BA82902YFJ-C_技术文档

Datasheet

Operational Amplifier Series

Automotive Excellent EMI Immunity

Ground Sense

Operational Amplifiers

BA82904Yxxx-C BA82902Yxxx-C

Key Specifications

General Description

◼

Operating Supply Voltage Range

BA82904Yxxx-C and BA82902Yxxx-C are high-gain,

ground sense input Op-Amps. These ICs are

monolithic ICs integrated dual or quad independent

Op-Amps on a single chip. These Op-Amps have

some features of low power consumption, and can

operate from 3V to 36V (single power supply).

Single Supply:

Dual Supply:

3V to 36V

±1.5V to ±18.0V

◼

Low Supply Current

BA82904Yxxx-C

0.5mA (Typ)

BA82902Yxxx-C

0.7mA (Typ)

20nA (Typ)

2nA (Typ)

BA82904Yxxx-C

and

BA82902Yxxx-C

are

◼

Input Bias Current:

Input Offset Current:

Operating Temperature Range: -40°C to +125°C

manufactured for automotive requirements of engine

control unit, electric power steering, and so on.

Furthermore, they have the advantage of EMI

tolerance dose. It is easy to replace with conventional

products, and the EMI design is simple.

Packages

SOP8

W(Typ) x D(Typ) x H(Max)

5.00mm x 6.20mm x 1.71mm

8.70mm x 6.20mm x 1.71mm

5.00mm x 6.40mm x 1.35mm

2.90mm x 4.00mm x 0.90mm

8.65mm x 6.00mm x 1.65mm

5.00mm x 6.40mm x 1.20mm

Features

AEC-Q100 Qualified^{(Note 1)}

◼

SOP14

SSOP-B14

MSOP8

SOP-J14

◼

Single or Dual Power Supply Operation

Wide Operating Supply Voltage Range

Standard Op-Amp Pin-assignments

Operable from Almost GND Level for Both Input

and Output

TSSOP-B14J

◼

Low Supply Current

High Open Loop Voltage Gain

Internal ESD Protection Circuit

Wide Operating Temperature Range

Integrated EMI Filter

(Note 1) Grade 1

Applications

◼

Engine Control Unit

Electric Power Steering (EPS)

Anti-Lock Braking System (ABS)

Automotive Electronics

Selection Guide

Maximum Operating Temperature

Output Current

Source / Sink

125°C

Supply Current

0.5mA

BA82904YF-C

BA82904YFVM-C

Automotive

Dual

30mA / 20mA

BA82902YF-C

BA82902YFV-C

BA82902YFJ-C

BA82902YFVJ-C

Quad

30mA / 20mA

0.7mA

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Equivalent Circuit

VCC

-IN

OUT

+IN

VEE

Figure 1. Equivalent Circuit (One Channel Only)

Pin Configuration

BA82904YF-C: SOP8

BA82904YFVM-C: MSOP8

Pin No.

Pin Name

OUT1

-IN1

(TOP VIEW)

1

2

3

4

5

6

7

8

OUT1

-IN1

VCC

OUT2

-IN2

1

2

3

4

8

7

6

5

CH1

+IN1

-

+

VEE

+IN1

VEE

CH2

+IN2

+

-

-IN2

+IN2

OUT2

VCC

BA82902YF-C: SOP14

BA82902YFV-C: SSOP-B14

BA82902YFJ-C: SOP-J14

BA82902YFVJ-C: TSSOP-B14J

Pin No.

Pin Name

1

2

OUT1

-IN1

(TOP VIEW)

OUT1 1

OUT4

14

3

+IN1

VCC

+IN2

-IN2

4

-IN1

+IN1

VCC

2

3

4

13 -IN4

CH1

CH4

-

+

-

5

+IN4

VEE

+IN3

-IN3

12

11

10

9

6

7

OUT2

OUT3

-IN3

+IN2 5

8

+

CH3

-

+

CH2

9

6

7

-IN2

10

11

12

13

14

+IN3

VEE

OUT2

8 OUT3

+IN4

-IN4

OUT4

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Absolute Maximum Ratings (Ta = 25°C)

Parameter

Symbol

Rating

Unit

Supply Voltage

V_CC-V_EE

V_ID

36

V

Differential Input Voltage^{(Note 1)}

Input Common-mode Voltage Range

Input Current

36

(V_EE-0.3) to (V_EE+36)

-10

V_ICM

I_I

V

mA

°C

Storage Temperature Range

Maximum Junction Temperature

Tstg

Tjmax

-55 to +150

150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then the input pin voltage is set to V_EEor more.

