BD18KA5FP-E2 [ROHM]

500mA Variable/Fixed Output LDO Regulators Built-in thermal shutdown circuit; 500毫安可变/固定输出LDO稳压器内置热关断电路
BD18KA5FP-E2
型号: BD18KA5FP-E2
厂家: ROHM    ROHM
描述:

500mA Variable/Fixed Output LDO Regulators Built-in thermal shutdown circuit
500毫安可变/固定输出LDO稳压器内置热关断电路

线性稳压器IC 调节器 电源电路 输出元件
文件: 总18页 (文件大小:616K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
500mA Variable/Fixed Output  
LDO Regulators  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
General Description  
The BDxxKA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage  
precision is ±1%. These LDO regulators are offered in several output voltages and package lineups with or without  
ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of  
applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in  
overcurrent protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown  
circuit.  
Features  
„ Output voltage precision: ±1%  
Packages  
SOP8  
W (Typ.) x D (Typ.) x H (Max.)  
5.00mm x 6.20mm x 1.71mm  
6.50mm x 9.50mm x 2.50mm  
6.50mm x 9.50mm x 2.50mm  
„ Low-saturation voltage with PMOS output: 0.12V  
Typ.(Io=200mA)  
TO252-3  
TO252-5  
„ Built-in over-current protection circuit  
„ Built-in thermal shutdown circuit  
„ Shutdown switch (BDxxKA5WFP and BDxxKA5WF  
series)  
„ Ceramic capacitor compatible (recommended  
capacitance: 1μF or greater)  
Key Specifications  
„ Input Power Supply Voltage:  
„ Output voltage type: BA00KA5  
BAxxKA5  
5.5V (Max.)  
Variable  
SOP8  
Fixed  
„ Output current:  
500mA (Max.)  
„ Operating temperature range:  
-40to +105℃  
Applications  
Microcontrollers and all electronic devices that use  
logic circuit  
TO252-5  
TO252-3  
Lineup matrix  
Output Voltage (V)  
Part Number  
Package  
1.0  
1.2  
1.5  
1.8  
2.5  
3.0  
3.3 Variable  
BDxxKA5WFP  
BDxxKA5WF  
BDxxKA5FP  
-
TO252-5  
SOP8  
TO252-3  
Ordering Information  
B D x  
x
K
A
5
W
x
x
-
E 2  
Shutdown Switch  
W: Include  
None:without  
Package  
Part Number  
Output voltage Current capacity  
Packaging and forming specification  
E2: Embossed tape and reel  
KA5: 500mA  
00:Variable  
Other: Fixed  
FP : TO252-3  
TO252-5  
F
: SOP8  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays.  
www.rohm.com  
TSZ02201-0R6R0A600150-1-2  
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1/15  
TSZ2211114001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Lineup  
Maximum output  
current (Max.)  
Shutdown  
Switch  
Package  
Output  
voltage (Typ.)  
Orderable  
Part Number  
1.0V  
1.2V  
1.5V  
1.8V  
2.5V  
3.0V  
3.3V  
Variable  
1.0V  
1.2V  
1.5V  
1.8V  
2.5V  
3.0V  
3.3V  
Variable  
1.0V  
1.2V  
1.5V  
1.8V  
2.5V  
3.0V  
3.3V  
BD10KA5WFP-E2  
BD12KA5WFP-E2  
BD15KA5WFP-E2  
BD18KA5WFP-E2  
BD25KA5WFP-E2  
BD30KA5WFP-E2  
BD33KA5WFP-E2  
BD00KA5WFP-E2  
BD10KA5WF-E2  
BD12KA5WF-E2  
BD15KA5WF-E2  
BD18KA5WF-E2  
BD25KA5WF-E2  
BD30KA5WF-E2  
BD33KA5WF-E2  
BD00KA5WF-E2  
BD10KA5FP-E2  
BD12KA5FP-E2  
BD15KA5FP-E2  
BD18KA5FP-E2  
BD25KA5FP-E2  
BD30KA5FP-E2  
BD33KA5FP-E2  
TO252-5  
Reel of 2000  
With Switch  
500mA  
SOP8  
Reel of 2500  
No Switch  
TO252-3  
Reel of 2000  
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© 2012 ROHM Co., Ltd. All rights reserved.  
