BD37201NUX_技术文档

Datasheet

Power Supply IC for High Fidelity Audio

Linear Regulator for High Fidelity Audio

BD37201NUX

General Description

Key Specifications

BD37201NUX is a linear regulator of low noise (3.3

µVrms) which is most suitable to high quality audio

system. It operates at 2.7 V to 5.5 V and capable of

supplying a maximum load of 500 mA.

■

Input Voltage Range:

2.7 V to 5.5 V

1.0 V to 4.5 V

500 mA(Max)

Output Voltage Range:

Output Current:

Output Voltage Noise^{(Note 1)}

:

3.3 µVrms(10 Hz to 100 kHz, Typ)

PSRR^{(Note 2)}:90 dB(1 kHz, Typ), 55 dB(1 MHz, Typ)

Input Transient Response: 3 mV(1.0 V/µs, Typ)

In addition to the low noise, BD37201NUX has a high

PSRR and good input transient fluctuation

characteristic which makes it suitable for the

stabilization of DC/DC converter output, and an ideal

power supply to high precision analog circuits such as

D/A converter (DAC) and Clock generator.

■

Standby Current:

0.02 µA(Typ)

Operating Temperature Range: -10 °C to +85 °C

(Note 1) C_BC=10 µF, V_OUT=1 V, I_OUT=500 mA setting

(Note 2) C_OUT1=47 µF, C_OUT2=100 µF, V_OUT=1 V, I_OUT=500 mA setting

Furthermore, when BD37201NUX is placed in standby

mode, the supply current can be as small as 0.02 µA

(Typ) which can greatly reduce power consumption.

Package

VSON008X2030

W(Typ) x D(Typ) x H(Max)

2.00 mm x 3.00 mm x 0.60 mm

Features

■

Ultra Low Noise, High PSRR

Standby Mode that is controlled by Enable pin

Soft Start Function controlled by External

Capacitor

■

Under Voltage Lockout Protection, Over Current

Protection, Thermal Shutdown Protection

Applications

■

High Quality Audio Equipment

Power Supply for D/A Converter and Clock

Generator

VSON008X2030

Typical Application Circuit

V_IN=5.0 V

V_OUT=3.35 V

C_OUT1

10 µF 100 µF

Switching

Regulator

VIN

EN

VO

VS

C_IN

1 µF

C_OUT2

Clock

Generator

DAC

BAS

BAO

BC

R₁

120 kΩ

C_BC

1 µF

R₂

51 kΩ

GND

Figure 1. Basic Application Circuit Diagram (V_OUT=3.35 V)

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

1/23

TSZ22111 • 14 • 001

BD37201NUX

Pin Configuration

(TOP VIEW)

EXP-PAD

Figure 2. Pin Configuration

Pin Description

Pin No.

Pin Name

VO

Function

1

2

Output voltage

VS

Output voltage feedback

Ground

3

4

5

6

7

8

GND

BC

Bypass capacitor pin connected to ground

Enable

EN

BAO

BAS

VIN

Programmed voltage output

Programmed voltage feedback

Input voltage

The exposed pad should be connected to GND

pattern

-

EXP-PAD

Block Diagram

VIN

8

BG

100kΩ

REF

AMP

ERR

AMP

BC

CHARGE

VO

VS

1

2

OCP , TSD , UVLO

EN

5

6

7

4

3

BAS

BAO

BC

GND

Figure 3. Block Diagram

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

2/23

TSZ22111 • 15 • 001

BD37201NUX

Description of Block

1. Enable

Assuming EN is set to L, the IC can be set to standby state. In standby state, the output is OFF and since it will be in

static state, the power consumption can be reduced.

