BD3021HFP [ROHM]

BD3021HFP是50V高耐压车载微控制器对应的低待机电流稳压器＋看门狗计时器复位IC。输出电流500mA，但待机电流仅80µA(Typ)。输出相位补偿电容器可使用陶瓷电容器。BD3021HFP可通过INH引脚的输入逻辑来进行看门狗计时器的ON/OFF控制。;


型号：	BD3021HFP
厂家：	ROHM
描述：	BD3021HFP是50V高耐压车载微控制器对应的低待机电流稳压器＋看门狗计时器复位IC。输出电流500mA，但待机电流仅80µA(Typ)。输出相位补偿电容器可使用陶瓷电容器。BD3021HFP可通过INH引脚的输入逻辑来进行看门狗计时器的ON/OFF控制。控制器微控制器电容器陶瓷电容器稳压器
文件：	总27页 (文件大小：1252K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

LDO Regulators with Watch-Dog Timer

500mA Output LDO Regulators

with Voltage Detector and Watchdog Timer

BD3020HFP BD3021HFP

General Description

Key specification

BD3020HFP BD3021HFP is a regulator IC with integrated

WDT (Watch Dog Timer), high output voltage accuracy

±2.0 % and 80 µA (Typ) low circuit current consumption.

These are supports usage of low ESR ceramic capacitor for

output stability. The reset detection voltage can be adjusted

by connecting resistors on the Vs terminal (BD3020HFP).

They can be a stable power supply for any applications while

detecting malfunction of microcontrollers.



Low Circuit Current:

80 μA (Typ)

5.0 V (Typ)

500 mA

Output Voltage:

Output Current:

High Output Voltage Accuracy:

Low ESR ceramic capacitor

can be used as output capacitor

±2 %

Package

W (Typ) × D (Typ) × H (Max)

HRP7 9.395 mm × 10.540 mm × 2.005 mm

Features



Integrated WDT Reset Circuit

[BD3020HFP]: Adjustable Detection Voltage

through Vs pin

[BD3021HFP]: WDT Can be Switched ON / OFF

by Using INH Pin



Low saturation voltage by using PMOS output transistor

VCC Max Voltage: 50 V

Integrated Over Current Protection and

Thermal Shut Down



HRP7 package

Figure 1. Package Outlook

Applications



Automotive (body, audio system, navigation system, etc.)

Typical Application Circuits

FIN

BD3020HFP

BD3021HFP

2.Vs

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

1.CLK

3.VCC 5.VOUT

BD3020HFP

BD3021HFP

Figure 2. Typical Application Circuits

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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Ordering Information

Part number

3020

Package

HFP: HRP7

Taping

TR: reel-wound embossed tamping

3021

Pin Configuration

Pin Description

Pin No.

Pin Name

Function

CLK

Clock Input from Microcontroller

Reset Detection Voltage Set Pin

(TOP VIEW)

(BD3020HFP)

FIN

INH

(BD3021HFP)

WDT ON/OFF Function Pin

Power Supply Pin

GND

VCC

GND

VOUT

RESET

Voltage Output Pin

Reset Output Pin

External Capacitance for Reset

Output Delay Time, WDT Monitor

Time Setting Connection Pin

Figure 3. Pin Configuration

Fin

GND

Block Diagram

Figure 4. Block Diagrams

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_CC

Ratings

-0.3 to +50.0

-0.3 to +15.0

1.6

Unit

(1)

Supply Voltage

Vs pin Voltage (BD3020HFP)

INH pin Voltage (BD3021HFP)

Regulator Output pin Voltage

Reset Output pin Voltage

Watchdog Input pin Voltage

Reset Delay Setting pin Voltage

Power Dissipation

V_INH

V_OUT

V_RESET

V_CLK

V_CT

(2)

°C

Topr

Tstg

Tjmax

-40 to +125

-55 to +150

150

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

(1) Pd should not be exceeded.

