BD35395FJ-M [ROHM]

BD35395FJ-M是适用于JEDEC标准DDR1/2/3/3L-SDRAM的终端稳压器。内置N-MOSFET，漏型/源型最大可提供1A电流的线性电源。内部的OP-AMP采用高速设计，实现了优异的瞬态响应特性。为驱动内部的N-MOSFET，需要3.3V或5.0V偏压电源。为确保JEDEC规定的电压精度，本产品拥有独立的基准输入引脚（VDDQ）和独立的反馈引脚（VTTS），实现了优异的输出电压精度和负载调整率。Power Supply Reference BoardFor Xilinx’s FPGA Spartan-7;


型号：	BD35395FJ-M
厂家：	ROHM
描述：	BD35395FJ-M是适用于JEDEC标准DDR1/2/3/3L-SDRAM的终端稳压器。内置N-MOSFET，漏型/源型最大可提供1A电流的线性电源。内部的OP-AMP采用高速设计，实现了优异的瞬态响应特性。为驱动内部的N-MOSFET，需要3.3V或5.0V偏压电源。为确保JEDEC规定的电压精度，本产品拥有独立的基准输入引脚（VDDQ）和独立的反馈引脚（VTTS），实现了优异的输出电压精度和负载调整率。Power Supply Reference BoardFor Xilinx’s FPGA Spartan-7 驱动动态存储器双倍数据速率稳压器
文件：	总19页 (文件大小：1699K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Regulator IC Series for Automotive

Termination Regulator

for DDR-SDRAMs

BD35395FJ-M

General Description

Key Specifications

BD35395FJ-M is a termination regulator compatible with

JEDEC DDR1/2/3/3L-SDRAM, which functions as a linear

power supply incorporating an N-channel MOSFET and

provides a sink/source current capability up to 1A

respectively. A built-in high-speed OP-AMP specially

designed offers an excellent transient response.

Requires 3.3 volts or 5.0 volts as a bias power supply to

drive the N-channel MOSFET. Has an independent

reference voltage input pin (VDDQ) and an independent

feedback pin (VTTS) to maintain the accuracy in voltage

required by JEDEC, and offers an excellent output voltage

accuracy and load regulation.



Input Voltage Range:

2.7V to 5.5V

1.0V to 5.5V

1.0V to 2.75V

-1.0～1.0A(Max)

0.35Ω(Typ)

Termination Input Voltage:

VDDQ Reference Voltage:

Output Current:

Upper Side ON Resistance:

Lower Side ON Resistance:

Standby Current:

0.35Ω(Typ)

0.5mA (Typ)

Operating Temperature Range: -40°C to +105°C

Package(s)

W(Typ) x D(Typ) x H(Max)

4.90mm x 6.00mm x 1.65mm

SOP-J8

Features



Incorporates a push-pull power supply for

termination (VTT).



Incorporates an enabler.

Incorporates an under voltage lockout (UVLO).

Employs SOP-J8 package : 4.9×6.0×1.65(mm).

Incorporates a thermal shutdown protector (TSD).

Operates with input voltage from 2.7 to 5.5 volts.

Compatible with Dual Channel

(DDR1,DDR2,DDR3/DDR3L)



Incorporates PGOOD function.

Applications

 Power supply for DDR1/2/3/3L SDRAM

SOP-J8

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration(s)

TOP VIEW

PGOOD

GND

VTT

VTT_IN

VCC

VTTS

VDDQ

Pin Description(s)

Pin No.

Pin Name

PGOOD

GND

Function

PGOOD output pin

GND

VTTS

Detector Pin for Termination Voltage

ENABLE input pin

VDDQ

VCC

Reference Voltage Input Pin

VCC Pin

VTT_IN

VTT

Termination power supply Pin

Termination Output Pin

Block Diagram

VTT_IN

VCC

VDDQ

VCC

VDDQ

VTT_IN

VCC

UVLO

SOFT

Reference

Block

VTT

TSD

UVLO

VTT

TSD

UVLO

TSD

UVLO

Thermal

TSD

Protection

Enable

VTTS

PGOOD

Delay

Logic

GND

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Description of Block(s)

・VCC

In BD35395FJ-M, an independent power input pin is provided for an internal circuit operation of the IC. This is used to

drive the amplifier circuit of the IC, and its maximum current rating is 4mA. The power supply voltage is 2.7 to 5.5 volts.

