BD00FDAWHFP [ROHM]
BD00FDAWHFP是一款可提供最大2A电流的低饱和型稳压器。输出电压分为固定型和可通过外部电阻设置的可调型两种。本系列产品还内置过电流保护电路，可防止输出短路等导致的IC损坏；内置过热保护电路，可防止IC因过负载状态等导致的热损坏。;
| 型号： | BD00FDAWHFP |
| 厂家： | 
ROHM |
| 描述： | BD00FDAWHFP是一款可提供最大2A电流的低饱和型稳压器。输出电压分为固定型和可通过外部电阻设置的可调型两种。本系列产品还内置过电流保护电路，可防止输出短路等导致的IC损坏；内置过热保护电路，可防止IC因过负载状态等导致的热损坏。 过电流保护 稳压器 |
| 文件： | 总25页 (文件大小：1412K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Single-Output LDO Regulators
35 V Voltage Resistance
2 A LDO Regulators
BD00FDAWHFP
Description
Key Specifications
The BD00FDAWHFP is low-saturation regulators. The
series’ output voltages are Variable type.
BD00FDAWHFP have a built-in over-current protection
circuit that prevents the destruction of the IC due to
output short circuits and a thermal shutdown circuit that
protects the IC from thermal damage due to overloading.
◼ Supply Voltage (Vo ≥ 3.0 V):
◼ Supply Voltage (Vo < 3.0 V):
◼ Output Voltage:
◼ Output Current:
◼ Output Voltage Precision:
Vo+1.0 V to 32.0 V
4.0 V to 32.0 V
1.5 V to 30.0 V
2 A
±1 % (Ta = 25 °C)
◼ Operating Temperature Range: -40 °C to +105 °C
Features
Package
HRP5
W (Typ) x D (Typ) x H (Max)
9.395 mm x 10.540 mm x 2.005 mm
◼
◼
◼
Output Current Capability: 2 A
Output Voltage: Variable
±1 %
High Output Voltage Accuracy (Ta = 25 °C)
Low Saturation with PDMOS Output
Built-in Over-current Protection Circuit that
Prevents the Destruction of the IC due to Output
Short Circuits
◼
◼
◼
Built-in Thermal Shutdown Circuit for Protecting the
IC from Thermal Damage due to Overloading
Low ESR Capacitor
◼
◼
HRP5 Package
Applications
General Purpose
Typical Application Circuits
Vcc
CTL
Vo
R2
Vcc
Cin
Cout
ADJ
GND
R1
Figure 1. Typical Application Circuit
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BD00FDAWHFP
Contents
Description......................................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuits .............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Description................................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................3
Description of Blocks ......................................................................................................................................................................4
Absolute Maximum Ratings ............................................................................................................................................................4
Thermal Resistance........................................................................................................................................................................4
Recommended Operating Conditions.............................................................................................................................................5
Electrical Characteristics.................................................................................................................................................................5
Typical Performance Curves...........................................................................................................................................................6
Measurement Setup for Reference Data ......................................................................................................................................10
Linear Regulators Surge Voltage Protection.................................................................................................................................11
1. Applying positive surge to the input ...................................................................................................................................11
2. Applying negative surge to the input..................................................................................................................................11
Linear Regulators Reverse Voltage Protection .............................................................................................................................11
1. About Input /Output Voltage Reversal................................................................................................................................11
2. Protection against Input Reverse Voltage..........................................................................................................................12
3. Protection against Output Reverse Voltage when Output Connect to an Inductor.............................................................13
Thermal design.............................................................................................................................................................................14
I/O Equivalence Circuits................................................................................................................................................................15
Output Voltage Configuration Method...........................................................................................................................................15
Operational Notes.........................................................................................................................................................................16
1. Reverse Connection of Power Supply...................................................................................................................................16
2. Power Supply Lines...............................................................................................................................................................16
3. Ground Voltage .....................................................................................................................................................................16
4. Ground Wiring Pattern...........................................................................................................................................................16