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

3

5

36

(±18)

Operating Supply Voltage

Operating Temperature

Vopr

Topr

V

(±1.5)

(±2.5)

-40

+25

+125

°C

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Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

MSOP8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

284.1

21

135.4

11

°C/W

Ψ_JT

SOP8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

197.4

21

109.8

19

°C/W

Ψ_JT

SOP14

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

166.5

26

108.1

22

°C/W

Ψ_JT

SSOP-B14

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

159.6

13

92.8

9

°C/W

Ψ_JT

SOP-J14

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

118.5

10

67.2

10

°C/W

Ψ_JT

TSSOP-B14J

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

185.4

16

98.4

14

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2mm x 74.2mm

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

70μm

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Electrical Characteristics

○BA82904Yxxx-C (Unless otherwise specified V_CC=5V, V_EE=0V)

Limits

Temperature

Parameter

Input Offset Voltage^{(Note 1)}

Input Offset Current^{(Note 1)}

Input Bias Current^{(Note 1)}

Supply Current

Symbol

V_IO

Unit

mV

Conditions

Range

Min

-

Typ

2

Max

25°C

Full range

25°C

6

V_OUT=1.4V

V_CC=5V to 30V, V_OUT=1.4V

-

9

-

2

40

I_IO

nA V_OUT=1.4V

Full range

25°C

-

50

-

20

-

60

I_B

nA V_OUT=1.4V

Full range

25°C

-

100

-

0.5

-

1.2

I_CC

mA R_L=∞, All Op-Amps

Full range

25°C

-

1.2

3.5

3.2

27

-

R_L=2kΩ

Maximum Output

Voltage (High)

V_OH

-

V

Full range

28

5

-

V_CC=30V, R_L=10kΩ

Maximum Output Voltage(Low) V_OL

Full range

25°C

20

mV R_L=∞, All Op-Amps

25

0

100

-

R_L≥2kΩ, V_CC=15V

V/mV

Large Signal Voltage Gain

A_V

V_OUT=1.4V to 11.4V

Full range

25°C

-

V_CC-1.5

Input Common-mode

Voltage Range

(V_CC-V_EE)=5V

V

V_ICM

V_OUT=V_EE+1.4V

Full range

0

-

V_CC-2.0

Common-mode Rejection

Ratio

CMRR Full range

70

20

10

2

80

100

30

-

dB V_OUT=1.4V

Power Supply Rejection Ratio PSRR Full range

dB V_CC=5V to 30V

25°C

V_+IN=1V, V_-IN=0V

mA V_OUT=0V

Output Source Current^{(Note 2)}

Output Sink Current^{(Note 2)}

I_SOURCE

Full range

25°C

1CH is short circuit

20

-

V_+IN=0V, V_-IN=1V

mA V_OUT=5V

Full range

25°C

1CH is short circuit

I_SINK

V_+IN=0V, V_-IN=1V

μA

12

-

40

0.2

0.5

120

V_OUT=200mV

V_CC=15V, A_V=0dB

R_L=2kΩ, C_L=100pF

Slew Rate

SR

GBW

CS

V/μs

25°C

V_CC=30V, R_L=2kΩ

C_L=100pF

Gain Bandwidth Product

25°C

-

MHz

Channel Separation

dB f=1kHz, input referred

25°C

-

(Note 1) Absolute value

(Note 2) Under high temperatures, it is important to consider the Tjmax and Thermal Resistance when selecting the output current.

When the output pin is continuously shorted, the output current may reduce because of the internal temperature rise by heating.

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Electrical Characteristics - continued

○BA82902Yxxx-C (Unless otherwise specified V_CC=5V, V_EE=0V)

Limits

Temperature

Parameter

Input Offset Voltage^{(Note 1)}

Input Offset Current^{(Note 1)}

Input Bias Current^{(Note 1)}

Supply Current

Symbol

V_IO

Unit

mV

Conditions

Range

Min

-

Typ

2

Max

25°C

Full range

25°C

6

V_OUT=1.4V

V_CC=5V to 30V, V_OUT=1.4V

-

9

-

2

40

I_IO

nA V_OUT=1.4V

Full range

25°C

-

50

-

20

-

60

I_B

nA V_OUT=1.4V

Full range

25°C

-

100

-

0.7

-

2

I_CC

mA R_L=∞, All Op-Amps

Full range

25°C

-

3

3.5

3.2

27

-

R_L=2kΩ

Maximum Output

Voltage (High)

