BD2808MUV-M [ROHM]
BD2808MUV-M是高耐压（20V）带2线串行接口、内置PWM调光功能的24ch恒电流LED驱动器。以RGB LED的驱动为假想，搭载了3组独立灰度控制的6bit电流DAC和各信道独立PWM占空比控制8bit（模拟Log曲线），可实现精细的色彩控制。由于是小型封装，适合省空间用途。;
| 型号： | BD2808MUV-M |
| 厂家： | 
ROHM |
| 描述： | BD2808MUV-M是高耐压（20V）带2线串行接口、内置PWM调光功能的24ch恒电流LED驱动器。以RGB LED的驱动为假想，搭载了3组独立灰度控制的6bit电流DAC和各信道独立PWM占空比控制8bit（模拟Log曲线），可实现精细的色彩控制。由于是小型封装，适合省空间用途。 驱动 驱动器 |
| 文件： | 总33页 (文件大小：950K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Serial-in Parallel-out LED Driver
24ch Constant Current LED Driver IC
with 2-line Serial Interface
BD2808MUV-M
General Description
Key Specifications
BD2808MUV-M is 24ch Constant current sink LED Driver
with a high output voltage capability.
This device is optimized for driving RGB LEDs featuring a
6bit Current DAC for each color.
Input Voltage Range:
3.0V to 5.5V
20V (Max)
50mA (Max)
Output Voltage Range:
DC Output Current (per ch):
Operating Temperature Range:
-40°C to +105°C
8bit PWM control is integrated for each channel.
Small VQFN48MCV070 package.
.
Package
W (Typ) x D (Typ) x H (Max)
7.00mm x 7.00mm x 1.00mm
VQFN48MCV070
Features
AEC-Q100 Qualified (Note 1)
2-Line Serial Control + Enable Signal
VQFN48 Package
24 channel constant current LED driver (max
50mA / channel)
Independent PWM control for each channel
6 bit current DAC for RGB
Protection features
Equipped with PWM phase shift function to reduce
EMI
(Note1: Grade 2)
VQFN48MCV070
Applications
Instrument Cluster
LED status indicators
Instrument backlighting
LED Interior illumination
VLED
(Max=20V )
Typical Application Circuit
CVLED
VCC
RXERR
A5
OUTG5
OUTR5
PGND
SDI
TEST2
Micro-
computer
AGND
OUTB4
OUTG4
OUTR4
OUTB3
OUTG3
OUTR3
PGND
CLK
TEST3
BD2808MUV
OE
RISET
ISET
AGND
VCC
TEST1
A0
Fuse
VCC
3.0~5.5V
CVCC
OUTB2
OUTG2
ROUTR0～7
ROUTG0～7
ROUTB0～7
Figure 1. Typical Application Circuit
○Product structure: Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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BD2808MUV-M
Pin Configuration
Pin Descriptions
36
25
Pin No.
1
Pin Name
Functions
A1
Device-address bit
Device-address bit
Serial data output
Ground
2
A2
37
24
OUTG5
OUTR5
PGND
3
SDO
A5
4
PGND
OUTR0
OUTG0
OUTB0
PGND
OUTR1
OUTG1
OUTB1
OUTR2
OUTG2
OUTB2
PGND
OUTR3
OUTG3
OUTB3
OUTR4
OUTG4
OUTB4
PGND
OUTR5
OUTG5
OUTB5
OUTR6
OUTG6
OUTB6
PGND
OUTR7
OUTG7
OUTB7
PGND
XERR
A3
SDI
5
R0 constant-current output
G0 constant-current output
B0 constant-current output
Ground
TEST3
AGND
CLK
6
OUTB4
OUTG4
OUTR4
OUTB3
OUTG3
OUTR3
PGND
7
8
TEST2
OE
9
R1 constant-current output
G1 constant-current output
B1 constant-current output
R2 constant-current output
G2 constant-current output
B2 constant-current output
Ground
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
ISET
AGND
VCC
TEST1
A0
OUTB2
OUTG2
13
R3 constant-current output
G3 constant-current output
B3 constant-current output
R4 constant-current output
G4 constant-current output
B4 constant-current output
Ground
48
1
12
Figure 2. Pin Configuration
R5 constant-current output
G5 constant-current output
B5 constant-current output
R6 constant-current output
G6 constant-current output
B6 constant-current output
Ground
R7 constant-current output
G7 constant-current output
B7 constant-current output
Ground
Error output
Device-address bit
A4
Device-address bit
A5
Device-address MSB
Serial data input
SDI
TEST3
AGND
CLK
Test terminal
Analog Ground
Serial data clock input
Test terminal
TEST2
OE
Output enable
ISET
Constant-current value setting
Analog Ground
AGND
VCC
Power supply
TEST1
A0
Test terminal
Device-address LSB
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Block Diagram
VCC
VCC
OSC
TSD
1µF/10V
VLED
VREF
OUTR0
OUTG0
OUTB0
CLK
PWM 8bit-Log
for each Channel
SDI
OUTR1
OUTG1
OUTB1
Digital
Control
SDO
I/O
6bit
DAC
OE
A0
A1
6bit
DAC
・
・
・
・
A2
6bit
A3
A4
DAC
OUTR6
OUTG6
OUTB6
A5
OUTR7
OUTG7
OUTB7
XERR
TEST1
TEST2
TEST3
ISET
Figure 3. Block Diagram
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Description of Blocks
(1) Power Supply Start-up
The rise and fall time of a power supply can be from 10us to 1s.