2. Rising, Falling, and EN Controlled Timing

2.45 V(Typ)

2.30 V(Typ)

V_IN

0.40 V(Typ)

0 V

1.6 V(Typ)

1.4 V(Typ)

EN

0 V

UVLO

H

L

(internal

signal)

OUTPUT

DISABLE

(internal

signal)

H

L

1.0 V

85 %

V_OUT

0 V

1.0 V

BC

0 V

15.3 ms

Soft start time

15.3 ms

Soft start time

EN ON

UVLO

release

EN OFF

UVLO

detect

time

UVLO

detect

UVLO

release

Figure 4. The Sequence Waveform During V_IN/EN Rising and Falling

(When at BC Capacitor 1 µF and V_OUT1.0 V Settings)

It will operate if EN is H and UVLO (Under Voltage Lockout) is released. In addition, when EN is L or UVLO is detected,

the regulator operation stops.

V_INdoes not have the necessity to supply earlier than EN.

The maximum slew rate of input voltage has to be set 1 V/µs or below.

3. Soft Start Function

In BD37201NUX, there exists a function that limits the rising speed of output when EN rises by the capacitor connected

to the BC pin due to decrease of inrush current of output. The rising speed depends on the internal charging current 100

µA (Typ), the capacitance value connected to the BC pin and on the output programmed voltage. It is about 15.3 ms

(Max) if capacitance of C_BCis 1 µF and output programmed voltage is 1.0 V, and almost 45.4 ms (Max) if output

programmed voltage is set to 3.35 V. The above is an aim level, and soft start time may change depending on the case

that the input voltage is less than the output voltage or the input and output voltage condition.

When EN ON / OFF repeating signal input during soft start time, soft start function doesn’t work. After the EN ON

operation, during the soft start time, EN ON / OFF operation that necessary to control not to perform.

4. REFAMP

REFAMP sets its output voltage. Refer Selection of Components Externally Connected about setting of output voltage.

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

3/23

TSZ22111 • 15 • 001

BD37201NUX

Description of Block – continued

5. BC

Noise at the output voltage of REFAMP is reduced because of the internal resistor 100 kΩ and the external capacitor of

the BC pin. In addition to it, the external capacitor of the BC pin also has a soft start function so the rising speed can be

adjusted by this value.

The higher value of capacitor will decrease the noise but the soft start time will be longer.

6. ERRAMP

The ERRAMP outputs the voltage set in REFAMP at voltage follower. The VS pin must be connected to the VO pin by

all means. In addition, the VS pin can decrease a voltage drop by the pattern resistance on the VO pin course by returning

the voltage from the supply point.

www.rohm.com

TSZ02201-0V3V0A600100-1-2

4/23

TSZ22111 • 15 • 001

07.Feb.2019 Rev.004

BD37201NUX

Absolute Maximum Rating (Ta=25 °C)

Parameter

Symbol

Rating

Unit

Power Supply Voltage (PIN 8)

Pin Voltage (PIN 1, 2, 4, 5, 6, 7)

Storage Temperature Range

Junction Temperature

V_IN

V_PIN

-0.3 to +7.0

-55 to +150

150

V

Tstg

°C

Tjmax

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 3)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 5)}

2s2p^{(Note 6)}

VSON008X2030

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 4)}

θ_JA

308.3

43

69.6

10

°C/W

Ψ_JT

(Note 3) Based on JESD51-2A(Still-Air).

(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 5) Using a PCB board based on JESD51-3.

(Note 6) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Layer Number of

Measurement Board

Thermal Via^{(Note 7)}

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm

(Note 7) This thermal via connects with the copper pattern of all layers.

Recommended Operating Conditions

Parameter

Symbol

V_IN

Min

2.7

1.0

Typ

Max

Unit

V

Power Supply Voltage

-

5.5

4.5

Output Voltage Setting is within a

Possible Range

Output Current^{(Note 8)}

V_OUT

V

I_OUT

-

500

+85

mA

°C

Operating Temperature

Topr

-10

+25

(Note 8) Tjmax should not be exceeded.

Operating Condition

Parameter

Symbol

C_IN

Min

0.47

1

Typ

1

Max

Unit

Conditions

Film capacitors are

recommended

Film capacitors are

recommended

Electrolytic capacitors are

recommended

Input Capacitor^{(Note 9)}

-

µF

Output Capacitor 1^{(Note 9)(Note 10)}

Output Capacitor 2^{(Note 9)(Note 10)}

BC Capacitor^{(Note 9)(Note 10)}

C_OUT1

C_OUT2

C_BC

10

100

1

4.7

Film capacitors are

recommended

0.01

(Note 9) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.

