BD00C0AFP-CE2 [ROHM]
Fixed Positive LDO Regulator;
| 型号： | BD00C0AFP-CE2 |
| 厂家： | 
ROHM |
| 描述： | Fixed Positive LDO Regulator |
| 文件： | 总46页 (文件大小：1744K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Single-Output LDO Regulators
35V Voltage Resistance
1A LDO Regulators
BDxxC0A-C series BDxxC0AW-C series
●Description
●Packages
W(Typ) x D(Typ) x H(Max)
The BDxxC0A-C series and the BDxxC0AW-C series are
low-saturation regulators. The series’ output voltages are
Variable, 3.3V, 5.0V, 8.0V and 9.0V and packages are
TO252-3/5 and HRP5 and TO263-3F/5F. This series has a
built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits and a
thermal Shutdown circuit that protects the IC from thermal
damage due to overloading.
TO252-5
TO252-3
HRP5
6.50mm x 9.50mm x 2.50mm
6.50mm x 9.50mm x 2.50mm
9.395mm x 10.540mm x 2.005mm
10.16mm x 15.10mm x 4.70mm
●Key Specifications
1) Output current capability: 1A
2) Output voltage: Variable, 3.3V, 5.0V, 8.0V and 9.0V
3) High output voltage accuracy
(Ta=25°C, TO252-3/5, HRP5): ±1%
4) Low saturation with PDMOS output
5) Built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits
6) Built-in thermal Shutdown circuit for protecting the IC
from thermal damage due to overloading
7) Low ESR Capacitor
TO263-5F
8) TO252-3/5, HRP5, TO263-3F/5F package
9) AEC-Q100 Qualified
●Features
・Supply Voltage(Vo ≥ 3.0V):
・Supply Voltage(Vo < 3.0V):
・Output Voltage(BD00C0AW):
・Output Current:
Vo+1.0V to 26.5V
4.0V to 26.5V
1.0V to 15.0V
1A
TO263-3F
10.16mm x 15.10mm x 4.70mm
・Output Voltage Precision
(Ta=25°C): ±1% (TO252-3/5, HRP5)
(-40°C ≤ Ta ≤ +125°C): ±3%
・Operating Temperature Range: -40°C ≤ Ta ≤ +125°C
●Applications
Automotive
(body, audio system, navigation system, etc.)
●Ordering part number
B
D
x
x
C
0
A W
x
x
x
- C
x
x
Output voltage
00: Variable
33: 3.3V
50: 5.0V
80: 8.0V
Current
capacity
C0A: 1A
Shutdown switch
W: With switch
None: Without switch
Package
FP: TO252-3/5
HFP: HRP5
Packaging and forming specification
E2: Embossed tape and reel
(TO252-3/5, TO263-3F/5F)
TR: Embossed tape and reel
(HRP5)
FP2: TO263-3F/5F
90: 9.0V
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
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General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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BDxxC0A-C series BDxxC0AW-C series
●Lineup
Articles
Variable
3.3
○
○
○
○
○
○
5.0
○
○
○
○
○
○
8.0
○
○
○
○
○
○
9.0
○
○
○
○
○
○
Package
TO252-5 Reel of 2000
BDxxC0AWFP-CE2
BDxxC0AFP-CE2
BDxxC0AWHFP-CTR
BDxxC0AHFP-CTR
BDxxC0AWFP2-CE2
BDxxC0AFP2-CE2
○
-
TO252-3
HRP5
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 500
Reel of 500
○
-
HRP5
○
-
TO263-5F
TO263-3F
●Typical Application Circuits
〈Output Voltage Variable Type〉
Vcc
Vo
R2
Vcc
Cin
Cout
CTL
ADJ
GND
R1
Figure 1. Typical Application Circuit
Output Voltage Variable Type
〈Output Voltage Fixation Type (With Shutdown SW)〉
Vcc
Vo
Vcc
Cin
Cout
CTL
N.C.
GND
Figure 2. Typical Application Circuit
Output Voltage Fixation Type (With Shutdown SW)
〈Output Voltage Fixation Type (Without Shutdown SW)〉
Vcc
Vo
Vcc
Cin
Cout
GND
Figure 3. Typical Application Circuit
Output Voltage Fixation Type (Without Shutdown SW)
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BDxxC0A-C series BDxxC0AW-C series
●Pin Configurations/Pin Descriptions
〈With Shutdown SW (TO252-5/HRP5/TO263-5F)〉
TO252-5
(TOP VIEW)
TO263-5F
(TOP VIEW)
HRP5
(TOP VIEW)
FIN
FIN
1
2
3
4 5
1 2 3 4
5
1 2 3 4 5
HRP5
TO263-5F
TO252-5
Figure 4. Pin Configurations (With Shutdown SW)
Pin No.