Allow at least 0.1ms after VCC exceeds VUVLORise UVLO before commencing communication.
Input pin voltages must not exceed VCC or LED flicker may occur at start-up.
VCCmin=3.0V
VCC
TrVCC
TACSS=min 0.1ms
TfVCC
Register
access
Possible
Impossible
Impossible
(2) LED Driver operation
Maximum LED current can be set by selecting the value of RISET
.
The following formula gives the required value of RISET
.
ꢇ
ꢉ
ꢀꢁꢂꢃ_ꢄꢅꢆ ꢄꢈ ꢊ ꢋꢌ ꢍ ꢎꢋ/ꢏꢀꢐꢂꢑꢇꢒꢓꢉꢔ
(Typ)
(3) Reset
Power on reset occurs when VCC voltage falls below VUVLOFall
.
Software reset is by command. If reset occurs, all registers are cleared (set to 0)
(4) Protection function (XERR output)
When thermal shutdown, channel open, or ISET terminal short to ground are detected, the XERR terminal is pulled LOW.
All protection functions incorporate noise rejection. The XERR terminal output is low only during detection. (Latch and
intentional delay time are not provided.) These signals are also written into a register. The flag returns to “0” only when
the register is read.
The thermal shutdown operates at 175°C typically with 10°C of hysteresis, release therefore occurring at 165°C
typically. All the channels of are turned OFF automatically when thermal shut down operates.
When the RISET is out of range RISETSHT, a short to ground function prevents large current from flowing into the LEDs.
All channels of LED driver are turned OFF automatically.
A Channel OPEN is detected when VLED < VLOD.
The individual channel is turned OFF automatically and VLED becomes high impedance.
OPEN detection is not active if Brightness is set to 0.
The Error flag output pin (XERR pin) is in the same period with the OUT** pin and outputs a flag.
The flag stored in register retains the state once detected and is not changed until register is read.
VOUT*
VXERR
Register
(LEDOPEN)
It returns to "0" when the register is read.
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Description of Blocks – Continued
(5) LED Current ON/OFF Function by External Pin (OE terminal)
All channels can be controlled by the external pin. If OE pin is HIGH, the LED drivers are active.
The internal PWM control circuit becomes asynchronous.
(6) Unused Pins
Set up the test terminals and the unused terminals as follows.
Pin Name
OUT**
Connection
Reason
To avoid uncertain/unfixed state.
(Brightness setting of unused channel should be set
to zero.)
Short to GND
SDO
Open
CMOS output terminal
Open or
Short to GND
Open drain output terminal.
When XERR is shorted to GND, noise is avoided.
XERR
Voltage clamp is necessary for CMOS input terminal.
When OE is set to “LOW”, LED current is OFF.
OE
Short to VCC
Short to GND
TESTx
To avoid test mode functionality.
(7) LED Current Waveform
To reduce EMI, the on-timing and off-timing of LED are shifted in 8 groups and simultaneous ON or OFF are avoided.
The rise tr and tf fall time of the output current is also limited to further reduce EMI noise.
OUTR0
OUTG0
OUTB0
OUTR1
OUTG1
OUTB1
t
r
tf
1/8 × 4ms
1/8 × 4ms
OUTR7
OUTG7
OUTB7
Figure 4. PWM phase-shift (8 groups)
(8) Diming function (PWM and DAC diming)
This IC has 2 diming functions which are PWM and DAC.
It is possible to set independent PWM control for each channel.
DAC diming is made 3 groups(R: Red, G: Green, B: Blue).
There are these detail at page 18, 19.
(9) Others(VREF and OSC)
There are VREF and OSC block for reference voltage and moving digital block.
(10) Test Processing
Test 1-3 are pins that are used for testing.
These pins are not used in normal operations, therefore connect it to ground.
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BD2808MUV-M
Absolute Maximum Ratings
Item
Symbol
VCC
Value
-0.3 to +7 (Note 1)
-0.3 to +20 (Note 1)
-0.3 to VCC
-0.3 to VCC
4.09 (Note 2)
5.20 (Note 3)
-40 to +105
-55 to +150
150
Unit
V
Power Supply Voltage
Output Voltage 1 (Pin No: Pin No: 5-7, 9-14, 16-21, 23-28, 30-32)
Output Voltage 2 (Pin No: 34)
VLEDmax
VXERR
VIN
V
V
Input Voltage (Pin No: 1-3, 35-38, 41, 43-44, 48)
Power Dissipation1
V
Pd1
W
W
°C
°C
°C
mA
Power Dissipation2
Pd2
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
Junction Temperature
Tjmax
IomaxD
Drive Current (DC)
50
(Note 1) Pd should not be exceeded.
