BD46322G-TR [ROHM]
Counter Timer Built-in CMOS Voltage Detector IC;型号: | BD46322G-TR |
厂家: | ROHM |
描述: | Counter Timer Built-in CMOS Voltage Detector IC |
文件: | 总16页 (文件大小:482K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Voltage Detector IC Series
Counter Timer Built-in
CMOS Voltage Detector IC
BD45xxx series BD46xxx series
●Key Specifications
Detection voltage:
●General Description
2.3V to 4.8V (Typ.)
0.1V steps
±1.0%
ROHM’s BD45xxx and BD46xxx series are highly
accurate, low current consumption Voltage Detector ICs.
Because the counter timer delay circuit is built into
these series, an external capacitor for the delay time
setting is unnecessary. The lineup was established with
low output types (Nch open drain and CMOS output)
and detection voltages range from 2.3V to 4.8V in
increments of 0.1V, so that the series may be selected
according the application at hand.
High accuracy detection voltage:
Ultra-low current consumption:
Operating temperature range:
Three internal, fixed delay time:
0.85µA (Typ.)
-40°C to +105°C
50ms
100ms
200ms
●Package
SSOP5
2.90mm x 2.80mm x 1.25mm
●Features
Counter Timer Built-in
●Applications
No delay time setting external capacitor required
Ultra-low current consumption
Circuits using microcontrollers or logic circuits that
require a reset.
Two output types (Nch open drain and CMOS output)
Package SSOP5 is similar to SOT-23-5 (JEDEC)
●Typical Application Circuit
VDD1
VDD2
VDD1
RL
Micro
controller
Micro
controller
BD46xxx
RST
BD45xxx
RST
CL
CL
(Noise-filtering
Capacitor)
(Noise-filtering
Capacitor)
GND
GND
(Open Drain Output Type)
(CMOS Output Type)
BD45xxx series
BD46xxx series
●Connection Diagram
●Pin Descriptions
SSOP5
VDD
VOUT
PIN No.
Symbol
ER
Function
1
2
3
4
5
Manual Reset
Substrate *
SUB
GND
VOUT
VDD
GND
Reset Output
Power Supply Voltage
Lot. No
Marking
ER SUB GND
*Connect the substrate to GND.
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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●Ordering Information
B
D
x
x
x
x
x
x
-
T
R
Part
Number
Output Type
45 : Open Drain
46 : CMOS
Reset Voltage Value Counter Timer
23 : 2.3V
Package
Delay Time Settings G : SSOP5
0.1V step 5 : 50ms
Packaging and
forming specification
TR : Embossed tape
and reel
48 : 4.8V
1 : 100ms
2 : 200ms
SSOP5
<Tape and Reel information>
°
°
+
−4
2.9 0.2
6
°
4
Tape
Embossed carrier tape
3000pcs
5
4
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
1pin
+0.05
0.13
−0.03
S
+0.05
−0.04
0.42
0.1
0.95
S
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
∗
●Lineup
Table 1. Open Drain Output Type
Counter Timer Delay Time Settings
50ms
100ms
Part
200ms
Detection
Voltage
Part
Part
Marking
Marking
Marking
Number
Number
Number
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
TA
TB
TC
TD
TE
TF
TG
TH
TJ
BD45485
BD45475
BD45465
BD45455
BD45445
BD45435
BD45425
BD45415
BD45405
BD45395
BD45385
BD45375
BD45365
BD45355
BD45345
BD45335
BD45325
BD45315
BD45305
BD45295
BD45285
BD45275
BD45265
BD45255
BD45245
BD45235
TS
TT
TU
TV
TW
TX
TY
TZ
U0
U1
U2
U3
U4
U5
U6
U7
U8
U9
UA
UB
UC
UD
UE
UF
UG
UH
BD45481
BD45471
BD45461
BD45451
BD45441
BD45431
BD45421
BD45411
BD45401
BD45391
BD45381
BD45371
BD45361
BD45351
BD45341
BD45331
BD45321
BD45311
BD45301
BD45291
BD45281
BD45271
BD45261
BD45251
BD45241
BD45231
UJ
UK
UL
UM
UN
UP
UQ
UR
US
UT
UU
UV
UW
UX
UY
UZ
V0
V1
V2
V3
V4
V5
V6
V7
V8
BD45482
BD45472
BD45462
BD45452
BD45442
BD45432
BD45422