2/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions  
Fig.1  
Fig.4  
Fig.2  
N.C.(2PIN)  
Fig.5  
[BDxxKA5FP]  
GND(FIN)  
Fig.3  
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3/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Power Supply Voltage  
Output Control Terminal Voltage  
TO252-3  
Symbol  
Vcc  
Limits  
-0.3 to +7.0*1  
-0.3 to Vcc*1  
1200*2  
Unit.  
V
VCTL  
V
Power Dissipation TO252-5  
SOP8  
Pd  
1300*3  
mW  
687.6*4  
Operating Temperature Range  
Ambient Storage Temperature  
Topr  
Tstg  
-40 to +105  
-55 to +150  
150  
Maximum Junction Temperature  
Tjmax  
*1 Must not exceed Pd  
*2 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/over 25.  
*3 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/over 25.  
*4 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/over 25.  
Recommended Operating Ratings (Ta=25)  
Parameter  
Input Power Supply Voltage  
Output Current  
Symbol  
Vcc  
Io  
Min.  
2.3  
0
Max.  
5.5  
Unit.  
V
500  
4.0  
mA  
V
Output Voltage Configuration Range*5  
Vo  
1.0  
0
Output Control Terminal Voltage  
VCTL  
Vcc  
V
*5 Only BD00KA5WFP and BD00KA5WF  
Electrical Characteristics  
BDxxKA5 Series BDxxKA5W Series  
(Unless otherwise specified,Ta=25, VCTL =2V, Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V), Vcc=3.3V(Vo=2.5V), Vcc=5.0V(Vo=3.0V,3.3V))  
Limit  
Parameter  
Symbol  
Vo  
Unit  
V
Conditions  
Min  
Typ  
Vo(T)  
Vo(T)  
0
Max  
Vo(T)-0.015  
Vo(T)+0.015  
Io=200mA (Vo=1.0V,1.2V)  
Io=200mA (Vo1.5V)  
VCTL=0V, Io=0mA (OFFmode)  
Io=0mA  
Output Voltage  
Vo(T)×0.99  
Vo(T)×1.01  
Shut Down Current  
Bias Current  
Dropout Voltage *6  
Isd  
Ib  
1
μA  
μA  
V
350  
0.12  
550  
0.20  
ΔVd  
Io  
Io=200mA, Vcc=0.95×Vo  
Peak Output Current  
500  
mA  
9
f=120Hz, ein =-10dBV,  
Io=100mA  
Ripple Rejection  
R.R.  
50  
dB  
Vcc=Vo+0.5V5.5V,  
Io=200mA  
*7  
Line Regulation  
Reg.I  
Reg.L  
Tcvo  
10  
25  
35  
75  
mV  
mV  
Load Regulation  
Io=0mA500mA  
Temperature Coefficient  
of Output Voltage *8  
±100  
ppm/Io=5mA,Tj=0 to 125℃  
CTL ON Mode Voltage  
VCTLON  
2.0  
40  
0.8  
60  
V
V
ACTIVE MODE, Io=0mA  
OFF MODE, Io=0mA  
Io=0mA  
CTL OFF Mode Voltage VCTLOFF  
CTL Input Current  
ICTL  
20  
μA  
Vo(T) : Output Voltage  
6
*
*
*
*
Vo2.5V  
7
8
9
1.0Vo1.8V,Vcc=2.3V5.5V  
Not 100% tested  
ein : Input Voltage Ripple  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
4/15  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Electrical Characteristics – continued  
BD00KA5W Series  
(Unless otherwise specified, Ta=25, Vcc=2.5V, VCTL=2V ,Vo=1.5V)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Typ  
0
Max  
1
Shut Down Current  
Bias Current  
Isd  
Ib  
μA  
μA  
V
VCTL=0V, Io=0mA (OFFmode)  
Io=0mA  
350  
550  
Reference Voltage  
Dropout Voltage *10  
Peak Output Current  
Ripple Rejection  
Line Regulation  
VADJ  
ΔVd  
Io  
0.742 0.750 0.758  
Io=50mA  
500  
0.12  
0.20  
V
Io=200mA, Vcc=0.95×Vo  
mA  
dB  
mV  
mV  
R.R.  
