BD3506EFV-E2_技术文档

High Performance Regulators for PCs

Nch FET Ultra LDO

for PC Chipsets

BD3506F,BD3506EFV

No.10030EAT30

Description

The BD3506F/EFV is an ultra-low dropout linear regulator for chipset that can achieve ultra-low voltage input to ultra-low

voltage output. By using N-MOS FET for built-in power transistor, the regulator can be used at ultra-low I/O voltage

difference up to voltage difference generated by ON resistor (Ron = 120 mΩ/100 mΩ). Because by reducing the I/O voltage

difference, large current (Iomax = 2.5A) output is achieved and conversion loss can be reduced, switching power supply can

be replaced. BD3506F/EFV does not need any choke coil, diode for rectification and power transistors which are required

for switching power supply, total cost of the set can be reduced and compact size can be achieved for the set. Using

external resistors, optional output from 0.65V to 2.5V can be set. In addition, since voltage output start-up time can be

adjusted by using the NRCS terminal, it is possible to meet the power supply sequence of the set.

Features

1) Built-in high-accuracy reference voltage circuit (0.65V±1%)

2) Built-in VCC low input maloperation prevention circuit (Vcc = 4.15V)

3) Reduced rush current by NRCS

4) Built-in ultra-low on-resistor (120/100 mΩ typ) Nch Power MOSFET (BD3506F/BD3506EFV)

5) Built-in current limiting circuit (2.5A min)

6) Built-in thermal shutdown circuit

7) Output variable type (0.65-2.5V)

8) Adoption of SOP8 package (BD3506F): 5.0 x 6.2 x 1.5 (mm)

9) Adoption of high power HTSSOP-B20 package (BD3506EFV): 5.0 x 6.4 x 1.0 (mm)

Applications

Mobile PC, desktop PC, LCD-TV, DVD, digital home appliances

●Line up

Parameter

BD3506F

120mꢀ

2.5A

BD3506EFV

100mꢀ

Ron

Output Current

Package

2.5A

SOP8

HTSSOP-B20

●Absolute Maximum Ratings(Ta=25℃)

Ratings

BD3506EFV

Parameter

Symbol

Unit

BD3506F

7 *¹

Input Voltage1

VCC

VIN

7 *¹

V

Input Voltage2

7 *¹

Enable Input Voltage

Power Dissipation1

Power Dissipation2

Operating Temperature Range

Storage Temperature Range

Ven

7

V

Pd1

560 *²

690 *³

-10～+100

-55～+125

+150

-

mW

℃

Pd2

1000 *⁴

-10～+100

-55～+125

+150

Topr

Tstg

Tjmax

℃

Maximum Junction Temperature

℃

*1 However, not exceeding Pd.

*2 In the case of Ta≥25°C (no heat radiation board), derated at 4.48 mW/°C.

*3 In the case of Ta≥25°C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 5.52 mW/°C.

*4 In the case of Ta≥25°C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 8.00 mW/°C.

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2010.05 - Rev.A

1/14

Technical Note

BD3506F,BD3506EFV

●Recommended Operating Conditions(Ta=25℃)

Ratings

Parameter

Symbol

Unit

MIN

4.3

MAX

5.5

VCC-1 *⁵

Input Voltage1

VCC

VIN

V

Input Voltage2

1.2

Output Voltage

Vo

VFB

-0.3

0.001

2.5

V

Enable Input Voltage

Ven

5.5

V

Capacitor in NRCS pin

CNRCS

1

µF

*5 However, irrespective of charging order of VCC and VIN.

* No radiation-resistant design is adopted for the present product.

●Electrical Characteristics (unless otherwise noted, Ta=25 VCC=5V Ven=3V VIN=1.8V R1=3.9KΩ R2=3.3KΩ)

