BD4734G-TR [ROHM]
Power Supply Support Circuit, Fixed, 1 Channel, +3.4VV, BIPolar, PDSO5, ROHS COMPLIANT, SSOP-5;
| 型号： | BD4734G-TR |
| 厂家： | 
ROHM |
| 描述： | Power Supply Support Circuit, Fixed, 1 Channel, +3.4VV, BIPolar, PDSO5, ROHS COMPLIANT, SSOP-5 光电二极管 |
| 文件： | 总13页 (文件大小：958K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Voltage Detector IC Series
Bipolar
Voltage Detector ICs
BD47xx series
●General Description
●Key Specifications
The BD47xx series is
a
Voltage Detector IC,
Detection voltage range:
1.9V to 4.6V (Typ.)
0.1V steps
developed to prevent system errors at transient state,
when the power of CPU or logic circuit switches
ON/OFF or in cases of momentary shut down. These
ICs consist of three terminals (power supply, GND and
reset output) to detect power supply voltages and
outputs reset signals of various systems. These ICs
are ultra-compact and have low current consumption,
making them ideal for portable products.
High accuracy detection voltage:
Low current consumption:
±1%
1.6µA (Typ.)
-40°C to +75°C
Operating temperature range:
●Package
SSOP5
2.90mm x 2.80mm x 1.25mm
●Applications
●Features
Circuits using microcontrollers or logic circuits that require
a reset.
High accuracy detection
Low current consumption
Very small package
Open collector “L” reset output
Package SSOP5 is similar to SOT-23-5 (JEDEC)
●Typical Application Circuit
VDD
VDD
RL
CL
CPU
Micro-controller
BD47xx series
VOUT
GND
RESET
GND
●Connection Diagram
●Pin Descriptions
SSOP5
TOP VIEW
VDD
PIN No.
Symbol
N.C.
Function
Unconnected Terminal
Substrate*
VOUT
1
2
3
4
5
SUB
GND
VOUT
VDD
GND
Reset Output
Lot. No
Marking
Power Supply Voltage
N.C. SUB GND
*Substrate Pin should be connected with GND
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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BD47xx series
●Ordering Information
B D
4
7
x
x
G
-
T
R
Part
Number
Reset Voltage Value Package
G : SSOP5
0.1V step
Packaging and
19 : 1.9V
forming specification
TR : Embossed tape
and reel
46 : 4.6V
(SOT-23-5)
●Lineup
Detection
Marking
Detection
Detection
Part Number
Voltage
Part Number
Marking
Part Number
Marking
Voltage
Voltage
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
B2
B1
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
BD4746
BD4745
BD4744
BD4743
BD4742
BD4741
BD4740
BD4739
BD4738
BD4737
BR
BQ
BP
B4
BN
BM
BL
BK
BJ
BD4736
BD4735
BD4734
BD4733
BD4732
BD4731
BD4730
BD4729
BD4728
BD4727
BH
BG
BF
BE
BD
BC
BB
BA
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
BD4726
BD4725
BD4724
BD4723
BD4722
BD4721
BD4720
BD4719
BZ
BY
BX
BW
BV
BU
BT
BS
B3
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BD47xx series
●Absolute maximum ratings
Parameter
Symbol
VDD
Limit
-0.3 to +10
-0.3 to +10
60
Unit
V
Power Supply Voltage
Output Voltage
VOUT
V
Output Current
Io
mA
mW
°C
°C
Power Dissipation *1 *2
Pd
540
Operation Temperature Range
Topt
Tstg
-40 to +75
-55 to +125
Ambient Storage Temperature
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical characteristics (Unless Otherwise Specified Ta=25°C)
Limit
Typ.
Parameter
Symbol
Condition
VDD=HL RL=4.7kΩ
Unit
Min.
VDET (T)
×0.99
2.475
2.418
2.970
2.901
3.267
3.191
4.158
4.061
Max.