BD45412
BD45402
BD45392
BD45382
BD45372
BD45362
BD45352
BD45342
BD45332
BD45322
BD45312
BD45302
BD45292
BD45282
BD45272
BD45262
BD45252
BD45242
BD45232
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
TK
TL
TM
TN
TP
TQ
TR
V9
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●Lineup - continued
Table 2. CMOS Output Type
Counter Timer Delay Time Settings
50ms
100ms
Part
200ms
Detection
Marking
Part
Part
Marking
Marking
Voltage
Number
Number
Number
VA
VB
VC
VD
VE
VF
VG
VH
VJ
BD46485
BD46475
BD46465
BD46455
BD46445
BD46435
BD46425
BD46415
BD46405
BD46395
BD46385
BD46375
BD46365
BD46355
BD46345
BD46335
BD46325
BD46315
BD46305
BD46295
BD46285
BD46275
BD46265
BD46255
BD46245
BD46235
W2
W3
W4
W5
W6
W7
W8
W9
WA
WB
WC
WD
WE
WF
WG
WH
WJ
WK
WL
WM
WN
WP
WQ
WR
WS
WT
BD46481
BD46471
BD46461
BD46451
BD46441
BD46431
BD46421
BD46411
BD46401
BD46391
BD46381
BD46371
BD46361
BD46351
BD46341
BD46331
BD46321
BD46311
BD46301
BD46291
BD46281
BD46271
BD46261
BD46251
BD46241
BD46231
WU
WV
WW
WX
WY
WZ
X0
X1
X2
X3
X4
BD46482
BD46472
BD46462
BD46452
BD46442
BD46432
BD46422
BD46412
BD46402
BD46392
BD46382
BD46372
BD46362
BD46352
BD46342
BD46332
BD46322
BD46312
BD46302
BD46292
BD46282
BD46272
BD46262
BD46252
BD46242
BD46232
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
4.8V
4.7V
4.6V
4.5V
VK
VL
VM
VN
VP
VQ
VR
VS
VT
VU
VV
VW
VX
VY
VZ
W0
W1
X5
X6
X7
X8
X9
XA
XB
XC
XD
XE
XF
XG
XH
XJ
XK
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BD45xxx series BD46xxx series
z Absolute maximum ratings
Parameter
Symbol
Limits
-0.3 to +10
Unit
Power Supply Voltage
VDD-GND
V
Nch Open Drain Output
CMOS Output
GND-0.3 to +10
GND-0.3 to VDD+0.3
60
Output Voltage
VOUT
V
Output Current
ER pin Voltage
Power Dissipation
IO
mA
V
VCT
Pd
GND-0.3 to VDD+0.3
540
*1 *2
mW
°C
Operating Temperature
Topr
Tstg
-40 to +105
-55 to +125
Ambient Storage Temperature
°C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Limit
Typ.
Parameter
Symbol
Condition
Unit
Min.
VDET(T)
×0.99
2.475
2.417
2.422
2.970
2.901
2.906
3.267
3.191
3.196
4.158
4.061
4.068
4.752
4.641
4.649
Max.
VDET(T)
×1.01
2.525
2.580
2.598
3.030
3.095
3.117
3.333
3.405
3.429
4.242
4.334
4.364
4.848
4.953
4.988
*1
VDD=HÆL, RL=470kΩ
VDET(T)
2.5
Ta=+25°C
-
VDET=2.5V
VDET=3.0V
VDET=3.3V
VDET=4.2V
VDET=4.8V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
-
3.0
-
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
-
3.3
Detection Voltage
VDET
V
-
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
-
4.2
-
-
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
4.8
-
Ta=-40°C to 85°C
Ta=85°C to 105°C
-
Detection Voltage
Temperature coefficient
VDET/
∆T
-
±100
±360 ppm/°C
-40°C to +105°C
VDET(T) VDET(T) VDET(T)
VDD=LÆHÆL, RL=470kΩ
Hysteresis Voltage
∆VDET
V
×0.03
45
×0.05
50
×0.08
55
BD45XX5, BD46XX5
BD45XX1, BD46XX1
BD45XX2, BD46XX2
CL=100pF,
‘High’ Output
Delay time
tPLH
90
100
110
ms
RL=100kΩ
*1, *2, *3
180
200
220
*1
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V
-
-
-
-
-
-
-
-
-
-
-
-
0.70
0.70
0.75
0.75
0.80
0.80
0.75
0.75
0.80
0.80
0.85
0.85
2.10
2.85
2.25
3.00
2.40
3.15
2.25
4.28
2.40
4.50
2.55
4.73
*1
*1
Circuit Current
when ON
IDD1
IDD2
µA
µA
*1
*1
*1
Circuit Current
when OFF
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected between VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(VDET(T)-0.5V)Æ(VDET(T)+0.5V)
*3 tPLH:VDD=Please set the rise up time between VDD=0ÆVDET to more than 100µs.