V_OH

-

V

Full range

28

5

-

V_CC=30V, R_L=10kΩ

Maximum Output Voltage(Low) V_OL

Full range

25°C

20

mV R_L=∞, All Op-Amps

25

0

100

-

R_L≥2kΩ, V_CC=15V

V/mV

Large Signal Voltage Gain

A_V

V_OUT=1.4V to 11.4V

Full range

25°C

-

V_CC-1.5

Input Common-mode

Voltage Range

(V_CC-V_EE)=5V

V

V_ICM

V_OUT=V_EE+1.4V

Full range

0

-

V_CC-2.0

Common-mode Rejection

Ratio

CMRR Full range

70

20

10

2

80

100

30

-

dB V_OUT=1.4V

Power Supply Rejection Ratio PSRR Full range

dB V_CC=5V to 30V

25°C

V_+IN=1V, V_-IN=0V

mA V_OUT=0V

Output Source Current^{(Note 2)}

Output Sink Current^{(Note 2)}

I_SOURCE

Full range

25°C

1CH is short circuit

20

-

V_+IN=0V, V_-IN=1V

mA V_OUT=5V

Full range

25°C

1CH is short circuit

I_SINK

V_+IN=0V, V_-IN=1V

μA

12

-

40

0.2

0.5

120

V_OUT=200mV

V_CC=15V, Av=0dB

R_L=2kΩ, C_L=100pF

Slew Rate

SR

GBW

CS

V/μs

25°C

V_CC=30V, R_L=2kΩ

C_L=100pF

Gain Bandwidth Product

25°C

-

MHz

Channel Separation

dB f=1kHz, input referred

25°C

-

(Note 1) Absolute value

(Note 2) Under high temperatures, it is important to consider the Tjmax and Thermal Resistance when selecting the output current.

When the output pin is continuously shorted, the output current may reduce because of the internal temperature rise by heating.

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Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also

shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s or general

document.

1. Absolute Maximum Ratings

Absolute maximum rating items indicate the condition which must not be exceeded even momentarily. Applying of voltage in

excess of absolute maximum rating or use at outside the temperature range which is provided in the absolute maximum

ratings may cause deteriorating the characteristics of the IC or destroying it.

1.1 Supply Voltage (V_CC-V_EE

)

Indicates the maximum voltage that can be applied between the positive power supply pin and negative power

supply pin without deteriorating the characteristics of internal circuit or destroying the IC.

1.2 Differential Input Voltage (V_ID)

Indicates the maximum voltage that can be applied between non-inverting pin and inverting pin without deteriorating

the characteristics of the IC or without destroying it.

1.3 Input Common-mode Voltage Range (V_ICM

)

Indicates the voltage range that can be applied to the non-inverting pin and inverting pin without deteriorating the

characteristics of the IC or without destroying it. Input common-mode voltage range of the maximum ratings does not

assure normal operation of the IC. For normal operation, use the IC within the input common-mode voltage range of

electrical characteristics.

1.4 Storage Temperature Range (Tstg)

The storage temperature range denotes the range of temperatures the IC can be stored without causing excessive

deteriorating the characteristics of the IC.

2. Electrical Characteristics

2.1 Input Offset Voltage (V_IO)

Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated as the input voltage

difference required for setting the output voltage at 0V.

2.2 Input Offset Current (I_IO)

Indicates the difference of input bias current between the non-inverting and inverting pins.

2.3 Input Bias Current (I_B)

Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the

non-inverting and inverting pins.

2.4 Supply Current (I_CC

)

Indicates the current that flows within the IC under no-load conditions.

2.5 Maximum Output Voltage (High) / Maximum Output Voltage (Low) (V_OH/V_OL

)

Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output

voltage High and maximum output voltage Low. Maximum output voltage (High) indicates the upper limit of output

voltage while maximum output voltage (Low) indicates the lower limit.

2.6 Large Signal Voltage Gain (A_V)

Indicates the amplifying rate (gain) of output voltage regarding the voltage difference between non-inverting pin and

inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage.

A_V= (Output Voltage) / (Differential Input Voltage)

2.7 Input Common-mode Voltage Range (V_ICM

)

Indicates the input voltage range where IC normally operates.

2.8 Common-mode Rejection Ratio (CMRR)

Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is

normally the fluctuation of DC.

CMRR = (Change of Input Common-mode Voltage) / (Input Offset Voltage Fluctuation)

2.9 Power Supply Rejection Ratio (PSRR)

Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of

DC.