(Note 2) Pd1 is decreased by 32.7mW/°C for temperatures above Ta=25°C, mounted on 114.3mm x76.2mm x1.6mm Glass-epoxy PCB.
(Note 3) Pd2 is decreased by 41.6mW/°C for temperatures above Ta=25°C, mounted on 114.3mm x76.2mm x1.6mm Glass-epoxy PCB.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=-40°C to 105°C)
Item
Symbol
VCC
Min
3.0
-
Typ
3.3
-
Max
5.5
50
Unit
V
Power Supply Voltage
IMAX
mA
LED Maximum Output Current
Application Conditions (External Constant Range)
Parameters
VCC Capacitor
Symbols
Min
1.0
10
Max
-
Unit
µF
CVCC
CVLED
RISET
RXERR
VLED Capacitor
ISET Resistor
XERR Resistor
-
µF
50
200
100
kΩ
kΩ
10
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BD2808MUV-M
Electrical Characteristics
(Unless specified, Ta=-40 to 105°C VCC=3.0 to 5.5V)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
【Circuit Current】
RESET state (all registers have default
values)
Standby VCC Circuit
Current
ISTB
-
0.4
2.7
20
µA
LED terminal leak current is excluded
All Ch=ON, PWM=100%
VCC Circuit Current
IVCC
5.0
mA
I
LED=17.9mA setting, ISET=56kꢀ (Note1)
【LED driver】
Current DAC
LED Current Step
ILEDSTP
IMAX
64
50
step
mA
LED Maximum Setup
Current
ISET=50kꢀ (Note2)
-
-
Terminal voltage=1V, Current accuracy of
each OUT terminal
LED Current Accuracy
ILED
-5
0
0
+5
+5
%
%
ILED=17.9mA setting, ISET=56kꢀ (Note1)
An error with the average value of output
current,
LED Current Matching
ILEDMT
-5
Terminal voltage=1V
ILED=17.9mA setting, ISET=56kꢀ (Note1)
LED Current Matching
between RGB terminal
Terminal voltage=1V
ILEDMT_RGB
-5
-5
0
0
+5
+5
%
%
ILED=17.9mA setting, ISET=56kꢀ (Note1)
LED Current Matching
between devices
Terminal voltage=1V
ILEDMT_DEV
I
LED=17.9mA setting, ISET=56kꢀ (Note1)
V
CC from 3V to 5.5V
OUT from 1V to 20V
Line Regulation
Load Regulation
∆ILIN
∆IRO
-
-
-
-
2
1
%/V
%/V
V
Current Linearity at PWM
Control
PWM Duty over 3%
ILINPWM
ILKL
-
-
-
1.5
3
%
μA
V
LED OFF Leak Current
-
0.96
-
Terminal voltage =20V
ISET Terminal Output
Voltage
VISET
RISET
-
-
ISET Resistance
50
200
kꢀ
【OSC】
OSC Frequency
PWM Frequency
fOSC
0.82
200
1.02
250
1.23
300
MHz
Hz
fPWM
【UVLO】
When power supply voltage falls
When power supply voltage rises
UVLO Detection Voltage
VUVLOFall
2.0
2.4
-
V
UVLO Release Voltage
VUVLORise
VUVLOHYS
-
-
-
2.7
-
V
Hysteresis Voltage
50
mV
【Protection Function】
LED Terminal Open
Detection Voltage
VLOD
-
0.2
20
0.3
40
V
ISET Short Detection
Resistance
RISETSHT
5.0
kꢀ
(Note1) At DAC Setting R: ad03, data=18h, DAC Setting G: ad04, data=18h, DAC Setting B: ad05, data=18h
(R=56kꢀ: IMAX=40*64/56kꢀ =45.7mA)
(Note2) IMAX=40*64/50kꢀ =50mA
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Electrical Characteristics - continued
(Unless specified, Ta=-40 to 105°C VCC=3.0 to 5.5V)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
【CLK, SDI】
0.25 ×
VCC
Input L Level Voltage
Input H Level Voltage
Input Hysteresis Voltage
Input Current
VILI1
VIHI1
VHYSI1
lINI1
-0.3
-
-
-
-
V
V
0.75 ×
VCC
VCC
+0.3
0.05 ×
VCC
-
V
-1
1
μA
Input voltage= 3.3V
【SDO】 (CMOS Output Pin)
Output L Level Voltage
Output H Level Voltage
VOLSDO
VOHSDO
-
-
-
V
V
IOL=1mA
IOH=1mA
0.2
-
VCC
-0.2
【XERR】 (Open Drain Output Pin)
Output L Level Voltage
【A0-5, OE】 (CMOS input pin)
Input L Level Voltage
VOLXE
-
-
V
IOL=1mA
0.2
0.25 ×
VCC
VILI2
VIHI2
VHYSI2
lINI2
-0.3
-
-
-
-
V
V
0.75 ×
VCC
VCC
+0.3
Input H Level Voltage
0.05 ×
VCC
Input Hysteresis Voltage
Input Current
-
V
-1