(2) HRP7 mounted on 70.0 mm × 70.0 mm × 1.6 mmt Glass-Epoxy PCB. If Ta ≥ 25 °C, reduce by 12.8 mW / °C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins

or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding

a fuse, in case the IC is operated over the absolute maximum ratings.

Operating Conditions (-40°C ≤ Ta ≤ +125 °C)

Parameter

Symbol

V_CC

Min

5.6

Max

36.0

500

Unit

(3)

Supply Voltage

Output Current

(3) For the output voltage, consider the voltage drop (dropout voltage) due to the output current.

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Electrical Characteristics (Unless otherwise specified, -40°C ≤ Ta ≤ +125 °C, V_CC= 13.5 V, V_CLK= GND)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

Overall Device

μA

Bias Current 1

Io = 0 mA

Icc1

Icc2

－

130

300

Bias Current 2

Io = 50 mA (Ta = 25 °C)

150

Regulator

Output Voltage

V_OUT

Line.Reg

Load.Reg

∆Vd

4.90

－

5.00

5.10

Io = 200 mA

Line Regulation

5.6 V ≤ V_CC≤ 36 V

5 mA ≤ Io ≤ 200 mA

Load Regulation

Dropout Voltage

Ripple Rejection

Reset

－

0.3

0.6

－

V_CC= 4.75 V, Io = 200 mA

R.R.

f = 120Hz, ein = 1 Vrms, Io = 100 mA

Detection Voltage (BD3020HFP）

Detection Voltage (BD3021HFP)

Hysteresis Width

Vdet

V_HS

4.02

4.40

4.10

4.50

100

4.18

4.60

150

_CC= Vdet ±0.5 V (V_CC= V_OUT

)

Output Delay Time LowHigh

(Power On Reset Time)

t_dLH

1.1

－

1.9

100

－

2.7

300

－

μs

INH = open⁽¹⁾, C_CT= 0.01 μF

V_CC= Vdet ±0.5 V (V_CC= V_OUT

INH = open⁽¹⁾, C_CT= 0.01 μF

)

Output Delay Time High→Low

t_dHL

V_CC= 1.5 V, V_RESET= 0.5 V

RESET Discharge Current

I_RESET

0.2

0.1

(V_CC= V_OUT

)

V_CC= 1.5 V, V_CT= 0.5 V

CT Discharge Current

Low Output Voltage

Ict

－

(V_CC= V_OUT

)

V_RST

V_OPL

－

0.1

0.2

V_OUT= 4.0 V

Min Operating Voltage

1.5

－

(1) BD3021HFP only

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Electrical Characteristics (Unless otherwise specified, -40°C, ≤ Ta ≤ +125 °C, V_CC= 13.5 V, V_CLK= GND)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

Watchdog timer

CT Switching Threshold Voltage High

CT Switching Threshold Voltage Low

WDT ON⁽¹⁾, INH = open⁽¹⁾

VthH

VthL

1.08

0.13

1.15

0.15

1.25

0.17

WDT ON⁽¹⁾, INH = open⁽¹⁾

V_CT= 0 V

WDT Charge Current

Ictc

Ictd

3.5

1.2

6.0

2.0

8.5

2.8

μA

WDT ON⁽¹⁾, INH = open⁽¹⁾

V_CT= 1.3 V

WDT Discharge Current

WDT ON⁽¹⁾, INH = open⁽¹⁾,

Watchdog Monitor Time Low

t_WH

3.0

5.0

7.0

_CT= 0.01 μF (Ceramic Capacitor) ⁽²⁾

Watchdog Reset Time

CLK Input Pulse Width

INH*

t_WL

1.0

1.7

2.4

t_WCLK

500

V_OUT

× 0.8

WDT OFF Threshold Voltage

V_HINH

V_OUT

× 0.3

INH is pulled down inside the IC

when INH open.

WDT ON Threshold Voltage

V_LINH

INH Input current

I_INH

μA

V_INH= 5 V

(1) BD3021HFP only

(2) Characteristics of ceramic capacitor not considered.

