BD2606MVV [ROHM]
BD2606MVV不仅可通过升压率自动切换实现高效升压，还可通过64步可变的恒流驱动器进行驱动电流的细微调整，是适合需要高精度LED亮度控制的白色LED亮灯的IC。;
| 型号： | BD2606MVV |
| 厂家： | 
ROHM |
| 描述： | BD2606MVV不仅可通过升压率自动切换实现高效升压，还可通过64步可变的恒流驱动器进行驱动电流的细微调整，是适合需要高精度LED亮度控制的白色LED亮灯的IC。 驱动 驱动器 |
| 文件： | 总19页 (文件大小：1761K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
6-Channel Charge Pump
White LED Driver
with 64 Dimming Steps and I2C Compatible Interface
BD2606MVV
General Description
Key Specifications
BD2606MVV is a multi-level brightness control white
LED driver that not only ensures efficient boost by
automatically changing the boost rate but also works as
a constant current driver with 64 steps, so that the
driving current can be adjusted finely. This IC is best
suited to turn ON white LEDs that require high-accuracy
LED brightness control.
■
■
■
■
Power Supply Voltage Range:
Oscillation Frequency:
Quiescent Current:
2.7V to 5.5V
1.0MHz(Typ)
0μA(Typ)
Operating Temperature Range:
-30°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
Features
■
■
■
■
6-Ch Parallel LED Driver
64-Step LED Current Adjust Function
Inter-LED Relative Current Accuracy: 3% or less
LED Individual Lighting/Dimming Control via I2C
BUS Interface
■
Automatic Transition Charge Pump Type DC/DC
Converter (x1, x1.5 and x2)
SQFN016V4040
4.00mm x 4.00mm x 1.00mm
■
■
High Efficiency (90% or More at Maximum)
Various Protection Functions such as Output
Voltage Protection, Over-Current Limiter and
Thermal Shutdown Circuit
Applications
This driver is applicable for various fields such as
mobile phones, portable game machines and white LED
products.
C2 = 1μF
C1 = 1μF
Typical Application Circuit
Battery
OUT
IN
CIN
= 1μF
COUT = 1μF
EN
BD2606MVV
LEDA1
SCL
SDA
LEDA2
LEDB1
LEDB2
LEDC1
LEDC2
GND
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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TSZ22111 • 14 • 001
BD2606MVV
Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Supply Voltage
Operating Temperature Range
Storage Temperature Range
Power Dissipation
Symbol
Ratings
7
-30 to +85
-55 to +150
0.78 (Note 1)
Unit
V
°C
°C
W
Condition
VMAX
Topr
Tstg
Pd
(Note 1) When mounted on a glass epoxy substrate (70mm x 70mm x 1.6mm), derate by 6.2mW/°C for Ta is higher than 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta=-30°C to +85°C)
Parameter
Operating power supply voltage
Symbol
VCC
Ratings
2.7 to 5.5
Unit
V
Condition
Electrical Characteristics (Unless otherwise specified, Ta = 25°C and VIN = 3.6V.)
Limit
Typ
0
Parameter
Symbol
Unit
Conditions
Min
-
-
Max
7
2.6
Quiescent Current
IDDQ
IDD1
μA
mA
VEN=0V, VIN=3.6V
x1 mode, IOUT=0mA, VIN=3,6V
Circuit Current 1
[Charge Pump]
Output Current
Oscillation Frequency
[LED Driver]
1.0
IOUT
fOSC
-
-
120
1.2
mA
VOUT=4.0V, VIN=3.6V
0.8
1.0
MHz Add=0 x 03, D6=’0’
ILED =16.5mA(LEDxCNT=0x20),
LED pin voltage 1.0V
ILED =16.5mA(LEDxCNT=0x20) ,
LED pin voltage 1.0V
ILEDA1,ILEDA2,ILEDB1,
ILEDB2,ILEDC1,ILEDC2
LED Current Absolute Precision
LED Current Relative Precision
LED Control Voltage
ILED-ERR
ILED-to-LED
VLED
-
-
-
-
±6.5
±3.75(Note 2)
0.25
%
%
V
0.5
0.2
[Logic Interface]
Input ‘L’ Voltage
Input ‘H’ Voltage
Input ‘H’ Current
Input ‘L’ Current
VIL
VIH
IIH
-
1.6
-
-10
-
-
-
-
-
-
-
0.4
-
10
-
0.4
0.6
V
V
μA
μA
V
EN, SCL, SDA
EN, SCL, SDA
EN, SCL, SDA=VIN
EN, SCL, SDA=GND
SDA, 3mA source
SDA, 6mA source
IIL
‘L’ Level SDA Output
VOL
-
V
[I2C BUS Interface (Standard Mode)]
SCL Clock Frequency
SCL Low Duration
SCL High Duration
Data Hold Time
Data Setup Time
Setup Time – Restart Condition
Hold Time – Restart Condition
Setup Time – Stop Condition
Bus Free Time Between Start and
Stop
