BD34700FV [ROHM]

实现4ch独立控制的音量控制器。具备μ-step音量,可减轻增益ATT切换时的开关机噪声。既适合用作AV接收器等多通道音量的副音量,也适合用作2ch等简单系统的主音量。;
BD34700FV
型号: BD34700FV
厂家: ROHM    ROHM
描述:

实现4ch独立控制的音量控制器。具备μ-step音量,可减轻增益ATT切换时的开关机噪声。既适合用作AV接收器等多通道音量的副音量,也适合用作2ch等简单系统的主音量。

开关 控制器
文件: 总31页 (文件大小:937K)
中文:  中文翻译
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Datasheet  
Sound Processors for Home Theater Systems  
4ch Sound Processor  
with Built-in Micro-step Volume  
BD34700FV  
General Description  
Key Features  
The BD34700FV is a 4ch independent volume system.  
Micro-step volume can reduce the switching pop noise  
when volume changes, so it can achieve a high-quality  
set. It is most suitable for subvolume of the multi channel  
volume such as AV receivers, but is most suitable for  
main volume of simple systems such as 2ch.  
Total harmonic distortion:  
Maximum output voltage:  
Output noise voltage:  
Residual output noise voltage:  
Cross-talk between channels:  
0.0004%(Typ.)  
4.2Vrms(Typ.)  
1.5uVrms(Typ.)  
1.0uVrms(Typ.)  
-105dB(Typ.)  
Package  
SSOP-B40  
W(Typ.) x D(Typ.) x H(Max.)  
13.60mm x 7.80mm x 2.00mm  
Features  
Micro-step volume can reduce the switching pop  
noise when volume changes.  
Micro-step volume can reduce the capacitor for the  
DC offset cut  
2-wire serial bus control, corresponding to 3.3/5V.  
It is controllable to two chips on the same serial bus  
by using chip select terminal.  
Applications  
Most suitable for the AV receivers, home theater and  
mini-component systems  
SSOP-B40  
Typical Application Circuit  
Figure 1. Application Circuit  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays  
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BD34700FV  
Pin Configuration  
SSOP-B40  
(TOP VIEW)  
40 TEST  
39 TEST  
VEES  
1
TEST  
TEST  
2
3
38 TEST  
37 TEST  
36 NC  
GND  
GND  
4
5
35 NC  
NC  
VINL1  
VINR1  
VINL2  
6
7
8
9
34 GND  
33 GND  
32 GND  
31 GND  
VINR2 10  
GND 11  
GND 12  
GND 13  
CHIP 14  
NC 15  
30 GND  
29 GND  
28 GND  
27 GND  
26 VOUTL1  
25 VOUTR1  
24 TEST  
VCC 16  
DGND 17  
DA 18  
23 TEST  
22 VOUTL2  
21 VOUTR2  
CL 19  
VEE 20  
Figure 2. Pin Configuration  
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Description of terminal  
Terminal  
Symbol  
Number  
Terminal  
Number  
Function  
Symbol  
VOUTR2  
VOUTL2  
TEST  
TEST  
VOUTR1  
VOUTL1  
GND  
Function  
Negative power supply  
terminal  
1
2
VEES  
TEST  
TEST  
GND  
GND  
NC  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
Volume output terminal R2  
Volume output terminal L2  
TEST terminal  
TEST terminal  
3
TEST terminal  
4
Analog ground terminal  
Analog ground terminal  
Non connection  
TEST terminal  
5
Volume output terminal R1  
Volume output terminal L1  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Non connection  
6
7
VINL1  
VINR1  
VINL2  
VINR2  
GND  
GND  
GND  
CHIP  
NC  
Volume input terminal L1  
Volume input terminal R1  
Volume input terminal L2  
Volume input terminal R2  
Analog ground terminal  
Analog ground terminal  
Analog ground terminal  
Chip select  
8
GND  
9
GND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
GND  
GND  
GND  
GND  
GND  
Non connection  
NC  
Positive power supply  
terminal  
VCC  
DGND  
DA  
NC  
Non connection  
Digital ground terminal  
Data and latch input terminal  
Clock input terminal  
TEST  
TEST  
TEST  
TEST  
TEST terminal  
TEST terminal  
CL  
TEST terminal  
Negative power supply  
terminal  
VEE  
TEST terminal  
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BD34700FV  
Block Diagram  
Figure 3. Block Diagram  
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Absolute Maximum Ratings  
Item  
Symbol  
VCC  
VEE  
Pd  
Rating  
Unit  
V
(Note1)  
+7.75  
-7.75  
1.12  
Positive power supply  
Negative power supply  
Power dissipation  
(Note1)  
(Note2)  
V
W
V
Vin  
Vee-0.2 to Vcc+0.2  
Input voltage  
(Note3)  
Topr  
Tstg  
-40 to +85  
°C  
°C  
Operating temperature  
Storage temperature  
-55 to +150  
(Note1)  
(Note2)  
(Note3)  
The maximum voltage that can be applied based on GND.  