PSRR = (Change of Power Supply Voltage) / (Input Offset Voltage Fluctuation)

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Description of Electrical Characteristics - continued

2.10 Output Source Current / Output Sink Current (I_SOURCE/ I_SINK

)

The maximum current that can be output from the IC under specific output conditions. It is typically divided into

output source current and output sink current. The output source current indicates the current flowing out from the IC,

and the output sink current indicates the current flowing into the IC.

2.11 Slew Rate (SR)

This parameter indicates the operation speed of the Op-Amps. Indicates the rate at which the output voltage can

change per specified unit time.

2.12 Gain Bandwidth Product (GBW)

This indicates the product of an arbitrary frequency and its gain in the range of the gain slope of 6 dB/octave.

2.13 Channel Separation (CS)

Indicates the fluctuation in the output voltage of the other channel regarding the change of output voltage of the

channel which is driven.

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Typical Performance Curves

○BA82904Yxxx-C

1.0

0.8

1.0

0.8

0.6

0.4

0.2

0.0

Ta=+25ºC

V_CC=36V

Ta=-40ºC

0.6

V_CC=5V

0.4

Ta=+125ºC

V_CC=3V

0.2

0.0

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 2. Supply Current vs Supply Voltage

Figure 3. Supply Current vs Ambient Temperature

5

4

3

2

1

0

40

30

20

10

0

Ta=+25ºC

Ta=+125ºC

Ta=-40ºC

-50 -25

0

25

50

75 100 125 150

0

10

20

30

40

Ambient Temperature: Ta[°C]

Supply Voltage: Vcc[V]

Figure 4. Maximum Output Voltage vs Supply Voltage

Figure 5. Maximum Output Voltage vs Ambient Temperature

(R_L=10kΩ)

(V_CC=5V, R_L=2kΩ)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82904Yxxx-C

50

40

30

20

10

0

Ta=-40ºC

40

V_CC=5V

Ta=+25ºC

V_CC=36V

V_CC=3V

30

20

Ta=+125ºC

10

0

1

2

3

4

5

-50 -25

0

25

50

75 100 125 150

Output Voltage: VOUT[V]

Ambient Temperature: Ta[°C]

Figure 6. Output Source Current vs Output Voltage

(V_CC=5V)

Figure 7. Output Source Current vs Ambient Temperature

(V_OUT=0V)

50

100

10

40

V_CC=36V

Ta=+125ºC

1

30

V_CC=5V

Ta=+25ºC

0.1

20

V_CC=3V

Ta=-40ºC

0.01

10

0

0.001

-50 -25

0

25

50

75 100 125 150

0.0

1.0

2.0

3.0

4.0

5.0

Ambient Temperature: Ta[°C]

Output Voltage: VOUT[V]

Figure 8. Output Sink Current vs Output Voltage

(V_CC=5V)

Figure 9. Output Sink Current vs Ambient Temperature

(V_OUT=V_CC

)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82904Yxxx-C

80

70

80

70

60

50

40

30

20

10

0

Ta=+25ºC

V_CC=36V

60

Ta=-40ºC

50

V_CC=5V

40

Ta=+125ºC

V_CC=3V

30

20

10

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 11. Output Sink Current vs Ambient Temperature

(V_OUT=0.2V)

Figure 10. Output Sink Current vs Supply Voltage

(V_OUT=0.2V)

8

6

8

6

4

Ta=-40ºC

Ta=+25ºC

V_CC=5V

V_CC=36V

2

V_CC=3V

0

-2

-4

-6

-8

Ta=+125ºC

-2

-4

-6

-8

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 13. Input Offset Voltage vs Ambient Temperature

(V_ICM=0V, V_OUT=1.4V)

Figure 12. Input Offset Voltage vs Supply Voltage

(V_ICM=0V, V_OUT=1.4V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82904Yxxx-C

50

40

30

50

40

30

20

10

0

V_CC=36V

V_CC=3V

Ta=-40ºC

Ta=+25ºC

20

V_CC=5V

Ta=+125ºC

10

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 14. Input Bias Current vs Supply Voltage

(V_ICM=0V, V_OUT=1.4V)

Figure 15. Input Bias Current vs Ambient Temperature

(V_ICM=0V, V_OUT=1.4V)

50

40

30

20

10

0

10

8

6

Ta=-40ºC

Ta=+25ºC

4

2

0

Ta=+125ºC

-2

-4

-6

-8

-10

-1

0

1

2

3

4

5

-50 -25

0

25

50 75 100 125 150

Input Common-mode Voltage: V_ICM[V]