Pin Name
CTL
Function
1
2
Output Control Pin
Power Supply Pin
Vcc
N.C. (Note 1)
GND
N.C. Pin (TO252-5)
GND (HRP5/TO263-5F)
3
4
Vo
Output Pin
ADJ
Variable Pin (BD00C0AW)
N.C. Pin (BD33/50/80/90C0AW)
5
N.C. (Note 1)
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
〈Without Shutdown SW (TO252-3/TO263-3F)〉
TO263-3F
(TOP VIEW)
TO252-3
(TOP VIEW)
FIN
1
2
3
1
2
3
TO263-3F
TO252-3
Figure 5. Pin Descriptions (Without Shutdown SW)
Pin No.
1
Pin Name
Vcc
N.C. (Note 1)
GND
Function
Power Supply Pin
N.C. Pin (TO252-3)
GND (TO263-3F)
2
3
Vo
Output Pin
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
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BDxxC0A-C series BDxxC0AW-C series
〈Without Shutdown SW (HRP5)〉
HRP5
(TOP VIEW)
FIN
1
2
3
4 5
HRP5
Figure 6. Pin Descriptions (Without Shutdown SW) (HRP5)
Pin No.
Pin Name
Vcc
Function
Power Supply Pin
N.C. Pin
1
2
N.C. (Note 1)
3
GND
GND
4
N.C.
N.C. Pin
5
Vo
Output Pin
GND
FIN
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
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BDxxC0A-C series BDxxC0AW-C series
●Block diagrams
〈BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type) 〉
■TO252-5/HRP5/TO263-5F
Figum
BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type)
〈BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, with Shutdown SW) 〉
■TO252-5/HRP5/TO263-5F
Figum
BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, with Shutdown SW)
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BDxxC0A-C series BDxxC0AW-C series
〈BDxxC0AFP/HFP/FP2-C (Output Voltage Fixation Type, without Shutdown SW) 〉
■TO252-3/TO263-3F
Figk gram
BDxxC0AFP/FP2-C (Output Volage Fixation Type, without Shutdown SW)
■HRP5
Figur. Block diagram
BDxxC0AHFP-C (Output Voltage Fixation Type, without Shutdown SW)
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BDxxC0A-C series BDxxC0AW-C series
●Absolute Maximum Ratings (Ta= 25°C)
Parameter
Symbol
Vcc
VCTL
Ratings
-0.3 to +35.0
-0.3 to +35.0
Unit
V
V
W
W
W
°C
°C
°C
Supply Voltage (Note 1)
Output Control Voltage (Note 2)
1.3 (TO252-3/5) (Note 3)
1.2 (HRP5) (Note 4)
1.3 (TO263-3F/5F) (Note 5)
-40 to +125
Power Dissipation
Pd
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
(Note 1) Do not exceed Pd.
Topr
Tstg
Tjmax
-55 to +150
150
(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within
the range of the operation power-supply voltage ahead.
(Note 3) TO252-3 : 114.3mm×76.2mm×1.6mmt Glass-Epoxy PCB. If Ta ≥ 25°C, reduce by 10.4mW/°C
(Note 4) TO252-5 : 114.3mm×76.2mm×1.6mmt Glass-Epoxy PCB. If Ta ≥ 25°C, reduce by 9.6mW/°C
(Note 5) HRP5 : 114.3mm×76.2mm×1.6mmt Glass-Epoxy PCB. If Ta ≥ 25°C, reduce by 15.2mW/°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage
can either be a short circuit between pins or an open circuit between pins and the internal circuitry.
Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
●Recommended Operating Conditions (-40°C ≤ Ta ≤ +125°C)
Parameter
Supply Voltage (Vo ≥ 3.0V)
Supply Voltage (Vo ≤ 3.0V)
Startup Voltage (Io=0mA)
Output Control Voltage (With SW)
Output Current
Symbol
Vcc
Vcc
Vcc
VCTL
Io
Min
Vo+1
4.0
-
0
0
Max.
26.5
26.5
3.8
26.5
1.0
Unit
V
V
V
V
A
V
Output Voltage (BD00C0AW) (Note 1)
Vo
1.0
15.0
(Note 1) Please refer to Notes16 for use when you use BD00C0AW by output voltage 1.0V ≤ Vo < 3.0V.
●Electrical Characteristics
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, Io=0mA, VCTL=5.0V (With SW)
The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ (BD00C0AW)
Guaranteed Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
0
Max.