5. Recommended Operating Conditions ...................................................................................................................................16
6. Inrush Current .......................................................................................................................................................................16
7. Testing on Application Boards ...............................................................................................................................................16
8. Inter-pin Short and Mounting Errors......................................................................................................................................16
9. Unused Input Pins.................................................................................................................................................................16
10. Regarding the Input Pin of the IC ........................................................................................................................................17
11. Ceramic Capacitor...............................................................................................................................................................17
12. Thermal Shutdown Circuit (TSD).........................................................................................................................................17
13. Over Current Protection Circuit (OCP) ................................................................................................................................17
14. Vcc Pin................................................................................................................................................................................17
15. Output Pin ...........................................................................................................................................................................18
16. CTL Pin ...............................................................................................................................................................................19
17. Rapid variation in Vcc Voltage and load Current CTL Pin ...................................................................................................19
18. Minute variation in output voltage........................................................................................................................................19
19. Regarding the Input Pin and Vcc voltage ............................................................................................................................19
Ordering Information.....................................................................................................................................................................20
Marking Diagram ..........................................................................................................................................................................20
Physical Dimension and Packing Information...............................................................................................................................21
Revision History............................................................................................................................................................................22
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BD00FDAWHFP
Pin Configuration
HRP5
(TOP VIEW)
FIN
1
2
3
4 5
Figure 2. Pin Configurations
Pin Description
Pin No.
Pin Name
Function
Control terminal
1
CTL
By setting this pin to High, you can turn the device on. By setting this pin to Low, you can
turn the device off.
Input Power source terminal
2
3
Vcc
GND
Vo
Connect a ceramic capacitor between Vcc and GND. Place the capacitor close to the
terminal.
Ground
It is connected to the FIN terminal at the ground of the circuit.
Output terminal
Connect a capacitor between Vo and GND. Place the capacitor close to the terminal.
Refer to Operational Notes 15 for capacitance and ESR value.
Output voltage setting terminal
Connect a resistor between Vo and ADJ, ADJ and GND.
Heat dissipating FIN
4
5
ADJ
FIN
FIN
It is recommended that FIN is soldered to a copper foil part with a large area.
It is electrically connected to GND inside the package.
Block Diagram
FIN
PREREG
VREF
Driver
AMP
OCP
TSD
4
5
1
3
2
CTL
Vcc
GND
Vo
ADJ
Figure 3. Block Diagram
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BD00FDAWHFP
Description of Blocks
Block Name
Function
Description of Blocks
A logical “High” (VthH ≥ 2.0 V) at the CTL enables
Power Supply for Internal Circuit
To protect the device from overheating.
If the chip temperature (Tj) reaches ca. 175 °C (Typ),
the output is turned off.
PREREG
TSD
Internal Power Supply
Thermal Shutdown Protection
VREF
AMP
Reference Voltage
Error Amplifier
Generate the Reference Voltage
The Error Amplifier amplifies the difference between the feedback
voltage of the output voltage and the reference v.
Driver
Output MOS FET Driver
Drive the Output MOS FET
To protect the device from damage caused by over current.
If the output current reaches current ability (Typ: 2500 mA),
the output is turned off.
OCP
Over Current Protection
Absolute Maximum Ratings
Parameter
Supply Voltage(Note 1)
Output Control Pin Voltage(Note 2)
Symbol
Vcc
Ratings
-0.3 to +35.0
-0.3 to +35.0
-0.3 to +35.0
-40 to +105
-55 to +150
150
Unit
V
VCTL
VOUT
Ta
V
Output Pin Voltage
V
Operating Temperature Range
Storage Temperature Range
°C
°C
°C
Tstg
Maximum Junction Temperature
Tjmax
(Note 1) Do not exceed Tjmax.
(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within
the range of the operation power-supply voltage ahead.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
HRP5
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
119.3
8
22.0
3
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Thermal Via(Note 5)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.