1
μA
Input voltage= 3.3V
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BD2808MUV-M
Typical Performance Curves
3.0
2.5
2.0
1.5
1.0
0.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
105°C
5.5V
25°C
3.3V
-40°C
3.0V
35
0.0
-40
-15
10
60
85
110
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage: VCC [V]
Ambient Temperature: Ta [℃]
Figure 5. Standby Current
(VCC characteristic)
Figure 6. Standby Current
(Temperature characteristic)
4.0
4.0
5.5V
3.5
3.0
2.5
2.0
1.5
1.0
3.5
3.0
2.5
2.0
1.5
1.0
105°C
-40°C
25°C
3.0V
3.3V
-40
-15
10
35
60
85
110
3.0
3.5
4.0
4.5
5.0
5.5
Ambient Temperature: Ta [℃]
Supply Voltage: VCC [V]
Figure 8. Circuit Current
(Temperature characteristic @ ALL OUTn=ON
Figure 7. Circuit Current
(VCC characteristic @ All OUTn=ON
PWM=100% ILED=17.9mA ISET=56kΩ)
PWM=100% ILED=17.9mA ISET=56kꢀ)
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BD2808MUV-M
Typical Performance Curves – continued
18.6
18.4
18.2
18.0
17.8
17.6
17.4
17.2
17.0
18.6
18.4
5.5V
105°C
18.2
18.0
25°C
-40°C
17.8
3.3V
3.0V
17.6
17.4
17.2
17.0
-40
-15
10
35
60
85
110
3.0
3.5
4.0
4.5
5.0
5.5
Ambient Temperature: Ta [℃]
Supply Voltage: VCC [V]
Figure 9. LED Current
Figure 10. LED Current
(Temperature characteristic @ ISET=56kꢀ)
(VCC characteristic @ ISET=56kꢀ)
50
40
30
20
10
0
50
40
30
20
10
0
105°C
-40°C
105°C
-40° C
25°C
25°C
0
16
32
48
64
0
64
128
192
256
Code: ILEDSTP [step]
Code: ILEDSTP [step]
Figure 11. LED Current DAC Step
(VCC=3.3V)
Figure 12. LED Current PWM Step
(VCC=3.3V)
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Typical Performance Curves – continued
1.2
300
280
260
240
220
200
3.3V
5.5V
1.1
1.0
0.9
0.8
0.7
5.5V
3.3V
3.0V
3.0V
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Ambient Temperature: Ta [℃]
Ambient Temperature: Ta [℃]
Figure 14. PWM Frequency
(Temperature characteristic)
Figure 13. Oscillation Frequency
(Temperature characteristic)
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BD2808MUV-M
Bus Format
Device Address
A7
0
A6
1
A5
A5
*
A4
A4
*
A3
A3
*
A2
A2
*
A1
A1
*
A0
A0
*
Device control mode
Bus control mode
0
0
Device control mode: Data is dependent on the A0 to A5 terminal settings.
Bus control mode: Data can be received without being dependent on A0 to A5 terminal settings.
START Condition
At STARTUP, the device enters WAIT mode when “1” is written 16 times or more, and a device address is recognized
after writing “0”.
WRITE PROTOCOL
Data is shifted in the internal shift register on the rising edge CLK. MSB is entered first. The command format is: writing
command “00” (2bit), device address (6bit), register address (8bit) and data (8bit).
Register address is incremented after the fourth byte automatically.
Device enters Sleep state when “1” is written eight times.
Sleep condition
A7A6A5A4 A3A2A1A0D7D6D5D4D3D2D1D0
1 0 X
X X X X X X
D7D6D5D4D3D2D1D0 1
Data
1 1 1 1 1 1 1
1
“1”≧16 回
Device Address(DAD)
Register Address(RAD)
Data
“FF”
CLK
SDI
・・
・・
・・
H
L
H
X
X
X
X
X
X
X
A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
“1”≧16 times
“FF”
READ PROTOCOL
Read from the next byte after register address “WRITE data” for “READ data” and device address.
READ data is output on the SDO pin. For a READ command 8 clocks cycles are necessary. At the 8th clock of last bit of
the specified register address, it becomes Sleep state, and the SDO pin becomes “L” output.
The last bit (D0) is outputted 7 clocks.