(Note 10) Refer the Selection of Components Externally Connected written in Page 16 and Page 17, and decide the value of each capacitor.

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

5/23

TSZ22111 • 15 • 001

BD37201NUX

Electrical Characteristics

(Unless otherwise specified, V_IN=V_OUT+1.0 V or 2.7 V whichever is greater V_OUT=1.0 V Ta=25 °C C_OUT1=10 µF C_OUT2=100 µF

C_BC=1 µF I_OUT=5 mA V_EN=V_IN)

Parameter

Circuit Current

Symbol

Min

Typ

Max

Unit

Conditions

I_CC

I_STB

-

1.33

0.02

1.00

1

2.3

1.0

1.01

20

0.5

-

mA

μA

V

-

Standby Current

Reference Voltage

Line Regulation

Load Regulation

Dropout Voltage

PSRR 1 kHz

-

V_IN=5.5 V, V_EN=0 V

BAO Voltage

V_REF

0.99

D_VI

-

mV

V

V_IN=2.7 V to 5.5 V

I_OUT=0 A to 500 mA

I_OUT=500 mA, V_OUT=3.35 V

f=1 kHz

D_VL

3

V_SAT

0.2

90

PSRR_1kHz

PSRR_1MHz

dB

PSRR 1 MHz

55

-

f=1 MHz, C_OUT1=47 μF

BW=10 Hz to 100 kHz,

C_BC=10 µF, I_OUT=500 mA

Output Noise Voltage

V_NOISE

I_OCP

-

3.3

-

μVrms

Over Current Protection

Detect Current

500

mA

-

UVLO Detect Voltage

UVLO Release Voltage

EN Input H Level

V_UVLOH

V_UVLOL

V_THENH

V_THENL

I_EN

2.10

2.25

2.20

0.00

-

2.30

2.45

-

2.50

2.65

V_IN

V

-

V

-

EN Input L Level

-

0.60

2.10

V

-

EN Input Current

1.23

µA

V_EN=3 V

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

6/23

TSZ22111 • 15 • 001

BD37201NUX

Typical Performance Curves

(Unless otherwise specified, V_IN=V_OUT+1.0 V or 2.7 V whichever is greater V_OUT=1.0 V Ta=25 °C C_OUT1=10 µF C_OUT2=100 µF

C_BC=1 µF I_OUT=5 mA V_EN=V_IN)

10

100

V_OUT=1.0 V

V_OUT=3.35 V

I_OUT=500 mA

10

C_BC=0.1 µF

V_NOISE=6.91 µVrms

C_BC=0.1 µF

1

V_NOISE=35.44 µVrms

C_BC=1 µF

1

V_NOISE=3.51 µVrms

V_NOISE=5.69 µVrms

0.1

C_BC=10 µF

V_NOISE=3.33 µVrms

V_NOISE=3.72 µVrms

0.1

0.01

0.001

0.01

0.001

10

100

1 k

10 k

100 k

1 M

10

100

1 k

10 k

100 k

1 M

Frequency [Hz]

Figure 5. Noise Spectral Density vs Frequency

(V_OUT=1.0 V)

Figure 6. Noise Spectral Density vs Frequency

(V_OUT=3.35 V)

10

1

10

1

V_OUT=3.35 V

C_BC=1 µF

V_OUT=1.0 V

C_BC=1 µF

I_OUT=500 mA

V_NOISE=5.69 µVrms

V_NOISE=3.51 µVrms

I_OUT=50 mA

V_NOISE=4.98 µVrms

V_NOISE=3.39 µVrms

0.1

I_OUT=5 mA

V_NOISE=4.76 µVrms

V_NOISE=3.17 µVrms

0.01

0.001

0.01

0.001

10

100

1 k

10 k

100 k

1 M

10

100

1 k

10 k

100 k

1 M

Frequency [Hz]