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BD00FDAWHFP
Recommended Operating Conditions (-40 °C ≤ Ta ≤ +105 °C)
Parameter
Supply Voltage (Vo ≥ 3.0 V)
Supply Voltage (Vo < 3.0 V)
Startup Voltage (Io = 0 mA)
Output Control Pin Voltage
Output Current
Symbol
Vcc
Vcc
Vcc
VCTL
Io
Min
Vo+1.0
4.0
-
0
Max
32.0
32.0
3.8
32.0
2.0
Unit
V
V
V
V
0
1.5
A
V
Output Voltage(Note 1)
Vo
30.0
(Note 1) Refer to Linear Regulators Reverse Voltage Protection 1 for use by output voltage 16 V and more.
Refer to Operational Notes 15 for use by output voltage 1.5 V ≤ Vo < 3.0 V.
Electrical Characteristics (Unless otherwise specified, Ta = 25 °C, Vcc = 13.5 V(Note 1), Io = 0 mA, VCTL = 5.0 V)
The resistor of between ADJ and Vo = 56.7 kΩ, ADJ and GND = 10 kΩ
Parameter
Shutdown Current
Symbol
Min
Typ
Max
Unit
Conditions
Isd
Ib
-
-
0
10
1.0
μA VCTL = 0 V, Vcc < 10 V
Circuit Current
0.5
mA
ADJ Terminal Voltage
VADJ
0.742
0.750
0.758
V
V
Io = 500 mA, Vcc = 13.5 V
Vcc = Vo x 0.95, Io = 1 A,
Vo ≥ 5.0 V
Dropout Voltage
ΔVd
-
0.40
0.55
f = 120 Hz,
Ripple Rejection
R.R.
45
55
-
dB Input Voltage Ripple = 1 Vrms,
Io = 500 mA
Vo+1.0 V ≤ Vcc ≤ 26.5 V
Vo ≥ 3.3 V
5 mA ≤ Io ≤ 1 A
Vo ≥ 3.3 V
Line Regulation
Load Regulation
Reg.I
-
-
20
80
mV
Vo x
0.007
Vo x
0.014
Reg.L
V
CTL Pin ON Mode Voltage
CTL Pin OFF Mode Voltage
VthH
VthL
ICTL
2.0
-
-
-
V
V
ACTIVE MODE
OFF MODE
-
-
0.8
50
CTL Pin Bias Current
25
μA
(Note 1) In case of Vo > 10 V, Vcc = Vo + 5 V
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BD00FDAWHFP
Typical Performance Curves
BD00FDAWHFP (Vo = 5.0 V)
Unless otherwise specified, Ta = 25 °C, Vcc = 13.5 V, VCTL = 5.0 V, Io = 0 mA, Vo = 5.0 V
(The resistor of between ADJ and Vo = 56.7 kΩ, ADJ and GND = 10.0 kΩ)
Figure 4. Circuit Current
(IFEEDBACK_R ≈ 75 µA)
Figure 5. Shutdown Current
(VCTL = 0 V)
Figure 6. Line Regulation
(Io = 0 mA)
Figure 7. Line Regulation
(Io = 1.0 A)
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BD00FDAWHFP
Typical Performance Curves - continued
Figure 8. Startup voltage characteristic
(Io = 1.0 A, Vcc = 0 V to 6 V)
Figure 9. Load regulation
(Io = 0 A to 2 A)
Figure 10. Over Current Protection Characteristic
Figure 11. Dropout Voltage
(Vcc = 4.75 V)
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BD00FDAWHFP
Typical Performance Curves - continued
Figure 12. Ripple Rejection
(Io = 500 mA)
Figure 13. Output Voltage Temperature Characteristic
Figure 14. Output Current vs Circuit Current
(0 mA ≤ Io ≤ 1000 mA, IFEEDBACK_R ≈ 75 µA)
Figure 15. CTL voltage vs CTL current
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BD00FDAWHFP
Typical Performance Curves - continued
Figure 16. CTL voltage vs Output Voltage
Figure 17. CTL voltage vs Output Voltage
(VCTL = 0 V to 2 V)
Figure 18. Thermal Shutdown Protection Characteristic
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BD00FDAWHFP
Measurement Setup for Reference Data
BD00FDAWHFP (Vo = 5.0 V)
Vcc
Vo
Vcc
Vo
Vcc
Vo
56.7 kΩ
10 kΩ
2.2 µF
2.2 µF
2.2 µF
56.7 kΩ
2.2 µF
10 kΩ
56.7 kΩ
CTL
ADJ
CTL
ADJ
CTL
ADJ
2.2 µF
2.2 µF
GND
GND
GND
5 V
5 V
10 kΩ
FEEDBACK _R
Measurement setup for
Figure 4.