It is recommended to connect a bypass capacitor of 1μF or so to VCC.

・VDDQ

Reference input pin for the output voltage that may be used to satisfy the JEDEC requirement for DDR1/2/3/3L-SDRAM

(VTT = 1/2VDDQ) by dividing the voltage inside the IC with two 100kΩ voltage-divider resistors.

For BD35395FJ-M, care must be taken to an input noise to VDDQ pin because this IC also cuts such noise input into half

and provides it with the voltage output divided in half. Such noise may be reduced with an RC filter consisting of such

resistance and capacitance (220Ω and 2.2μF, for instance) that may not give significant effect to voltage dividing inside the IC.

・VTT_IN

VTT_IN is a power supply input pin for VTT output. Voltage in the range between 1.0 and 5.5 volts may be supplied to

this VTT_IN terminal, but care must be taken to the current limitation due to on-resistance of the IC and the change in

allowable loss due to input/output voltage difference.

Generally, the following voltages are supplied:

・DDR1

・DDR2

・DDR3

・DDR3L

VTT_IN=2.5V

VTT_IN=1.8V

VTT_IN=1.5V

VTT_IN=1.35V

Higher impedance of the voltage input at VTT_IN may result in oscillation or degradation in ripple rejection, which must

be noted. To VTT_IN terminal, it is recommended to use a 10μF capacitor characterized with less change in

capacitance. But it may depend on the characteristics of the power supply input and the impedance of the pc board

wiring, which must be carefully checked before use.

・PGOOD

PGOOD pin is power good output pin. This is the open drain pin, so pull up resistor is connected via other power supply If

VTT voltage becomes over 1/2 ×VDDQ+30mV,or under 1/2 ×VDDQ+30mV, it outputs High voltage.

・VTTS

An isolated pin provided to improve load regulation of VTT output. In case that longer wiring is needed to the load at

VTT output, connecting VTTS from the load side may improve the load regulation.

・VTT

A DDR memory termination output pin. BD35395FJ-M has a sink/source current capability of ±1.0A respectively. The

output voltage tracks the voltage divided in half at VDDQ pin. VTT output is turned to OFF when VCC UVLO or thermal

shutdown protector is activated with EN pin level turned to “Low”. Do not fail to connect a capacitor to VTT output pin for

a loop gain phase compensation and a reduction in output voltage variation in the event of sudden change in load.

Insufficient capacitance may cause an oscillation. High ESR (Equivalent Series Resistance) of the capacitor may result

in increase in output voltage variation in the event of sudden change in load. It is recommended to use a 10μF or so

ceramic capacitor, though it depends on ambient temperature and other conditions.

・EN

With an input of 2.3 volts or higher, the level at EN pin turns to “High” to provide VTT output. If the input is lowered to

0.8 volts or less, the level at EN pin turns to “Low” and VTT status turns to Hi-Z.

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Absolute Maximum Ratings(Ta = 25°C)

Parameter

Symbol

Limit

Unit

Input Voltage

VCC

VEN

7 ^{(Note1) (Note2)}

1^(Note1)

Enable Input Voltage

Termination Input Voltage

VDDQ Reference Voltage

Output Current (when pulse is active^{(Note1 3)}

Power Dissipation1

VTT_IN

VDDQ

ITT

)

Pd1

563^(Note4)

675^(Note5)

℃

Power Dissipation2

Pd2

Operating Temperature Range

Storage Temperature Range

Topr

-40～+105

-55～+150

+150

Tstg

Maximum Junction Temperature

Tjmax

(Note 1) Should not exceed Pd.