5
Shutdown Current
Isd
Ib
-
-
µA
Circuit Current
0.5
2.5
mA
ADJ Terminal Voltage
(BD00C0AWFP/WHFP)
VADJ
VADJ
Vo
0.742
0.727
0.750
0.750
Vo
0.758
0.773
V
V
V
V
V
V
V
Io=50mA, Ta=25°C
Io=50mA
ADJ Terminal Voltage (BD00C0AW)
Output Voltage
(BD33/50C0A(W9FP/(W)HFP)
Vo×0.99
Vo×0.97
Vo×0.99
Vo×0.97
-
Vo×1.01
Vo×1.03
Vo×1.01
Vo×1.03
0.5
Io=200mA, Ta=25°C
Io=200mA
Output Voltage (BD33/50C0A(W))
Vo
Vo
Output Voltage
(BD80/90C0A(W)FP/(W)HFP)
Vo
Vo
Io=500mA, Ta=25°C
Io=500mA
Output Voltage (BD80/90C0A(W))
Vo
Vo
Dropout Voltage
(BD00/50/80/90C0A(W))
ΔVd
0.3
Vcc=Vo×0.95,Io=500mA
f=120Hz,
Ripple Rejection (BD00/33/50C0A(W)) R.R.
45
40
55
50
-
-
dB Input Voltage Ripple =1Vms,
Io=100mA
f=120Hz,
dB Input Voltage Ripple =1Vms,
Io=100mA
Ripple Rejection (BD80/90C0A(W))
R.R.
Line Regulation
Load Regulation
Reg.I
-
-
20
Vo
80
Vo
mV Vo+1.0V ≤ VCC ≤ 26.5V
Reg.L
V
5mA ≤ Io ≤1A
×0.010 ×0.020
CTL ON Mode Voltage (With SW)
CTL OFF Mode Voltage (With SW)
CTL Bias Current (With SW)
VthH
VthL
ICTL
2.0
－
－
－
25
－
0.8
50
V
V
ACTIVE MODE
OFF MODE
－
μA
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BDxxC0A-C series BDxxC0AW-C series
●Thermal Resistance
Parameter
Symbol
Min.
Max.
Unit
TO252-3/5 (Note 1)
Junction to Ambient
θja
θjc
24.5
3
－
－
°C/W
°C/W
Junction to Case (bottom)
HRP5 (Note 2)
Junction to Ambient
θja
θjc
19.2
1
－
－
°C/W
°C/W
Junction to Case (bottom)
TO263-3F/5F (Note 3)
Junction to Ambient
θja
θjc
15.6
1
－
－
°C/W
°C/W
Junction to Case (bottom)
(Note 1) TO252-3/5 mounted on 114.3mmx76.2mmx1.6mmt Glass-Epoxy PCB based on JEDEC.
(4-layer PCB: Copper foil on the reverse side of PCB:74.2mmx74.2mm).
(Note 2) HRP5 mounted on 114.3mmx76.2mmx1.6mmt Glass-Epoxy PCB based on JEDEC.
(4-layer PCB: Copper foil on the reverse side of PCB:74.2mmx74.2mm).
(Note 3) TO263-3F/5F mounted on 114.3mmx76.2mmx1.6mmt Glass-Epoxy PCB based on JEDEC.
(4-layer PCB: Copper foil on the reverse side of PCB:74.2mmx74.2mm).
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BDxxC0A-C series BDxxC0AW-C series
●Reference Data(Vo=5.0V)
■BD00C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA, Vo=5.0V
(The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ)
18
15
12
9
1.0
0.8
0.6
0.4
0.2
0.0
Ta=‐40℃
Ta=25℃
Ta=125℃
6
Ta=‐40℃
Ta=25℃
Ta=125℃
3
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 12. Shutdown Current
Figure 11. Circuit Current
(IFEEDBACK_R ≈ 75µA)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Ta=‐40℃
Ta=‐40℃
Ta=25℃
Ta=25℃
Ta=125℃
Ta=125℃
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 14. Line Regulation
(Io=500mA)
Figure 13. Line Regulation
(Io=0mA)
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BDxxC0A-C series BDxxC0AW-C series
●Reference Data - Continue
1,000
900
800
700
600
500
400
300
200
100
0
6
5
4
3
Ta=‐40℃
Ta=25℃
Ta=125℃
2
Ta=‐40℃
1
Ta=25℃
Ta=125℃
0
0
400
800
1200 1600 2000 2400
0
200
400
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 15. Load Regulation
Figure 16. Dropout Voltage
(Vcc=Vo×0.95, 0mA ≤ Io ≤ 1000mA)
5.15
5.10
5.05
5.00
4.95
4.90
4.85
80
70
60
50
40
30
20
10
0
Ta=‐40℃
Ta=25℃
Ta=125℃
10
100
1000
10000 100000 1000000
-40 -20
0
20
40
60
80 100 120
Frequency: f [Hz]
Ambient Temperature: [℃]
Figure 18. Output Voltage
Temperature Characteristic
Figure 17. Ripple Rejection
(lo=100mA)
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BDxxC0A-C series BDxxC0AW-C series
●Reference Data - Continue
180
160
140
120
100
80
1.0
0.8
0.6
0.4
60
Ta=‐40℃
Ta=‐40℃
0.2
40
Ta=25℃
Ta=25℃
Ta=125℃
20
Ta=125℃
0.0
0
0
200
400
600
800
1000
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Output Current:Io [mA]
Control Voltage: VCTL[V]
Figure 19. Circuit Current
Figure 20. CTL Voltage vs CTL Current
(0mA ≤ Io ≤ 1000mA, (IFEEDBACK_R ≈ 75µA)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Ta=‐40℃
Ta=25℃
Ta=125℃
130
140
150
160
170
180
190
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Ambient Temperature:Ta [℃]
Control Voltage: VCTL[V]
Figure 22. Thermal Shutdown
Circuit Characteristic
Figure 21. CTL Voltage vs Output Voltage
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BDxxC0A-C series BDxxC0AW-C series