Reg.I  
Reg.L  
50  
f=120Hz, ein 12=-10dBV, Io=100mA  
10  
35  
Vcc=Vo+0.5V5.5V, Io=200mA  
Io=0mA500mA  
Load Regulation  
25  
75  
Temperature Coefficient of  
Output Voltage *11  
Tcvo  
±100  
ppm/Io=5mA,Tj=0 to 125℃  
CTL ON Mode Voltage  
CTL OFF Mode Voltage  
CTL Input Current  
VCTLON  
VCTLOFF  
ICTL  
2.0  
40  
0.8  
60  
V
V
ACTIVE MODE, Io=0mA  
OFF MODE, Io=0mA  
Io=0mA  
20  
μA  
10  
*
*
*
Vo2.5V  
11  
Not 100% tested  
12  
ein : Input Voltage Ripple  
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5/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Typical Performance Curves  
(Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA)  
SUPPLY VOLTAGE : Vcc[V]  
SUPPLY VOLTAGE : Vcc[V]  
Fig.7  
Fig.6  
Input StabilityIo=0mA)  
Circuit current  
OUTPUT CURRENT : IO[A]  
SUPPLY VOLTAGE : Vcc[V]  
Fig.9  
Load Stability  
Fig.8  
Input Stability  
Io=500mA)  
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TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
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6/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Typical Performance Curves - continued  
Fig.11  
Ripple Rejection  
Fig.10  
Input/Output Voltage Difference  
ein=10dBV,Io=100mA)  
Vcc=3.135V)  
TEMPERATURE : Ta[]  
TEMPERATURE : Ta[]  
Fig.12  
Fig.13  
Output Voltage  
Circuit Current  
Temperature Characteristics  
Io=5mA)  
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TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
7/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Typical Performance Curves - continued  
CONTROL VOLTAGE : VCTL[V]  
OUTPUT CURRENT : IO[A]  
Fig.15  
Fig.14  
CTL Voltage vs. Output Voltage  
Circuit Current by load Level  
CONTROL VOLTAGE : VCTL[V]  
TEMPERATURE : Ta[]  
Fig.16  
Fig.17  
Thermal Shutdown  
CTL Voltage vs. Output Current  
Circuit Characteristics (Io=5mA)  
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TSZ02201-0R6R0A600150-1-2  
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8/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
I/O equivalence circuit  
Vcc Vcc  
Vcc  
Vcc  
With BD00KA5WFP/WF,R1and R2 are connected  
outside the IC between ADJ and GND and  
between OUT and ADJ.  
31.25kΩ 2kΩ  
25kΩ  
OUT  
ADJ  
CTL  
R2  
R1  
(BD00KA5WFP/WF)  
Fig.18  
Fig.19  
Power Dissipation  
TO252-3  
TO252-5  
2.0  
1.6  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
Rohm standard board mounting  
Board size70×70×1.6mm  
Copper foil area7×7mm2  
θja=104.2(/W)  
Rohm standard board mounting  
Board size70×70×1.6mm  
Copper foil area7×7mm2  
θja=96.2(/W)  
1.30  
1.20  
1.2  
0.8  
0.4  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Ambient temperatureTa()  
Ambient temperature:Ta(℃)  
Fig.21 Power Dissipation heat  
reducing characteristics  
Fig.20 Power Dissipation heat  
reducing characteristics  
SOP8  
1000  
800  
600  
400  
200  
0
(1)When using a standard board:  
θj-c=181.8(/W)  
(2) When using an IC alone  
θj-a=222.2(/W)  
687.6mW  
(1)  
562.6mW  
(2)  
0
25  
50  
75  
100  
125  
150  
Ambient temperatureTa()  
Fig.22 Power Dissipation heat  
reducing characteristics  
When using at temperatures over Ta=25, please refer to the power dissipation shown in Fig.20 through 22.  