VDET(T)
×1.01
2.525
2.584
3.030
3.100
3.333
3.410
4.242
4.341
VDET(T)
Ta=+25°C
2.5
-
3.0
-
3.3
-
4.2
-
VDET=2.5V
VDET=3.0V
VDET=3.3V
VDET=4.2V
Ta=-40°C to 75°C
Ta=+25°C
Detection Voltage
VDET
V
Ta=-40°C to 75°C
Ta=+25°C
Ta=-40°C to 75°C
Ta=+25°C
Ta=-40°C to 75°C
Temperature Coefficient
Of Detection Voltage
VDET/∆T RL=4.7kΩTa=-20 to+75°C Designed Guarantee
-
±0.01
-
%/°C
Detection Hysteresis Voltage ∆VDET RL=4.7kΩ, VDD=LHL
30
50
20
100
50
mV
µs
µs
V
*1
Transfer Delay Time ”H”
Transfer Delay Time ”L”
Reset Output Voltage ”L”
Circuit Current ON
tPLH
tPHL
VOL
Icc1
Icc2
VOPL
Ileak
IOL
CL=100pF，RL=4.7kΩ
CL=100pF，RL=4.7kΩ
-
*2
-
60
120
0.4
3.0
3.2
0.85
0.1
-
VDD=VDET(min.)-0.05V, RL=4.7kΩ
VDD=VDET(min.)-0.05V, RL=∞
VDD=VDET(typ.)/0.85V, RL=∞
RL=4.7kΩ，VOL≤0.4V
-
0.1
1.5
1.6
0.65
-
-
µA
µA
V
Circuit Current OFF
-
-
Operating Voltage Range
Output Leak Current
VDD=VOUT=10V
-
µA
mA
Reset Output Current ”L”
Vo=0.4V, VDD=VDET(min.)-0.05V
3.0
15.0
VDET(T):Standard Detection Voltage(1.9V to 4.6V, 0.1V step）
RＬ:Pull-up resistor to be connected between VOUT and power supply.
CL:Capacitor to be connected between VOUT and GND.
*1 tPLH:VDD=(VDET(typ.)-0.4V)(VDET(typ.)+0.4V)
*2 tPHL:VDD=(VDET(typ.)+0.4V)(VDET(typ.)-0.4V)
Design Guarantee. (Outgoing inspection is not done on all products)
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BD47xx series
●Block Diagram
VDD
5
4
V
OUT
Vref
3
GND
Fig.1 BD47xx series
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BD47xx series
●Typical Performance Curves
800
700
600
500
400
300
200
100
0
10
9
【BD4729】
【BD4729】
8
7
6
5
IOL=12.194mA at Vo=400mV
4
3
2
Icc1=1.34μA
1
0
0
1
2
3
4
5
6
7
8
9 10
0
5
10
15
20
25
30
VDD SUPPLY VOLTAGE ：VDD[V]
OUTPUT VOLTAGE ： VOUT[mV]
Fig.2 Circuit Current
Fig.3 “Low” Output Current
1000
6
5
4
3
2
1
0
【BD4729】
900
800
700
600
500
400
300
200
100
0
【BD4729】
】
VOPL=0.675V
VDET=2.90V
VDET=2.95V
⊿VDET=50mV
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
VDD SUPPLY VOLTAGE ：VDD[V]
VDD SUPPLY VOLTAGE ： VDD[V]
Fig.4 I/O Characteristics
Fig.5 Operating Limit Voltage
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BD47xx series
●Typical Performance Curves – continued
3.5
2.5
2.0
1.5
1.0
0.5
0.0
【BD4729】
【BD4729】
3.3
3.1
2.9
2.7
2.5
-0.007%/
℃
~
~
-20 -10 0 10 20 30 40 50 60 70 80
-20 -10 0 10 20 30 40 50 60 70 80
TEMPERATURE ： Ta[℃]
TEMPERATURE ： Ta[℃]
Fig.6 Detection Voltage
Fig.7 Circuit Current when ON
2.5
2.0
1.5
1.0
0.5
0.0
0.9
0.8
0.7
0.6
0.5
0.4
【BD4729】
【BD4729】
-20 -10 0 10 20 30 40 50 60 70 80
-20 -10 0 10 20 30 40 50 60 70 80
TEMPERATURE ： Ta[℃]
TEMPERATURE ： Ta[℃]
Fig.8 Circuit Current when OFF
Fig.9 Operating Limit Voltage
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BD47xx series
●Typical Performance Curves – continued
500
【BD4729】
400
300
200
100
0
Ta=-20℃
Ta=75℃
Ta=25℃
0
1
2
3
4
5
"LOW" OUTPUT CURRENT ： IOL[mA]
Fig.10 Output Saturation Voltage
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BD47xx series
●Application Information
Explanation of Operation
BD47xx series has threshold voltages namely the detection voltage and release voltage. As the voltages applied to the
input reach their respective thresholds, the output switches from “High” to “Low” and from “Low” to “High”. The release
voltage has a hysteresis that is the value of the detection voltage +50mV (Typ.), preventing chattering in the output. When
the input is greater than the release voltage, the output is in a “High” state. When the input decreases from that state, the