0 X X X X X X X A7A6A5A4 A3A2A1 A0D7D7D7D7D7D7D7D7D6D6D6D6D6D6D6D6
D0D0D0D0D0D0D0
Data
Device Address(DAD)
Register Address(RAD)
Data
Data
CLK
・・
・・
SDI
A7 A6 A5 A4 A3 A2 A1 A0
SDO
L
D7
D6
D5
D0
L
8 clocks
7 clocks
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Protocol
Sleep
Input “1” 16 times in a row
“1”input
Start standby
“0” input
Receive device
address
Different device address
Input device address
(※1)
Receive device
address
Input inexistent
register address
“FF” input
Data
※1) Condition becomes START standby in any condition, if “1” is detected more
than 16 times. For example, Sleep condition starts if “1” is received 8 times while
waiting for register address. Moreover, the condition becomes START standby
after receiving “1” 8 times.
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Timing Diagram
tSP
SDI
t sh
t whc
t ss
t wlc
CLK
tSP
tdodl
SDO
Timing Characteristics (Ta=-40 to 105 °C VCC=3.0 to 5.5V)
Standard value
Item
Symbol
Unit
Min
Typ
Max
【Interface】
CLK cycle time
tscyc
twhc
twlc
100
50
50
45
45
5
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
CLK cycle “H” period
CLK cycle “L” period
SDI setup time
-
-
tss
-
SDI hold time
tsh
-
-
Pulse width of spike removed by input filter
of CLK and SDI
tSP
SDO Output Delay (CL = 1,000pF)
Tdodl
-
500
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Register Map
Write
Register
Or
Register data
Function
Address
Read
D7
D6
D5
A5
D4
A4
D3
A3
-
D2
A2
D1
A1
D0
A0
Device address
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
R
-
-
-
-
-
-
-
-
-
-
-
-
R
-
-
ISETSH
-
LEDOPN Error condition detection
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
-
-
SFTRST ENMD
MD1
DAR1
DAG1
DAB1
MD0
DAR0
DAG0
DAB0
Mode setup
DAR5
DAG5
DAB5
DAR4
DAG4
DAB4
DAR3
DAG3
DAB3
DAR2
DAG2
DAB2
DAC setting for OUTRx terminal
DAC setting for OUTGx terminal
DAC setting for OUTBx terminal
BRR0(7) BRR0(6) BRR0(5) BRR0(4) BRR0(3) BRR0(2) BRR0(1) BRR0(0) OUTR0 PWM Setting
BRG0(7) BRG0(6) BRG0(5) BRG0(4) BRG0(3) BRG0(2) BRG0(1) BRG0(0) OUTG0 PWM Setting
BRB0(7) BRB0(6) BRB0(5) BRB0(4) BRB0(3) BRB0(2) BRB0(1) BRB0(0) OUTB0 PWM Setting
BRR1(7) BRR1(6) BRR1(5) BRR1(4) BRR1(3) BRR1(2) BRR1(1) BRR1(0) OUTR1 PWM Setting
BRG1(7) BRG1(6) BRG1(5) BRG1(4) BRG1(3) BRG1(2) BRG1(1) BRG1(0) OUTG1 PWM Setting
BRB1(7) BRB1(6) BRB1(5) BRB1(4) BRB1(3) BRB1(2) BRB1(1) BRB1(0) OUTB1 PWM Setting
BRR2(7) BRR2(6) BRR2(5) BRR2(4) BRR2(3) BRR2(2) BRR2(1) BRR2(0) OUTR2 PWM Setting
BRG2(7) BRG2(6) BRG2(5) BRG2(4) BRG2(3) BRG2(2) BRG2(1) BRG2(0) OUTG2 PWM Setting
BRB2(7) BRB2(6) BRB2(5) BRB2(4) BRB2(3) BRB2(2) BRB2(1) BRB2(0) OUTB2 PWM Setting
BRR3(7) BRR3(6) BRR3(5) BRR3(4) BRR3(3) BRR3(2) BRR3(1) BRR3(0) OUTR3 PWM Setting
BRG3(7) BRG3(6) BRG3(5) BRG3(4) BRG3(3) BRG3(2) BRG3(1) BRG3(0) OUTG3 PWM Setting
BRB3(7) BRB3(6) BRB3(5) BRB3(4) BRB3(3) BRB3(2) BRB3(1) BRB3(0) OUTB3 PWM Setting
BRR4(7) BRR4(6) BRR4(5) BRR4(4) BRR4(3) BRR4(2) BRR4(1) BRR4(0) OUTR4 PWM Setting
BRG4(7) BRG4(6) BRG4(5) BRG4(4) BRG4(3) BRG4(2) BRG4(1) BRG4(0) OUTG4 PWM Setting
