BD14210G-LA (新产品) [ROHM]
BD14210G-LA是一款电流检测放大器IC。该产品是能够保证向工业设备市场长期供应的产品，而且是非常适用于这些应用领域的产品。该产品通过2.7V〜5.5V的单电源供电，支持-0.2V〜+26V的宽范围共模电压，输出模拟电压。检测放大器的增益为20V/V。通过增益匹配电阻将增益误差降至更低，从而具有低失调的特点。输入电流低至1µA(Typ)，无需误差调整。该产品内置电流检测放大器(CSA)，可提供30A电流检测的参考设计。 .csampmovie-wrap { max-width: 33%;} .csampmovie { position: relative; width:100%; height:0; padding-top: 56.25%; }.csampmovie-wrap iframe { position: absolute; top: 0; left: 0; width: 100%; height: 100%;}@media screen and (max-width: 769px) {.csampmovie-wrap { max-width: 100%; } };
| 型号： | BD14210G-LA (新产品) |
| 厂家： | 
ROHM |
| 描述： | BD14210G-LA是一款电流检测放大器IC。该产品是能够保证向工业设备市场长期供应的产品，而且是非常适用于这些应用领域的产品。该产品通过2.7V〜5.5V的单电源供电，支持-0.2V〜+26V的宽范围共模电压，输出模拟电压。检测放大器的增益为20V/V。通过增益匹配电阻将增益误差降至更低，从而具有低失调的特点。输入电流低至1µA(Typ)，无需误差调整。该产品内置电流检测放大器(CSA)，可提供30A电流检测的参考设计。 .csampmovie-wrap { max-width: 33%;} .csampmovie { position: relative; width:100%; height:0; padding-top: 56.25%; }.csampmovie-wrap iframe { position: absolute; top: 0; left: 0; width: 100%; height: 100%;}@media screen and (max-width: 769px) {.csampmovie-wrap { max-width: 100%; } } 放大器 |
| 文件： | 总19页 (文件大小：972K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Current Sensor
Current Sense Amplifier
BD14210G-LA
General Description
Key Specifications
The BD14210G-LA current sense amplifier.
This is the product guarantees long time support in
Industrial market.
This device operates from a single 2.7 V to 5.5 V power
supply.
◼ VDD Voltage Range:
◼ Quiescent Current:
◼ Common Mode Voltage Range:
◼ Gain:
2.7 V to 5.5 V
170 μA (Typ)
-0.2 V to +26 V
20 V/V (Typ)
±1.0 % (Max)
◼ Gain Accuracy:
It has wide common mode voltage range from -0.2 V to
+26 V, outputs analog voltage. The gain is 20 V/V.
The matched gain resistor minimizes gain error and
realizes low offset voltage.
◼ Operating Temperature Range: -40 °C to +125 °C
Package
SSOP6
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
The input bias current is 1 µA (Typ) at typical condition.
There is no need to adjust the gain error.
Features
◼
◼
◼
◼
◼
Long Time Support Product for Industrial Applications.