Ambient Temperature: Ta[°C]

Figure 16. Input Bias Current vs Ambient Temperature

(V_CC=30V, V_ICM=28V, V_OUT=1.4V)

Figure 17. Input Offset Voltage vs

Input Common-mode Voltage

(V_CC=5V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82904Yxxx-C

10

5

10

5

V_CC=36V

Ta=-40ºC

Ta=+25ºC

V_CC=5V

0

V_CC=3V

Ta=+125ºC

-5

-10

0

10

20

30

40

-50 -25

0

25

50 75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 19. Input Offset Current vs

Ambient Temperature

Figure 18. Input Offset Current vs

Supply Voltage

(V_ICM=0V, V_OUT=1.4V)

140

130

120

110

100

90

140

130

120

110

100

90

Ta=+25ºC

Ta=-40ºC

V_CC=36V

V_CC=5V

V_CC=3V

Ta=+125ºC

80

70

60

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 21. Large Signal Voltage Gain vs

Ambient Temperature

(R_L=2kΩ)

Figure 20. Large Signal Voltage Gain vs

Supply Voltage

(R_L=2kΩ)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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TSZ02201-0GLG0G200040-1-2

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Typical Performance Curves - continued

○BA82904Yxxx-C

140

120

100

80

120

V_CC=36V

Ta=+25ºC

Ta=-40ºC

100

V_CC=5V

80

Ta=+125ºC

V_CC=3V

60

40

60

40

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 22. Common Mode Rejection Ratio vs

Supply Voltage

Figure 23. Common Mode Rejection Ratio vs

Ambient Temperature

(V_OUT=1.4V)

140

130

120

110

100

90

80

70

60

-50 -25

0

25 50 75 100 125 150

Ambient Temperature: Ta[°C]

Figure 24. Power Supply Rejection Ratio vs

Ambient Temperature

(V_CC=5V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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TSZ02201-0GLG0G200040-1-2

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Typical Performance Curves - continued

○BA82902Yxxx-C

2.0

1.6

1.2

0.8

0.4

0.0

2.0

1.6

1.2

V_CC=36V

Ta=+25ºC

Ta=-40ºC

0.8

Ta=+125ºC

V_CC=5V

V_CC=3V

0.4

0.0

-50 -25

0

25

50

75 100 125 150

0

10

20

30

40

Ambient Temperature: Ta[°C]

Supply Voltage: Vcc[V]

Figure 26. Supply Current vs Ambient Temperature

Figure 25. Supply Current vs Supply Voltage

5

4

3

2

1

0

40

30

20

10

0

Ta=+25ºC

Ta=+125ºC

Ta=-40ºC

-50 -25

0

25

50

75 100 125 150

0

10

20

30

40

Ambient Temperature: Ta[°C]

Supply Voltage: Vcc[V]

Figure 28. Maximum Output Voltage vs Ambient Temperature

Figure 27. Maximum Output Voltage vs Supply Voltage

(V_CC=5V, R_L=2kΩ)

(R_L=10kΩ)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82902Yxxx-C

50

40

30

20

10

0

Ta=-40ºC

40

V_CC=5V

Ta=+25ºC

V_CC=36V

V_CC=3V

30

20

Ta=+125ºC

10

0

1

2

3

4

5

-50 -25

0

25

50

75 100 125 150

Output Voltage: VOUT[V]

Ambient Temperature: Ta[°C]

Figure 30. Output Source Current vs Ambient Temperature

(V_OUT=0V)

Figure 29. Output Source Current vs Output Voltage

(V_CC=5V)

50

100

10

40

V_CC=36V

Ta=+125ºC

1

30

V_CC=5V

Ta=+25ºC

0.1

20

V_CC=3V

Ta=-40ºC

0.01

10

0

0.001

-50 -25

0

25

50

75 100 125 150

0.0

1.0

2.0

3.0

4.0

5.0

Ambient Temperature: Ta[°C]

Output Voltage: VOUT[V]

Figure 32. Output Sink Current vs Ambient Temperature

(V_OUT=V_CC

Figure 31. Output Sink Current vs Output Voltage

(V_CC=5V)

)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82902Yxxx-C

80

70

80

70

60

50

40

30

20

10

0

Ta=+25ºC

V_CC=36V

60

Ta=-40ºC

50

V_CC=5V

40

Ta=+125ºC

V_CC=3V

30

20

10

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 33. Output Sink Current vs Supply Voltage

(V_OUT=0.2V)

Figure 34. Output Sink Current vs Ambient Temperature

(V_OUT=0.2V)