Limits

Parameter

Symbol

Unit

Condition

MIN

TYP

0.7

0

MAX

Bias Current

Bias current

I_CC

I_ST

-

1.4

mA

-

10

-

µA Ven=0V

Shut-Down Mode Current

Output Voltage

V_OUT

Io

-

2.5

-

1.200

-

V

A

Io=50mA

-

Maximum Output Current

Maximum Short Current

Temperature coefficient of Output Voltage

Feed Back Voltage 1

Feed Back Voltage 2

Line Regulation 1

Iost

2.0

0.01

-

A

Vo=0V

Tcvo

V_FB1

V_FB2

Reg.l1

Reg.l2

Reg.L

dVo

-

%/℃

V

0.643 0.650 0.657

0.630 0.650 0.670

Io=50mA

V

Io=0 to 2A, Ta=-10 to 100℃*⁵

-

0.1

0.5

120

100

-

0.5

10

%/V VCC=4.3V to 5.5V

-

%/V VIN=1.2V to 3.3V

Line Regulation 2

-

mV Io=0 to 2A

Dropout Voltage (BD3506F)

Dropout Voltage (BD3506EFV)

Standby Discharge Current

[Enable]

-

200

160

-

mV Io=1A,VIN=1.2V, Ta=-10 to 100℃*⁵

mA Ven=0V, Vo=1V

dVo

Iden

150

High level Enable Input Voltage

Low level Enable Input Voltage

Enable pin Input Current

[Voltage Feed Back]

Enhi

Enlow

Ien

2

-0.3

-

5.5

0.8

10

V

7

µA Ven=3V

Feed Back terminal Bias Current

[NRCS]

I_FB

-100

0

100

nA

NRCS Charge Current

NRCS Standby Voltage

[UVLO]

Inrcs

V_STB

14

-

20

0

26

50

µA Vnrcs=0.5V

mV Ven=0V

VCC UVLO

V_CCUVLO4.00

Vcchys 100

4.15

160

4.30

220

V

Vcc:Sweep-up

VCC UVLO Hysteresis

mV Vcc:Sweep-down

*5 Design Guarantee

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2010.05 - Rev.A

2/14

Technical Note

BD3506F,BD3506EFV

●Reference Data

10

8

EN

Vin

⊿Vout

(50mV/div)

6

Vcc

Vo

4

Iout

(1A/div)

2

0

2

4

6

8

VIN(V)

Fig.1 Transient Response

Fig.2 Input Voltage

SequenceFinal Input Voltage

EN

Fig.3 VIN-IIN(Ta=25℃)

656

655

654

653

652

651

650

649

648

647

646

EN

Vin

EN

Vin

Vcc

Vo

Vcc

Vo

-10

10

30

50

70

90

Ta(

)

℃

Fig.4 Input Voltage

SequenceFinal Input Voltage

VIN

Fig.5 Ta-Vfb

Fig.6 Input Voltage

SequenceFinal Input Voltage

VCC

18

16

14

12

10

8

Vo

20mV/DIV

Vo

20mV/DIV

Io

1A/DIV

Io

1A/DIV

6

4

2

0

1

2

3

4

5

VEN(V)

Fig.7 Transient Response (rise)

Cout=100uF

Fig.8 Transient Response (fall)

Cout=100uF

Fig.9 VEN-IEN

EN

2V/DIV

Vo

20mV/DIV

EN

2V/DIV

NRCS

0.5V/DIV

NRCS

0.5V/DIV

Io

1A/DIV

Vo

0.5V/DIV

Vo

0.5V/DIV

Fig.10 Transient Response (rise)

Cout=220uF

Fig.11 Start up Wave Form

Fig.12 Shut down Wave Form

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2010.05 - Rev.A

3/14

Technical Note

BD3506F,BD3506EFV

700

600

500

400

300

200

100

0

Vo

20mV/DIV

Vo

50mV/DIV

Io

1A/DIV

Io

1A/DIV

0

0.2

0.4

0.6

0.8

1

1.2

VNRCS(V)

Fig.13 VNRCS-VFB

Fig.14 Transient Response (fall)

Cout=220uF

Fig.15 Transient Response (rise)

47u MLCC+30mꢀ

Vo

50mV/DIV

Io

1A/DIV

Fig.16 Transient Response (fall)