Attention: Please connect the GND when you don’t use ‘ER’
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●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued
Limit
Condition
Parameter
Symbol
VOPL
Unit
Min.
0.95
1.20
Typ.
-
-
-
Max.
-
-
-
VOL≤0.4V, RL=470kΩ, Ta=25 to 105°C
Operating Voltage Range
‘High’ Output Voltage (Pch)
V
V
VOL≤0.4V, RL=470kΩ, Ta=-40 to 25°C
VDD-0.5
VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V)
VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V)
VOH
VDD-0.5
-
-
-
-
-
-
-
-
-
1
0.3
0.3
0.1
-
0.8
10
VDD=1.2V, ISINK = 0.45 mA
‘Low’Output Voltage (Nch)
VOL
V
VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V)
*1
*1
Leak Current when OFF
ER Pin ‘H’ Voltage
ER Pin ‘L’ Voltage
Ileak
VEH
VEL
IEL
VDD=VDS=10V
-
2.0
-
µA
V
V
*1
ER Pin Input Current
-
µA
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected between VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
Attention: Please connect the GND when you don’t use ‘ER’
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BD45xxx series BD46xxx series
●Block Diagrams
VDD
VOUT
Oscillation
Circuit Counter
Timer
Vref
GND
ER
Fig.1 BD45xxx Series
VDD
Oscillation
Circuit Counter
Timer
VOUT
Vref
GND
ER
Fig.2 BD46xxx Series
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●Typical Performance Curves
2.0
20
15
10
5
【BD45281】
【BD45281】
【BD46281】
【BD46281】
1.5
1.0
0.5
0.0
VDD=2.4V
VDD=1.2V
0
0.0
0.5
1.0
1.5
2.0
2.5
DS[V]
0
1
2
3
4
5
6
7
8
9 10
DRAIN-SOURCE VOLTAGE
V
:
V
DD SUPPLY VOLTAGE VDD[V]
:
Fig.4 “Low” Output Current
Fig.3 Circuit Current
7
6
5
4
3
2
1
0
20
15
10
5
【BD46281】
【BD45281】
】
【BD46281】
VDD=6.0V
VDD=4.8V
Ta=25
℃
Ta=25
℃
0
0
1
2
3
4
5
6
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
DRAIN-SOURCE VOLTAGE
VDS[V]
:
VDD SUPPLY VOLTAGE VDD[V]
:
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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●Typical Performance Curves – continued
20
20
15
10
5
【BD45281】
【BD45421】
【BD46281】
【BD46421】
15
10
5
0
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9 10
ER VOLTAGE
V
ER[V]
:
ER VOLTAGE VER[V]
:
Fig.7 ER Terminal Threshold Voltage
Fig.8 ER Terminal Input Current
5.8
5.4
5.0
4.6
4.2
3.8
3.4
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
【BD45421】【BD46421】
【BD45421】
【BD46421】
Low to high(VD ET+ΔVD ET
)
High to low(VD ET
)
~
-40 -20
0
20
40
60
80
100
-0
0
40
80
TEM PERATURE Ta[
]
℃
:
TEM PERATURE Ta[
]
℃
:
Fig.9 Detection Voltage
Release Voltage
Fig.10 Circuit Current when ON
(VDET-0.2V)
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●Typical Performance Curves – continued
1.5
1.0
3.0
2.8
【BD45421】
【BD45421】
【BD46421】
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
【BD46421】
0.5
0.0
-40 -20
0
20
40
60
80
100
-40 -20
0
20 40 60 80 100
TEM PERATURE Ta[
]
℃
:
TEMPERATURE Ta[
]
:
℃
Fig.11 Circuit Current when OFF
Fig.12 Operating Limit Voltage
50
40
30
20
10
0
250
【BD45282】【BD46282】
【
【BD45281】
200
150
100
50
【BD46281】
【BD45281】【BD46281】
【BD45285】【BD46285】
0
-60 -40 -20
0
20 40 60 80 100 120
-60 -40 -20
0
20 40 60 80 100 120
TEMPERATURE Ta[ ]
℃
TEMPERATURE Ta[
]
℃
:
:
Fig.13 Output Delay Time
Fig.14 Output Delay Time
“Low”Æ”High”
“High”Æ”Low”
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●Application Information
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45xxx series uses an open drain output
type, it is necessary to connect either a pull-up resistor to VDD or another power supply if needed [The output “High” voltage
(VOUT) in this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
R1
R2
R1
R2
Q2
Q1
Vref
Vref
Reset
VOUT
Oscillation
Circuit Counter
Timer
Oscillation
Circuit Counter
Timer
Reset
VOUT
Q1
R3
R3
GND
GND
ER
ER
Fig.15 (BD45xxx Type Internal Block Diagram)
Fig.16 (BD46xxx Type Internal Block Diagram)
Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
Part Number
tPLH[ms]
50
tPHL[µs]
BD45275G
BD46275G
18
18
50
VDD=2.2VÆ3.2V
VDD=3.2VÆ2.2V
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveform
Example: The following shows the relationship between the input voltages VDD, the output voltage VOUT and ER terminal when