8

6

8

6

4

Ta=-40ºC

Ta=+25ºC

V_CC=5V

V_CC=36V

2

V_CC=3V

0

-2

-4

-6

-8

Ta=+125ºC

-2

-4

-6

-8

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 36. Input Offset Voltage vs Ambient Temperature

(V_ICM=0V, V_OUT=1.4V)

Figure 35. Input Offset Voltage vs Supply Voltage

(V_ICM=0V, V_OUT=1.4V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82902Yxxx-C

50

40

30

50

40

30

20

10

0

V_CC=36V

Ta=-40ºC

Ta=+25ºC

20

V_CC=3V

V_CC=5V

Ta=+125ºC

10

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 38. Input Bias Current vs Ambient Temperature

(V_ICM=0V, V_OUT=1.4V)

Figure 37. Input Bias Current vs Supply Voltage

(V_ICM=0V, V_OUT=1.4V)

50

40

30

20

10

0

10

8

6

Ta=-40ºC

Ta=+25ºC

4

2

0

Ta=+125ºC

-2

-4

-6

-8

-10

-1

0

1

2

3

4

5

-50 -25

0

25

50 75 100 125 150

Input Common-mode Voltage: V_ICM[V]

Ambient Temperature: Ta[°C]

Figure 40. Input Offset Voltage vs

Input Common-mode Voltage

(V_CC=5V)

Figure 39. Input Bias Current vs Ambient Temperature

(V_CC=30V, V_ICM=28V, V_OUT=1.4V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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TSZ02201-0GLG0G200040-1-2

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Typical Performance Curves - continued

○BA82902Yxxx-C

10

5

10

5

V_CC=36V

Ta=-40ºC

Ta=+25ºC

V_CC=5V

0

V_CC=3V

Ta=+125ºC

-5

-10

0

10

20

30

40

-50 -25

0

25

50 75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 41. Input Offset Current vs

Supply Voltage

Figure 42. Input Offset Current vs

Ambient Temperature

(V_ICM=0V, V_OUT=1.4V)

140

130

120

110

100

90

140

130

120

110

100

90

Ta=+25ºC

Ta=-40ºC

V_CC=36V

V_CC=5V

V_CC=3V

Ta=+125ºC

80

70

60

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 44. Large Signal Voltage Gain vs

Ambient Temperature

(R_L=2kΩ)

Figure 43. Large Signal Voltage Gain vs

Supply Voltage

(R_L=2kΩ)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves - continued

○BA82902Yxxx-C

140

120

100

80

120

V_CC=36V

Ta=+25ºC

Ta=-40ºC

100

V_CC=5V

80

Ta=+125ºC

V_CC=3V

60

40

60

40

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage: Vcc[V]

Ambient Temperature: Ta[°C]

Figure 45. Common Mode Rejection Ratio vs

Supply Voltage

Figure 46. Common Mode Rejection Ratio vs

Ambient Temperature

(V_OUT=1.4V)

140

130

120

110

100

90

80

70

60

-50 -25

0

25 50 75 100 125 150

Ambient Temperature: Ta[°C]

Figure 47. Power Supply Rejection Ratio vs

Ambient Temperature

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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TSZ02201-0GLG0G200040-1-2

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Application Information

Test Circuit 1: Measurement Condition

V_CC, V_EE, V_EK, V_ICMUnit: V

Parameter

V_F

SW1

SW2

SW3

V_CC

V_EE

V_EK

V_ICM

Calculation

Input Offset Voltage

V_F1

V_F2

ON

OFF 5 to 30

0

-1.4

0

1

2

3

4

5

6

Input Offset Current

Input Bias Current

OFF

ON

5

V_F3

V_F4

V_F5

V_F6

V_F7

V_F8

V_F9

V_F10

OFF

ON

OFF

15

5

0

-1.4

-11.4

-1.4

0

Large Signal Voltage Gain

ON

0

Common-mode Rejection Ratio

(Input Common-mode Voltage Range)

OFF

5

3.5

0

5

Power Supply Rejection Ratio

30

0

0.1µF

- Calculation -

1. Input Offset Voltage (V_IO)

R_F=50kΩ

V

500kΩ

0.1µF

F1

1+ R / R

V

=

[V]

SW1

VCC

IO

F

S

15V

V_EK

V_O

R_S=50Ω

R_I=10kΩ

2. Input Offset Current (I_IO)

500kΩ

DUT

V

-V

NULL

-15V

F2 F1

× (1+ R / R

I

=

[A]