●Measurement setup for reference data
■BD00C0AW-C series (Vo=5.0V)
Measurement setup for Figure 11
Measurement setup for Figure 12
Measurement setup for Figure 13
Vcc
Vo
56.7kΩ
10kΩ
1µF
CTL
ADJ
1µF
GND
500mA
5V
Measurement setup for Figure 14
Measurement setup for Figure 15
Measurement setup for Figure 16
Vcc
Vo
Vcc
Vo
56.7kΩ
10kΩ
56.7kΩ
10kΩ
1Vrms
1µF
1µF
CTL
ADJ
CTL
ADJ
13.5V
1µF
1µF
13.5V
100mA
GND
GND
5V
5V
Measurement setup for Figure 17
Measurement setup for Figure 18
Measurement setup for Figure 19
Vcc
Vo
Vcc
Vo
56.7kΩ
10kΩ
56.7kΩ
10kΩ
1µF
1µF
CTL
ADJ
CTL
ADJ
13.5V
1µF
13.5V
1µF
GND
GND
5V
Measurement setup for Figure 20
Measurement setup for Figure 21
Measurement setup for Figure 22
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BDxxC0A-C series BDxxC0AW-C series
●Reference Data
■BD33C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA
1.0
18
Ta=‐40℃
Ta=25℃
Ta=125℃
15
0.8
12
0.6
9
0.4
6
Ta=‐40℃
0.2
Ta=25℃
3
Ta=125℃
0.0
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 23. Circuit Current
Figure 24. Shutdown Current
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Ta=‐40℃
Ta=‐40℃
Ta=25℃
Ta=25℃
Ta=125℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 26. Line Regulation
(Io=500mA)
Figure 25. Line Regulation
(Io=0mA)
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●Reference Data - Continue
6
80
70
60
50
40
30
20
10
0
Ta=‐40℃
Ta=‐40℃
Ta=25℃
5
4
3
2
1
0
Ta=25℃
Ta=125℃
Ta=125℃
0
400
800 1200 1600 2000 2400
Output Current:Io [mA]
10
100
1000
10000 100000 1000000
Frequency: f [Hz]
Figure 27. Load Regulation
Figure 28. Ripple Rejection
(lo=100mA)
1.0
0.8
0.6
0.4
0.2
0.0
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
Ta=‐40℃
Ta=25℃
Ta=125℃
-40 -20
0
20
40
60
80 100 120
0
200
400
600
800
1000
Ambient Temperature: [℃]
Output Current:Io [mA]
Figure 29. Output Voltage Temperature Characteristic
Figure 30. Circuit Current
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●Reference Data - Continue
180
160
140
120
100
80
6
5
4
3
2
1
0
60
Ta=‐40℃
Ta=‐40℃
Ta=25℃
Ta=125℃
40
Ta=25℃
20
Ta=125℃
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Control Voltage: VCTL[V]
Control Voltage: VCTL[V]
Figure 31. CTL Voltage vs CTL Current
Figure 32. CTL Voltage vs Output Voltage
6
5
4
3
2
1
0
130
140
Ambient Temperature:Ta [℃]
Figure 33. Thermal Shutdown Circuit Characteristic
150
160
170
180
190
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●Reference Data
■BD50C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA
1.0
18
Ta=‐40℃
Ta=25℃
Ta=125℃
15
0.8
12
0.6
9
0.4
6
Ta=‐40℃
0.2
Ta=25℃
3
0
Ta=125℃
0.0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 34. Circuit Current
Figure 35. Shutdown Current
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Ta=‐40℃
Ta=‐40℃
Ta=25℃
Ta=25℃
Ta=125℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 36. Line Regulation
(Io=0mA)
Figure 37. Line Regulation
(Io=500mA)
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●Reference Data - Continue
6
5
4
3
1,000
900
800
700
600
500
400
300
200
100
0
Ta=‐40℃
Ta=25℃
Ta=125℃
2
Ta=‐40℃
1
Ta=25℃
Ta=125℃
0
0
400
800
1200 1600 2000 2400
0
200
400
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 38. Load Regulation
Figure 39. Dropout Voltage
(Vcc=Vo×0.95V)
80
70
60
50
40
30
20
10
0
5.15
5.10
5.05
5.00
4.95
4.90
4.85
Ta=‐40℃
Ta=25℃
Ta=125℃
-40 -20
0
20
40
60
80 100 120
10
100
1000
10000 100000 1000000
Ambient Temperature: [℃]
Frequency: f [Hz]
Figure 41. Output Voltage
Temperature Characteristic
Figure 40. Ripple Rejection
(lo=100mA)
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●Reference Data - Continue
1.0
0.8
0.6
180
160
140
120
100
80
0.4
60
Ta=‐40℃
Ta=‐40℃
40
0.2
Ta=25℃
Ta=25℃
20
Ta=125℃
Ta=125℃
0.0
0
0
200
400
600
800
1000
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Output Current:Io [mA]
Control Voltage: VCTL[V]
Figure 43. CTL Voltage vs CTL Current
Figure 42. Circuit Current
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Ta=‐40℃
Ta=25℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
130
140
150
160
170
180
190
Control Voltage: VCTL[V]