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the  
maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient  
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal  
damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.  
Even when the ambient temperature Ta is a normal temperature (25), the chip(junction) temperature Tj may be quite high,  
so please operate the IC at temperatures less than the acceptable loss Pd.  
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TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
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9/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
The calculation method for power consumption Pc(W) is as follows :  
Vcc:  
Vo:  
Input voltage  
Output voltage  
Load current  
Circuit current  
Pc = (Vcc-Vo)×Io+Vcc×Icca  
Acceptable loss PdPc  
Io:  
Icca:  
Solving for the load current IO in order to operate within the acceptable loss,  
Pc – Vcc×Icca  
Io≦  
VccVo  
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.  
Calculation Example  
Example 1) When Ta=85, Vcc=2.5V, Vo=1.0V  
BA10KA5WFPTO252-5 packaging)  
0.6762.5×Icca  
Io≦  
Io440mA (Icca : 6mA)  
θja=96.2/W -10.4mW/℃  
2.5-1.0  
25=1300mW 85=676mW  
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating  
temperature ranges.  
The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :  
Pc=Vcc×(Icca+Ishort)  
*Ishort : Short circuit current  
Terminal Vicinity Settings and Cautions  
Vcc Terminal  
Please attach a capacitor (greater than 1μF) between Vcc and GND.  
The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the  
operation on actual board.  
GND Terminal  
Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not  
arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not  
be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns  
as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.  
CTL Terminal  
The CTL terminal is turned ON at 2.0V and higher, and OFF at  
0.8V and lower, within the operating power supply voltage range.  
31.25k  
CTL  
The power supply and the CTL terminal may be started up and  
shut down in any order without problems.  
25kΩ  
Fig.23 Input equivalent circuit  
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Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Vo Terminal  
Please be sure to attach an anti-oscillation capacitor between Vo and GND.  
100  
Oscillation region  
10  
OUT  
Stable region  
IC  
ESR  
1
Cin  
1μF  
Vcc  
1μF  
Vcc OUT  
1μF  
CTL GND ADJ R2  
R1  
VCTL  
2V  
Io(ROUT)  
0.1  
R1=30kΩ,R2=2kΩ  
0.01  
0
100  
200  
300  
400  
500  
Io(mA)  
Fig.24 Output Equivalent Circuit  
Fig.25 ESR-Io Characteristics  
Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the  
capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series resistance  
(ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally have  
favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high voltage  
capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R, is  
recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after  
sufficiently confirming its properties according to its specifications in the actual application.  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
50V Max.Input  
50V Max.Input  
16V Max.Input  
X7R  
X5R  
Y5V  
10V Max.Input  
16V Max.Input  
10V Max.Input  
Vdc=0  
0
1
2
3
4
0
1
2
3
4
-25  
0
25  
50  
75  
DCbypass Vdc(V)
(a) Capacitance-bypass  
characteristics (Y5V)  
bCapacitance-bypass  
characteristicsX5R,X7R)  
DC bypass Vdc(V)  
Temp()  
CCapacitance-temperature  
characteristicsX5R,X7R,Y5V)  
Fig.26 General characteristics of ceramic capacitors  
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TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Operational Notes  
Protection Circuits  
Over-current Protection Circuit  
A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when  
there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is  
restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance  
capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,  
it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the  
over-current protection circuit has negative current capacity characteristics with regard to temperature.  
Thermal Shutdown Circuit (Thermal Protection)  
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As  
shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously  
exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal shutdown  
circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip  
temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Fig.17 for the temperatures at  
which the temperature protection circuit operates).  
There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to  
avoid leaving the IC in the overloaded state.  
Reverse Current  
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode  
be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).  
Reverse current  
Vcc  
OUT  
CTL  
GND  
Fig.27 Bypass diode  
This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N  
junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as :  
- a parasitic diode when the electric potential relationship is GND> Pin A, GND> Pin B, or  
- a parasitic transistor when the electric potential relationship is Pin B > GND> Pin A.  
Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference  
between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in  
ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board)  
to the input terminal.  
Transistor (NPN)  
Resistor  
B
C
(Pin A)  
(Pin B)  
(Pin B)  
E
C
E
B
GND  
N
P+  
P+  
P
GND  
P+  
P
N
Parasitic element  
or transistor  
N
P+  
N
P
N
N
N
Parasitic element  
GND  
P
(Pin A)  
Parasitic element  
Parasitic element  
or transistor  
GND  
GND  
Fig.28 Basic structure example  
Status of this document  
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to  
help reading the formal version.  
If there are any differences in translation version of this document formal version takes priority.  
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TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
12/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Physical Dimension Tape and Reel Information  
SOP8  
<Tape and Reel information>  
5.0 0.2  
(MAX 5.35 include BURR)  
Tape  
Embossed carrier tape  
2500pcs  
+
6
°
4°  
4
°
Quantity  
8
1
7
6
5
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
2
3
4
0.595  
+0.1  
0.17  
-
0.05  
S
1.27  
Direction of feed  
1pin  
0.42 0.1  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
TO252-3  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
6.5 0.2  
+0.2  
C0.5  
Quantity  
2000pcs  
5.1  
-
0.1  
2.3 0.2  
E2  
0.5 0.1  
Direction  
of feed  
The direction is the 1pin of product is at the lower left when you hold  
reel on the left hand and you pull out the tape on the right hand  
FIN  
(
)
1
2
3
0.65  
0.65  
0.5 0.1  
0.75  
1.0 0.2  
2.3 0.2  
2.3 0.2  
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
1pin  
Reel  
(Unit : mm)  
TO252-5  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2.3 0.2  
0.5 0.1  
6.5 0.2  
Quantity  
2000pcs  
C0.5  
+0.2  
5.1  
-0.1  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the lower left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
FIN  
3
1
2
4 5  
0.5 0.1  
1.0 0.2  
0.5  
1.27  
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
1pin  
Reel  
(Unit : mm)  
www.rohm.com  
TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
13/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Marking Diagrams  
SOP8(TOP VIEW)  
Part Number Marking  
LOT Number  
1PIN MARK  
TO252-3  
(TOP VIEW)  
TO252-5  
(TOP VIEW)  
Part Number Marking  
Part Number Marking  
LOT Number  
LOT Number  
Orderable  
Part Number  
Package  
Part Number Marking  
BD10KA5WFP-E2  
BD12KA5WFP-E2  
BD15KA5WFP-E2  
BD18KA5WFP-E2  
BD25KA5WFP-E2  
BD30KA5WFP-E2  
BD33KA5WFP-E2  
BD00KA5WFP-E2  
BD10KA5WF-E2  
BD12KA5WF-E2  
BD15KA5WF-E2  
BD18KA5WF-E2  
BD25KA5WF-E2  
BD30KA5WF-E2  
BD33KA5WF-E2  
BD00KA5WF-E2  
BD10KA5FP-E2  
BD12KA5FP-E2  
BD15KA5FP-E2  
BD18KA5FP-E2  
BD25KA5FP-E2  
BD30KA5FP-E2  
BD33KA5FP-E2  
10KA5W  
12KA5W  
15KA5W  
18KA5W  
25KA5W  
30KA5W  
33KA5W  
00KA5W  
10KA5W  
12KA5W  
15KA5W  
18KA5W  
25KA5W  
30KA5W  
33KA5W  
00KA5W  
10KA5  
TO252-5  
SOP8  
12KA5  
15KA5  
TO252-3  
18KA5  
25KA5  
30KA5  
33KA5  
www.rohm.com  
TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
14/15  
TSZ2211115001  
Datasheet  
BDxxKA5 Series BDxxKA5W Series BD00KA5W Series  
Revision History  
Date  
Revision  
001  
Changes  
26.Jun.2012  
New Release  
www.rohm.com  
TSZ02201-0R6R0A600150-1-2  
26.Jun.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
15/15  
TSZ2211115001  
Daattaasshheeeett  
Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  

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