BD35615HFV [ROHM]

Fixed Positive LDO Regulator, PDSO6, ROHS COMPLIANT, HVSOF-6;


型号：	BD35615HFV
厂家：	ROHM
描述：	Fixed Positive LDO Regulator, PDSO6, ROHS COMPLIANT, HVSOF-6 光电二极管输出元件调节器
文件：	总12页 (文件大小：773K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TECHNICAL NOTE

High-performance Regulator IC Series for PCs

300mA Linear Regulators

for Desktop PC

BD35613HFV/EFJ/HFN, BD35615HFV/EFJ/HFN, BD35618HFV/EFJ/HFN

●Description

BD3561□ series is a LDO regulator with output current 300mA. The output accuracy is±1% of output voltage. BD3561

□ series has some kinds of output voltage line-up and package line-up. Thus, it is used for the wide applications of

digital appliances. Over current protection (for protecting the IC destruction by output short circuit), shutdown ON/OFF

switch (for setting the circuit current 0μA at shutdown mode), and thermal shutdown circuit (for protecting ICs from heat

destruction by over load condition) are all built in.

●Features

1) Output current 300mA

2) Output voltage accuracy : ±1%

3) Built-in Over Current Protection circuit (OCP)

4) Built-in Thermal Shut Down circuit (TSD)

5) With shut down switch

6) Rich package line-up : HSON8, HTSOP-J8, HVSOF6

●Line-up

Product name

BD3561□HFN

BD3561□EFJ

BD3561□HFV

8.0V

○

5.0V

○

3.3V

○

Package

HSON8

○

HTSOP-J8

HVSOF6

○

Product name : BD3561□ □□□

Symbol

Output Voltage (V)

1□

□□□

HFN

EFJ

Package

HSON8

8.0V typ.

5.0V typ.

3.3V typ.

HTSOP-J8

HVSOF6

HFV

Oct. 2008

●Absolute maximum ratings (Ta=25℃)

Parameter

Symbol

Vcc

Limits

15.0 *¹

Unit

Power Supply Voltage

EN Voltage

VEN

15.0

HSON8

1350 ^*2

2110 ^*3

850.0 ^*4

-10～+100

-55～+150

+150

Power Dissipation

HTSOP-J8

HVSOF6

Operating Temperature Range

Storage Temperature Range

Topr

Tstg

℃

Junction Temperature

Tjmax

*1 Not to exceed Pd

*2 Reduced by 10.8mW for each increase in Ta of 1℃ over 25℃.

(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB. (copper foil area:100mm²))

*3 Reduced by 16.9mW for each increase in Ta of 1℃ over 25℃.

(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB, 2 layer)

*4 Reduced by 6.8mW for each increase in Ta of 1℃ over 25℃.

(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB. (copper foil area:100mm²))

●Operating Conditions (Ta=25℃)

Parameter

Input Power Supply Voltage

EN Voltage

Symbol

VCC

VEN

Min.

Max.

14.0

300

Unit

Vo+1.8

Output Current

★This product should not be used in a radioactive environment.

●ELECTRICAL CHARACTERISTICS

BD3561□HFN/EFJ/HFV (Unless otherwise noted, Ta=25℃, EN=3V, Vcc=12V)

Parameter

Symbol

Min.

Vo(T)×

0.99

Vo(T)×

0.985

Typ.

Max.

Vo(T)×

1.01

Vo(T)×

1.015

Unit

Conditions

Io=0mA

Output Voltage 1

Vo1

Vo(T)

Tj=0 to 100℃

Output Voltage 2

Vo2

Vo(T)

Io=0mA→300mA

EN=0V, @OFF mode

Circuit Current at shutdown mode

Bias Current

Isd

Icc

200

μA

300

Output Current Ability

300

Vcc=(Vo+1.8V)→14.0V,

Line Regulation

Reg.I

Io=300mA

EN Low Voltage

EN High Voltage

EN Bias Current

VEN (Low)

VEN (High)