47u MLCC+30mꢀ

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2010.05 - Rev.A

4/14

Technical Note

BD3506F,BD3506EFV

●Block Diagram

◎BD3506F

VCC

4

VCC

VIN

Vo1

Current

Limit

UVLO

Enable

CL

VIN

2

EN

Reference

Block

1

7

8

Vo

CL

Vo2

VFB

EN

UVLO

TSD

R2

Thermal

3

Shutdown

NRCS

R1

TSD

6

5

NRCS

GND

◎BD3506EFV

VCC

17

VIN1

VIN2

VCC

14

15

VIN

Current

Limit

CL

UVLO

EN

13

Reference

Block

VCC

Vo1

Vo2

5

6

Vo3

Vo4

Vo5

Vo6

7

Vo

8

CL

9

EN

UVLO

TSD

10

R2

R1

Thermal

FB

16

Shutdown

NRCS

4

TSD

2

3

20

GND

NRCS

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2010.05 - Rev.A

5/14

Technical Note

BD3506F,BD3506EFV

●Pin Configration and Pin Function

◎BD3506F

○Pin Configration

○Pin Function

No.

Name

PIN FUNCTION

EN 1

8 VO2

1

2

3

4

5

6

7

8

EN

Enable Pin

Input Voltage Pin

VIN

FB

VIN

VO1

7

2

Output Voltage Feedback

Power Source

FB 3

6 NRCS

VCC

GND

NRCS

VO1

VO2

GND

5

VCC 4

Ground Pin

NRCS(Non Rush Current on Start Up)

time setup

VO1 Pin

VO2 Pin

◎BD3506EFV

○Pin Configration

○Pin Function

No.

Name

PIN FUNCTION

1

N.C.

Non connection

Ground1 Pin

Ground2 Pin

N.C.

GND1

GND2

NRCS

2

3

GND1

GND2

1

2

3

20

19

18

17

16

15

14

13

GND3

N.C.

NRCS(Non Rush Current on Start Up)

time setup

4

NRCS

5

VO1

VO2

VO3

VO4

VO5

VO6

N.C.

EN

VO1 Pin

N.C.

VCC

6

VO2 Pin

7

VO3 Pin

4

5

6

8

VO4 Pin

VO1

VO2

VO3

9

VO5 Pin

FB

10

11

12

13

14

15

16

17

18

19

20

VO6 Pin

VIN2

VIN1

Non connection

Enable Pin

7

8

9

VIN1

VIN2

FB

Input Voltage1 Pin

Input Voltage2 Pin

Output Voltage Feedback

Power Source

Non connection

Ground3 Pin

VO4

VO5

EN

12

11

N.C.

VCC

N.C.

GND3

VO6 10

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2010.05 - Rev.A

6/14

Technical Note

BD3506F,BD3506EFV

●Block Function

AMP

An error amplifier that compares reference voltage (VREF) to Vo and drives Nch FET (Ron = 120/100 mꢀ) of output. The

frequency characteristics are optimized so that low ESR functional polymer capacitor can be used for the output capacitor

and high-speed transient response can be achieved. The input voltage range at the AMP section is GND-2.5V and the

output voltage range of the AMP section is GND-VCC. At the time of EN OFF or UVLO, the output is brought to the LOW

level and the output NchFET is turned OFF.

EN

By the logic input pin, regulator ON/OFF is controlled. At the time of OFF, the circuit current is controlled to be 0 µA to

reduce the standby current consumption of the apparatus. In addition, EN turns ON FET that can discharge NRCS

terminal Vo and removes excess electric charge to prevent maloperation of IC on the load side. Since there is no

electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input

sequence.

UVLO

UVLO turned OFF output to prevent output voltage from making maloperation at the time of Vcc reduced voltage. Same

as EN, UVLO discharges NRCS Vo. When voltage exceeds the threshold voltage (TYP 4.15V), UVLO starts output.

CURRENT LIMIT

In the event the output current that exceeds the current (2.5A or more) set inside the IC flows when output is turned ON,

output voltage is attenuated to protect the IC on the load side. When current reduces, output voltage returns to the set

voltage.

NRCS

Connecting an external capacitor to the counter-GND of NRCS pin can achieve soft start. The output voltage startup time

is determined by the time when the NRCS terminal reaches VFB (0.65V). During start-up, the NRCS terminal serves as

a constant current source of 20 µA (Typ.) output, and charges the capacitor externally connected.

TSD (Thermal Shut down)

In order to prevent thermal breakdown and thermal runaway of the IC, the output is turned OFF when chip temperature

becomes high. In addition, when temperature returns to the specified temperature, the output is recovered. However,

since the temperature protection circuit is originally built in to protect the IC itself, thermal design within Tj(max) is

requested.