[I2C BUS Interface (Fast Mode)]
fSCLC
tLOW
tHIGH
tHD;DAT
tSU;DAT
tSU;STA
tHD;STA
tSU;STO
0
-
-
-
-
-
-
-
-
100
-
-
kHz
μs
μs
μs
ns
μs
μs
μs
4.7
4.0
0
250
4.7
4.0
4.0
3.45
-
-
-
-
tBUF
4.7
-
-
μs
SCL Clock Frequency
SCL Low Duration
SCL High Duration
Data Hold Time
Data Setup Time
Setup Time – Restart Condition
Hold Time – Restart Condition
Setup Time – Stop Condition
Bus Free Time Between Start and
Stop
fSCL
tLOW
tHIGH
tHD;DAT
tSU;DAT
tSU;STA
tHD;STA
tSU;STO
0
-
-
-
-
-
-
-
-
400
-
-
kHz
μs
μs
μs
ns
μs
μs
μs
1.3
0.6
0
100
0.6
0.6
0.6
0.9
-
-
-
-
tBUF
1.3
-
-
-
-
μs
μs
Interface Startup Time
tEN
350
Bus startup time (after EN=‘H’)
(Note 2) The following expression is used for calculation:
ILED-match={(IMAX-IMIN)/(IMAX+IMIN)} x 100
IMAX= Current value in a channel with the maximum current value among all channels
IMIN=Current value in a channel with the minimum current value among all channels
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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BD2606MVV
Pin Description
Pin
Pin
Pin
Pin
In/Out
Out
In
Function
In/Out
In/Out
In/Out
Function
Number Name
Number Name
Flying capacitor pin negative
(-) side
Flying capacitor pin positive
(+) side
1
2
LEDA1
SDA
LED current driver output
I2C BUS control pin
9
C2N
C2P
10
3
4
5
6
SCL
EN
In
In
I2C BUS control pin
ON/OFF control
Charge pump output
Power supply
11
12
13
14
GND
-
GND
LEDC2
LEDC1
LEDB2
Out
Out
Out
LED current driver output
LED current driver output
LED current driver output
OUT
IN
Out
-
Flying capacitor pin negative
(-) side
Flying capacitor pin positive
(+) side
Heat radiation PAD of back
side. Connect to GND
7
8
-
C1N
C1P
In/Out
In/Out
-
15
16
-
LEDB1
LEDA2
-
Out
Out
-
LED current driver output
LED current driver output
-
Thermal
PAD
Block Diagram
OUT
×1, ×1.5, ×2
Charge Pump
IN
Over Voltage
Protect
Charge Pump
Mode Control
OSC
TSD
EN
OUT Control
LEDA1
SCL
SDA
LEDACNT
LEDA2
LEDB1
LEDB2
LEDC2
LEDC2
Current
I2C I/F
&
DAC
6
Control
Logic
LEDBCNT
LEDCCNT
Current
DAC
6
Current
DAC
6
GND
Pin number 16pin
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BD2606MVV
Typical Performance Curves
2.0
1.6
1.2
Ta=25°C
Ta=85°C
Ta=25°C
0.8
Ta=85°C
Ta=-30°C
0.4
Ta=-30°C
0.0
2
3
4
5
6
7
Input Voltage: V [V]
IN
Input Voltage: VIN [V]
Figure 1. Quiescent Current vs Input Voltage
(Standby)
Figure 2. Circuit Current 1 vs Input Voltage
(Operation in x1.0 Mode)
100
100
90
80
70
60
50
40
30
20
10
0
Ta=-30°C
90
80
70
60
50
40
DOWN
Ta=25°C
Ta=85°C
UP
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
2
3
4
5
6
7
Input Voltage: VIN [V]
Input Voltage: VIN [V]
Figure 4. Efficiency vs Input Voltage
(3.5mA x 6 Lights)
Figure 3. Efficiency Hysteresis vs Input Voltage
(13mA x 6 Lights)
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BD2606MVV
Typical Performance Curves - continued
100
100
90
80
70
60
50
40
30
20
10
0
Ta=-30°C
Ta=25°C
Ta=-30°C
90
80
Ta=25°C
70
60
Ta=85°C
50
Ta=85°C
40
30
20
10
0
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
Input Voltage: VIN [V]
Input Voltage: VIN [V]
Figure 5. Efficiency vs Input Voltage
(10mA x 6 Lights)
Figure 6. Efficiency vs Input Voltage
(20mA x 6 Lights)
20.0
17.5
15.0
12.5
10.0
7.5
2.0
1.5
Ta=25°C
Ta=25°C
Ta=85°C
Ta=-30°C
1.0
Ta=85°C
0.5
0.0
Ta=-30°C
-0.5
-1.0
-1.5
-2.0
5.0
2.5
0.0
0.0
0.4
0.8
1.2
1.6
2.0
0
10
20
30
40
50
60
LED Control Voltage : VLED [V]
STATE[DEC]
Figure 7. LED Current Characteristics vs
LED Control Voltage
Figure 8. LED Current Characteristics
(Differential Linearity Error)
(LED Current 16.5mA)
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© 2012 ROHM Co., Ltd. All rights reserved.