This value decreases 9.0mW/°C for Ta=25°C or more. A standard board, 70×70×1.6 mm, shall be mounted.  
If it within operation voltage range, circuit functions operation is guaranteed within operation temp.  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between  
pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as  
adding a fuse, in case the IC is operated over the absolute maximum ratings.  
Operating Condition  
Item  
Symbol  
Rating  
Unit  
(Note4,5)  
(Note4,5)  
VCC  
VEE  
+6.5 to +7.5  
-6.5 to -7.5  
V
V
Positive power supply  
Negative power supply  
(Note4)  
(Note5)  
Applying a voltage based on GND.  
Within operation temp range, basic circuit function Operation is guaranteed within operation voltage range.  
But please confirm set up of constant and element, voltage set up and temp set up on use.  
Please watch out except condition stipulated by electrical characteristics within the range,  
It cannot guarantee standard value of electrical characteristics. But it retains original function  
.
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Electrical characteristic  
Unless specified particularly, Ta=25°C, Vcc=7V, Vee=-7V, f=1kHz, Vin=1Vrms, RL=10k,  
Stereo input =VINL1,VINR1, Stereo output=VOUTL1,VOUTR1, Volume=0dB.  
Limit  
Item  
Symbol  
Unit  
Conditions  
No signal  
No signal  
Min.  
-
Typ.  
22  
Max.  
44  
Iqp  
Iqn  
mA  
mA  
dB  
dB  
%
Positive circuit current  
Negative circuit current  
Output voltage gain  
Channel balance  
-44  
-1.5  
-0.5  
-
-22  
-
Gv  
0
0
1.5  
0.5  
0.02  
21,22,25,26pin output  
L Channel reference,  
CB  
BW=400 to 30kHz  
21,22,25,26pin output  
THD=1%,  
THD  
0.0004  
Total harmonic distortion  
TOTAL  
Vom  
Vno  
3.8  
4.2  
1.5  
1
-
10  
8
Vrms VOLUME=+10dB  
21,22,25,26pin output  
Maximum output voltage  
Rg=0, BW=IHF-A  
21,22,25,26pin output  
-
-
µVrms  
Output noise voltage *  
Volume=Mute,  
µVrms Rg=0, BW=IHF-A  
21,22,25,26pin output  
Residual output noise  
voltage *  
Vnor  
Cross-talk between  
channels *  
Rg=0, BW=IHF-A  
dB  
CT  
Rin  
-
32  
-
-105  
47  
-80  
62  
21,22,25,26pin output  
kΩ  
7 to 10pin  
Input impedance  
VOLUME  
ATTmax  
-115  
-100  
dB  
Volume=Mute, BW=IHF-A  
Maximum attenuation *  
VP-9690A(Average value detection, effective value display) filter by Panasonic is used for measurement.  