VIN

This is a large-current supply line. The VIN terminal is connected to the rain of output NchFET. Since there is no

electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input

sequence. However, because there is body Di of output NchFET between VIN and Vo, there is electrical connection

(Di-connection) between VIN and Vo. Consequently, when the output is turned ON/OFF by VIN, reverse current flows

from Vo to VIN, to which care must be taken.

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2010.05 - Rev.A

7/14

Technical Note

BD3506F,BD3506EFV

●Timing Chart

EN ON/OFF

VIN

VCC

EN

NRCS

Vo

Start up Time

t

V_CC

ON/OFF

VIN

VCC

EN

UVLO

hysteresis

NRCS

Vo

Start up Time

t

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2010.05 - Rev.A

8/14

Technical Note

BD3506F,BD3506EFV

●Evaluation Board

■BD3506F Evaluation Board Circuit

U1

EN

BD3506F

Vo

1

2

3

4

8

7

6

5

EN

VO2

VO1

VIN

Cin1

VCC

Ccc

CO

R1

R2

VIN

FB

NRCS

GND

C_NRCS

VCC

■BD3506F Evaluation Board Application Components

Part No Value

Company

ROHM

Parts Name

BD3506F

Part No Value

Company

MURATA

Parts Name

GRM18 Series

GRM21 Series

2R5TPE220MF

GRM18 Series

U1

R1

R2

-

Ccc

Cin1

Co

1µF

3.3k

3.9k

MCR03Series

10µF

ROHM

220µF SANYO,etc

0.01µF MURATA

C6

■BD3506F Evaluation Board Layout

Silk Screen

TOP Layer

Bottom Layer

For Evaluation Board, BD3506EFV is available.

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2010.05 - Rev.A

9/14

Technical Note

BD3506F,BD3506EFV

●Recommended Circuits

R2

VOUT(1.2V)/2.5A

1

8

+

C3

Ven

2

3

7

6

C2

VIN

R1

C4

4

5

C1

Vcc

Part No

Value

Notes for use

The present IC can set output voltage by external reference voltage (VR) and value of output voltage

setting resistors (R1, R2). Output voltage can be set by VRxR2/(R1+R2) but it is recommended to

use at the resistance value (total: about 10 kꢀ) which is not susceptible to VREF bias current (±100

nA).

R1/R2 6.5k/5.5k

Connect the output capacitor between Vo1, Vo2 terminals and GND terminal without fail in order to

stabilize output voltage. The output capacitor has a role to compensate for the phase of loop gain

and to reduce output voltage fluctuation when load is rapidly changed. When there is an

insufficient capacity value, there is a possibility to cause oscillation, and when the equivalent serial

resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is

rapidly changed. About 100-µF high-performance electrolytic capacitors are recommended but

output capacitor greatly depends on temperature and load conditions. In addition, when only

ceramic capacitors with low ESR are used, or various capacitors are connected in series, the total

phase allowance of loop gain becomes not sufficient, and oscillation may result. Thoroughgoing

confirmation at application temperature and under load range conditions is requested.

C3

100µF

The input capacitor plays a part to lower output impedance of a power supply connected to input

terminals (Vcc). When output impedance of this power supply increases, the input voltages (Vcc,)

become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection

characteristics. The use of capacitors of about 0.1 µF with low ESR, which provide less capacity

value changes caused by temperature changes, is recommended, but since input capacitor greatly

depends on characteristics of the power supply used for input, substrate wiring pattern,

thoroughgoing confirmation under the application temperature and load range, is requested.

C1

C2

0.1µF

10µF

1µF

The input capacitor plays a part to lower output impedance of a power supply connected to input

terminals (VIN). When output impedance of this power supply increases, the input voltages (VIN)

become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection

characteristics. The use of capacitors of about 10 µF with low ESR, which provide less capacity

value changes caused by temperature changes, is recommended, but since input capacitor greatly

depends on characteristics of the power supply used for input, substrate wiring pattern,

thoroughgoing confirmation under the application temperature and load range, is requested.

