BD3852MUZ-Z [ROHM]
BD3852MUZ-Z是对震动传感器的冲击检测信号进行放大的放大器IC，需要外接震动传感器使用。适合在HDD等控制用途进行冲击检测传感器的信号放大。本产品不仅S/N特性优异，而且内置陷波滤波器，用于减轻震动传感器的共振点的影响。;
| 型号： | BD3852MUZ-Z |
| 厂家： | 
ROHM |
| 描述： | BD3852MUZ-Z是对震动传感器的冲击检测信号进行放大的放大器IC，需要外接震动传感器使用。适合在HDD等控制用途进行冲击检测传感器的信号放大。本产品不仅S/N特性优异，而且内置陷波滤波器，用于减轻震动传感器的共振点的影响。 放大器 传感器 |
| 文件： | 总17页 (文件大小：1081K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Shock Sensor (Impact Sensor) IC
BD3852MUZ-Z
General Description
Key Specifications
BD3852MUZ-Z is connected with an external shock
sensor. It is equipped with a function to amplify the shock
detection signal from the shock sensor and transmit the
amplified signal externally.
It delivers high S/N characteristics and is ideal for control
system applications such as HDD processing.
Recommended Operating Power
Supply Voltage Range:
Notch Frequency:
Notch Attenuation Rate:
Current Consumption:
Recommended Operating
Temperature Range:
1.6 V to 2.3 V
31 kHz (Typ)
-23 dB (Max)
3.9 mA (Typ)
-40 °C to +85 °C
Features
Package
VQFN16Z3030A
W (Typ) x D (Typ) x H (Max)
3.0 mm x 3.0 mm x 0.4 mm
Operating Power Supply Voltage Range:
1.6 V to 2.3 V, Single Power Supply Operation
Freely Tunable Frequency Characteristics and the
Gain according to Applications
Built-in Notch Filter for Reducing the Effect of the
Shock Sensor Resonance Point
(fO: 31 kHz)
Applications
HDD/light Pick-up Shock Detection and Write
Protection
HDD/light Pick-up Inertial Force Fluctuation Feed
Forward Control
Typical Application Circuit
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configuration
Pin Description
Pin No.
Pin Name
EN
Function
Enable input pin (H input: Power ON, L input: Power saving)
Pull-down at 50 kΩ inside the IC
1
2
NC
Connect to the GND pin
Reference output pin (0.8 V)
OP-AMP2 non-inverting input pin
OP-AMP2 output pin
3
REF2
A2IP
A2O
4
5
6
A2IM
FO
OP-AMP2 inverting input pin
Filter output pin
7
8
NC
Connect to the GND pin
OP-AMP1 output pin
9
A1O
10
11
12
13
14
15
16
-
NC
Connect to the GND pin
Connect to the GND pin
Power supply voltage pin
OP-AMP1 non-inverting input pin
OP-AMP1 inverting input pin
Reference output pin (0.4 V)
Ground pin
NC
VCC
A1IP
A1IM
REF1
GND
EXP-PAD
The EXP-PAD connect to the GND pin
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Block Diagram
Description of Blocks
OP-AMP1: Detects the charge signal generated in the shock sensor by the charge amplifier configuration.
Filter: Amplifies by 13.9 dB with the preamplifier, and attenuates the fO component of the shock sensor resonance frequency
(Typ: 31 kHz) with the notch filter.
OP-AMP2: Serves as the amplifier for the signal amplification and the filter. (The gain is configurable using add-on R and C.)
VREF: Generates the REF1 and REF2 output voltages.
PS: Switches between the power saving and power ON states according to the EN pin input voltage.
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Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Power Supply Voltage
Input Voltage
VCC
VA1IM, VA1IP, VA2IM, VA2IP, VEN
VA1O, VA2O, VFO, VREF1, VREF2
Tjmax
4.5
V
V
-0.3 to VCC + 0.3
-0.3 to VCC + 0.3
150
Output Voltage
V
Maximum Junction Temperature
Storage Temperature
°C
°C
Tstg
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Power Dissipation
Parameter
Symbol
Pd
Rating
3.00
Unit
W
Power Dissipation(Note 1)
(Note 1) When a 114.3 mm x 76.2 mm x 1.6 mm glass epoxy substrate (JEDEC substrate) is mounted. Reduced at 24.9 mW/°C in Ta > 25 °C.
Recommended Operating Conditions
Operating Range
Parameter
Symbol
Unit
Min
1.6
-40
Typ
1.8
Max
2.3
VCC
V
Power Supply Voltage
Operating Temperature
Topr
+25
+85
°C
(Note 2) A short circuit between the adjacent pins, reverse connection, rotated connection, short circuit with the power supply, ground fault, and so on may
destroy the IC. Since an overload voltage or overload current may be applied to peripheral components, pay sufficient attention during the design and
installation.
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Electrical Characteristics (VCC = 1.8 V, Ta = 25 °C unless otherwise specified.)
