BD27400GUL_技术文档

Datasheet

Small-sized Class-D Speaker Amplifiers

Filter-Less Class-D

Monaural Speaker Amplifier

BD27400GUL

General Description

Key Specifications

BD27400GUL is a low voltage drive class-D monaural

speaker amplifier that was developed for cellular

telephones, mobile audio products and the others.

The LC filter of the speaker output is unnecessary and

the external part can compose a speaker amplifier at

three.

Because the efficiency is high and is low consumption

power with the class-D operation, it is the optimal for the

application of the battery drive.



Operating voltage Range:

Circuit current(No signal):

Circuit current(Stand by):

Output Power(RL=8Ω):

Output Power(RL=4Ω):

Start-up time:

2.5V to 5.5V

2.9mA(Typ)

0.1μA(Typ)

0.85W(Typ)

2.5W(Typ)

3.0msec(Typ)

-40°C to +85°C

Operating Temperature Range:

Package(s)

W(Typ) x D(Typ) x H(Max)

Also Current consumption of 0μA when standby and fast

transitions from standby to active with little pop noise

make it is suitable for applications that switch repeatedly

between suspended and active.

VCSP50L1

1.50mm x 1.50mm x 0.55mm

Features



High output power

2.5W typ.(VDD=5V, RL=4Ω, THD+N=10%, BTL）

Very small package 9-Pin WL-CSP

Gain selectable by external resistor

LC Filter less



Protection circuitry

(Short protection, Thermal shutdown,

Under voltage lockout)



Analogue differential input / PWM digital output

Pop noise suppression circuitry

VCSP50L1

Applications

 Mobile phone, Smart phone, Digital video camera

+V_BAT

Typical Application Circuit(s)

CS

VDD B1

B2

PVDD

STBY

C2

Bias

OSC

OUT-

A3

IN+

A1

Ri

H-

Bridge

PWM

OUT+

C3

IN-

C1

GND A2

B3

PGND

Figure 1. Application circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration(s)

Bottom View

IN-

STBY

OUT+

PGND

C

B

A

PVDD

VDD

IN+

GND

OUT-

1

3

2

Figure.2 Pin configuration

Pin Description(s)

No.

Name

I/O

I

Function

A1

IN+

Positive input terminal

GND terminal

(Connect to PGND terminal)

A2

A3

B1

B2

B3

C1

C2

C3

GND

OUT-

VDD

P

O

P

I

Negative output terminal

Power supply terminal

(Connect to PVDD terminal)

Power supply terminal

(Connect to VDD terminal)

PVDD

PGND

IN-

Power GND terminal

(Connect to GND terminal)

Negative input terminal

Stand by control terminal

Positive output terminal

STBY

OUT+

I

O

※Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply.

PVDD

B2

VDD B1

Block Diagram(s)

STBY

C2

Bias

OSC

OUT-

A3

IN+

A1

H-

Bridge

PWM

IN-

C1

OUT+

C3

B3

A2

PGND

GND

Figure.3 Block diagram

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Absolute Maximum Ratings(Ta = 25°C)

Parameter

Symbol

Rating

Unit

V

W

V

Power Supply Voltage

VDDmax

Pd

7.0

Power Dissipation

0.69 ^{(Note 1)}

-0.3 to VDD+0.3

-55 to +150

150

STBY Terminal Input Voltage Range

IN+, IN- Terminal Voltage Range

Storage Temperature Range

Maximum Junction Temperature

Operating Temperature Range

Vstby

Vin

V

Tstg

°C

Tjmax

Topr

-40 to +85

(Note 1) Derating in done 5.52 mW/°C for operating above Ta≧25°C (Mount on 1-layer 50.0mm x 58.0mm x 1.6mm board)

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Recommended Operating Conditions(Ta= -40°C to +85°C)

Parameter

Symbol

Min

Typ

Max

Unit

Power Supply Voltage

VDD

VIC

2.5

3.6

-

5.5

V

Common Mode Input Voltage Range

+0.5

VDD-0.8

Electrical Characteristics(Unless otherwise specified Ta=25°C.VDD=3.6V.R_L=8Ω.BTL Connection)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Circuit current (No signal)

Circuit current (Standby)

Output power 1

I_CC

mA

µA

Active mode, No load

Standby mode

-

2.9

0.1

5.4

I_STBY

-

8 Ω, f=1kHz, THD+N=1% *1

8 Ω, f=1kHz, THD+N=10% *1

P_O1

P_O2

P_O3

450

550

-

680

850

2.5

mW

Output power 2

Output power 3

-

W

V

4 Ω, f=1kHz, THD+N=10% *1

BTL, RL=100kΩ

285kΩ 300kΩ

Ri

315kΩ

Ri

Voltage gain

Gain

Ri

0.18

40

64

55

150

250

3

Total harmonic distortion

Output noise voltage

Power supply ripple rejection ratio

Common mode rejection ratio

Input impedance

THD+N

Vno

%

8 Ω, f=1kHz,0.4W

-

µVrms A-weighting

-

PSRR

CMRR

Zin

dB

0.1Vp-p, f=217Hz

-

kΩ

kHz

msec

V

-

Switching Frequency

Start-up time

f_OSC

－

200

1

300

5

Ton

－

STBY

threshold

voltage

High level

Low level

V_STBYH

V_STBYL

R_STBY

Active mode

Stand by mode

1.4

-

VDD

0.4

390

V

0

-

STBY input impedance

kΩ

210

300

*1: Band-width = 400～30kHz, BTL=Bridge Tied Load (Voltage between A3-C3.)