BRB4(7) BRB4(6) BRB4(5) BRB4(4) BRB4(3) BRB4(2) BRB4(1) BRB4(0) OUTB4 PWM Setting
BRR5(7) BRR5(6) BRR5(5) BRR5(4) BRR5(3) BRR5(2) BRR5(1) BRR5(0) OUTR5 PWM Setting
BRG5(7) BRG5(6) BRG5(5) BRG5(4) BRG5(3) BRG5(2) BRG5(1) BRG5(0) OUTG5 PWM Setting
BRB5(7) BRB5(6) BRB5(5) BRB5(4) BRB5(3) BRB5(2) BRB5(1) BRB5(0) OUTB5 PWM Setting
BRR6(7) BRR6(6) BRR6(5) BRR6(4) BRR6(3) BRR6(2) BRR6(1) BRR6(0) OUTR6 PWM Setting
BRG6(7) BRG6(6) BRG6(5) BRG6(4) BRG6(3) BRG6(2) BRG6(1) BRG6(0) OUTG6 PWM Setting
BRB6(7) BRB6(6) BRB6(5) BRB6(4) BRB6(3) BRB6(2) BRB6(1) BRB6(0) OUTB6 PWM Setting
BRR7(7) BRR7(6) BRR7(5) BRR7(4) BRR7(3) BRR7(2) BRR7(1) BRR7(0) OUTR7 PWM Setting
BRG7(7) BRG7(6) BRG7(5) BRG7(4) BRG7(3) BRG7(2) BRG7(1) BRG7(0) OUTG7 PWM Setting
BRB7(7) BRB7(6) BRB7(5) BRB7(4) BRB7(3) BRB7(2) BRB7(1) BRB7(0) OUTB7 PWM Setting
-
-
-
-
-
-
-
EN
Brightness reflection (latch)
Assume that the input of “-“is “0”.
An undefined address may be assigned for test purposes. Access to undefined register is prohibited.
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Register Description
Register address 00h < Read Device address>
Address
(Index)
R/W
R
Bit7
Bit6
Bit5
A5
0
Bit4
A4
0
Bit3
A3
0
Bit2
A2
0
Bit1
A1
0
Bit0
A0
0
00h
-
-
Initial
value
(Arbitrary)
0
0
Bit [5: 0]: Device address (Read only)
Device address set by external terminal (A0 – A5) is returned.
Register address 01h <Read Error condition detection>
Address
(Index)
R/W
R
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
ISETSH
0
Bit1
Bit0
LEDOPN
01h
-
-
-
-
-
-
Initial
Value
(Arbitrary)
0
0
0
0
0
0
0
Bit 2: ISETSH ISET terminal short detection
“0”: Normal operation
“1”: ISET terminal GND short-circuit is detected
Bit 0: LEDOPN LED open detect
“0”: Normal operation
“1”: Detect LED open on any channel
(At LED is ON, detect LED terminal < 0.2V (Typ))
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Register address 02h <Write Mode setup>
Address
(Index)
R/W
W
Bit7
-
Bit6
-
Bit5
-
Bit4
-
Bit3
Bit2
Bit1
Bit0
MD0
02h
SFTRST
ENMD
MD1
Initial
value
00h
0
0
0
0
0
0
0
0
Bit 3: SFTRST Soft reset
“0”: Release reset
“1”: Reset (Auto return zero)
Sleep condition starts after soft reset.
Bit 2: ENMD Enable mode
“0”: Brightness register is latched on edge of EN
“1”: Ignore EN (brightness register is updated immediately)
Bit [1: 0]: MD(1: 0) Mode setup
“00”: Increment mode0
Sleep after register address 1Eh.
Example) 1Ch→1Dh→1Eh→Sleep
“01”: Increment mode1
“10”: Increment mode2
“11”: Prohibited command
Return to 03h after register address 1Eh. (Round)
Example) 1Ch→1Dh→1Eh→03h→04h→･･･
Return to 06h after register address 1Eh. (Round)
Example) 1Ch→1Dh→1Eh→06h→07h→･･･
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Register address 03h-05h < Write RGB DAC setup>
Address
(Index)
R/W
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
03h
W
-
-
DACR5
DACR4
DACR3
DACR2
DACR1
DACR0
04h
05h
W
W
-
-
-
-
DACG5
DACB5
0
DACG4
DACB4
0
DACG3
DACB3
0
DACG2
DACB2
0
DACG1
DACB1
0
DACG0
DACB0
0
Initial
value
00h
0
0
DAC (R, G, B) deserve for changing OUT (R, G, B) current.