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Reference data

Unless otherwise specified, Ta = 25 °C, V_CC= 13.5 V, V_CLK= GND

500

400

300

200

100

120

100

-40°C

25°C

125°C

100

200

300

400

500

OUTPUT CURRENT: Io [mA]

SUPPLY VOLTAGE : VCC[V]

Figure 5. Circuit Current 1

Figure 6. Circuit Current 2

-40°C

25°C

-40°C

25°C

125°C

0.0

0.2

0.4

0.6

0.8

1.0

1.2

SUPPLY VOLTAGE : VCC[V]

OUTPUT CURRENT : Io[A]

Figure 8. Lode Stability

Figure 7. Input Stability

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Reference data

Unless otherwise specified, Ta = 25 °C, V_CC= 13.5 V, V_CLK= GND

1.0

-40°C

25°C

0.8

0.6

0.4

0.2

0.0

25°C

125°C

100

1000

10000 100000 1000000

100

200

300

400

500

FREQUENCY : f[Hz]

OUTPUT CURRENT : Io[mA]

Figure 9. Dropout Voltage

Figure 10. Ripple Rejection

5.50

5.25

5.00

4.75

4.50

100

120

140

160

180

200

-40

120

AMBIENT TEMPERATURE : Ta[

]

℃

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 11. Output Voltage

Temperature Characteristics

Figure 12. Thermal Shutdown

Circuit Characteristics

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Reference data

Unless otherwise specified, Ta = 25 °C, V_CC= 13.5 V, V_CLK= GND

-40°C

25°C

125°C

BD3021HFP

BD3020HFP

-1

-3

0.0

0.5

1.0

1.5

2.0

2.5

3.0

OUTPUT VOLTAGE : VOUT[V]

CT PIN VOLTAGE : VCT[V]

Figure 13. Detection Voltage

Figure 14. CT Pin Charge / Discharge

Current (V_CC=5V)

(V_CC=V_OUT

)

4.8

BD3021HFP

BD3020HFP

4.6

4.4

4.2

VHS

t_WH

Vdet

t_WL

VHS

3.8

-40

120

-40

120

AMBIENT TEMPERATURE : Ta[

]

℃

AMBIENT TEMPERATURE : Ta[℃]

Figure 15. Reset Detection

Voltage vs. Temperature

Figure 16. WDT Time vs. Temperature

(C_CT=0.01μF)

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Measurement Circuits (BD3020HFP)

FIN

BD3020HFP

2.Vs

1.CLK

4.GND

6.RESET

7.CT

2.Vs

1.CLK

4.GND

6.RESET

7.CT

2.Vs

1.CLK

4.GND

6.RESET

7.CT

3.VCC 5.VOUT

Measurement setup for Figure 5.

Measurement setup for Figure 6.

Measurement setup for Figure 7, 11, 12.

FIN

BD3020HFP

2.Vs

1.CLK

4.GND

6.RESET

7.CT

2.Vs

1.CLK

4.GND

6.RESET

7.CT

2.Vs

1.CLK

4.GND

6.RESET

7.CT

3.VCC 5.VOUT

100mA

Measurement setup for Figure 8.

Measurement setup for Figure 9.

Measurement setup for Figure 10.

FIN

BD3020HFP

2.Vs

1.CLK

4.GND

6.RESET

7.CT

2.Vs

1.CLK

4.GND

6.RESET

7.CT

2.Vs

1.CLK

4.GND

6.RESET

7.CT

3.VCC 5.VOUT

オシロ

Measurement setup for Figure 13, 15.

Measurement setup for Figure 14.

Measurement setup for Figure 16.

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Measurement Circuits (BD3021HFP)

FIN

BD3021HFP

2.INH

1.CLK

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

3.VCC 5.VOUT

Measurement setup for Figure 5.

Measurement setup for Figure 6.

Measurement setup for Figure 7, 11, 12.

FIN

BD3021HFP

2.INH

1.CLK

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

3.VCC 5.VOUT

100mA

Measurement setup for Figure 8.

Measurement setup for Figure 9.