Ambient Temperature:Ta [℃]
Figure 45. Thermal Shutdown Circuit Characteristic
Figure 44. CTL Voltage vs Output Voltage
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●Reference Data
■BD80C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA
18
15
12
9
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=‐40℃
Ta=25℃
Ta=125℃
6
Ta=‐40℃
Ta=25℃
Ta=125℃
3
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 46. Circuit Current
Figure 47. Shutdown Current
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
Ta=‐40℃
Ta=‐40℃
Ta=25℃
Ta=25℃
Ta=125℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 48. Line Regulation
(Io=0mA)
Figure 49. Line Regulation
(Io=500mA)
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●Reference Data - Continue
10
9
1,000
900
800
700
600
500
400
300
200
100
0
Ta=‐40℃
Ta=25℃
Ta=125℃
8
7
6
5
4
3
Ta=‐40℃
2
Ta=25℃
1
Ta=125℃
0
0
400
800
1200 1600 2000 2400
0
200
400
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 51. Dropout Voltage
(Vcc=Vo×0.95V)
Figure 50. Load Regulation
80
70
60
50
40
30
20
10
0
8.21
8.16
8.11
8.06
8.01
7.96
7.91
7.86
7.81
7.76
Ta=‐40℃
Ta=25℃
Ta=125℃
10
100
1000
10000
100000 1000000
-40 -20
0
20
40
60
80 100 120
Frequency: f [Hz]
Ambient Temperature: [℃]
Figure 52. Ripple Rejection
(lo=100mA)
Figure 53. Output Voltage Temperature Characteristic
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●Reference Data - Continue
180
160
140
120
100
80
1.0
0.8
0.6
0.4
60
Ta=‐40℃
Ta=‐40℃
40
0.2
Ta=25℃
Ta=25℃
20
Ta=125℃
Ta=125℃
0
0.0
0
200
400
600
800
1000
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Output Current:Io [mA]
Control Voltage: VCTL[V]
Figure 54. Circuit Current
Figure 55. CTL Voltage vs CTL Current
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
Ta=‐40℃
Ta=25℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
130
140
150
160
170
180
190
Control Voltage: VCTL[V]
Ambient Temperature:Ta [℃]
Figure 57. Thermal Shutdown Circuit Characteristic
Figure 56. CTL Voltage vs Output Voltage
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●Reference Data
■BD90C0AW-C series
Unless otherwise specified, -40°C ≤Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA
18
15
12
9
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=‐40℃
Ta=25℃
Ta=125℃
6
Ta=‐40℃
Ta=25℃
Ta=125℃
3
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 58. Circuit Current
Figure 59. Shutdown Current
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
Ta=‐40℃
Ta=‐40℃
Ta=25℃
Ta=25℃
Ta=125℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 60. Line Regulation
(Io=0mA)
Figure 61. Line Regulation
(Io=500mA)
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●Reference Data - Continue
10
9
1,000
900
800
700
600
500
400
300
200
100
0
Ta=‐40℃
Ta=25℃
Ta=125℃
8
7
6
5
4
3
Ta=‐40℃
2
Ta=25℃
1
Ta=125℃
0
0
400
800
1200 1600 2000 2400
0
200
400
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 62. Load Regulation
Figure 63. Dropout Voltage
(Vcc=Vo×0.95V)
80
70
60
50
40
30
20
10
0
9.23
9.13
9.03
8.93
8.83
8.73
Ta=‐40℃
Ta=25℃
Ta=125℃
10
100
1000
10000 100000 1000000
-40 -20
0
20
40
60
80 100 120
Ambient Temperature: [℃]
Frequency: f [Hz]
Figure 64. Ripple Rejection
(Io =100mA)
Figure 65. Output Voltage
Temperature Characteristic
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●Reference Data - Continue
180
160
140
120
100
80
1.0
0.8
0.6
0.4
60
Ta=‐40℃
Ta=‐40℃
40
0.2
Ta=25℃
Ta=25℃
20
Ta=125℃
Ta=125℃
0
0.0
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
200
400
600
800
1000
Output Current:Io [mA]
Control Voltage: VCTL[V]
Figure 66. Circuit Current
Figure 67. CTL Voltage vs CTL Current
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
Ta=‐40℃
Ta=25℃
Ta=125℃
0
2
4
6
8
10 12 14 16 18 20 22 24 26
130
140
150
160
170
180
190
Control Voltage: VCTL[V]
Ambient Temperature:Ta [℃]
Figure 69. Thermal Shutdown
Circuit Characteristic
Figure 68. CTL Voltage vs Output Voltage
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●Measurement setup for reference data
■BDxxC0AW-C series(Output Voltage Fixation Type)
Vcc
Vo
Vcc
Vo
(1.0µF)
2.2µF
(1.0µF)
2.2µF
1µF
1µF
CTL
N.C.