≪Gain adjustment≫

Please use a gain adjustment below 26dB (Input Resistor Ri≥15kΩ)

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Typical Performance Curves

Figure.5

Figure.4

Figure.7

Figure.6

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Typical Performance Curves - continued

Figure.9

Figure.8

Figure.10

Figure.11

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Typical Performance Curves - continued

Figure.12

Figure.13

Figure.14

Figure.15

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Typical Performance Curves - continued

Figure.16

Figure.17

Figure.19

Figure.18

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Typical Performance Curves - continued

Figure.20

Figure.21

Figure.23

Figure.22

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Typical Performance Curves - continued

Figure.25

Figure.24

Figure.27

Figure.26

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Typical Performance Curves - continued

Figure.28

Figure.29

Figure.30

Figure.31

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Typical Performance Curves - continued

Figure.32

Figure.33

Figure.34

Figure.35

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Application Example(s)

Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply.

(1)Differential input

+V_BAT

CS

VDD B1

B2

PVDD

STBY

C2

H：Active

L：STBY

STBY

Bias

OSC

control

+

OUT-

A3

IN+

A1

Ri

-

H-

Bridge

Differential

Input

PWM

OUT+

C3

IN-

C1

+

-

GND A2

B3

PGND

Figure.36 Differential input for mobile phone

+V_BAT

CS

VDD B1

B2

PVDD

STBY

H：Active

L：STBY

STBY

control

C2

Bias

OSC

OUT-

A3

IN+

A1

Ci

+

-

Ri

H-

Bridge

Differential

PWM

Input

OUT+

C3

IN-

C1

+

-

GND A2

B3

PGND

Figure.37 Differential input with coupling input capacitors

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(2)Single-Ended input

+V_BAT

CS

VDD B1

B2

PVDD

STBY

C2

STBY

H：Active

Bias

OSC

control

L：STBY

OUT-

A3

IN+

A1

Ci

Single End

Input

Ri

H-

Bridge

PWM

OUT+

C3

IN-

C1

GND A2

B3

PGND

Figure.38 Single-Ended input

・It is possible to input audio signal from IN+ terminal, or IN- terminal when single-end mode.

・Don't make the input terminal (no input terminal, C1 terminal in above figure) open.

Pop noise may be caused when the power supply starts up or the standby is released, if input terminal is opened.

・Connect non signal input side(C1 in above figure)to GND through Ci, and make the value of Ri, Ci of non signal input side

same as the value of signal input side (A1 in above figure).

Pop noise may be caused if each values of Ci, Ri are different, because the values of Ci, Ri decide the rise of Input terminal

DC voltage when start-up. Difference of input terminal DC voltages may make pop noise.

・Make the value of Ri, Ci of non signal input side same as the value of signal input side when making LPF(Low Pass Filter) at

previous stage of Ci.

・Put external input resistor Ri as close as possible to this IC.

Selection of Components Externally Connected

・Description of External components

① Input coupling capacitor (Ci) and input resistor (Ri).

It makes an Input coupling capacitor 0.1uF. Input impedance is 150kΩ.

It sets cutoff frequency fc by the following formula by input coupling capacitor Ci and input impedance Ri.

1

fc 

[Hz]

2π Ri Ci

In case of Ri=150kΩ , Ci=0.1uF, it becomes fc = about 10 Hz.

② Power decoupling capacitor (CS)

It makes a power decoupling capacitor 10 μF.

When making capacitance of the power decoupling capacitor, there is an influence in the Audio characteristic.

When making small, careful for the Audio characteristic at the actual application.

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Power Dissipation

690

(*1) ROHM standard board mounted. Board size 50mm×58mm,1layer

Material: FR4 glass-epoxy (copper foil area: not more than 3%)

derating in done at 5.52mW/°C above Ta=+25°C.

0

25

75

Ambient Temperature [°C]

50

100

125

150

I/O equivalence circuits

Pin name

Pin No.

IN+

IN-

A1

C1

VDD

150k

IN+

IN-

-

+

GND

OUT+

OUT-

C3

A3

VDD

OUT+

OUT-

GND

300k

STBY

C2

VDD

STBY

GND

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 50mm×58mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 39. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

B D 2 7 4 0 0 G U L -

E 2

Part Number

Package

GUL:VCSP50L1

(WL-CSP)

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

Vcsp50L1(TOP VIEW)

Part Number Marking

LOT Number

7

4

0

1PIN MARK

Part Number Marking

7400

Package

Orderable Part Number

VCSP50L1

BD27400GUL-E2

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Physical Dimension Tape and Reel Information

Package Name

VCSP50L1(BD27400GUL)

< Tape and Reel Information >

Tape

Embossed carrier tape

Quantity

3000pcs

Direction of feed

E2

The direction is the pin 1 of product is at the upper left when you

hold reel on the left hand and you pull out the tape on the right hand

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Revision History

Date

Revision

Changes

05.Apr.2012

05.Nov.2012

001

002

New Release

All. Change to a new format

p.3.

Change unit of a Output Power3 mW -> W

Change the value of PSRR 56dB->64dB

23.Apr.2014

11.May.2017

003

004

p.17 Change Part Number Marking

p.18 Change to a new format at Physical Dimension Tape and Reel Information

P.17 Change Part Number Marking

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

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Notice-PGA-E

Rev.003


型号：	BD27400GUL
厂家：	ROHM
描述：	BD27400GUL是为手机、便携设备等移动、音频产品用途而开发的低电压驱动的单声道D类扬声器放大器。扬声器输出无需使用LC滤波器，可通过外接电阻设定增益。与D类动作相比效率高、功耗低，适用于电池驱动应用。待机消耗电流为0.1µA(typ.)，从待机状态恢复的时间短、爆破音小，适用于重复进行待机⇔动作的组件。手机电池放大器驱动
文件：	总22页 (文件大小：1801K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD27400GUL [ROHM]

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