Measurement setup for Figure 10.

FIN

BD3021HFP

2.INH

1.CLK

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

2.INH

1.CLK

4.GND

6.RESET

7.CT

3.VCC 5.VOUT

オシロ

Measurement setup for Figure 13, 15.

Measurement setup for Figure 14.

Measurement setup for Figure 16.

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BD3020HFP Detection Voltage Adjustment (Resistance value is typical value)

VOUT

470 kΩ

R2 = 900 kΩ

RESET

1 kΩ

10 kΩ

Vs ≈ 1.23 V

R1 = 330 kΩ

IC Internal Block Diagram

When typical detection voltage is 4.1 V

Vdet ≈ Vs × (R1 + R2) / R1

・Vdet

・Vs

: Reset detection voltage

: Internal reference voltage (MOS input)

・R1, R2 : IC internal resistor

(Voltage detection precision is tightened up to ±2 % by laser-trimming the R1 and R2)

Vs will fluctuate 1.23 V ±6.0 %.

The reset detection voltage can be adjusted by connecting resistors on the Vs terminal.

Insert pull down resistor R3 (lower resistance than R1) in between Vs-GND, and pull down resistor R4 (lower resistance

than R2) in between Vs-VOUT to adjust the detection voltage.

By doing so, the detection voltage can be adjusted by the calculation below.

Vdet = Vs × [{R2 × R4 / (R2 + R4)} + {R1 × R3 / (R1 + R3)}] / {R1 × R3 / (R1+R3)}

When the output resistance value is as small enough to ignore the IC internal resistance, you can find the detection voltage

by the calculation below.

Vdet ≈ Vs × (R3 + R4 ) / R3

Adjust the resistance value by application as the circuit current will increase due to the added resistor.

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BD3020/21HFP Power on Reset / Watchdog Timer

Power ON reset (output delay time) is adjustable by CT pin capacitor.

t_dLH(S) ≈ (1.15 V × CT capacitance (μF)) / Ictc (μA) (Typ)

・t_dLH

: Output delay time ( power ON reset)

: Upper switching threshold voltage (Typ)

・1.15 V

・CT capacitance : Capacitor connected to CT pin

・Ictc : WDT charge current

Calculation example) with 0.01 µF CT pin capacitor

t_dLH(S) = 1.15 V × 0.01 μF / 6 μA

≈ 1.9 ms

*If the CT capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01 µF, choose the capacitance value in ratio referring

to the above equation.

Watch Dog Timer ( WDT t_WH, t_WL) is adjustable by the CT pin capacitor

t_{W H}( S ) ≈ 1.00 V × CT capacitance (μF)) / Ictd(μA) (Typ)

t_{W L}( S ) ≈ 1.00 V × CT capacitance (μF)) / Ictc(μA) (Typ)

・t_WH

: Watchdog monitor time Low (delay time to turn the reset ON)

: Watchdog reset time (time the reset is ON)

・t_WL

・1.00 V

: Upper switching threshold voltage - lower switching threshold voltage

・CT capacitance : CT pin capacitor *Shared with power ON reset

・Ictc

・Ictd

: WDT charge current

: WDT discharge current

Calculation example) with 0.01 µF CT pin capacitor

t_{W H}( S ) ≈ 1.00 V × 0.01 μF / 2 μA ≈ 5.0 ms (Typ)

t_{W L}( S ) ≈ 1.00 V × 0.01 μF / 6 μA ≈ 1.7 ms (Typ)

*If the CT capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01 µF, choose the capacitance value in ratio referring

to the above equation.

13.5V

VCC

4.0V

4.60 (BD3021HFP)

Vdet=4.50 VHS 100mV (BD3021HFP)

VOUT

4.0V

4.20 (BD3020HFP)

Vdet=4.10 100mV (BD3020HFP)

CT pull up voltage

1.25V

1.15V

0.15V

CLK

t_dLH

(Power on reset)

Reset ON

VOUT

RESET

t_dLH

(Power on reset)

Reset ON

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WDT timer ON / OFF switch INH (Resistance value is typical value)

BD3021HFP has a switch INH to turn the WDT ON / OFF.