SW3

IO

R

)

R_S=50Ω

R_I=10kΩ

1000pF

I

F

S

V

V_F

R_L

V_ICM

SW2

3. Input Bias Current (I_B)

50kΩ

VEE

V

-V

F4 F3

2 × R × (1+ R / R

I

=

[A]

B

)

I

F

S

Figure 48. Test Circuit 1 (One Channel Only)

4. Large Signal Voltage Gain (A_V)

ΔV × (1+ R /R

)

EK

F

S

A

=

20 × Log

[dB]

V

-V

F5 F6

5. Common-mode Rejection Ration (CMRR)

ΔV

× (1+ R /R

F

)

ICM

S

CMRR

=

20 × Log

[dB]

V

-V

F8 F7

6. Power Supply Rejection Ratio (PSRR)

ΔV

CC

× (1+ R /R )

F

S

PSRR = 20 × Log

[dB]

V

-V

F10 F9

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Application Information - continued

Test Circuit 2: Switch Condition

SW SW SW SW SW SW SW SW SW SW SW SW SW SW

10 11 12 13 14

SW No.

1

2

3

4

5

6

7

8

9

Supply Current

OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF

OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF

OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF

OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON

OFF OFF OFF ON OFF OFF OFF ON ON ON ON OFF OFF OFF

OFF ON OFF OFF ON ON OFF OFF ON ON ON OFF OFF OFF

ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF

Maximum Output Voltage (High)

Maximum Output Voltage (Low)

Output Source Current

Output Sink Current

Slew Rate

Gain Bandwidth Product

Equivalent Input Noise Voltage

SW4

Input voltage

SW5

R₂

V_H

VCC

A

V_L

－

＋

time

Input wave

Output voltage

SW1

R_S

SW2

SW3

SR＝ΔV/Δt

90%

SW14

SW13

SW9 SW10 SW11 SW12

V_H

SW7 SW8

SW6

R₁

C

ΔV

VEE

A

10%

V

R_L

C_L

V

～

V_L

～

V_IN-

V_IN+

V_OUT

t

Δ

time

Output wave

Figure 49. Test Circuit 2 (One Channel Only)

Figure 50. Slew Rate Waveform

Test Circuit 3: Channel Separation Measurement Condition

VCC

OTHER

CH

R₁//R₂

VEE

R₁

R₂

R₁

R₂

V_OUT1

V

V_OUT2

V_IN

=0.5[Vrms]

40dB amplifier

100 V_OUT1

×

CS 20 log

＝

×

V_OUT2

(R₁=1kΩ, R₂=100kΩ)

Figure 51. Test Circuit 3

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Application Information - continued

EMI Immunity

BA82904Yxxx-C and BA82902Yxxx-C have high tolerance for electromagnetic interference from the outside because they

have EMI filter, and the EMI design is simple. The data of the IC simple substance on ROHM board are as follows. They

are most suitable to replace from conventional products. The test condition is based on ISO11452-2.

<Test Condition> Based on ISO11452-2

Test Circuit: Voltage Follower

V_CC: 12V

V_IN+: 6V

Conventional Product

Test Method: Substituted Law

(Progressive Wave)

Field Intensity: 200V/m

Test Wave: CW (Continuous Wave)

Frequency: 200MHz – 1000MHz (2% step)

BA82904Yxxx-C,

BA82902Yxxx-C

Figure 52. EMI Characteristics

Figure 54. EMI Evaluation Board (BA82902Yxxx-C)

Figure 53. EMI Evaluation Board (BA82904Yxxx-C)

Figure 55. Measurement Circuit of EMI Evaluation

(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed.

Design and Evaluate in actual application before use.

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Application Information - continued

VCC

1. Unused Circuits

When there are unused circuits, it is recommended that they are

connected as in Figure 56, and set the non-inverting input pin to electric

potential within the input common-mode voltage range (V_ICM).

+

-

Connect

to V_ICM

V_ICM

2. Input Voltage

Applying V_EE+36V to the input pin is possible without causing deterioration

of the electrical characteristics or destruction, regardless of the supply

voltage. However, this does not ensure normal circuit operation. Note that

the circuit operates normally only when the input voltage is within the

common-mode input voltage range of the electric characteristics.

VEE

Figure 56. Example of Application

Circuit for Unused Op-amp

3. Power Supply (single / dual)

The Op-Amp operates when the voltage supplied is between the VCC and

VEE pin. Therefore, the single supply Op-Amp can be used as dual supply

Op-Amp as well.