To the present IC, there mounted is a function (Non Rush Current on Start-up: NRCS) to prevent

rush current from VIN to load and output capacitor via Vo at the output voltage start-up. When the

EN terminal is reset from High or UVLO, constant current is allowed to flow from the NRCS terminal.

By this current, voltage generated at the NRCS terminal becomes the reference voltage and output

voltage is started. In order to stabilize the NRCS set time, it is recommended to use a capacitor (B

special) with less capacity value change caused by temperature change.

C4

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2010.05 - Rev.A

10/14

Technical Note

BD3506F,BD3506EFV

●About heat loss

In designing heat, operate the apparatus within the following conditions.

(Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.)

1. Ambient temperature Ta shall be not more than 100°C.

2. Chip junction temperature Tj shall be not more than 150°C.

Chip junction temperature Tj can be considered under the following two cases.

①Chip junction temperature Tj is found from

IC surface temperature TC under actual

application conditions:

②Chip junction temperature Tj is found from ambient temperature Ta:

Tj=Ta+θj-a×W

Tj=TC+θj-c×W

＜Reference value＞

(IC only)

Single-layer substrate

(substrate surface copper foil area: less 3%)

Single-layer substrate

θj-a:SOP8 222.0℃/W

181.0℃/W

＜Reference value＞

θj-c:SOP8 41.0℃/W

HTSSOP-B20 45.0℃/W

Substrate size:70×70×1.6mm

(Substrate surface capper

foil area:less3%)

(substrate surface copper foil area: less 3%))

2nd-layer

θj-a:HTSSOP-B20 125.0℃/W

(substrate surface copper foil area:15×15mm²)

2nd-layer

86.2℃/W

54.3℃/W

39.1℃/W

θj-a:HTSSOP-B20 125.0℃/W

86.2℃/W

(substrate surface copper foil area: 70×70mm²)

4th-layer

54.3℃/W

39.1℃/W

(substrate surface copper foil area: 70×70mm²)

Substrate size 70×70×1.6mm³(thermal vias in the board.)

Most of heat loss in BD3506F/EFV occurs at the output Nch FET. The power lost is determined by multiplying the voltage

between VIN and Vo by the output current. Confirm voltage and output current conditions of VIN and Vo used, and

collate them with the thermal derating characteristics. Because BD3506EFV employs the power PKG, the thermal

derating characteristics significantly vary in accord with the pc board conditions. When designing, care must be taken to

the size of a pc board to be used.

Power dissipation (W) = {Input voltage (VIN) – Output voltage (V0≒VREF)}×Io (averaged)

Ex.) If VIN = 1.8 volts, V0=1.2 volts, and Io (averaged)=1.5 A, the power dissipation is given by the following:

Power dissipation (W) =(1.8 volts – 1.2 volts) × 1.5 (A)

= 0.9 W

●Equivalent Circuit

Vcc

1kΩ

NRCS

VIN

1kΩ

10kΩ

1kΩ

Vcc

1kΩ

VFB

1kΩ

EN

Vo1

Vo2

350kΩ

1kΩ

100kΩ

50kΩ

10kΩ

20pF

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2010.05 - Rev.A

11/14

Technical Note

BD3506F,BD3506EFV

●Notes for use

1. Input terminals (VCC,VIN,EN)

In the present IC, EN terminal, VIN terminal, and VCC terminal have an independent construction. In addition, in order to

prevent malfunction at the time of low input, the UVLO function is equipped with the VCC terminal. They begin to start

output voltage when all the terminals reach threshold voltage without depending on the input order of input terminals.

2. Operating range

Within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature

within the range specified. The values specified for electrical characteristics may not be guaranteed, but drastic change

may not occur to such characteristics within the operating range.

3. Permissible dissipation

With respect to the permissible dissipation, the thermal derating characteristics are shown in the Exhibit, which we hope

would be used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the permissible dissipation,

reduction of current capacity due to chip temperature rise, and other degraded properties inherent to the IC would result.

You are strongly urged to use the IC within the permissible dissipation.

4. Built-in thermal shutdown protection circuit

The thermal shutdown circuit is first and foremost intended for interrupt IC from thermal runaway, and is not intended to

protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use

the circuit with the activation of the circuit premised.

5. Inspection by set substrate

In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a

fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic

measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore,

when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig

and be sure to turn OFF power supply to remove the jig.