VREF_R

(TYP ≈ 1.25V)

LOW

10kΩ

WDT

～～

INH

ON/OFF

HIGH

WDT

OFF

500kΩ

External

Capacitor

IC Internal Block Diagram

By using INH ON, CT potential can be pulled up to internal voltage VREF_R (invalid with power ON reset).

<Timing Chart> BD3021HFP

13.5V

VCC

VOUT

The CT pin is pulled up

after CT pin is charged.

The CT pin is pulled up

WDT ON

INH

CT pull up Voltgge

Upper switching threshold voltage

1.25V

1.15V

0.15V

Lower switching threshold voltage

CLK

VOUT

RESET

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<Timing Chart> BD3020HFP

13.5V

VCC

4.0V

4.20 V

4.10 V

VOUT

4.0V

VHS 100mV

Watch time

1.25V

1.15V

0.15V

Detect positive edge.

The CLK pin charges discharge to chaeging.

CLK width<500ns

CLK

Power on reset

WDT reset time

Power on reset

VOUT

RESET

Minimum reset

Movement voltage

Reset ON

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<Timing Chart> BD3021HFP

13.5V

VCC

5.5V

4.0V

4.60V

4.50V

VOUT

VHS100mV

WDT OFF(INH=ON)

INH

Watch time

Detect positive edge.

1.25V

1.15V

0.15V

Detect positive edge.

CLK

CLK width<500ns

WDT Reset time

Power on reset

VOUT

Minimum reset

Movement voltage

RESET

Reset ON

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Pin Settings / Precautions

1. VCC Pin

Insert a 0.33 µF to 1000 µF capacitor between the VCC and GND. The appropriate capacitance value varies by application.

Be sure to allow a sufficient margin for input voltage levels.

2. Output pins

In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND. We recommend using a

capacitor with a capacitance of 0.1 µF to 1000 µF. Electrolytic, tantalum and ceramic capacitors can be used. When

selecting the capacitor ensure that the capacitance of 0.1µF to 1000µF is maintained at the intended applied voltage and

temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate possibly resulting in

oscillation. For selection of the capacitor refer to the Cout_ESR vs. Io data. The stable operation range given in the

reference data is based on the standalone IC and resistive load. For actual applications the stable operating range is

influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final

operating environment is needed.

Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that

the actual application meets with the required specification.

V_CC= 5.6 V to 36 V

Ta = -40 °C to +125 °C

Io = 0 A to 500 mA

C_IN= 0.33 μF to 100 μF, C_OUT= 0.1 μF to 100 μF

FIN

100

Unstable operating region

BD3021HFP

(BD3020HFP)

2.INH

(Vs)

1.CLK

4.GND

6.RESET

7.CT

Stable operating

3.VCC 5.VOUT

0.1

region

0.01

ESR

VCC

CIN

COUT

0.001

100

200

300

400

500

Io(mA)

Output Capacitor_ESR vs Io (reference data)

*Pin Settings / Precautions2 Measurement circuit

3. CT pin

Connecting a capacitance of 0.01 µF to 1 µF on the CT pin is recommended.

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Power Dissipation

■HRP7

IC mounted on ROHM standard board.

Board material: FR4

Board size: 70.0 mm × 70.0 mm × 1.6 mmt

(with thermal via on the board)

②7.3 W

Mount condition: PCB and exposed pad are soldered.

Top copper foil: The footprint ROHM recommend.

+ wiring to measure.

①: 1-layer PCB

(Back surface copper foil area : 0mm × 0 mm)

②: 4-layer PCB

(Back surface copper foil area : 70.0mm × 70.0 mm)

①1.6 W

Condition①: θja = 78.1 °C / W

Condition②: θja = 17.1 °C / W

150

100

125

AmbientTemperature:Ta[°C]

Figure 17. Package Data

(HRP7)

Refer to Figure 17 thermal dissipation characteristics for usage above Ta = 25 °C. The IC’s characteristics are affected

heavily by the temperature, and if is exceeds its max junction temperature (Tjmax), the chip may degrade or destruct.