Figure 7. Noise Spectral Density vs Frequency

(V_OUT=1.0 V)

Figure 8. Noise Spectral Density vs Frequency

(V_OUT=3.35 V)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

7/23

BD37201NUX

Typical Performance Curves – continued

10

1.020

1.015

1.010

1.005

1.000

0.995

0.990

0.985

0.980

I_OUT=500 mA

C_BC=1 µF

V_OUT=4.5 V

1

0.1

V_NOISE=6.42 µVrms

V_OUT=3.35 V

V_NOISE=5.69 µVrms

V_OUT=1.0 V

V_NOISE=3.51 µVrms

0.01

0.001

V_OUT=1.0 V

5

2

3

4

6

10

100

1 k

10 k

100 k

1 M

Input Voltage:V_IN[V]

Frequency [Hz]

Figure 9. Noise Spectral Density vs Frequency

Figure 10. Line Regulation (D_VI)

(V_OUT=1.0 V)

1.020

1.015

1.010

1.005

1.000

0.995

0.990

0.985

0.980

3.450

3.430

3.410

3.390

3.370

3.350

3.330

3.310

3.290

3.270

3.250

V_OUT=3.35 V

V_OUT=1.0 V

3

4

5

6

0

100

200

300

400

500

Input Voltage:V_IN[V]

Output Current:I_OUT[mA]

Figure 11. Line Regulation (D_VI)

(V_OUT=3.35 V)

Figure 12. Load Regulation (D_VL)

(V_OUT=1.0 V)

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

8/23

TSZ22111 • 15 • 001

BD37201NUX

Typical Performance Curves – continued

3.450

3.430

3.410

3.390

3.370

3.350

3.330

3.310

3.290

3.270

4

3

2

1

0

V_OUT=3.35 V

I_OUT=500 mA

V_OUT=3.35 V

3.250

0

100

200

300

400

500

0

1

2

3

4

5

6

7

Output Current:I_OUT[mA]

Input Voltage:V_IN[V]

Figure 13. Load Regulation (D_VL)

(V_OUT=3.35 V)

Figure 14. Output Voltage vs Input Voltage

(V_OUT=3.35 V)

2.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

I_OUT=0.0 A

1.5

1.0

0.5

0.0

V_OUT=3.35 V

V_OUT=1.0 V

0

1

2

3

4

5

6

7

0

1

2

3

4

5

6

7

Input Voltage:V_IN[V]

Figure 15. Circuit Current vs Input Voltage

Figure 16. Standby Current vs Input Voltage

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

9/23

TSZ22111 • 15 • 001

BD37201NUX

Typical Performance Curves – continued

4.0

3.5

3.0

2.5

1.020

1.015

1.010

1.005

1.000

0.995

0.990

0.985

0.980

2.0

V_OUT=3.35 V

V_OUT=1.0 V

1.5

1.0

0.5

0.0

0

200

400

600

800

1,000

-20

0

20

40

60

80

100

Output Current:I_OUT[mA]

Temperature:Ta [°C]

Figure 17. Output Voltage vs Output Current

Figure 18. Output Voltage vs Temperature

(V_OUT=1.0 V)

120

100

80

60

40

20

0

3.45

3.43

3.41

3.39

3.37

3.35

3.33

3.31

3.29

3.27

3.25

C_OUT1=10 µF

V_OUT=1.0 V

C_OUT1=47 µF

I_OUT=500 mA

-20

0

20

40

60

80

100

10

100

1 k

10 k

100 k

1 M

Frequency [Hz]

Temperature:Ta [°C]

Figure 19. Output Voltage vs Temperature

(V_OUT=3.35 V)

Figure 20. Power-Supply Rejection Ratio

(V_OUT=1.0 V)