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BD2606MVV
Typical Performance Curves - continued
2.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.5
1.0
Ta=25°C
Ta=85°C
Ta=-30°C
0.5
Ta=-30°C
Ta=85°C
0.0
0.5
1.0
1.5
2.0
Ta=25°C
0
10
20
30
40
50
60
0
10
20
30
40
50
60
STATE[DEC]
STATE[DEC]
Figure 9. LED Current Characteristics
(Integral Linearity Error)
Figure 10. LED Current Matching
20.0
17.5
15.0
12.5
10.0
7.5
Ta=-30°C
Ta=25°C
Ta=85°C
5.0
2.5
0.0
0
1
2
3
4
5
6
7
Input Voltage: VIN [V]
Figure 11. LED Current vs Input Voltage
(LED Current 16.5mA)
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BD2606MVV
Application Information
1. Description of Operations
(1) LED Driver
(a) I2C BUS Interface
BD2606MVV can control the LED ON/OFF, brightness and charge pump switching frequency by writing to the
register via the I2C BUS interface. Control by the I2C BUS interface is effective when EN is at ‘H’ level. When EN
is at ‘L’ level, this LSI is completely shut down and the control and associated functions via the I2C BUS interface
are all stopped.
As shown in Figure 12 below, the I2C BUS interface of BD2606MVV operates using the VEN voltage (buffering the
EN pin voltage) as supply voltage. For this reason, it is desirable that the ‘H’ voltage in the I2C BUS interface is
equal to the EN pin voltage.
VEN
VEN
I2C Interface Buffer
EN
SDA
SCL
Figure 12. I2C BUS Interface Buffer
SDA
SCL
tBUF
tr
tf
tSU;DAT
tHD;STA
tLOW
tSU;STO
tSU;STA
tHD;STA
tHD;DAT
S
Sr
P
S
tHIGH
Figure 13. I2C BUS Interface Timing
BD2606MVV operates as a slave device for the I2C BUS interface.
Slave Address
A7
1
A6
1
A5
0
A4
0
A3
1
A2
1
A1
0
R/W
1/0
Data Format
The data format is shown below.
Write format:
One-byte register
address
Slave address
7 bit
Slave address
7 bit
One-byte register data
8 bit
As
As Sr
As
P
As
P
S
W
R
8 bit
Or
S
One-byte register
address
Slave address
7 bit
One-byte register data
8 bit
As
As
As
W
8 bit
Read format:
One-byte register
address
Slave address
Slave address
One-byte register data Am
8 bit
As
As
As
S
W
Sr
R
P
7 bit
8 bit
7 bit
(Note)
S: Start condition
W: ‘0=Write
R: ‘1=Read
As: Acknowledge (slave -> master)
Am: No acknowledge
Sr: Repeated start condition
P: Stop condition
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BD2606MVV
(b) Register Table
Register Map
Address Register
D7
D6
D5
D4
D3
D2
D1
D0
Function
Hex
0x00
0x01
0x02
name
LEDACNT
LEDBCNT
LEDCCNT
LEDPWR
CNT
-
-
-
-
LEDACNT
LEDBCNT
LEDCCNT
Current setting of ILEDA1/2
Current setting of ILEDB1/2
Current setting of ILEDC1/2
Current driver
-
-
FREQNT
1/0
0x03
-
LEDC2 LEDC1 LEDB2 LEDB1 LEDA2 LEDA1
ON/OFF control
(Note) ‘-’: Invalid at write time
‘-’: ‘L’ at read time
Description of Registers
LEDACNT (initial value: undefined) --- <Address: 0x00, Data: [D5: D0]>
LEDBCNT (initial value: undefined) --- <Address: 0x01, Data: [D5: D0]>
LEDCCNT (initial value: undefined) --- <Address: 0x02, Data: [D5: D0]>
LED current values are controlled. LEDA1/A2, LEDB1/B2 and LEDC1/C2 are controlled through the registers
LEDACNT, LEDBCNT and LEDCCNT respectively, and the current setting can be switched every 2 channels.
For the current setting value in each register setting, refer to ‘LED Current Setting Table’ on page 9.