Thermal design is critical in terms of avoiding Instantaneous destruction and reliability in long term usage.

The IC needs to be operated below its max junction temperature (Tjmax) to avoid thermal destruction. Refer to Figure 17 for

HRP7 package thermal dissipation characteristics. Operate the IC within power dissipation (Pd) when using this IC.

Power consumption Pc (W) calculation will be as below

V_CC

: Input Voltage

V_OUT: Output Voltage

Pc = (V_CC- V_OUT) × Io + V_CC× Icc

Power dissipation Pd ≥ Pc

Icc

: Load Current

: Circuit Current

If load current Io is calculated to operate within power dissipation, it will be as below, where you can find the max load current

IoMax for the applied voltage V_CCof the thermal design.

Pd - V_CC× Icc

Io ≤

(Refer to Figure 6 for the Icc)

V_CC- V_OUT

■Example) at Ta = 125 °C, V_CC= 12 V, V_OUT= 5 V

1.452 - 12 × Icc

Io ≤

θja = 17.1 °C / W → -58.4 mV / °C

25 °C = 7.30 W → 125 °C = 1.452 W

12 - 5

Io ≤ 207 mA (Icc: 150 µA)

At Ta = 125 °C with Figure 17 ② condition, the calculation shows that ca 207 mA of output current is possible at 7 V potential

difference across input and output.

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I/O Equivalence Circuit (Resistance value is typical value)

CLK (1pin)

Vs (BD3020HFP 2pin)

INH (BD3021HFP 2pin)

VCC (3pin)

VOUT

INH

10kΩ

500kΩ

VOUT (5pin)

RESET (6pin)

CT (7pin)

Figure 18. I / O equivalence circuit

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Operational Notes

Electrical characteristics

Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage,

external circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size

and copper area to prevent exceeding the Pd rating.

Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.

Consider Pc that does not exceed Pd in actual operating conditions. (Pd ≥ Pc)

Tjmax: Maximum junction temperature = 150 °C, Ta: Peripheral temperature [°C],

θja: Thermal resistance of package-ambience [°C / W], Pd : Package Power dissipation [W],

Pc: Power dissipation [W], V_CC: Input Voltage, V_OUT:Output Voltage, Io: Load, I_CC2: Bias Current2

Package Power dissipation

Power dissipation

: Pd (W) = (Tjmax - Ta) / θja

: Pc (W) = (V_CC- V_OUT) × Io + V_CC× I_CC2

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 19. Example of monolithic IC structure

12. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

14. Applications or inspection processes where the potential of the VCC pin or other pins may be reversed from their

normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or

lower in case VCC is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with VCC

to prevent reverse current flow, or insert bypass diodes between VCC and each pin.

15. Positive voltage surges on VCC pin

A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50 V

on the VCC pin.

Figure 20. Application Examples 1

16. Negative voltage surges on VCC pin

A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on

the VCC pin.

Figure 21. Application Examples 2

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Operational Notes – continued

17. Output protection diode

Loads with large inductance components may cause reverse current flow during startup or shutdown.

In such cases, a protection diode should be inserted on the output to protect the IC.

Figure 22. Application Examples 3

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Physical Dimension, Tape and Reel Information

Package Name

HRP7

Tape

Embossed carrier tape

2000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

Reel

∗

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Marking Diagram

HRP7 (TOP VIEW)

Part Number Marking

LOT Number

Part Number

Marking

Product Name

BD3020HFP

BD3021HFP

BD3020

BD3021

1PIN MARK

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Revision History

Date

Revision

001

Changes

New Release

10.Nov.2015

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD3021HFP [ROHM]

相关型号：

BD3021HFP-M

BD3021HFP-M_10

BD302N

BD302P

BD303

BD303

BD3037

BD304

BD304N

BD304P

BD3062

BD3063