Measurement setup for
Figure 5.
Measurement setup for
Figure 6.
Vcc
Vo
Vcc
Vo
Vcc
Vo
56.7 kΩ
10 kΩ
56.7 kΩ
56.7 kΩ
10 kΩ
2.2 µF
2.2 µF
2.2 µF
CTL
ADJ
CTL
ADJ
CTL
ADJ
2.2 µF
4.75 V
2.2 µF
2.2 µF
13.5 V
GND
GND
10 kΩ
GND
1.0 A
5 V
5 V
5 V
Measurement setup for
Figure 7,8.
Measurement setup for
Figure 9,10.
Measurement setup for
Figure 11.
Vcc
Vo
Vcc
Vo
Vcc
Vo
56.7 kΩ
56.7 kΩ
1 Vrms
56.7 kΩ
10 kΩ
2.2 µF
2.2 µF
2.2 µF
2.2 µF
V
CTL
ADJ
CTL
ADJ
CTL
ADJ
13.5 V
13.5 V
2.2 µF
2.2 µF
13.5 V
GND
500 mA
GND
GND
10 kΩ
10 kΩ
5 V
FEEDBACK _R
5 V
5 V
Measurement setup for
Figure 12.
Measurement setup for
Figure 13.
Measurement setup for
Figure 14.
Vcc
Vo
Vcc
Vo
Vcc
Vo
56.7 kΩ
10 kΩ
56.7 kΩ
56.7 kΩ
2.2 µF
2.2 µF
2.2 µF
CTL
ADJ
CTL
ADJ
CTL
ADJ
13.5 V
2.2 µF
13.5 V
2.2 µF
2.2 µF
13.5 V
GND
GND
10 kΩ
GND
10 kΩ
5 V
Measurement setup for
Figure 15.
Measurement setup for
Figure 18.
Measurement setup for
Figure 16,17.
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BD00FDAWHFP
Linear Regulators Surge Voltage Protection
The following provides instructions on surge voltage overs absolute maximum ratings polarity protection for ICs.
1. Applying positive surge to the input
If the possibility exists that surges higher than absolute maximum ratings 35 V will be applied to the input, a Zener Diode
should be placed to protect the device in between the VIN and the GND as shown in the Figure 19.
IN
OUT
VIN
VOUT
COUT
GND
D1
CIN
Figure 19. Surges Higher than 35 V will be Applied to the Input
2. Applying negative surge to the input
If the possibility exists that surges lower than absolute maximum ratings -0.3 V will be applied to the input, a Schottky
Diode should be placed to protect the device in between the VIN and the GND as shown in the Figure 20.
IN
OUT
VIN
VOUT
COUT
GND
D1
CIN
Figure 20. Surges Lower than -0.3 V will be Applied to the Input
Linear Regulators Reverse Voltage Protection
A linear regulator integrated circuit (IC) requires that the input voltage is always higher than the regulated voltage. Output
voltage, however, may become higher than the input voltage under specific situations or circuit configurations, and that
reverse voltage and current may cause damage to the IC. A reverse polarity connection or certain inductor components can
also cause a polarity reversal between the input and output pins. The following provides instructions on reversed voltage
polarity protection for ICs.