Wide Common Mode Voltage Range
High Accuracy
Low Offset Voltage
Low Input Bias Current
SSOP6
Applications
◼
◼
◼
Industrial Equipment
Telecom Equipment
Over Current Detection
Typical Application Circuit
ss capacitor
ary,
wer supply
, etc.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Contents
General Description......................................................................................................................................................................1
Features.........................................................................................................................................................................................1
Applications ..................................................................................................................................................................................1
Key Specifications........................................................................................................................................................................1
Package .........................................................................................................................................................................................1
Typical Application Circuit...........................................................................................................................................................1
Pin Descriptions ...........................................................................................................................................................................3
Pin Configurations........................................................................................................................................................................3
Absolute Maximum Ratings.........................................................................................................................................................4
Thermal Resistance......................................................................................................................................................................4
Recommended Operating Conditions.........................................................................................................................................5
Electrical Characteristics.............................................................................................................................................................5
Typical Performance Curves........................................................................................................................................................6
Figure 1. Quiescent Current vs Operating Temperature..........................................................................................................6
Figure 2. Offset Voltage vs Operating Temperature.................................................................................................................6
Figure 3. Gain Accuracy vs Operating Temperature................................................................................................................6
Figure 4. Input Bias Current vs Operating Temperature..........................................................................................................6
Figure 5. H level Output Voltage vs Operating Temperature...................................................................................................7
Figure 6. L level Output Voltage vs Operating Temperature ...................................................................................................7
Basic Explanation.........................................................................................................................................................................8
Control Sequence.......................................................................................................................................................................10
I/O Equivalence Circuits.............................................................................................................................................................11
Operational Notes.......................................................................................................................................................................12
Ordering Information..................................................................................................................................................................14
Marking Diagram.........................................................................................................................................................................14
Physical Dimension and Packing Information .........................................................................................................................15
Revision History .........................................................................................................................................................................16
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Pin Descriptions
Top View
OUT
GND
VINP
6
5
4
VDD
REF
1
2
3
VINM
Pin Configurations
Pin No.
Pin Name
Function
1
OUT
GND
VINP
VINM
REF
Current detection output
Ground
2
3
4
5
6
Input of supply side of shunt resister
Input of load side of shunt resister
Reference input
VDD
Power supply(Note 1)
(Note 1) Dispose a bypass capacitor between VDD and GND.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VDD
VCM
7.0
V
V
Power Supply Voltage
Common Mode Voltage
Input Voltage
-0.2 to +26
-0.3 to VDD+0.3
-55 to +150
150
VIN
V
Tstg
°C
Storage Temperature Range
Tjmax
°C
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SSOP6
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A (Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
FR-4
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Power Supply Voltage
Common Mode Voltage
Operating Temperature
VDD
VCM
Topr
2.7
-0.2
-40
-
-
5.5
+26
V
V
VINP, VINM
+25
+125
°C
Electrical Characteristics
(Unless otherwise specified VDD = 5 V, VREF = 1/2 x VDD, VCM = 12 V, VSENSE = (VVINP – VVINM), Ta = 25 °C)
Parameter
Power Supply
Symbol
Min
Typ
Max
Unit
Condition
IDD
-
170
280
µA
VSENSE = 0 mV
Quiescent Current
Current Sense Amplifier
Offset Voltage
Gain
VOS
-
-
-
±0.6
mV
V/V
RTI(Note 6) , VSENSE = 0 mV
GAIN
20
-
VOUT = 0.5 V to VDD-0.5 V
Ta = -40 °C to +125 °C
Gain Accuracy
GERR
Lin
-
-
-
-
±1.0
%
%
µA
V
±0.01
-
-
-
VOUT = 0.5 V to VDD-0.5 V
Nonlinearity Error
Input Bias Current
High-level Output Voltage
VSENSE = 0 mV
Ta = -40 °C to +125 °C
IVINM
1.0
VOUT_H VDD – 0.02
VOUT_L
-
-
OUT, RL = 10 KΩ pulldown
GND +
0.05
-
V
OUT, RL = 10 KΩ pullup
Low-level Output Voltage
(Note 6) RTI = Referred To Input
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Typical Performance Curves
(Unless otherwise specified VDD = 5 V, VREF = 1/2 x VDD, VCM = 12 V, VSENSE = (VVINP – VVINM), Ta = 25 °C)
280
260
240
220
200
180
160
140
120
100
80
500
400
300
200
100
0
-100
-200
-300
-400
-500
60
40
20
VSENSE = 0 mV
0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
OperatingTemperature: Topr [°C]
Operating Temperature: Topr [°C]
Figure 1. Quiescent Current vs Operating Temperature
Figure 2. Offset Voltage vs Operating Temperature
1.0
1.0
0.8
0.6
0.4
0.2
0.0
0.5
0.0
-0.5
-1.0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Operating Temperature: Topr [°C]
Operating Temperature: Topr [°C]
Figure 3. Gain Accuracy vs Operating Temperature
Figure 4. Input Bias Current vs Operating Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VDD = 5 V, VREF = 1/2 x VDD, VCM = 12 V, VSENSE = (VVINP – VVINM), Ta = 25 °C)
5.000
4.998
4.996
4.994
4.992
4.990
4.988
4.986
4.984
4.982
4.980
0.050
0.040
0.030
0.020
0.010
0.000
-50 -25
0
25
50
75 100 125
-50 -25
Operating Temperature: Topr [°C]
Figure 6. Low-level Output Voltage vs Operating Temperature
0
25
50
75 100 125
Operating Temperature: Topr [°C]
Figure 5. High-level Output Voltage vs Operating
Temperature
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Basic Explanation
This IC has the structure specialized for Current Sense Amplifier and has the following features. Common mode voltage
range is maximum 26 V with VDD of maximum 5.5 V, therefore it is possible to detect the current flowing in a power supply
line exceeding VDD voltage. And its input bias current is very low.