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BD34700FV  
Typical Performance Curve(s)  
34  
32  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
30  
25  
20  
15  
10  
5
0
Operational  
range  
-5  
-10  
-15  
-20  
-25  
-30  
6
4
2
0
-2  
10  
100  
1000  
10000  
100000  
0
1
2
3
4
5
6
7
8
VCC(+)/VEE(-)[V]  
Frequency[Hz]  
Figure 4. Circuit Currents vs. Circuit Voltage  
Figure 5. Volume Gain vs. Input Frequency  
(32dB to 0 dB setting)  
2
0
-2  
-4  
-6  
-30  
-32  
-34  
-36  
-38  
-40  
-42  
-44  
-46  
-48  
-50  
-52  
-54  
-56  
-58  
-60  
-62  
-64  
-66  
-8  
-10  
-12  
-14  
-16  
-18  
-20  
-22  
-24  
-26  
-28  
-30  
-32  
-34  
10  
100  
1000  
10000  
100000  
10  
100  
1000  
10000  
100000  
Frequency[Hz]  
Frequency[Hz]  
Figure 6. Volume Gain vs. Input Frequency  
(0dB to -32 dB setting)  
Figure 7. Volume Gain vs. Input Frequency  
(-32dB to -64 dB setting)  
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BD34700FV  
1.0000  
0.1000  
0.0100  
0.0010  
0.0001  
-60  
-62  
-64  
-66  
-68  
-70  
-72  
-74  
-76  
-78  
-80  
-82  
-84  
-86  
-88  
-90  
-92  
-94  
-96  
-98  
10kHz  
100Hz  
1 kHz  
10  
100  
1000  
10000  
100000  
0.001  
0.010  
0.100  
1.000  
10.000  
Frequency[Hz]  
Input Voltage [Vrms]  
Figure 8. Volume Gain vs. Input Frequency  
(-64dB to -95 dB setting)  
Figure 9. THD + N vs. Input Voltage  
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BD34700FV  
Specifications for Control Signal  
(1) Timing of control signal  
Data is read at a rising edge of clock.  
Latch is read at a falling edge of clock. And Data on the latest 16bit are taken in the inside of this IC.  
Be sure to set DA and CL to LOW after latching.  
1byte=16bit  
90  
90  
90  
90  
CL  
CLOCK  
tsu  
twc  
twc  
(
)
10  
10  
10  
thd  
ts  
th  
tsd  
thd  
tsl  
thl  
DA  
DATA  
LATCH  
90  
90  
90  
90  
90  
twh  
twd  
twl  
DATA  
DATA  
10  
LATCH  
10  
10  
Figure 10. The timing definition of the control signal.  
Limit  
Typ.  
Item  
Symbol  
Unit  
Min.  
1.0  
1.0  
1.0  
1.0  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
Max.  
Clock width  
Data width  
Latch width  
Low hold width  
twc  
twd  
twl  
twh  
tsd  
thd  
tsl  
thl  
ts  
th  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
µsec  
µsec  
µsec  
µsec  
µsec  
µsec  
µsec  
µsec  
µsec  
µsec  
Data setup time (DATACLK)  
Data hold time (CLKDATA)  
Latch setup time (CLKLATCH)  
Latch hold time  
Latch Low setup time  
Latch Low hold time  
(2) Voltage of control signal (CL, DA, CHIP)  
Limit  
Typ.  
Item  
Conditions  
Max.  
(<Vcc)  
Unit  
Min.  
2.3  
0
High input voltage  
-
-
5.5  
V
V
Vcc=+6.5 to +7.5V  
Vee=-6.5 to -7.5V  
Low input voltage  
1.0  
(3) Basic Structure of Control Data  
Input Direction  
D15 D14 D13 D12 D11 D10  
D9  
Data  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Select Address  
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(4) Table of Control Data  
Input Direction  
Select  
Addre  
ss  
D15 D14 D13 D12 D11 D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
No.  
0
1
2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
0
1
0
MUTE  
on/off  
L2,R2  
MUTE  
on/off  
L1,R1  
Chip  
Select  
Volume channel  
Select  
3
7
Volume  
0
0
1
*
1
1
0
0
1
1
1
0
1
*
AB  
switch-time  
BA  
switch-time  
Base  
clock  
System  
reset  
0
0
0
BD3843FS (6ch Selector IC)  
BD3841FS (9ch Selector IC)  
BD3812F (2ch volume IC)  
1
1
1
*
*
Serial control lines can be shared with BD34701KS2(8ch Volume IC) to set different data by chip select.  
Serial control lines can be shared with BD3843FS(6ch selector IC), BD3841FS(9ch selector IC) and  
BD3812F(2ch volume IC).  
Initialize all data at every turning on the power supply.  
(Example)  
Input direction  
Address  
No.3  
Lch  
Address  
No.3  
Rch  
Address  
No.0  
Address  
No.1  
Address  
No.2  
L
L
L
L
L
Address  
No.3  
L1ch  
Address  
No.3  
R1ch  
Address  
No.7  
L
L
L
At the second time after turning on the power supply, eight any data to be changed.  
(5) Chip Select Setting Table  
CHIP terminal condition  
D2  
0 (LOW)  
1 (HIGH)  
0
1
BD34700FV can be operated in combination with another by setting the CHIP terminal.  