IEN

0.8

14.0

5.0

2.4

0.5

1.0

μA

2/12

●Reference Data

BD35618HFV (Unless otherwise specified, Ta=25℃, EN=3V, Vcc=12V)

100mV/div

5V/div

200mA/di

5V/div

(20m sec/div)

(10μsec/div)

(0.2msec/div)

Fig.3 Waveform at output start

Co=1μF

Fig.2 Transient Response

Fig.1 Transient Response

(0→50mA)

Co=1μF

(50→0mA)

Co=1μF

5V/div

VCC

5V/div

VCC

5V/div

(1msec/div)

Fig.6 Input sequence 2

Co=1μF

(1sec/div)

(1msec/div)

Fig.5 Input sequence 1

Fig.4 Waveform at output OFF

Co=1μF

1.0

0.8

0.6

0.4

0.2

0.0

8.5

8.3

8.1

7.9

7.7

7.5

230

220

210

200

190

180

-10

100

-10

100

-10

Ta [ ]

℃

Ta [℃]

Ta [ ]

℃

Fig.7 Ta-Vo (Io=0mA)

Fig.8 Ta-Icc

(VEN=12V)

Fig.9 Ta-Icc

(Vcc=12V, VEN=0V)

2.0

1.6

1.2

0.8

0.4

0.0

8.20

8.10

8.00

7.90

7.80

7.70

100

-10

100

200

300

Ta [℃]

Io [mA]

Vcc [V]

Fig.12 Vcc-ISTB

(Vcc=12V, VEN=3V)

Fig.11 Io-Vo

Fig.10 Ta-IEN

(Vcc=12V, VEN=3V)

3/12

●Reference Data

BD35618HFV (Unless otherwise specified, Ta=25℃, EN=3V, Vcc=12V)

Vcc [V]

Fig.13 Vcc-Vo

●Heat Dissipation Characteristics

◎HSON8

◎HTSOP-J8

[W]

2.0

4.0

④3.76W

PCB size：70mm×70mm×1.6mmt

③1.75W

②1.35W

Board①：1 layer (copper foil area: less than 0.2%)

Board②：1 layer (copper foil area:7％)

Board③：1 layer (copper foil area:65％)

Board①：θja=153.2℃/W

Board②：θja=113.6℃/W

Board③：θja=59.2℃/W

Board④：θja=33.3℃/W

1.5

3.0

①：θja=198.4℃/W

②：θja=92.4℃/W

③：θja=71.4℃/W

③2.11W

1.0

0.5

2.0

1.0

①0.63W

②1.10W

①0.82W

100

125

150

[℃]

100

125

150

[℃]

Ambient Temperature [Ta]

◎HVSOF6

[W]

3.0

2.5

2.0

PCB size：70mm×70mm×1.6mm

Board①：1 layer (copper foil area:100mm²).

Board②：1 layer (copper foil area:900 mm²)

Board③：1 layer (copper foil area: 2500mm²)

③1.70W

②1.40W

1.5

1.0

①：θja=147.1℃/W

②：θja=89.3℃/W

③：θja=73.5℃/W

①0.85W

0.5

100

125

150

[℃]

Ambient Temperature [Ta]

4/12

●Block Diagram

(HSON8, HTSOP-J8)

(Vo+1.8)～14V

GND

Vcc

OCP

GND_S

SOFT

Ceramic

Capacitor

≧ 1uF

V_FB

TSD

(HVSOF6)

(Vo+1.8)～14V

Vcc

GND

OCP

GND_S

SOFT

Ceramic

Capacitor

≧ 1uF

V_FB

TSD

5/12

●Pin Function Table (HSON8, HTSOP-J8)

(HVSOF6)

Pin No.

Pin name

Vcc

Pin Function

Input Voltage Pin

Open

Pin No.

Pin name

Pin Function

Output Voltage Pin

GND Pin

N.C.

GND

GND_S

Output Voltage Pin

Open

GND Sense Pin

Enable Pin

N.C.