CTL
N.C.
GND
GND
5V
Measurement setup for
Figure 23, 34, 46 and 58
Measurement setup for
Figure 24, 35, 47 and 59
Measurement setup for
Figure 25, 36, 48 and 60
Measurement setup for
Figure 26, 37, 49 and 61
Measurement setup for
Figure 39, 51 and 63
Measurement setup for
Figure 27, 38, 50 and 62
Vcc
Vo
(1.0µF)
2.2µF
1µF
CTL
N.C.
GND
100mA
5V
Measurement setup for
Figure 28, 40, 52 and 64
Measurement setup for
Figure 29, 41, 53 and 65
Measurement setup for
Figure 30, 42, 54 and 66
Measurement setup for
Figure 31, 43, 55 and 67
Measurement setup for
Figure 32, 44, 56 and 68
Measurement setup for
Figure 33, 45, 57 and 69
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●Application Examples
・Applying positive surge to the Vcc pin
If the possibility exists that surges higher than 35.0V will be applied to the Vcc pin, a zenar diode should be placed
between the Vcc pin and GND pin as shown in the Figure below.
Vcc
GND
Figure 70
・Applying negative surge to the Vcc pin
If the possibility exists that negative surges lower than the GND are applied to the Vcc pin, a schottky diode should be
place between the Vcc pin and GND pin as shown in the Figure below.
Vcc
GND
Figure 71
・Implementing a protection diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and Shutdown, a protection diode should be placed as shown in the Figure below.
Vo
Figure 72
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●Thermal design
TO252-3
6
②5.1 W
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
5
4
3
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
2
①: 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
①1.3 W
1
0
②: 4-layer PCB
(2 inner layers and copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
0
25
50
75
100
125
150
AmbientTemperature:Ta[°C]
Condition①: θja = 96.2 °C/W, θjc(top) = 22 °C/W
Condition②: θja = 24.5 °C/W, θjc(top) = 5 °C/W,
θjc(bottom) = 3 °C/W
Figure 73
TO252-5
6
5
4
3
2
1
0
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
②5.1 W
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
①: 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
①1.3 W
②: 4-layer PCB
(2 inner layers and copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
0
25
50
75
100
125
150
Condition①: θja = 96.2 °C/W, θjc(top) = 22 °C/W
Condition②: θja = 24.5 °C/W, θjc(top) = 5 °C/W,
θjc(bottom) = 3 °C/W
AmbientTemperature:Ta[°C]
Figure 74
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HRP5
8
IC mounted on ROHM standard board based on JEDEC.
②6.5 W
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
6
4
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
①: 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
①1.6 W
2
②: 4-layer PCB
(2 inner layers and copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
0
0
25
50
75
100
125
150
Condition①: θja = 104.2 °C/W, θjc(top) = 7 °C/W
Condition②: θja = 19.2 °C/W, θjc(top) = 2 °C/W,
θjc(bottom) = 1 °C/W
AmbientTemperature:Ta[°C]
Figure 75
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TO263-3F
10
IC mounted on ROHM standard board based on JEDEC.