LEDA1 (initial value: ‘0) --- <Address: 0x03, Data: D0>
LEDA2 (initial value: ‘0) --- <Address: 0x03, Data: D1>
LEDB1 (initial value: ‘0) --- <Address: 0x03, Data: D2>
LEDB2 (initial value: ‘0) --- <Address: 0x03, Data: D3>
LEDC1 (initial value: ‘0) --- <Address: 0x03, Data: D4>
LEDC2 (initial value: ‘0) --- <Address: 0x03, Data: D5>
The ON/OFF setting of each LED driver channel is as follows:
’0’: OFF
‘1’ :ON
FREQCNT (initial value: ‘0) --- <Address: 0x03, Data: D6>
The switching frequency of a charge pump is set as follows:
’0’: 1MHz
‘1’: 250kHz
When ‘250kHz’ is selected, the flying capacitor of C1, C2 and COUT must be set to 10µF.
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BD2606MVV
LED Current Setting Table
The following table lists the current setting values for the respective register settings.
Initially, these registers have not been initialized. For this reason, they are not initialized under EN= ‘0.
D5 D4 D3 D2 D1 D0 Output Current (mA) D5 D4 D3 D2 D1 D0 Output Current (mA)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0.5
1.0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
16.5
17.0
17.5
18.0
18.5
19.0
19.5
20.0
20.5
21.0
21.5
22.0
22.5
23.0
23.5
24.0
24.5
25.0
25.5
26.0
26.5
27.0
27.5
28.0
28.5
29.0
29.5
30.0
30.5
31.0
31.5
32.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
15.5
16.0
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BD2606MVV
(2) Charge Pump
(a) Description of Operations
Pin voltage comparison takes place at OUT control section, and then VOUT generation takes place so that the LED
cathode voltage with the highest VF is set to 0.1V. A boost rate is changed automatically to a proper one at the
Charge Pump Mode Control section so that operation can take place at possible low boost rate. When the current
taken from the IN pin exceeds 600mA, the overcurrent limiter is activated and the IC resets. In addition, if the
output voltage falls below 1.5V, the IC will reset due to short-circuit at the output.
(b) Soft-Start Function
BD2606MVV has a soft start function that prevents rush current.
EN/LED*
VOUT
ILED
Soft Start
Ordinal mode
Figure 14. Soft-Start
(c) Automatic Boost Rate Change
The boost rate automatically switches to the best mode.
(x1 mode → x1.5 mode) or (x1.5 mode → x2 mode)
If a battery voltage drop occurs, BD2606MVV cannot maintain the LED constant current and then mode
transition begins.
(x1.5 mode → x1 mode) or (x2 mode → x1.5 mode)
If a battery voltage rise occurs, the output voltage (VOUT) and the supply voltage (VIN) detection are activated
and then mode transition begins.
(3) UVLO (Ultra Low Voltage Lock Out)
If the input voltage falls below 2.2V, BD2606MVV is shut down to prevent malfunction due to ultra-low voltage.
(4) OVP (Over Voltage Protection)
This circuit protects the IC against damage when the C/P output voltage (VOUT) rises extremely for some external
factors.
(5) Thermal Shutdown (TSD)
To protect the IC against thermal damage or heat-driven uncontrolled operations, this circuit turns OFF the output if
the chip temperature rises over 150°C.
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2. Recommended PCB Layout
In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if
needed. Heat radiation of back side PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane of board using via as shown in the patterns of below page.
The efficiency of heat radiation improves according to the area of ground plane.
To substrate
GND
GND
SDA
SDA
EN
SCL
EN
SCL
OUT
C1
C1
VCC
To substrate
VCC
Rear-side GND
Figure 15. Application Layout Image (Top View)
Figure 16. Front (Top View)
3. Application Parts Selection Method
Capacitor (Use a ceramic capacitor with good frequency and temperature characteristics)
Symbol
Recommended Value
Recommended Parts
Type
COUT,CIN,C1,C2
1μF
GRM188B11A105KA61B(MURATA)
Ceramic capacitor
Connect an input bypass capacitor CIN between IN and GND pin and an output capacitor between OUT and GND pin in
proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip. Furthermore, select a ceramic
capacitor with a sufficient rating for the voltage to be applied.
When other than these parts are used, the equivalent parts must be used.
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 17. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
TSD ON Temp. [°C] (typ)
BD2606MVV
175
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BD2606MVV
Ordering Information
B D
2
6
0
6 M V V
-
E 2
Part Number
Package
MVV:SQFN016V4040
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SQFN016V4040 (TOP VIEW)
Part Number Marking
D 2 6 0 6
LOT Number
1PIN MARK
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BD2606MVV
Physical Dimension, Tape and Reel Information
Package Name
SQFN016V4040
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BD2606MVV
Revision History
Date
Revision
Changes
03.Dec.2012
10.Dec.2015
001
002
New Release
Applied the ROHM Standard Style and improved understandability.
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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