the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 12 and 13).
1
When the power supply is turned on, the output is unstable from
VDD
VDET+ΔVDET
after over the operating limit voltage (VOPL) until tPHL. Therefore it is
possible that the reset signal is not outputted when the rise time of
VDET
VDD
⑦
VDD is faster than tPHL
2
.
VOPL
0V
When VDD is greater than VOPL but less than the reset release
voltage (VDET + ∆VDET), the output voltages will switch to Low.
VOH
3
If VDD exceeds the reset release voltage (VDET + ∆VDET), the
tPLH
tPLH
tPLH
VOUT
counter timer start and VOUT switches from L to H.
tPHL
VOL
VEH
4
When more than the high level voltage is supplied to the ER
tPHL
terminal, VOUT comes to “L” after tPLH delay time. Therefore, a time
when ER terminal is “H” is necessary for 100µsec or more.
ER
5
tPHL
When the ER terminal switches to Low, the counter timer starts
to operate, a delay of tPLH occurs, and VOUT switches from “L” to “H”.
6
If VDD drops below the detection voltage (VDET) when the power
①
②
③
④ ⑤
⑥
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of tPHL).
Fig.17 Timing Waveform
7
The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not toggle with power
supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
These time changes by the application and use it, please verify and confirm using practical applications.
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●Circuit Applications
1) Examples of common power supply detection reset circuits.
Application examples of BD45xxx series (Open Drain
output type) and BD46xxx series (CMOS output type)
are shown below.
VDD1
VDD2
RL
Micro
controller
BD45xxx
RST
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
CL
(Noise-filtering
Capacitor)
Use an open drain output type (BD45xxx) with a load
resistance RL as shown Fig.18.
GND
Fig.18 Open Drain Output Type
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BD46xxx) device or an open
drain output type (BD45xxx) device with a pull up
VDD1
resistor between the output and VDD1
.
Micro
controller
BD46xxx
RST
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (VOUT).
CL
(Noise-filtering
Capacitor)
GND
Fig.19 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
Micro
controller
BD45xxx
BD45xxx
RST
GND
Fig. 20
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD45xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
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3) Examples of the power supply with resistor dividers.
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current
that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause
malfunction in the systems operation such as output oscillations, etc.
V1
R2
I1
VDD
BD45xxx
BD46xxx
R1
VOUT
CIN
CL
GND
Fig. 21
When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
IDD
In-rush Current
VDD
0
VDET
Fig. 22 Current Consumption vs. Power Supply Voltage
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●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of
about 1MΩ is assumed between the ER terminal and the GND terminal, 100kΩ connection between the ER terminal
and the VDD terminal would be recommended. If the leakage is assumed between the VOUT terminal and the GND
terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance.
11) External parameters
The recommended parameter range for RL is 50kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
12) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
13) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
14) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
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Notice
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●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
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●Precaution for Electrostatic
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1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
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ROHM, its affiliated companies or third parties.
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