This IC amplifies the voltage difference across the shunt resister between VINP and VINM and outputs a voltage with the REF
pin as reference voltage.
If the current flows from VINP to VINM, OUT pin voltage is higher than REF pin voltage. If the current flows from VINM to VINP,
OUT pin voltage is lower than REF pin voltage. When the voltages of VINP and VINM are equal, OUT pin voltage is equal to
REF pin voltage.
ILOAD
Bus Voltage
(+)
(-)
Load
RSHUNT
VINM
VINP
OUT
REF
VOUT
VREF
ILOAD [A]
0
VOUT [V]
VREF
0
Figure 7. Basic Explanation
VOUT is calculated by the below formula.
VOUT = (RSHUNT x ILOAD x GAIN) + VREF
Where,
RSHUNT is the Shunt resistance
ILOAD is the Load current
GAIN is the Gain of Current Sense Amplifier
VREF is the REF pin voltage
Also, VOUT needs to be GND < VOUT < VDD.
VOUT is clipped to Low-level Output Voltage (VOUT_L) when it’s under GND.
VOUT is clipped to High-level Output Voltage (VOUT_H) when it’s over VDD.
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Basic Explanation – continued
Input pin VINP and VINM needs to be connected to IC as close as possible in order to minimize the influence on series
resistance of shunt resister.
For stability, dispose and connect a bypass capacitor for removing power source noise close to IC.
Selection of shunt resister
Shunt resister RSHUNT should be selected considering the accuracy of measuring current and the maximum power dissipation
according to an application.
If the value of shunt resister is high, it minimizes the influence of offset and increases the accuracy of measuring current.
If the value of shunt resister is low, it reduces the power dissipation of VDD.
Shunt resister value is calculated by below formula.
RSHUNT < (VDD – VREF) / (abs(ILOADMAX) x GAIN)
Where
VDD is the Power Supply
abs(ILOADMAX) is the Maximum of load current (absolute value)
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Control Sequence
1. Control Sequence
1.1 Power supply start-up sequence
VDD(Min)
tOEN
VDD
0.4 V
OUT
X
Figure 8. Timing Chart at Power ON
Stable time of OUT(tOEN) should be more than 1 ms.
1.2 Power supply end sequence
tPSL
VDD(Min)
0.4 V
VDD
OUT
tOEN
X
Figure 9. Timing Chart at Power OFF
Power off time(tPSL) should be more than 1 ms.
If VDD voltage is under the recommended operating condition, LSI is unstable state. In that case, set Power OFF
and ON again. When the power is ON again, the period of VDD<0.4 V should be more than tPSL
.
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I/O Equivalence Circuits
Pin Name
Equivalent Circuit Diagram
Pin Name
Equivalent Circuit Diagram
OUT
VINP
VINM
VDD
VDD
VDD
VDD
REF
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes - continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 10. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B D 1
4
2
1
0 G
-
L A T R
Package
Product Class
G: SSOP6
LA for Industrial Applications
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP6 (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
SSOP6
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Revision History
Date
Revision
001
Changes
New Release
3.Mar.2022
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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