(Note 2) Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.

(Note 3) Voltage under less than 10u sec.

(Note 4) Reduced by 4.50℃/W for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board)

(Note 5) Reduced by 5.40℃/W for each increase in Ta of 1℃ over 25℃ (when mounted on a 70mm×70mm×1.6mm glass epoxy board)

Recommended Operating Conditions(Ta= 25°C)

Limit

Parameter

Symbol

Unit

MIN

2.7

MAX

5.5

Input Voltage

VCC

VTT_IN

VDDQ

VEN

Termination Input Voltage

VDDQ Reference Voltage

Enable Input Voltage

1.0

5.5

1.0

2.75

5.5

-0.3

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Electrical Characteristics(Unless otherwise specified Ta=25℃, VCC=3.3V, VEN=3V, VDDQ=1.8V, VTT_IN=1.8V)

Limit

Parameter

Standby Current

Symbol

Unit

Condition

MIN

TYP

MAX

1.0

IST

0.5

mA VEN=0V

mA VEN=3V

Bias Current

[Enable]

ICC

High Level Enable Input Voltage VENHIGH

2.3

-0.3

5.5

0.8

Low Level Enable Input Voltage

Enable Pin Input Current

[Termination]

VENLOW

IEN

µA VEN=3V

Termination Output Voltage

(DDR2)

1/2×VDDQ

ITT=-1.0A to 1.0A

Ta=-40℃ to 105℃

VCC = 5.3V, VDDQ = 2.5V

VTT_IN = 2.5V

ITT=-1.0A to 1.0A

Ta=-40℃ to 105℃

VCC = 3.3V, VDDQ =1.5V

VTT_IN =1.5V

ITT=-1.0A to 1.0A

Ta=-40℃ to 105℃

VCC=3.3V, VDDQ=1.35V,

VTT_IN=1.35V

VTT2

VTT1

1/2×VDDQ

-30m

+30m

Termination Output Voltage

(DDR1)

1/2×VDDQ

-30m

+30m

Termination Output Voltage

(DDR3)

1/2×VDDQ

VTT3

1/2×VDDQ

-15m

+15m

Termination Output Voltage

(DDR3L)

1/2×VDDQ

-13.5m

1/2×VDDQ

+13.5m

VTT3L

ITT=-1.0A to 1.0A

Ta=-40℃ to 105℃

Source current

ITT+

ITT-

1.0

Sink current

-1.0

Load Regulation

Upper Side ON Resistance

Lower Side ON Resistance

[VREF]

⊿VTT

HRON

LRON

mV ITT=-1.0A to 1.0A

0.35

0.65

Input Impedance

[PGOOD]

ZVDDQ

140

200

260

kΩ

VTT PGOOD Low

Threshold voltage

VTT PGOOD High

Threshold Voltage

1/2×VDDQ

-30m

1/2×VDDQ

+30m

PGDLow

PGDHigh

PGDRon

PGDleak

PGDdelay

PGOOD output ON resistor

PGOOD output leakage current

PGOOD delay time

[UVLO]

µA PGOOD=6V

Threshold Voltage

VUVLO

2.35

120

2.50

180

2.65

240

VCC : sweep up

Hysteresis Voltage

⊿VUVLO

mV VCC : sweep down

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Typical Performance Curves

VTT(20mV/div)

VTT

source

ITT

source

ITT(1A/div)

sink

ITT(1A/div)

sink

ITT

(10µsec/Div.)

Figure 1. DDR3 (-1A→1A)

Figure 2. DDR2 (-1A→1A)

VTT(20mV/div)

VTT

source

ITT

ITT(1A/div)

sink

source

ITT(1A/div)

ITT

sink

(10µsec/Div.)

Figure 4. DDR3 (1A→-1A)

Figure 3. DDR1 (-1A→1A)

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Typical Performance Curves - continued

VTT(20mV/div)

VTT

source

ITT(1A/div)

ITT

sink

(10µsec/Div.)