6. For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working

temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because

it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute

maximum rating, physical safety measures are requested to be taken, such as fuses, etc..

7. The use in the strong electromagnetic field may sometimes cause malfunction, to which care must be taken.

8. In the event that load containing a large inductance component is connected to the output terminal, and generation of

back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.

(Example)

OUTPUT PIN

9. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm

the characteristics before using the IC. In addition, when the IC is used with the external circuit changed, decide the IC

with sufficient margin provided while consideration is being given not only to static characteristics but also variations of

external parts and our IC including transient characteristics.

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2010.05 - Rev.A

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Technical Note

BD3506F,BD3506EFV

10.The present IC is a monolithic IC and has P⁺isolation between elements to separate elements and a P substrate.

With this P layer and N layer of each element, PN junction is formed, and various parasitic elements are formed.

For example, when resistors and transistors are connected to terminals as illustrated below,

○at the resistor, when GND>terminal A, and at transistor (NPN),

when GND>terminal B,PN junction works as a parasitic diode.

○at the transistor (NPN), when GND>terminal B,the parasitic NPN transistor is operated

by the N-layer of other element adjacent to the parasitic diode.

The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives

rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take

utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to

the input terminal.

(PIN A)

Resistor

NPN Transistor Structure (NPN)

B

(PIN A)

(PIN B)

C

E

Parasitic diode

GND

N

(PIN B)

P+

P

P+

P

N

C

N

B

Parasitic diode

P substrate

GND

E

P substrate

GND

Parasitic diode

Nearby other device

GND

Parasitic diode

●Power Dissipation

SOP8

HTSSOPB-20

7.0

5.0

②5.90W

PCB①：θja=125.0℃/W

PCB②：θja=86.2℃/W

PCB③：θja=54.3℃/W

PCB④：θja=39.1℃/W

6.0

4.0

3.0

2.0

1.0

5.0

①5.50 W

④3.20W

③2.30W

4.0

3.0

2.0

1.0

0.0

100

℃

②1.45W

①1.00W

0.0

0

25

50

75

100

125

150

25

50

75

100

125

150

Ambient Temperature：Ta(℃)

measure：TH-156(Kuwano-Denki)

①Without heat sink

measure condition：Rohm Standard Board

PCB size：70mm×70mm×1.6mmt(PCB with Thermal Via)

PCB①：Single-layer substrate

θj-a=222℃/W

②Mounted on board

70mm×70mm×1.6mm Glass-epoxy PCB

θj-a=181℃/W

PCB②：Double-layer substrate

(substrate surface copper foil area 15mm×15mm)

PCB③：Double-layer substrate

(substrate surface copper foil area 70mm×70mm)

PCB④：Fourth-layer substrate

(substrate surface copper foil area 70mm×70mm)

www.rohm.com

2010.05 - Rev.A

13/14

Technical Note

BD3506F,BD3506EFV

●Ordering part number

B D

3

5

0

6

E

F

V - E

2

Part No.

Package

Packaging and forming specification

E2: Embossed tape and reel

F

: SOP8

EFV : HTSSOPB-20

SOP8

5.0 0.2

(MAX 5.35 include BURR)

Tape

Embossed carrier tape

2500pcs

+

−

6

°

4°

4

°

Quantity

8

7

6

5

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2

3

4

0.595

+0.1

0.17

-

0.05

S

0.1

S

1.27

Direction of feed

1pin

0.42 0.1

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

HTSSOP-B20

6.5 0.1

(MAX 6.85 include BURR)

Tape

Embossed carrier tape (with dry pack)

(4.0)

Quantity

2500pcs

20

11

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

10

0.325

+0.05

0.17

-

0.03

S

0.08

S

0.65

+0.05

Direction of feed

1pin

0.24

-

0.04

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

www.rohm.com

2010.05 - Rev.A

14/14

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD3506EFV-E2
厂家：	ROHM
描述：	Fixed Positive LDO Regulator, 1.2V, 0.16V Dropout, CMOS, PDSO20, 5 X 6.40 MM, 1 MM HEIGHT, ROHS COMPLIANT, HTSSOP-20 光电二极管输出元件调节器
文件：	总17页 (文件大小：587K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD3506EFV-E2 [ROHM]

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