. (I.e. V_CCis shorted with the GND pin while an external capacitor is charged.) Use a maximum capacitance

of 1000 mF for the output pins. Inserting a diode to prevent back-current flow in series with V_CCor bypass diodes

between V_CCand each pin is recommended.

Bypass diode

抵抗

Resistor

Transistor (NPN)

トランジスタ(NPN)

(Pin B)

GND

B

Diode for preventing back current flow

C

（

P

端

in

子

A

）

（Pin B）

B

（端子）

C

E

B

V_CC

VCC

GND

N

Output pin

P

Ｐ

P

P^＋

N

Parasitic elements or

transistors

N

Ｎ

N

Ｎ

(Pin A)

P substrate

P 基板

P substrate

P 基板

Parasitic elements

寄生素子

Parasitic elements

GND

Parasitic elements

GND

Fig.32 Bypass diode

Fig.33 Example of Simple Bipolar IC Architecture

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

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Datasheet

BA3258HFP BA33Dxx series

●Physical Dimension Tape and Reel Information

HRP5

9.395 0.125

(MAX 9.745 include BURR)

Tape

Embossed carrier tape

2000pcs

8.82 0.1

(6.5)

1.905 0.1

Quantity

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

1

2

3

4

5

1.2575

+5.5°

4.5°

−4.5°

+0.1

0.27

−0.05

S

0.73 0.1

0.08

Direction of feed

1.72

S

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

●Marking Diagram

HRP5 (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Part Number

BA3258HFP

BA33D15HFP

BA33D18HFP

Package

HRP5

Part Number Marking

BA3258

HRP5

BA33D15

HRP5

BA33D18

www.rohm.com

TSZ02201-0R6R0A600090-1-2

26.2012 Rev.001

14/15

TSZ22111･15･001

Datasheet

BA3258HFP BA33Dxx series

●Revision History

Date

Revision

001

Changes

26.Jun.2012

New Release

www.rohm.com

TSZ02201-0R6R0A600090-1-2

26.2012 Rev.001

15/15

TSZ22111･15･001

Daattaasshheeeett

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Notice - Rev.003

Daattaasshheeeett

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Notice - Rev.003

Daattaasshheeeett

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.003


型号：	BA33D18HFP-TR
厂家：	ROHM
描述：	Dual Output Fixed Output LDO Regulators 双输出固定输出LDO稳压器线性稳压器IC 调节器电源电路输出元件
文件：	总18页 (文件大小：407K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BA33D18HFP-TR [ROHM]

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