Figure 5. DDR2 (1A→-1A)

Figure 6. DDR1 (1A→-1A)

VCC

VDDQ

VTT_IN

VTT

(2sec/Div.)

Figure 7. Input sequence1

Figure 8. Input sequence2

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Typical Performance Curves - continued

1050

1000

VCC

950

900

VDDQ

VTT_IN

850

800

VTT

(2sec/Div.)

750

-2

-1.5 -1.0

1.5

2.0

-0.5

0.5

1.0

ITT[A]

Figure.10 ITT-VTT(DDR2)

Figure 9. Input sequence3

900

850

1400

1350

1300

800

750

700

1250

1200

1150

1100

650

600

-2

-1.0

2.0

-1.5

0.5

1.0

1.5

-0.5

1.0

-1.5 -1.0

1.5

2.0

-2

0.5

-0.5

ITT[A]

Figure.12 ITT-VTT(DDR3)

Figure.11 ITT-VTT(DDR1)

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Typical Performance Curves - continued

VTT

PGOOD

(100µsec/Div.)

Figure.14 PGOOD Delay

(Start up-Shut down)

Fig.13 EN soft start

(DDR2)

PGOOD

(10µsec/Div.)

Fig.15 PGOOD Delay

(TSD OFF-TSD ON)

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Application Example

■ BD35395FJ-M Evaluation Board Circuit

C11

VCC

GND GND

SW1

VTT_IN

VTT

C8 C10

VTT_IN

VDDQ

VTT

VDDQ

C5, C6

VTTS

VCC

GND

PGOOD

C3,C4

PGOOD

■ BD35395FJ-M Evaluation Board Application Components

Designation Value

Company

ROHM

Part No.

Designation Value

Company

Part No.

BD35395FJ-M

10µF

KYOCERA CM21B106M06A

10kΩ

220Ω

0Ω

1µF

MCR031002

MCR032200

10µF

KYOCERA CM21B106M06A

2.2µF

KYOCERA CM105B225K06A

KYOCERA CM105B105K06A

C10

C11

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Power Dissipation

Thermal design must be conducted with the operation under the conditions listed below (which are the guaranteed

temperature range requiring consideration on appropriate margins etc);

1: Ambient temperature Ta: 105℃ or lower

2:Chip junction temperature Tj: 150℃ or lower

The chip junction temperature Tj can be considered as follows:

Most of heat loss in BD35395FJ-M occurs at the output N-channel FET. The power lost is determined by multiplying the

voltage between VIN and Vo by the output current. As this IC employs the power PKG, the thermal derating characteristics

significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be

used.

Power consumption (W) = Input voltage (V_{TT_IN})-Output voltage (V_TT≒1/2VDDQ) ×Io(Ave)

Example) Where V_{TT_IN}=1.8V, VDDQ=1.8V, Io(Ave)= 0.5A

Power consumption(W) = 1.8(V)-0.9(V) ×0.5(A)

= 0.45(W)

Heat dissipation characteristics

[W]

0.7

(1) 0.675W

0.6

(1) mounted on 70mm×70mm×1.6mm glass-epoxy board

0.5

θj-c=185.2℃/W

(2) 0.563W

(2) With no heat sink

θj-a=222.2℃/W

0.4

0.3

0.2

105℃

0.1

100

125 150

[℃]

Ambient temperature [Ta]

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure xx. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Ordering Information

B D 3

F J

E 2

Part Number

Package

FJ:SOP-J8

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

SOP-J8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Part Number Marking

Package

SOP-J8

Orderable Part Number

35395

BD35395FJ-ME2

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Physical Dimension, Tape and Reel Information

Package Name

SOP-J8

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Revision History

Date

Revision

Changes

26.Feb.2014

5.Jun.2014

001

002

New Release

The specification is added for DDR3L. (P.5)

The item of “16. Over Current Protection Circuit (OCP)” in “Operational Notes” is deleted.

(P.13)

30.Nov.2017

003

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD35395FJ-M [ROHM]

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