GND

GND_S

N.C.

GND Pin

N.C

Open

GND Sense Pin

Open

Vcc

Input Voltage Pin

Enable Pin

●Pin Layout (HSON8, HTSOP-J8)

(HVSOF6)

Vcc

N.C

GND

Vcc

N.C

GND_S

N.C

GND

6/12

●Evaluation Board Circuit (Vo=8.0V)

SW1

Vcc

N.C

Vcc

GND_S

GND

GND_S

GND

V_o

N.C

Gate

●Evaluation Board Parts List

Designation

Value

Part No.

Company

1uF

CM105B105K10A

KYOCERA

1uF

CM105B105K16A

KYOCERA

BD3561XHFV

ROHM

7/12

●Reference landing pattern

◎HSON8

MIE

(Unit : mm)

Lead pitch

landing pitch

landing length

≧l2

landing pitc

MIE

0.65

2.50

central pad pitch

0.40

0.35

central pad length

2.90

1.90

*It is recommended to design suitable for the actual application.

◎HVSOF6

MIE

(Unit:mm)

Lead pitch

landing pitch

MIE

landing length

landing pitch

0.50

3.00

0.55

0.25

central pad length

central pad pitch

1.60

2.60

*It is recommended to design suitable for the actual application.

8/12

●Operation Notes

1. Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any

over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as

fuses.

2. Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

3. Power supply lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to

ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the

circuit, not that capacitance characteristic values are reduced at low temperatures.

4. GND voltage

The potential of GND pin must be minimum potential in all operating conditions.

5. Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

6. Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

7. Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

8. ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

9. Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed

only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not

continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is

assumed.

TSD on temperature [°C] (typ.)

175

Hysteresis temperature [°C] (typ.)

BD3561XHFN/EFJ/HFV

10. Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.

Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or

removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic

measure. Use similar precaution when transporting or storing the IC.

9/12

11. Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be

used.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

element

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

12. Ground Wiring Pattern.

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing

a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations

caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND

wiring pattern of any external components, either.

10/12

●Type Designations (Ordering Information)

―

Package Type

Product Name

・BD35618

・BD35615

E2 Emboss tape reel opposite draw-out side: 1 pin

TR Emboss tape reel opposite draw-out side: 1 pin

・HFN : HSON8

・EFJ : HTSOP-J8

・HFV : HVSOF6

・BD35613

HSON8

Tape

Embossed carrier tape

Quantity

3000pcs

2.90 0.2

0.475

(2.2) (0.05)

Direction

of feed

(The direction is the 1pin of product is at the upper light when you hold

reel on the left hand and you pull out the tape on the right hand)

+0.1

0.13

−0.05

0.32 0.10

X X

0.65

X X

Direction of feed

1Pin

Reel

(Unit:mm)

※When you order , please order in times the amount of package quantity.

HVSOF6

Tape

Embossed carrier tape

(MAX 1.8 include BURR)

1.6 0.1

Quantity

3000pcs

Direction

of feed

(The direction is the 1pin of product is at the upper light when you hold

reel on the left hand and you pull out the tape on the right hand)

(1.2)

(1.4)

0.145 0.05

0.1 S

0.22 0.05

0.5

Direction of feed

1Pin

Reel

(Unit:mm)

※When you order , please order in times the amount of package quantity.

HTSOP-J8

4.9 0.1

Max5.25(include.BURR)

-4

(3.2)

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

(The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand)

+0.05

-0.03

0.17

0.545

+0.05

0.42

-0.04

0.08

1.27

0.08 S

Direction of feed

1Pin

Reel

※When you order , please order in times the amount of package quantity.

(Unit:mm)

11/12

BD35615HFV [ROHM]

相关型号：

BD35615HFV-TR

BD35618EFJ

BD35618EFJ-E2

BD35618HFN

BD35618HFN-TR

BD35618HFV

BD35618HFV-TR

BD35630HFV

BD35630HFV-TR

BD35631EFJ

BD35631EFJ-E2

BD35631F