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

10/23

TSZ22111 • 15 • 001

BD37201NUX

Typical Performance Curves – continued

120

100

80

60

40

20

0

100

80

60

I_OUT=0 A

40

I_OUT=0 A

I_OUT=5 mA

I_OUT=50 mA

20

0

V_OUT=1.0 V

C_OUT=47 µF

V_OUT=3.35 V

C_OUT1=47 µF

I_OUT=500 mA

10

100

1 k

10 k

100 k

1 M

10

100

1 k

10 k

100 k

1 M

Frequency [Hz]

Figure 21. Power-Supply Rejection Ratio

(V_OUT=1.0 V)

Figure 22. Power-Supply Rejection Ratio

(V_OUT=3.35 V)

120

100

80

60

40

20

0

120

100

80

60

40

20

0

V_OUT=3.35 V

I_OUT=50 mA

C_OUT=47 µF

V_OUT=3.35 V

I_OUT=500 mA

C_OUT1=47 µF

V_SAT=1.0 V

V_SAT=0.7 V

V_SAT=1.0 V

V_SAT=0.7 V

V_SAT=0.5 V

V_SAT=0.3 V

10

100

1 k

10 k

100 k

1 M

10

100

1 k

10 k

100 k

1 M

Frequency [Hz]

Figure 23. Power-Supply Rejection Ratio

(V_OUT=3.35 V)

Figure 24. Power-Supply Rejection Ratio

(V_OUT=3.35 V)

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

11/23

TSZ22111 • 15 • 001

BD37201NUX

Typical Performance Curves – continued

120

I_OUT=500 mA

C_OUT1=47 µF

EN: 2 V/Div

100

80

60

40

20

0

V_OUT: 200 mV/Div

V_OUT=1.0 V

V_OUT=3.35 V

V_OUT=4.5 V

10

100

1 k

10 k

100 k

1 M

Frequency [Hz]

Figure 25. Power-Supply Rejection Ratio

Figure 26. Soft Start

(V_OUT=1.0 V)

EN: 2 V/Div

V_IN: 2 V/Div

V_OUT: 1.0 V/Div

V_OUT: 10 mV/Div (AC)

Figure 27. Soft Start

(V_OUT=3.35 V)

Figure 28. Line Transient

(I_OUT=500 mA Slew Rate=1 V/µs V_OUT=1.0 V)

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

12/23

TSZ22111 • 15 • 001

BD37201NUX

Typical Performance Curves – continued

V_IN: 2 V/Div

V_OUT: 10 mV/Div (AC)

Figure 29. Line Transient

Figure 30. Line Transient

(I_OUT=500 mA Slew Rate=1 V/µs V_OUT=3.35 V)

(I_OUT=500 mA Slew Rate=0.2 V/µs V_OUT=1.0 V)

V_IN: 2 V/Div

I_OUT: 200 mA/Div

V_OUT: 10 mV/Div (AC)

V_OUT: 50 mV/Div (AC)

Figure 31. Line Transient

Figure 32. Load Transient

(I_OUT=500 mA Slew Rate=0.2 V/µs V_OUT=3.35 V)

(I_OUT=0 mA to 500 mA V_OUT=1.0 V)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

13/23

BD37201NUX

Typical Performance Curves – continued

I_OUT: 200 mA/Div

V_OUT: 50 mV/Div (AC)

Figure 33. Load Transient

(I_OUT=0 mA to 500 mA V_OUT=3.35 V)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

14/23

BD37201NUX

Application Examples

V_IN=2.7 V

V_OUT=1.0 V

VIN

EN

VO

VS

C_IN

1 µF

C_OUT2

100 µF

C_OUT1

10 µF

BAS

BAO

BC

C_BC

1 µF

GND

Parts

C_IN

C_OUT1

C_OUT2

C_BC

Maker

Rubycon

Toshin Kogyo

Rubycon

Value

1 µF

10 µF

100 µF

1 µF

Parts

16MU105M3216

16MU106M4532

1CUTSJ101M0

16MU105M3216

(Note) This application example is just one case. Actual setting will be decided after a thorough evaluation and verification in the set.

(Note) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.