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BD34700FV  
Select Address No.2 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
ON  
0
1
MUTE  
on/off  
L1,R1  
OFF  
ON  
Chip  
Select  
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
MUTE  
on/off  
L2,R2  
OFF  
: Initial condition  
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Select Address No.3 Setting Table  
Function & Setting  
D15 D14 D13 D12 D11 D10 D9  
D8 D7 D6 D5  
D4  
D3  
D2  
D1  
D0  
Non select  
0
0
0
1
1
0
0
0
1
0
1
R2  
L2  
Volume  
1
R1  
L1  
MUTE  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Prohibition  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
+32.0dB  
+31.5dB  
+31.0dB  
+30.5dB  
+30.0dB  
+29.5dB  
+29.0dB  
+28.5dB  
+28.0dB  
+27.5dB  
+27.0dB  
+26.5dB  
+26.0dB  
+25.5dB  
+25.0dB  
+24.5dB  
+24.0dB  
+23.5dB  
+23.0dB  
+22.5dB  
+22.0dB  
+21.5dB  
+21.0dB  
+20.5dB  
+20.0dB  
+19.5dB  
+19.0dB  
+18.5dB  
+18.0dB  
+17.5dB  
+17.0dB  
+16.5dB  
+16.0dB  
+15.5dB  
Chip  
Select  
0
1
1
Volume  
Channel  
Select  
1
: Initial condition  
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Select Address No.3 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10  
D9  
0
D8  
1
D7 D6 D5  
D4  
0
D3  
D2  
D1  
D0  
+15.0dB  
+14.5dB  
+14.0dB  
+13.5dB  
+13.0dB  
+12.5dB  
+12.0dB  
+11.5dB  
+11.0dB  
+10.5dB  
+10.0dB  
+9.5dB  
+9.0dB  
+8.5dB  
+8.0dB  
+7.5dB  
+7.0dB  
+6.5dB  
+6.0dB  
+5.5dB  
+5.0dB  
+4.5dB  
+4.0dB  
+3.5dB  
+3.0dB  
+2.5dB  
+2.0dB  
+1.5dB  
+1.0dB  
+0.5dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
Volume  
Channel  
Select  
Chip  
Select  
0
1
1
Prohibition  
-0dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
-0.5dB  
-1.0dB  
-1.5dB  
-2.0dB  
-2.5dB  
-3.0dB  
-3.5dB  
-4.0dB  
-4.5dB  
-5.0dB  
-5.5dB  
-6.0dB  
-6.5dB  
-7.0dB  
-7.5dB  
0
www.rohm.com  
TSZ02201-0C2C0E100060-1-2  
06.Aug.2014 Rev.001  
13/27  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
Daattaasshheeeett  
BD34700FV  
Select Address No.3 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10  
D9  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D8  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D7 D6 D5  
D4  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
D3  
D2  
D1  
D0  
-8.0dB  
-8.5dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
-9.0dB  
-9.5dB  
-10.0dB  
-10.5dB  
-11.0dB  
-11.5dB  
-12.0dB  
-12.5dB  
-13.0dB  
-13.5dB  
-14.0dB  
-14.5dB  
-15.0dB  
-15.5dB  
-16.0dB  
-16.5dB  
-17.0dB  
-17.5dB  
-18.0dB  
-18.5dB  
-19.0dB  
-19.5dB  
-20.0dB  
-20.5dB  
-21.0dB  
-21.5dB  
-22.0dB  
-22.5dB  
Volume  
Channel  
Select  
Chip  
Select  
0
0
1
1
-23.0dB  
0
0
1
0
1
1
1
0
-23.5dB  
-24.0dB  
-24.5dB  
-25.0dB  
-25.5dB  
-26.0dB  
-26.5dB  
-27.0dB  
-27.5dB  
-28.0dB  
-28.5dB  
-29.0dB  
-29.5dB  
-30.0dB  
-30.5dB  
-31.0dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
www.rohm.com  
TSZ02201-0C2C0E100060-1-2  
06.Aug.2014 Rev.001  
14/27  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
Daattaasshheeeett  
BD34700FV  
Select Address No.3 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10  
D9  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D8  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
D7 D6 D5  
D4  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
D3  
D2  
D1  
D0  
-31.5dB  
-32.0dB  
-32.5dB  
-33.0dB  
-33.5dB  
-34.0dB  
-34.5dB  
-35.0dB  
-35.5dB  
-36.0dB  