②8.0 W
Board material: FR4
8
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
6
4
①: 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
①1.9 W
2
②: 4-layer PCB
(2 inner layers and copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
0
0
25
50
75
100
125
150
Condition①: θja = 65.2 °C/W, θjc(top) = 19 °C/W
AmbientTemperature:Ta[°C]
Condition②: θja = 15.6 °C/W, θjc(top) = 16 °C/W,
θjc(bottom) = 1 °C/W
Figure 76
TO263-5F
10
8
②8.0 W
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
6
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
4
①: 1-layer PCB
①1.9 W
2
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
②: 4-layer PCB
(2 inner layers and copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
0
0
25
50
75
100
125
150
AmbientTemperature:Ta[°C]
Condition①: θja = 65.2 °C/W, θjc(top) = 19 °C/W
Condition②: θja = 15.6 °C/W, θjc(top) = 16 °C/W,
θjc(bottom) = 1 °C/W
Figure 77
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When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure 73
to 77.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure. 73 to 77 shows the acceptable power dissipation characteristic curves of the TO252-3/5, HRP5 and TO263-3F/5F
packages. Even when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be
quite high so please operate the IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows
Pc=(Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd ≥ Pc
Vcc : Input voltage
Solving this for load current Io in order to operate within the acceptable loss
Vo
Io
: Output voltage
: Load current
: Circuit current
Pd－Vcc×Ib
Vcc－Vo
Ib
Io ≤
(Please refer to 19, 30, 42, 54 and 66 about Ib.)
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example) When TO252-3 / TO252-5, Ta=85°C, Vcc=13.5V, Vo=5.0V
2.652－13.5×Ib
Io ≤
Figure 73, 74 ②θja=24.5°C /W → -40.8mW/°C
25°C = 5.1W → 85°C =2.652W
8.5
Io ≤ 311.2mA (Ib：0.5mA)
Calculation Example) When HRP5, Ta=85°C, Vcc=13.5V, Vo=5.0V
3.380－13.5×Ib
Io ≤
Figure 75 ②θja=19.2°C /W →-52.0mW/°C
25°C =6.5W → 85°C =3.380W
8.5
Io ≤ 396.8mA (Ib: 0.5mA)
Calculation Example) When TO263-3F / TO263-5F, Ta=85°C,Vcc=13.5V,Vo=5.0V
4.160－13.5×Ib
Io ≤
Figure 76, 77 ②θja=15.6°C /W →-64mW/°C
25°C =8.0W → 85°C =4.160W
8.5
Io ≤ 488.6mA (Ib: 0.5mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature
ranges.
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●I/O equivalence circuit
Vcc Terminal
CTL Terminal (With SW)
200kΩ
(Typ)
1kΩ
(Typ)
Vcc
CTL
200kΩ
(Typ)
IC
Vo Terminal BD33/50/80/90C0A(W)
Vcc
R1 (kΩ)
(Typ)
R2 (kΩ)
(Typ)
34
56.6
48.3
55
R3 (kΩ)
(Typ)
R3
BD33C0A(W)
BD50C0A(W)
BD80C0A(W)
10
15
20
Vo
5
R2
R1
BD90C0A(W)
BD00C0AW
Vo Terminal
ADJ Terminal
Vcc
15kΩ
(Typ)
Vo
Figure 78
●Output Voltage Configuration Method (BD00C0AW)
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 79.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are
large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R1.
Vo
R2
R1
IC
ADJ
pin
ADJ ≈ 0.75V
(Typ)
Vo ≈ ADJ×(R1+R2)/R1
Figure 79
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoid
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
15.Vcc Pin
Insert a capacitor (Vo ≥ 5.0V:capacitor ≥ 1µF, 1.0 ≤ Vo ≤ 5.0V:capacitor ≥ 2.2µF) between the Vcc and GND pins.
Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the
capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We
recommend using a capacitor with excellent voltage and temperature characteristics.
Electric capacitor
IC
Ceramic capacitor, Low ESR capacitor
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Operational Notes – continued
16.Output Pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1μF(3.0V ≤ Vo ≤ 15.0V). Electrolytic, tantalum and ceramic capacitors can
be used. We recommend a capacitor with a capacitance of more than 4.7μF(1.0V ≤ Vo ≤ 3.0V). Ceramic capacitors can
be used. When selecting the capacitor ensure that the capacitance of more than 1μF(3.0V ≤ Vo ≤ 15.0V) or more than
4.7μF(1.0V ≤ Vo ≤ 3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in
temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor refer to the
Cout_ESR vs Io data. The stable operation range given in the reference data is based on the standalone IC and
resistive load. For actual applications the stable operating range is influenced by the PCB impedance, input supply
impedance and load impedance. Therefore verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification.