Figure 34. Application Circuit 1 (V_OUT=1.0 V)

V_IN=5.0 V

V_OUT=3.35 V

VIN

EN

VO

VS

C_OUT2

100 µF

C_OUT1

10 µF

C_IN

1 µF

BAS

BAO

BC

R₂

51 kΩ

R₁

120 kΩ

C_BC

1 µF

GND

Parts

R₁

R₂

Maker

ROHM

Value

120 kΩ

51 kΩ

1 µF

10 µF

100 µF

1 µF

Part Number

MCR03EZPD1203

MCR03EZPD5102

16MU105M3216

16MU106M4532

1CUTSJ101M0

16MU105M3216

C_IN

Rubycon

Toshin Kogyo

Rubycon

C_OUT1

C_OUT2

C_BC

(Note) This application example is just one case. Actual setting will be decided after a thorough evaluation and verification in the set.

(Note) The value of R₁and R₂is set that R₁+ R₂becomes 100 kΩ or above.

The resistance for voltage setting is recommended the one that is 1 % accuracy or below.

(Note) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.

Figure 35. Application Circuit 2 (V_OUT=3.35 V)

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

15/23

TSZ22111 • 15 • 001

BD37201NUX

Selection of Components Externally Connected

V_IN

V_OUT

VIN

VO

VS

C_IN

C_OUT1

C_OUT2

EN

V_EN

BAS

BC

C_BC

R₂

R₁

BAO

GND

Figure 36. External Components Connection

1. Output Voltage Setting

To set output voltage, connect resistance of R₁between the BAO pin and the BAS pin and connect resistance of R₂in

between the BAS pin and GND. The value of R₁and R₂is set that R₁+ R₂becomes 100 kΩ or above. In addition, the

resistance for voltage setting is recommended the one that is 1 % accuracy or below. In the case to use 1 V setting, short

the BAS pin with the BAO pin.

푅 +푅

1

2

푉_푂푈푇= 푉

×

[V]

퐵퐴푆

푅

2

푉

퐵퐴푆

= ꢀ.0

[V] (Typ)

2. Output Capacitor C_OUT1,C_OUT2

Output capacitor C_OUT1should be selected 1 µF or above considering about the voltagemodulation, thermal characteristics,

and distribution of the value. Also, Output capacitor C_OUT2should be selected 4.7 µF or above considering about the

voltage modulation, thermal characteristics, and distribution of the value. Installation of output capacitor in the position

near the pin in between VO and GND is recommended. In addition, the rated voltage of capacitor should be set with

enough margins to output voltage.

The ESR of Output Capacitor C_OUT1effect the stability of IC operation. Refer the stable operation range for the selection

of Output Capacitor which is given in the reference data of Figure 37. This reference data is measured in combination of

the film capacitor of 10 µF and ESR in series to Output Capacitor C_OUT1and the electrolytic capacitor of 100 µF in parallel

to Output Capacitor C_OUT2. The Stable operation range of this graph is given by only the IC and load resistance. For actual

applications, the stable operating range is influenced by the wiring impedance of the PCB panel, input supply impedance

and load impedance. Therefore, verification of the final operating environment is needed.

100

Unstable Operation Range

10

1

Stable Operation Range

0.1

V_IN=5.0 V

V_OUT=3.35 V

-10 °C≤Ta≤+85 °C

0.01

0.0

0.1

0.2

0.3

0.4

0.5

Output Current:I_OUT[A]

Figure 37. ESR of C_OUT1vs Output Current

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

16/23

BD37201NUX

Selection of Components Externally Connected – continued

3. Input Capacitor C_IN

Input capacitor should be selected 0.47 µF or above considering about the voltage modulation, thermal characteristics,

and distribution of the value. Installation of input capacitor in the position close to the pin in between VIN and GND is

recommended also. In addition, the rated voltage of capacitor shall be set with enough margins with respect to input

voltage.

4. Filter Capacitor C_BC

Filter capacitor C_BCand built-in resistance formed a low pass filter that reduces the noise that appears in output voltage.