-36.5dB  
-37.0dB  
-37.5dB  
-38.0dB  
-38.5dB  
-39.0dB  
-39.5dB  
-40.0dB  
-40.5dB  
-41.0dB  
-41.5dB  
-42.0dB  
-42.5dB  
-43.0dB  
-43.5dB  
-44.0dB  
-44.5dB  
-45.0dB  
-45.5dB  
-46.0dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
Volume  
Channel  
Select  
Chip  
Select  
0
0
1
1
-46.5dB  
0
1
0
1
1
1
0
1
-47.0dB  
-47.5dB  
-48.0dB  
-48.5dB  
-49.0dB  
-49.5dB  
-50.0dB  
-50.5dB  
-51.0dB  
-51.5dB  
-52.0dB  
-52.5dB  
-53.0dB  
-53.5dB  
-54.0dB  
-54.5dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
www.rohm.com  
TSZ02201-0C2C0E100060-1-2  
06.Aug.2014 Rev.001  
15/27  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
Daattaasshheeeett  
BD34700FV  
Select Address No.3 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10  
D9  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
D8  
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
D7 D6 D5  
D4  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
D3  
D2  
D1  
D0  
-55.0dB  
-55.5dB  
-56.0dB  
-56.5dB  
-57.0dB  
-57.5dB  
-58.0dB  
-58.5dB  
-59.0dB  
-59.5dB  
-60.0dB  
-60.5dB  
-61.0dB  
-61.5dB  
-62.0dB  
-62.5dB  
-63.0dB  
-63.5dB  
-64.0dB  
-64.5dB  
-65.0dB  
-65.5dB  
-66.0dB  
-66.5dB  
-67.0dB  
-67.5dB  
-68.0dB  
-68.5dB  
-69.0dB  
-69.5dB  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Volume  
Channel  
Select  
Chip  
Select  
0
0
1
1
-70.0dB  
1
0
0
0
1
1
0
0
-70.5dB  
-71.0dB  
-71.5dB  
-72.0dB  
-72.5dB  
-73.0dB  
-73.5dB  
-74.0dB  
-74.5dB  
-75.0dB  
-75.5dB  
-76.0dB  
-76.5dB  
-77.0dB  
-77.5dB  
-78.0dB  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
www.rohm.com  
TSZ02201-0C2C0E100060-1-2  
06.Aug.2014 Rev.001  
16/27  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
Daattaasshheeeett  
BD34700FV  
Select Address No.3 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10  
D9  
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D8  
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
D7 D6 D5  
D4  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
D3  
D2  
D1  
D0  
-78.5dB  
-79.0dB  
-79.5dB  
-80.0dB  
-80.5dB  
-81.0dB  
-81.5dB  
-82.0dB  
-82.5dB  
-83.0dB  
-83.5dB  
-84.0dB  
-84.5dB  
-85.0dB  
-85.5dB  
-86.0dB  
-86.5dB  
-87.0dB  
-87.5dB  
-88.0dB  
-88.5dB  
-89.0dB  
-89.5dB  
-90.0dB  
-90.5dB  
-91.0dB  
-91.5dB  
-92.0dB  
-92.5dB  
-93.0dB  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
Volume  
Channel  
Select  
Chip  
Select  
0
0
1
1
-93.5dB  
1
0
1
1
1
0
1
1
-94.0dB  
-94.5dB  
-95.0dB  
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Prohibition  
1
1
1
1
1
1
1
1
www.rohm.com  
TSZ02201-0C2C0E100060-1-2  
06.Aug.2014 Rev.001  
17/27  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
Daattaasshheeeett  
BD34700FV  
Select Address No.7 Setting Table  
Function & Setting D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
11msec  
5msec  
7msec  
14msec  
3msec  
2msec  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
BA  
switching-time  
Prohibition  
Base  
clock  
11msec  
5msec  
7msec  
14msec  
3msec  
2msec  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
System  
Reset  
Chip  
Select  
0
0
0
0
1
1
1
AB  
switching-time  
Prohibition  
x1  
0
1
×1/2  
BA  
switching-time  
Normal  
Reset  
0
1
Base  
clock  
: Initial condition  
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BD34700FV  
Volume changing needs the time that is following Figure. (Ex. It selected 11msec, 22msec need.)  