Bit [5: 0]: RGB DAC setup
“000000”: Maximum LED current × 1/64
“000001”: Maximum LED current × 2/64
“000010”: Maximum LED current × 3/64
“000011”: Maximum LED current × 4/64
“000100”: Maximum LED current × 5/64
“000101”: Maximum LED current × 6/64
“000110”: Maximum LED current × 7/64
・
・
・
・
・
・
(Maximum LED current × 1/64 step)
“111000”: Maximum LED current × 57/64
“111001”: Maximum LED current × 58/64
“111010”: Maximum LED current × 59/64
“111011”: Maximum LED current × 60/64
“111100”: Maximum LED current × 61/64
“111101”: Maximum LED current × 62/64
“111110”: Maximum LED current × 63/64
“111111”: Maximum LED current × 64/64
Maximum LED current : ILED_max [mA] = 40 x 64 / RISET [kꢀ] (Typ)
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Register address 06h-1Dh <Write OUT** brightness setup>
Address
(Index)
R/W
W
Bit7
BR**(7)
0
Bit6
BR**(6)
0
Bit5
BR**(5)
0
Bit4
BR**(4)
0
Bit3
BR**(3)
0
Bit2
BR**(2)
0
Bit1
BR**(1)
0
Bit0
BR**(0)
0
06h –
1Dh
Initial
value
00h
Bit [7: 0]: OUT** brightness setup
“00000000” : PWM Duty 0/512 LED driver OFF setting (OUT terminal open detect function OFF)
“00000001” : PWM Duty 1/512 1/512 step setting
“00000010” : PWM Duty 2/512 1/512 step setting
“00000011” : PWM Duty 3/512 1/512 step setting
・
・
・
・
・
・
(1/512 step)
“01111101” : PWM Duty 125/512 1/512 step setting
“01111110” : PWM Duty 126/512 1/512 step setting
“01111111” : PWM Duty 128/512 2/512 step setting
“10000000” : PWM Duty 130/512 2/512 step setting
・
・
・
・
・
・
(2/512 step)
“10111100” : PWM Duty 250/512 2/512 step setting
“10111101” : PWM Duty 252/512 2/512 step setting
“10111110” : PWM Duty 256/512 4/512 step setting
“10111111” : PWM Duty 260/512 4/512 step setting
“11000000” : PWM Duty 264/512 4/512 step setting
・
・
・
・
・
・
(4/512 step)
“11111101” : PWM Duty 508/512 4/512 step setting
“11111110” : PWM Duty 512/512 DC setting
It is possible to control PWM brightness by individual channels.
[Duty]
100.00%
90.00%
80.00%
70.00%
60.00%
50.00%
40.00%
30.00%
20.00%
10.00%
0.00%
0
50
100
150
200
250
Figure 15. Register setup
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Register address 1Eh <Write Enable>
Address
(Index)
R/W
W
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
EN
0
1Eh
-
-
-
-
-
-
-
Initial
value
00h
0
0
0
0
0
0
0
Bit 0: EN enable control
“0”: No reflect
“1”: Reflect into output data of 03h to 1Dh (Auto return zero)
However, this bit is ignored at ENMD=1.
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Timing Diagram
Vcc > 3.
Vcc > 2.
Vcc < 3.0V
Vcc < 2.4V
Vcc > 1.
Vcc < 1.65V
Vcc
POR
10µs to 1s
10µs to 1s
0.1ms
0.1ms
CLK/SDA
REF
B12RST
UVLO
ILED
Hi_Z
Hi_Z
GATE
Normal Operation
Power ON Release
UVLO Release
Figure 16. Timing Diagram
The Power supply Rise and Fall time should be in the range of 10μs to 1s.
Digital communication can only start 0.1ms after VCC exceeds 3V.
Always set the register voltage lower than VCC voltage.
Otherwise, when it is driven with more than the VCC, LED may flicker at the start.
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Application Example
VLED
(Max=20V )
CVLED1～3
Vcc
RXERR
A5
OUTG5
OUTR5
PGND
SDI
TEST3
AGND
CLK
Micro-
computer
OUTB4
OUTG4
OUTR4
OUTB3
OUTG3
OUTR3
PGND
TEST2
OE
BD2808MUV
RISET
ISET
AGND
VCC
TEST1
A0
Fuse
Vcc
3.0~5.5V
CVCC
OUTB2
OUTG2
ROUTR0-7
ROUTG0-7
ROUTB0-7
Figure 17. Application Circuit diagram
Component
Name
Component
Product
Name
No.
Company
Value
1
2
3
4
5
6
CVCC
RISET
1μF
GCM188R71C105KA49
Murata
Rohm
56kꢀ
10kꢀ
4.7μF
4.7μF
4.7μF
MCR03 Series
RXERR
CVLED1
CVLED2
CVLED3
MCR03 Series
Rohm
GCM31CR71E475KA40
GCM31CR71E475KA40
GCM31CR71E475KA40
Murata
Murata
Murata
ROUTR0-7/ROUTG0-7
/ROUTB0-7
7
-
ESR25 Series
Rohm
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OUT pin and selection of external resistor
(a) Loss on OUT pin
The LED current is controlled by the driver.
However to limit the power dissipation of the IC an external resistor can be used. This resistor limits the Vout seen by the
IC, to reduce the power dissipation of the IC.