In addition, the filter capacitor C_BCalso has a soft start function because it limits the rush current of output when it starts.

The rising speed depends on the internal charging current 100 µA (Typ), the capacitance value connected to the BC pin

and on the output programmed voltage. The time of the soft start is about 15.3 ms (Max) if capacitance is 1 µF and output

programmed voltage is 1.0 V, and almost 45.4 ms (Max) if output programmed voltage is set to 3.35 V.

Because the higher value of capacitor will decrease the noise but the soft start time will be longer, it should be decided

that the proper value of the capacitance.

Refer the following calculation for C_BCcapacitance. Depending on the output capacitor, there is a possibility not to operate

properly.

ꢁ

+ꢁ

ꢂꢃꢄ2

ꢂꢃꢄ1

퐶_퐵ꢁ

≥

[F]

ꢅꢆꢆꢆ

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

17/23

TSZ22111 • 15 • 001

BD37201NUX

I/O Equivalence Circuits

VIN(PIN 8) / VO(PIN 1)

EN(PIN 5)

BAO(PIN 6)

VIN

VIN VIN

VIN(PIN 8)

EN(PIN 5)

BAO(PIN 6)

VO(PIN 1)

BAS(PIN 7)

BC(PIN 4)

VS(PIN 2)

VIN

BC(PIN 4)

BAS(PIN 7)

VS(PIN 2)

Figure 38. I/O Equivalence Circuits

PCB Layout Example

TOP

BOTTOM

(board size 60mm x 60mm, board thickness 1.6mm, material FR-4)

Figure 39. Circuit diagram of evaluation board

(Note) This PCB Layout example includes the test pattern also. This IC position is U1.

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

18/23

TSZ22111 • 15 • 001

BD37201NUX

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

www.rohm.com

TSZ02201-0V3V0A600100-1-2

19/23

TSZ22111 • 15 • 001

07.Feb.2019 Rev.004

BD37201NUX

Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 40. Example of monolithic IC structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

20/23

TSZ22111 • 15 • 001

BD37201NUX

Ordering Information

B D 3

7

2

0

1 N U

X

-

T R

Part Number

Package

NUX: VSON008X2030

Packaging and forming specification

TR : Embossed tape and reel

Marking Diagram

VSON008X2030 (TOP VIEW)

Part Number Marking

LOT Number

D 3 7

2 0 1

Pin 1 Mark

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

21/23

TSZ22111 • 15 • 001

BD37201NUX

Physical Dimension and Packing Information

Package Name

VSON008X2030

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

22/23

BD37201NUX

Revision History

Date

Revision

001

Changes

18.Apr.2016

New Release

Renewed the title

19.Mar.2018

002

Renewed Typical Performance Curves

Change the Output Capacitor

Renewed Typical Performance Curves

5.Oct.2018

7.Feb.2019

003

004

Change the Operating Temperature Range

www.rohm.com

TSZ02201-0V3V0A600100-1-2

07.Feb.2019 Rev.004

23/23

TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BD37201NUX
厂家：	ROHM
描述：	BD37201NUX是适合高音质音响组件的低噪声(3.3µVrms) 低饱和系列稳压器，工作时的输入电压为2.7～5.5V，拥有最大500mA的负载供应能力。BD37201NUX不仅噪声低，还具有高PSRR和优异的输入瞬态变动特性，不仅可用于降低DC/DC转换器的输出噪声，还适合向D/A转换器(DAC) 及时钟发生器等的高精度模拟电路供电。BD37201NUX的待机电流仅0.02µA (Typ) ，可大幅度减少待机时的功耗。ROHM Musical Device "MUS-IC""MUS-IC" Web Page 时钟转换器时钟发生器稳压器
文件：	总26页 (文件大小：2863K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD37201NUX [ROHM]

相关型号：

BD37201NUX-TR

BD37215MUV-E2

BD373

BD373/D10Z

BD373/D11Z

BD373/D26Z

BD373/D27Z

BD373/D28Z

BD373/D29Z

BD373/D74Z

BD373/D75Z

BD373/D81Z