BD2224G [ROHM]
High-Side Switch for Universal Serial Bus (USB); 高边开关为通用串行总线（ USB ）
| 型号： | BD2224G |
| 厂家： | 
ROHM |
| 描述： | High-Side Switch for Universal Serial Bus (USB) |
| 文件： | 总5页 (文件大小：133K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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● Structure
● Product
● Type
Silicon Monolithic IC
High-Side Switch for Universal Serial Bus (USB)
BD2224G
● Features
Low On-Resistance (Typ. 150mΩ) N-channel MOSFET Built-in
500mA Continuous Load Current
Over-Current Protection
Thermal Shutdown
Open-Drain Fault Flag Output
Under-Voltage Lockout
Soft-Start Circuit
Input Voltage Range: 2.7V ~ 5.5V
Active-High Control Logic
SSOP5 Package
● Absolute Maximum Ratings (TA= 25oC)
Parameter
VIN Supply Voltage
EN Input Voltage
/OC Voltage
Symbol
VIN
Rating
-0.3 ~ 6.0
-0.3 ~ 6.0
-0.3 ~ 6.0
5
Unit
V
VEN
V
V/OC
I/OC
V
/OC Sink Current
VOUT Voltage
mA
V
oC
VOUT
TSTG
PD
-0.3 ~ VIN + 0.3
-55 ~ 150
675
Storage Temperature
Power Dissipation (*1)
mW
(*1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1oC above 25oC.
● Operating Conditions
Parameter
VIN Operating Voltage
Symbol
VIN
Min.
2.7
-40
0
Typ.
Max.
5.5
Unit
V
5.0
Operating Temperature
Continuous Load Current
TOPR
IOUT
-
-
85
oC
500
mA
This IC is not designed to be radiation-proof.
REV. B
2/4
● Electrical Characteristics
VIN= 5V, TA= 25oC, unless otherwise specified.
DC Characteristics
Parameter
Symbol
IDD
Min.
-
Typ.
110
0.01
-
Max.
160
5
Unit
μA
μA
V
Conditions
VEN= 5V, VOUT= open
VEN= 0V, VOUT= open
High input
Operating Current
Standby Current
ISTB
VEN
VEN
IEN
-
2.0
-
-
EN Input Voltage
-
0.8
1
V
Low input
EN Input Leakage
-1
0.01
150
780
-
μA
VEN= 0V or 5V
On-Resistance
RON
ITH
-
200
1000
-
mΩ IOUT= 50mA
mA
Over-Current Threshold
Short Circuit Output Current
/OC Output Low Voltage
550
350
-
ISC
mA VOUT= 0V, RMS
V/OC
-
0.4
2.5
2.4
V
V
V
I/OC= 0.5mA
2.1
2.0
2.3
2.2
VIN increasing
VIN decreasing
UVLO Threshold
VTUV
AC Characteristics
Parameter
Turn-on Rise Time
Turn-on Delay Time
Turn-off Fall Time
Turn-off Delay Time
/OC Delay Time
Symbol
TON1
Min.
Typ.
1
Max.
6
Unit
ms
ms
μs
Conditions
-
-
RL= 20Ω
RL= 20Ω
RL= 20Ω
RL= 20Ω
TON2
1.5
1
10
20
40
20
TOFF1
TOFF2
T/OC
-
-
3
μs
10
15
ms
● Timing Chart
Over-Current
Detection
Over-Current
Load Removed
50%
50%
EN
VOUT
TON2
90%
TOFF2
ITH
ISC
IOUT
/OC
90%
10%
VOUT
10%
T/OC
TON1
TOFF1
Turn-on Time and Turn-off Time
Over-Current Protection
REV. B
3/4
● Block Diagram
/OC
Over-Current
Protection
Delay
Counter
Under-Voltage
Lockout
Charge
Pump
Thermal
Shutdown
GND
EN
VIN
VOUT
● Pin Description
Pin No.
Name
I/O
Function
1
2
VIN
-
-
Switch input and the supply voltage for the IC.
Ground.
GND
Active-High enable input.
3
EN
I
High level input turns on the switch.
Over-current notification terminal.
4
5
/OC
O
O
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
VOUT
Switch output.
● Package Outline
Lot No.
Unit : mm
Drawing No. EX106-5001-2
Package : SSOP5
REV. B
4/4
● Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode
exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including
the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the
interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when
there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND
pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no
problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating
or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (PD) in actual
states of use.
REV. B
Notice
N o t e s
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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The Products specified in this document are intended to be used with general-use electronic
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