Standard Values
Parameter
Symbol
Unit
Conditions
Min
1.6
Typ
3.9
Max
4.5
ICC
mA
μA
H input to the EN pin
L input to the EN pin
Current Consumption
ICCPS
-
-
10
1. EN Pin
Standard Values
Typ
Parameter
Symbol
Unit
Conditions
Min
Max
VIH1
VIL1
RUD
VCC x 0.7
-0.3
-
-
VCC + 0.3
V
V
Input Voltage
VCC x 0.3
65
Built-in Pull-down Resistance
35
50
kΩ
2. OP-AMP Characteristics
(1) OP-AMP1
Standard Values
Typ
Parameter
Symbol
VDC1
Unit
V
Conditions
Min
0.3
Max
0.5
Output DC Voltage
0.4
With no signal
Difference between the output
DC voltage with no load and the
output DC voltage when 80 µA is
subtracted
Difference between the output
DC voltage with no load and the
output DC voltage when 80 µA is
added
Output Load Fluctuations
(Source)
VSOURCE1
-100
-
-
-
mV
mV
Output Load Fluctuations
(Sink)
VSINK1
-
+100
(2) OP-AMP2
Parameter
Standard Values
Typ
Symbol
Unit
Conditions
Min
-50
Max
+50
Input Current
IIN
-
nA
V
When the A2IP and REF2 pins
are connected
Output DC Voltage 1
VDC21
VDC22
VOL2
VOH2
0.67
0.75
-
0.80
0.80
-
0.93
0.85
0.3
-
When 0.8 V is input to the A2IP
pin
Output DC Voltage 2
V
Output Voltage Range (L side)
Output Voltage Range (H side)
V
VCC - 0.3
80
-
-
V
Current flowing into the A2O pin
when VCC - 0.3 V is applied to the
A2O pin
Current flowing out of the A2O pin
when 0.3 V is applied to the A2O
pin
Output Source Current
Output Sink Current
IASO2
-
-
µA
μA
IASI2
80
-
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2. OP-AMP Characteristics – continued
(3) Filter
Standard Values
Typ
Parameter
Symbol
Unit
mV
Conditions
Min
200
Max
600
Output DC Voltage
VDC3
400
Difference between the output
DC voltage with no load and the
output DC voltage when 80 µA is
subtracted
Difference between the output
DC voltage with no load and the
output DC voltage when 80 µA is
added
Output Load Fluctuations
(Source)
VSOURCE3
-100
-
-
-
mV
mV
Output Load Fluctuations
(Sink)
VSINK3
-
+100
Voltage Gain
GV
-
-
13.9
-
-
dB
dB
Attenuation rate at fO = 31 kHz
when the signal amplitude of the
A1O pin is 5 mVpp
Notch Attenuation Rate
ATT
-23
(4) VREF
Standard Values
Typ
Parameter
Symbol
Unit
Conditions
Min
Max
0.45
REF1 Output Voltage
REF2 Output Voltage
VREF1
VREF2
VREF2SO
0.35
0.40
0.80
V
V
With no load
With no load
0.68
-100
0.92
-
Difference in the output DC
voltages with no load and when
80 µA is subtracted
Difference in the output DC
voltages with no load and when
80 µA is added
REF2 Output Load Fluctuations
(Source)
-
-
mV
mV
REF2 Output Load Fluctuations
(Sink)
VREF2SI
-
+100
Reference Data(Note 3)
(Note 3) No shipping test is performed for the reference data.
1. OP-AMP1
Standard Values
Typ
Parameter
Input Bias Voltage
Symbol
Unit
Conditions
Min
-
Max
-
VIN
ZIN
fT1
0.4
60
V
With no signal
Input Impedance
-
-
-
-
MΩ
MHz
GBW (Cut-off Frequency)
1.5
2. OP-AMP2
Standard Values
Typ
Parameter
Symbol
fT2
Unit
Conditions
Conditions
Min
-
Max
-
GBW (Cut-off Frequency)
1.5
MHz
3. Filter
Standard Values
Typ
Parameter
Symbol
fO
Unit
kHz
Min
-
Max
-
When the signal amplitude of the
A1O pin is 5 mVpp
Notch Frequency
31
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Reference Data – continued
4. Specifications of the EN Pin at Startup and during Power Saving
Standard Values
Typ
Parameter
Symbol
tSD
Unit
μs
Conditions
Min
-
Max
10
Time elapsed after the EN pin
input is changed from H to L until
the REF2 output voltage is
decreased to 10 % of VREF2 or
less
Shutdown Time
6
Time elapsed after the EN pin
input is changed from H to L until
the REF2 output voltage is
increased to 90 % of VREF2 or
more
Startup Time
tSU
-
10
50
ms
Application Example
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I/O Equivalence Circuits
(1) EN
(3) REF2
(4) A2IP
(5) A2O
(6) A2IM
(7) FO
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I/O Equivalence Circuits – continued
(9), (14) A1O/A1IM
(13), (15) A1IP/REF1
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
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Operational Notes – continued
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B
D
3
8
5
2
M
U
Z
-
ZTR
Package
MUZ:
Packaging and forming specification
TR: Embossed tape and reel
VQFN16Z3030A
Marking Diagram
VQFN16Z3030A (TOP VIEW)
Part Number Marking
B D 3
8 5 2
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
VQFN16Z3030A
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Revision History
Date
Revision
001
Changes
11.Mar.2020
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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