Current XdB  
Send YdB  
Changed YdB  
[A->B switching time] [B->A switching time]  
Prossing Time  
Figure 11. About [AB switching-time] [BA switching-time]  
Base clock is able to change Internal Oscillator Frequency. For example, when Base clock select ×1/2,  
A->B and B->A switching time is to be two times. (ex. 11msec->22msec)  
Caution on send data  
When send the same channel data among the switching process, internal operation is as below.  
Invalid data  
CLK  
DATA  
Processing time per  
1
Processing time per  
1
A->B switching time  
B->A switching time  
A->B switching time  
B->A switching time  
IC  
processing  
Output  
Initial  
Initial → ① →  
② → ④  
Figure 12. The switching process with send data  
data is sent during A -> B switching time, it is valid.  
data and data are sent during B -> A switching time, it is valid at the next processing time.  
But data is replaced by data.  
About pop noise in gain changing  
The level of the pop noise sometimes varies in the difference in output DC offset of the inside condition A and B.  
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TSZ02201-0C2C0E100060-1-2  
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Daattaasshheeeett  
BD34700FV  
Application Circuit Diagram  
VOUTL2  
VOUTR2  
VOUTR1  
VOUTL1  
10μ  
10μ  
10μ  
10μ  
34 33 32 31 30 29 28 27  
26  
25  
22  
21  
+32dB~95dB  
0.5dB step  
LOGIC  
1
10  
11  
12 13 14  
4 5  
7
8
9
16  
17 18 19  
20  
VINL1  
VINR1  
VINL2  
VINR2  
47μ  
2200p  
47μ  
2200p  
VCC  
VEE  
Figure 13. Application Circuit Diagram  
Notes on wiring  
GND shall be wired from reference point and thicken.  
Wiring pattern of CL and DA shall be away from that of analog unit and cross-talk shall not be acceptable.  
Lines of CL and DA of shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other.  
Please pay attention the wiring pattern of the input terminal of the input selector to the cross talk. Recommend that  
wiring period is shielded.  
Please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to VCC and  
GND, VEE.  
1pin have to connect to 20-pin(VEE), if you don’t connect like as this note, IC may occurred  
“latch-up or ESD damaged”.  
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TSZ02201-0C2C0E100060-1-2  
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06.Aug.2014 Rev.001  
TSZ2211115001  
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Power Dissipation  
About the thermal design by the IC  
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum  
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two  
standpoints of immediate damage and long-term reliability of operation.  
Reference data  
SSOP-B40  
Measurement condition: ROHM Standard board  
board Size70×70×1.6()  
materialA FR4 grass epoxy board  
2.0  
1.0  
(3% or less of copper foil area)  
1.12W  
θja = 111.1°C/W  
0.0  
85  
0
25  
50  
75  
100  
125  
150  
Ambient Temperature Ta(°C)  
Figure 14. Temperature Derating Curve  
Note) Value is actual measurements and is not guaranteed.  
Power dissipation values vary according to the board on which the IC is mounted.  
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© 2014 ROHM Co., Ltd. All rights reserved.  
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BD34700FV  
I/O equivalence circuit(s)  
Terminal  
Number  
Terminal  
Name  
Terminal  
Voltage (V)  
Equivalent Circuit  
Description of terminal  
Negative power supply terminal  
Vcc  
1
VEES  
-7  
Vee  
4
5
Analog ground terminals.  
Vcc  
11  
12  
13  
27  
28  
29  
30  
31  
32  
33  
34  
AGND  
0
Vee  
Positive power supply terminal and  
Negative power supply terminal  
16  
20  
VCC  
VEE  
+7  
-7  
Vcc  
Digital ground terminal.  
17  
DGND  
0
Vee  
Vcc  
Input terminals for a clock and data.  
18  
19  
14  
DA  
CL  
-
CHIP  
Vee  
Vcc  
Output terminals for analog sound signal.  
21  
22  
25  
26  
VOUTR2  
VOUTL2  
VOUTR1  
VOUTL1  
0
Vee  
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Terminal  
Number  
Terminal  
Name  
Terminal  
Voltage (V)  
Equivalent Circuit  
Description of terminal  
Vcc  
Input terminals for stereo sound signal.  
Input impedance is 47k(Typ.).  
7
8
9
VINL1  
VINR1  
VINL2  
VINR2  
47k  
0
10  
Vee  
TEST terminals  
2
3
23  
24  
37  
38  
39  
40  
TEST  
0
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Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply terminals.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3.  