output switches to “Low” upon reaching the detection voltage. When the input is less than the detection voltage, the output
is in a “Low” state. When the input increases from that state, the output switches to “High” upon reaching the release
voltage. Additionally, at least 0.85V input voltage is required for the circuit to function as expected. When the input falls
below the operating limit voltage, the output becomes unstable.
VDD
VDD
VDET+ΔVDET
⑤
VDET
VOPL
0V
VOUT
VOH
tPHL
tPLH
tPLH
tPHL
VOL
①
②
③
④
Fig.11 Timing Waveform
1
When the power supply is turned on, the output is still unstable until it reaches the operating limit voltage (VOPL) with a
given time tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL
.
2
When VDD is greater than VOPL but less than the reset release voltage (VDET+ΔVDET), the output voltages will switch to
Low.
3
If VDD exceeds the reset release voltage (VDET+ΔVDET) then VOUT switches from L to H after tPLH
.
4
If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power
supply fluctuation, VOUT switches to L (with a delay of tPHL).
5
The potential difference between the detection voltage and the release voltage is known as the Hysteresis Width
(ΔVDET). The system is designed such that, the output does not toggle with power supply fluctuations within this hysteresis
width, malfunctions due to noise are prevented.
<Precautions>
Please be aware that when there is resistance on the power supply line, the detection voltage varies with voltage drops
caused by the IC current consumption.
Please connect a capacitor between VDD and GND when the power supply line has high impedance.
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BD47xx series
●Circuit Applications
The following is an example of an application circuit using Reset IC for normal power supply detection. BD47xx series
requires a pull up resistor on the output terminal. The pull up resistor value should be decided depending on the
application, with enough consideration of power supply level and output current capability. When a capacitor is placed at
the output terminal, to delay the output time or to remove noise, the output will become slower during starting or stopping.
Please be careful in considering the appropriate value for pull up resistors, output current, and capacitor when inserting a
bypass capacitor between input and GND. Please be aware that if an extremely large capacitor is used, the response time
will become excessively slow.
●●●●●●●●●●●●
VDD
●
●
●
●
●
●
●
●
●
●
●
VDD
5
microcontroller
4
Reset Pin
VOUT
●●●●●●●●●●●●
Vref
BD47xx series
GND
3
Fig.12 Circuit Applications
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BD47xx series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The recommended parameter range for RL is 2kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
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only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BD4735G-TR
Power Supply Support Circuit, Fixed, 1 Channel, +3.5VV, BIPolar, PDSO5, ROHS COMPLIANT, SSOP-5
ROHM
BD4736G-TR
Power Supply Support Circuit, Fixed, 1 Channel, +3.6VV, BIPolar, PDSO5, ROHS COMPLIANT, SSOP-5
ROHM
BD4737G-TR
Power Supply Support Circuit, Fixed, 1 Channel, +3.7VV, BIPolar, PDSO5, ROHS COMPLIANT, SSOP-5
ROHM
BD4738G-TR
Power Supply Support Circuit, Fixed, 1 Channel, +3.8VV, BIPolar, PDSO5, ROHS COMPLIANT, SSOP-5
ROHM
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