6.0V ≤ Vcc ≤ 26.5V
5.0V ≤ Vo ≤ 15.0V
4.0V ≤ Vcc ≤ 26.5V
4.0V ≤ Vcc ≤ 26.5V
3.0V ≤ Vo ≤ 15.0V
3.0V ≤ Vo ≤ 15.0V
-40°C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
-40°C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
Cin=2.2µF ≤ Cin ≤ 100µF
1µF ≤ Cout ≤ 100µF
-40°C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
100
100
100
Unstable operating region
Stable operating region
10
1
Stable operating region
10
10
Stable operating region
0.1
0.01
2.2
1
Unstable
operating region
1
0.001
0
200
400
600
800
1000
1
10
100
1
10
100
（
）
Io(mA)
Cout µF
Cout(µF)
Cout_ESR vs Io
3.0V ≤ Vo ≤ 15.0V
(Reference data)
Cin vs Cout
3.0V ≤ Vo ≤ 15.0V
(Reference data)
4.0V ≤ Vcc ≤ 26.5V
4.0V ≤ Vcc ≤ 26.5V
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 1.5V
1.5V ≤ Vo < 3.0V
1.0V ≤ Vo < 3.0V
-40°C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
-40°C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
-40°C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
100
10
100
100
Unstable operating region
Stable operating region
Unstable operating region
Stable operating region
10
1
1
0.5
Unstable
Stable
10
operating region
operating region
0.1
0.1
0.01
0.01
2.2
0.001
0.001
1
0
200
400
600
800
1000
4.7
0
200
400
600
800
1000
1
10
100
Io(mA)
Io(mA)
（
）
Cout µF
Cout_ESR vs Io
1.0V ≤ Vo < 3.0V
(Reference data)
Cin vs Cout
1.0V ≤ Vo < 3.0V
(Reference data)
Vcc
Vo
Cin
Cout
(1µF or higher)
R2
(1µF or higher)
VCC
(4.0V to 26.5V)
Io
(Rout)
CTL
ADJ
GND
ESR
(0.001Ω
or higher)
VCTL
(5.0V)
R1
(5k to 10kΩ)
Operation Note 16 Measurement circuit (BD00C0AW)
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Operational Notes – continued
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-40°C ≤ Ta ≤ +125°C
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-40°C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
2.2µF ≤ Cin ≤ 100µF
1µF ≤ Cout ≤ 100µF
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
100
100
発振領域
10
1
安定領域
10
安定領域
0.1
0.01
2.2
1
発振領域
0.001
1
10
100
0
200
400
600
Io(mA)
800
1000
（
）
Cout µF
Cin vs Cout
1.0V ≤ Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
Cout_ESR vs Io
1.0V ≤ Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
(Reference data)
Vcc
Vo
VCC
Cin
R2
(4.0V to 26.5V)
(1µF or higher)
Cout
(1µF
or higher)
CTL
ADJ
出力負荷
Io(Rout)
10µF
GND
ESR
(0.001Ω
or higher)
R1
(5k to 10kΩ)
VCTL
(5.0V)
Operation Note 16 Measurement circuit (BD00C0AW)
17. CTL Pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
18. Rapid variation in Vcc Voltage and load Current CTL Pin
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output
current and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
19. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
20. In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a
capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a
bypass between all pins and the Vcc pin.
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●Physical Dimension, Tape and Reel Information
Package Name
TO252-3
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●Physical Dimension, Tape and Reel Information
Package Name
TO252-5
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●Physical Dimension, Tape and Reel Information
Package Name
HRP5
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●Physical Dimension, Tape and Reel Information
Package Name
TO263-3F
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●Physical Dimension, Tape and Reel Information
Package Name
TO263-5F
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●Marking Diagrams (TOP VIEW)
TO252-3
TO252-3
(TOP VIEW)
Part Number Marking
Output
Voltage(V)
Part Number
Marking
3.3
5.0
8.0
9.0
33C0AC
50C0AC
80C0AC
90C0AC
LOT Number
TO252-5
TO252-5
(TOP VIEW)
Output
Voltage(V)
Part Number
Marking
Part Number Marking
Variable
3.3
00C0AWC
33C0AWC
50C0AWC
80C0AWC
90C0AWC
5.0
8.0
9.0
LOT Number
HRP5
HRP5 (TOP VIEW)
Output
Voltage(V)
Shutdown
SW
Part Number
Marking
Part Number Marking
Variable
With SW
With SW
00C0AWHFPC
33C0AWHFPC
33C0AHFPC
50C0AWHFPC
50C0AHFPC
80C0AWHFPC
80C0AHFPC
90C0AWHFPC
90C0AHFPC
LOT Number
3.3
Without SW
With SW
5.0
8.0
9.0
Without SW
With SW
Without SW
With SW
1PIN MARK
Without SW
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TO263-3F
TO263-3F (TOP VIEW)
Part Number Marking
LOT Number
Output
Voltage(V)
Part Number
Marking
3.3
5.0
8.0
9.0
33C0AC
50C0AC
80C0AC
90C0AC
1PIN
TO263-5F
TO263-5F (TOP VIEW)
Part Number Marking
LOT Number
Output
Voltage(V)
Part Number
Marking
Variable
3.3
00C0AWC
33C0AWC
50C0AWC
80C0AWC
90C0AWC
5.0
8.0
9.0
1PIN
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
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