4.  
VEE Voltage  
Ensure that no pins are at a voltage below that of the VEE pin at any time, even during transient condition.  
Ground Wiring Pattern  
GND pins which are digital ground(17pin) and analog ground(4,5,11,12,13,27,28,29,30,31,32,33,34pin) are not  
connected inside LSI. These ground pins traces should be routed separately but connected to a single ground at the  
reference point of the application board. Also ensure that the ground traces of external components do not cause  
variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum  
rating, increase the board size and copper area to prevent exceeding the Pd rating.  
6.  
7.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately  
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.  
Rush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush  
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC  
has more than one power supply. Therefore, give special consideration to power coupling capacitance,  
power wiring, width of ground wiring, and routing of connections.  
8.  
9.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to IC pin may subject the IC to stress.  
Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned  
off completely before connecting or removing it from the test setup during the inspection process. To prevent damage  
from static discharge, ground the IC during assembly and use similar precautions during transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)  
and unintentional solder bridge deposited in between pins during assembly to name a few.  
11. Unused Input Terminals  
Because the input impedance of the terminal becomes 47kwhen the signal input terminal makes a terminal open,  
the plunge noise from outside sometimes becomes a problem. Please connect the no using input pin to GND. And  
please open the no using output pin.  
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Operational Notes – continued 1  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When Vee > Pin A and Vee > Pin B, the P-N junction operates as a parasitic diode.  
When Vee > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the Vee voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor( NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
N
P+  
N
P+  
P
P+  
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
Vee Vee  
P Substrate  
Vee  
Vee  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 15. Example of monolithic IC structure  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. About power ON/OFF  
1. At power ON/OFF, a pop sound will be generated and, therefore, use MUTE on the set.  
2. When turning on power supplies, Vee and Vcc should be powered on simultaneously or Vee first; then followed  
by Vcc. If the Vcc side is started up first, an excessive current may pass Vcc through Vee.  
15. About function switching  
When switching Input Selector, Mode selector or Input Gain, use MUTE on Volume.  
16. Volume gain switching  
In case of the boost of the volume when changing to the high gain which exceeds +20dB especially, the switching  
pop noise sometimes becomes big. In this case, we recommend changing every 1 dB step without changing a gain at  
once. Also, the pop noise sometimes can reduce by making micro-step volume switching time long, too.  
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TSZ02201-0C2C0E100060-1-2  
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Operational Notes – continued 2  
17. Output load characteristic  
The usages of load for output are below (reference). Please use the load more than 10 k(TYP).  
Output terminal  
Terminal  
No.  
Terminal  
Name  
Terminal  
No.  
Terminal  
Name  
21  
22  
VOUTR2  
VOUTL2  
25  
26  
VOUTR1  
VOUTL1  
5
4.5  
4
3.5  
3
2.5  
2
Vcc=+7V  
1.5  
1
Vee=-7V  
THD+n=1%  
BW=40030kHz  
0.5  
0
100  
1000  
10000  
100000  
Load Resistance  
Ω
Figure 16. Output load characteristic at Vcc=+7V, Vee=-7V(Reference)  
18. About TEST and N.C pins treatment  
About the next pin of the TEST and NC designator, please handle it as follows  
Pin number  
2,3,37,38,39,40  
6,15,23,24,35,36  
How to countermeasure  
Short to GND  
OPEN (None connection)  
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Ordering Name Selection  
F
V
B D 3  
4
7
0
0
E 2  
Package  
FV: SSOP-B40  
Tape and Reel Information  
E2: Reel type embossed taping  
(SSOP-B40)  
Part Number  
Physical Dimension Tape and Reel Information  
SSOP-B40  
<Tape and Reel information>  
13.6 0.2  
Tape  
Embossed carrier tape  
(MAX 13.95 include BURR)  
Quantity  
2000pcs  
40  
21  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
20  
0.15 0.1  
0.1  
S
0.65  
0.22 0.1  
Direction of feed  
1pin  
M
0.08  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
Marking Diagram  
SSOP-B40(TOP VIEW)  
Part Number Marking  
LOT Number  
BD34700FV  
1PIN MARK  
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Revision History  
Date  
Revision  
001  
Changes  
6.Aug.2014  
New Release  
www.rohm.com  
TSZ02201-0C2C0E100060-1-2  
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28/27  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice – GE  
Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice – GE  
Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  

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