1. About Input/Output Voltage Reversal
In an MOS linear regulator, a parasitic element exists as a body diode in the drain-source junction portion of its power
MOSFET. Reverse input/output voltage triggers the current flow from the output to the input through the body diode. The
inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the parasitic
body diode is usually disregarded for the regulator behavior (Figure 21).
IR
VOUT
VIN
Error
AMP.
VREF
Figure 21. Reverse Current Path in an MOS Linear Regulator
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BD00FDAWHFP
1. About Input/Output Voltage Reversal - continued
An effective solution to this is an external bypass diode connected in-between the input and output to prevent the reverse
current flow inside the IC (see Figure 22). Note that the bypass diode must be turned on before the internal circuit of the
IC. Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage VF. Some ICs are
configured with current-limit thresholds to shut down high reverse current even when the output is off, allowing large
leakage current from the diode to flow from the input to the output; therefore, it is necessary to choose one that has a
small reverse current. Specifically, select a diode with a rated peak inverse voltage greater than the input to output
voltage differential and rated forward current greater than the reverse current during use.
When output voltage setting is 16 V and more, always connect reverse current bias diode.
D1
IN
OUT
VIN
VOUT
COUT
GND
CIN
Figure 22. Bypass Diode for Reverse Current Diversion
The lower forward voltage (VF) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the
main drawback is found in the level of their reverse current (IR), which is relatively high. So, one with a low reverse current
is recommended when choosing a Schottky diode. The VR-IR characteristics versus temperatures show increases at
higher temperatures.
2. Protection against Input Reverse Voltage
Accidental reverse polarity at the input connection flows a large current to the diode for electrostatic breakdown protection
between the input pin of the IC and the GND pin, which may destroy the IC (see Figure 23).
A Schottky barrier diode or rectifier diode connected in series with the power supply as shown in Figure 24. is the simplest
solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by batteries because
there is a power loss calculated as VF x IOUT, as the forward voltage VF of the diode drops in a correct connection. The
lower VF of a Schottky barrier diode than that of a rectifier diode gives a slightly smaller power loss. Because diodes
generate heat, care must be taken to select a diode that has enough allowance in power dissipation. Areverse connection
allows a negligible reverse current to flow in the diode.
VIN
VOUT
COUT
GND
IN
OUT
D1
-
IN
OUT
VOUT
COUT
VIN
GND
GND
CIN
CIN
+
GND
Figure 23. Current Path in Reverse Input Connection
Figure 24. Protection against Reverse Polarity 1
Figure 25 shows a circuit in which a P-channel MOSFET is connected in series with the power. The diode located in the
drain-source junction portion of the MOSFET is a body diode (parasitic element). The voltage drop in a correct connection
is calculated by multiplying the resistance of the MOSFET being turned on by the output current IOUT, therefore it is
smaller than the voltage drop by the diode (see Figure 24) and results in less of a power loss. No current flows in a
reverse connection where the MOSFET remains off.
If the voltage taking account of derating is greater than the voltage rating of MOSFET gate-source junction, lower the
gate-source junction voltage by connecting voltage dividing resistors as shown in Figure 26.
Q1
Q1
VIN
IN
OUT
VIN
VOUT
COUT
GND
VOUT
COUT
CIN
IN
OUT
R1
GND
R2
CIN
Figure 25. Protection against Reverse Polarity 2
Figure 26. Protection against Reverse Polarity 3
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BD00FDAWHFP
Linear Regulators Reverse Voltage Protection - continued
3. Protection against Output Reverse Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground upon the
output voltage turning off. In-between the IC output and ground pins are a diode for preventing electrostatic breakdown,
in which large current flows that could destroy the IC. To prevent this from happening, connect a Schottky barrier diode
in parallel with the diode (see Figure 27).
Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the waveform
on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is needed for a motor load
that is affected by its counter electromotive force, as it produces an electrical current in a similar way.
VOUT
VIN
OUT
IN
GND
D1
CIN
XLL
COUT
GND
GND
Figure 27. Current Path in Inductive Load (Output: Off)
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BD00FDAWHFP
Thermal Design
IC mounted on ROHM standard board based on JEDEC.
(1): 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
8
7
(2) 5.68 W
6
5
4
3
2
1
0
(2): 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
(1) 1.04 W
0
25
50
75
100
125
150
Condition (1): θJA = 119.3 °C/W, ΨJT (top) = 8 °C/W
Condition (2): θJA = 22.0 °C/W, ΨJT (top) = 3 °C/W
Ambient Temperature: Ta [°C]
Figure 28. Power Dissipation
When operating at temperature more than Ta = 25 °C, please refer to the power dissipation characteristic curve shown in
Figure 28.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure 28 show the acceptable power dissipation characteristic curves of the HRP5 package. Even when the ambient
temperature (Ta) is at normal temperature (25 °C), the chip junction temperature (Tj) may be quite high so please operate the
IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc (W) is as follows
(
)
푃푐 = 푉푐푐 − 푉표 × 퐼표 + 푉푐푐 × 퐼푏
Acceptable loss Pd ≥ Pc
Solving this for load current Io in order to operate within the acceptable loss
푃푑 − 푉푐푐 × 퐼푏
퐼표 ≤
푉푐푐 − 푉표
푉푐푐 is Input voltage.
푉표 is Output voltage.
퐼표 is Load current.
퐼푏 is Circuit current.
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal
design.
Calculation Example) When HRP5, Ta = 85 °C, Vcc = 13.5 V, Vo = 5.0 V
2.953 − 13.5 × 퐼푏
Figure 28. (2) θja = 22 °C/W → -45.5 mW/°C
퐼표 ≤
8.5
25 °C = 5.68 W → 85 °C = 2.953 W
퐼표 ≤ 346.5 [mA] (lb: 0.58 mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
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TSZ22111 • 15 • 001
TSZ02201-0BAB0AG00030-1-2
16.May.2022 Rev.002
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BD00FDAWHFP
I/O Equivalence Circuits
2. Vcc Terminal
1. CTL Terminal
200 kΩ
(Typ)
1 kΩ
(Typ)
Vcc
CTL
IC
200 kΩ
(Typ)
4. Vo Terminal
Vcc
5. ADJ Terminal
Vo
1 kΩ
(Typ)
20 kΩ
(Typ)
ADJ
Vo
1 kΩ
(Typ)
28 kΩ
(Typ)
Figure 29. I/O equivalence circuit
Output Voltage Configuration Method
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 30.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are
large. Due to this, resistance ranging from 5 kΩ to 10 kΩ is highly recommended for R1.
Vo
ADJ 0.75 V
(
)
푅ꢀ + 푅ꢁ
푅ꢀ
R2
R1
푉표 ≈ 퐴퐷퐽 ×
IC
ADJ
pin
(Typ)
Figure 30. Output Voltage Configuration
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16.May.2022 Rev.002
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BD00FDAWHFP
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on
the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-
pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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TSZ22111 • 15 • 001
16.May.2022 Rev.002
BD00FDAWHFP
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 31. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used
in applications characterized by continuous operation or transitioning of the protection circuit.
14. Vcc Pin
Insert a capacitor (Vo ≥ 5.0 V: capacitor ≥ 1 µF, 1.5 V < Vo ≤ 5.0 V: capacitor ≥ 2.2 µF) between the Vcc and GND pins.
Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the
capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We
recommend using a capacitor with excellent voltage and temperature characteristics.