4. IC Operation

The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected

to the middle potential of V_CCand V_EE, crossover distortion occurs at the changeover between discharging and charging

of the output current. Connecting a resistor between the output pin and the VEE pin, and increasing the bias current for

Class A operation will suppress crossover distortion.

5. Output Capacitor

When the VCC pin is shorted to V_EE(GND) electric potential in a state where electric charge is accumulated in the

external capacitor that is connected to the output pin, the accumulated electric charge will flow through parasitic elements

or pin protection elements inside the circuit and discharges to the VCC pin. It may cause damage to the elements inside

the circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative

feedback circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, set the

value of the capacitor connected to the output pin to 0.1uF or less to prevent IC damage caused by the accumulation of

electric charge as mentioned above.

6. Oscillation by Output Capacitor

Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop

circuit with these ICs.

7. IC handling

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical

characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 57. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all

within the Area of Safe Operation (ASO).

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Ordering Information

B A 8 2 9 0 x Y x x x

-

C x x

Part Number

BA82904Yxxx

BA82902Yxxx

Package

: SOP8

SOP14

Packaging and forming specification

C: Automotive (Engine control unit, EPS,

ABS, and so on)

F

FV : SSOP-B14

FVM: MSOP8

FJ : SOP-J14

FVJ : TSSOP-B14J

E2: Embossed tape and reel

(SOP8/SOP14/SSOP-B8/SSOP-B14

/SOP-J14/TSSOP-B14J)

TR: Embossed tape and reel

(MSOP8)

Lineup

Operating

Temperature Range

Operating

Supply Voltage

Number of

Channels

Package

Reel of 2500

Orderable Part Number

SOP8

Dual

BA82904YF-CE2

BA82904YFVM-CTR

BA82902YF-CE2

BA82902YFV-CE2

BA82902YFJ-CE2

BA82902YFVJ-CE2

MSOP8

Reel of 3000

Reel of 2500

SOP14

-40°C to +125°C

3V to 36V

SSOP-B14

Quad

SOP-J14

TSSOP-B14J

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Marking Diagrams

SOP8(TOP VIEW)

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

Pin 1 Mark

SOP14(TOP VIEW)

SSOP-B14(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

Pin 1 Mark

SOP-J14(TOP VIEW)

TSSOP-B14J (TOP VIEW)

Part Number Marking

LOT Number

Pin 1 Mark

Product Name

Package Type

Marking

82904

F-C

SOP8

BA82904Y

MSOP8

FVM-C

F-C

SOP14

BA82902YF

802Y

FV-C

SSOP-B14

SOP-J14

BA82902Y

FJ-C

82902YFJ

802YJ

FVJ-C

TSSOP-B14J

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Physical Dimension and Packing Information

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT: mm)

PKG: SOP8

Drawing No.: EX112-5001-1

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Physical Dimension and Packing Information - continued

Package Name

SOP14

(Max 9.05 (include.BURR))

(UNIT: mm)

PKG: SOP14

Drawing No.: EX113-5001

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Physical Dimension and Packing Information - continued

Package Name

SSOP-B14

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Physical Dimension and Packing Information - continued

Package Name

MSOP8

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Physical Dimensions and Packing Information – continued

Package Name

SOP-J14

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Physical Dimensions and Packing Information – continued

Package Name

TSSOP-B14J

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Revision History

Date

Revision

001

Changes

10.May.2017

01.Jun.2017

14.Jun.2017

New Release

002

Correction of erroneous description : P.3 Delete (Note 2)

003

P.3 Update Orderable Parts Number

P.1 Update General description

P.23 Added application hint

29.Jun.2017

004

27.Jul.2017

31.Aug.2017

20.Feb.2018

15.Apr.2020

22.Sep.2022

005

006

007

008

009

Update Physical Dimension and Packing Information

P.5, 6 Change Limits

Update Lineup (BA82902YFJ-C, BA82902YFVJ-C)

Correction of erroneous description : Change Gain units of page 5 and page 6

Modified title

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BA82902YFJ-C
厂家：	ROHM
描述：	BA82902YFJ-C是将高增益且接地检测输入独立的运算放大器以4个电路集成于1枚芯片的单片IC。工作范围宽达3V～36V(单一电源工作时)，且消耗电流低，适用于引擎控制单元、EPS、ABS等所有车载应用。不仅如此，还具有出色的EMI耐受力，可轻松替换现有产品，EMI设计也更容易。放大器运算放大器
文件：	总38页 (文件大小：1977K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BA82902YFJ-C [ROHM]

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