VLED
The power dissipation of each channel is given by:
LED
ꢖ
ꢚ
ꢕ ꢊ ꢗꢁꢂꢃ ꢘ ꢗꢙ ꢍ ꢀꢛꢜꢝ
Vf
IC
Iout
R
ꢊ ꢗꢞꢟꢑ ꢍ ꢀꢛꢜꢝꢔꢔꢔꢔꢔꢔꢔꢔꢔꢔ
VBAT
OUT
There are 24 channels and W of total must be less than the
power dissipation limit Pd of the IC. Then, the following
expression holds true.
M1
Vout
ꢠꢋ ꢍ ꢕ ꢡ ꢕꢢꢔꢔꢔꢔꢔꢔꢔꢔꢔꢔ
V1
ꢖ
ꢚ ・・・①
ꢗꢛꢜꢝ ꢡ ꢕꢢ/ ꢀꢛꢜꢝ ꢍ ꢠꢋ ꢔ
PGND
For correct operation the following expression must be
satisfied
ꢗꢛꢜꢝ ꢣ ꢗꢞꢟꢑꢄꢤꢥꢔ・・・②
Figure 18. OUT terminal Output Circuit Diagram
From
① and ②, Vout voltage must meet the following
ranges
ꢖ
ꢚꢔ
ꢗꢞꢟꢑꢄꢤꢥ ꢡ ꢗꢛꢜꢝ ꢡ ꢕꢢ/ ꢀꢛꢜꢝ ꢍ ꢠꢋ
・・・③
( if all 24 channels are active)
When
③ is not satisfied, a resistor is required between
OUT pin and LED of the IC to reduce the power dissipation
of the IC by dropping the voltage seen by OUT pin.
Figure 19. OUT terminal Limit Voltage
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(b) OUT pin and GND short
When OUT pin is shorted to GND, high current may flow VLED to GND through the LED.
It is recommended to insert a resistor in the path so that current can be restricted, similar to that of Figure 20.
(c) Constant resistance of OUT pin and setting of LED voltage
Set the value of R by this formula:
ꢏ ꢡ ꢖꢗꢁꢂꢃ ꢘ ꢗꢙ ꢘ ꢗꢞꢟꢑꢚ/ꢀꢛꢜꢝ
If there is a maximum current, Imax, then the resistor value must meet the following equation:
ꢗꢁꢂꢃ ꢘ ꢗꢙ ꢘ ꢗꢞꢟꢑ/ꢀꢦꢈꢧ ꢡ ꢏ ꢡ ꢖꢗꢁꢂꢃ ꢘ ꢗꢙ ꢘ ꢗꢞꢟꢑꢚ/ꢀꢛꢜꢝ
Power Dissipation
6.0
(2) Pd=5.20W
5.0
(1) Pd=4.09W
4.0
3.0
2.0
1.0
0.0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Figure 20. VQFN48MCV070 Power Dissipation
Note 1: Power dissipation is calculated when mounted on 114.3mm X 76.2mm X 1.6mm glass epoxy substrate.
Note 2: Connect the back exposure cooling body of package and board.
Board(1): 2 Layer Board (Back Copper foil 74.2mm × 74.2mm)
θja = 30.5 °C/W
θja = 24.0 °C/W
Pd = 2.13W (Ta=85°C)
Pd = 2.71W (Ta=85°C)
Board(2): 4 Layer Board (2,3 Cu Layer, Back Copper foil 74.2mm × 74.2mm)
Power dissipation changes with copper foil density of the board. This value represents only observed values, not guaranteed values.
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I/O Equivalence Circuits
Pin4,8,15,22,29,33 (PGND),
Pin40,45(AGND)
Pin46(VCC)
Pin44(ISET)
VCC
VCC
Pin1(A1),Pin2(A2),Pin35(A3),
Pin36(A4),Pin37(A5),Pin38(SDI)
Pin43(OE),Pin41(CLK),Pin48(A0)
Pin3(SDO)
Pin34(XERR)
VCC
VCC
VCC
VCC
VCC
Pin5,9,12,16,19,23,26,30 (OUTR[0:7]),
Pin6,10,13,17,20,24,27,31(OUTG[0:7]),
Pin7,11,14,18,21,25,28,32 (OUTB[0:7])
( ) – Pin Name
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current
may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more
than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring,
width of ground wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD2808MUV-M
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 21. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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BD2808MUV-M
Ordering Information
M U
V
B D 2
8
0
8
-
M E 2
Package
MUV : VQFN48MCV070
Packaging and forming specification
M: High reliability
Part Number
E2: Embossed tape and reel
Marking Diagram
VQFN48MCV070 (TOP VIEW)
Part Number Marking
LOT Number
B D 2 8 0 8
1PIN MARK
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BD2808MUV-M
Physical Dimension, Tape and Reel Information
Package Name
VQFN48MCV070
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BD2808MUV-M
Revision History
Date
Revision
001
Changes
2014.12.12
2015.06.04
New Release
Page11 Delete Figure 13, 14
Page23 Add Figure 19
002
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.001
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Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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