Electric capacitor
IC
Ceramic capacitor, Low ESR capacitor
Figure 32. Input Capacitor
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16.May.2022 Rev.002
17/22
BD00FDAWHFP
Operational Notes – continued
15. Output Pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 2.2 μF (Min) (3.0 V ≤ Vo). Electrolytic, tantalum and ceramic capacitors can
be used. We recommend a capacitor with a capacitance of more than 4.7 μF (Min) (1.5 V ≤ Vo < 3.0 V). Ceramic
capacitors can be used. When selecting the capacitor ensure that the capacitance of more than 2.2 μF (Min) (3.0 V ≤
Vo ) or more than 4.7 μF (Min) (1.5 V ≤ Vo < 3.0 V) is maintained at the intended applied voltage and temperature range.
Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the
capacitor refer to the Cout ESR vs Io data. The stable operation range given in the reference data is based on the
standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB impedance,
input supply impedance and load impedance. Therefore verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and DC-
biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that
the actual application meets with the required specification.
4.0 V ≤ Vcc ≤ 26.5 V
1.5 V ≤ Vo < 3.0 V
-40 °C ≤ Ta ≤ +105 °C
4.0 V ≤ Vcc ≤ 32.0 V
3.0 V ≤ Vo ≤ 30.0 V
-40 °C ≤ Ta ≤ +105 °C
5 kΩ ≤ R1 ≤ 10 kΩ
5 kΩ ≤ R1 ≤ 10 kΩ
2.2 µF ≤ Cin ≤ 100 µF
4.7 µF ≤ Cout ≤ 100 µF
1.0 µF ≤ Cin ≤ 100 µF
2.2 µF ≤ Cout ≤ 100 µF
100
10
100
10
Unstable Operating Region
Unstable Operating Region
1
1
Stable Operating Region
0.1
Stable Operating Region
0.1
0.01
0.01
0.001
0.001
0
400
800
1200
1600
2000
0
400
800
1200
1600
2000
Io (mA)
Io (mA)
Cout ESR vs Io
Cout ESR vs Io
3.0 V ≤ Vo ≤ 30.0 V
1.5 V ≤ Vo < 3.0 V
Vcc
Vo
Cin
Cout
R2
VCC
(4.0 V to 30.0 V)
Io
(Rout)
CTL
ADJ
GND
VCTL
(5.0 V)
ESR
R1
(5 kΩ to 10 kΩ)
Measurement Circuit
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16.May.2022 Rev.002
18/22
BD00FDAWHFP
Operational Notes – continued
16. CTL Pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
17. Rapid variation in Vcc Voltage and load Current
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current
and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
18. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input voltage
and load current, etc., use countermeasures such as implementing filters.
19. Regarding the Input Pin and Vcc voltage
In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or damage
to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a capacitor with
a capacitance with less than 1000 μF. We also recommend using reverse polarity diodes in series or a bypass between
all pins and the Vcc pin.
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19/22
TSZ22111 • 15 • 001
16.May.2022 Rev.002
BD00FDAWHFP
Ordering Information
B D 0 0 F D A W H F P -
T R
Output Voltage
00: Variable
Input Voltage,
Current Capacity W: With CTL
FDA: 35 V, 2 A (Enable)
Enable
Package
HFP: HRP5
Packaging and forming specification
TR: Embossed tape and reel (HRP5)
Marking Diagram
HRP5 (TOP VIEW)
Part Number Marking
LOT Number
D00FDAWHFP
Pin 1 Mark
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TSZ02201-0BAB0AG00030-1-2
16.May.2022 Rev.002
20/22
BD00FDAWHFP
Physical Dimension and Packing Information
Package Name
HRP5
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TSZ22111 • 15 • 001
TSZ02201-0BAB0AG00030-1-2
16.May.2022 Rev.002
21/22
BD00FDAWHFP
Revision History
Date
Revision
Changes
11.May.2021
16.May.2022
001
002
New Release
P.15 Correction of Vout calculation formula errors
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16.May.2022 Rev.002
22/22
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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